Nasa

NASA
Technical
A Design
Phase
and
Paper
Handbook
Change
Energy
William
R.
George
C.
Marshall
1074
for
Thermal
Storage
Devices
Humphries
Marshal/
Space
Flight
Space
Flight
Center,
Tennessee
Cookeville,
I.
Griggs
Technological
Tennessee
NA.q&
National Aeronautics
and Space Administration
Scientific and Technical
Information Office
1977
Center
Alabama
and
Edwin
Control
University
ACKNOWLEDGMENTS
The authors
wish to recognize
a number
of contributors
whose
aid was
instrumental
in completing
this work. Dr. John Bailey of North Carolina State University
is due a special
debt
of gratitude
for his extensive
efforts
in paraffin
properties
investigations,
excerpts
of which are given in Section II. Dr. Donald Pitts of Tennessee
Technological
University
is due special recognition
for his work during two summers
at
the Marsnall
Space
Flight
Center,
under
the auspices
of the American
Society
tol
Engineering
Education.
During this period he made valuable contributions
to verification
of nondimensional
computer
modeling
and contributed
to parametric
studies given in
Section
IV. In addition,
a number
of graduate
students
at Tennessee
Technolegical
University
contributed
to certain
phases of this work, particularly
to the large body of
computer
runs required to amass the data given in Section IV.
It should be noted that the entire study was made possible by sustaining research
funds supplied
by the Marshall
Space Flight Center of the National
Aeronautics
and
Space Administration
through
basic research
and Skylab project
funding
and later by
funds supplied from the Energy Research
and Development
Administration
via the Solar
Heating and Cooling Program Office of the Marshall Space Flight Center.
TABLE
OF CONTENTS
Page
l
lI.
III.
IV.
V,
INTRODUCTION
.......................
A.
Definition
B.
C.
D.
Applications
.......................
Phase Change Material
...................
Scope of Study
......................
PROPERTY
........................
DATA
.......................
Availability,
A.
Sources,
and Estimated
B.
C.
Melting and Transition

Temperatures
..............
Heat of Fusion and tteat of Transition
.............
D.
E.
F.
G.
H.
Specific Heat
.......................
Density
.......
: .................
Thermal Conductivity
....................
Viscosity
.........................
Surface Tension
......................
I.
Coefficiept
of Expansion
TWO-DIMENSIONAL
Cost of Selected
..................
ANALYSIS
OF A PHASE
A.
Introduction
B.
C.
D.
Physical Model
.................
Differential
Formulation
...................
Finite Difference
Formulation
................
GENERAL
PARAMETRIC
STUDY
Introduction
B.
C.
Scope and Definitions

....................
Results
.........................
D.
Examples
......................
B -
APPEND1X
THERMAL
RESISTANCE
37
4O
43
47
146
Example Application
with a Nontmiform
Condition
........................
- PROPERTY
37
62
.........................
TOPICS
6
I0
10
10
20
20
29
29
29
62
62
65
142
C.
APPENDIX
.....
.......................
Filler
..........................
Convection
........................
I)EVICE
................
A.
B.
APPENDIX
CHANGE
.......................
A.
RELATED
Paraffins
146
148
Thermal
Boundary
159
................
VARIATION
nl
167
.........
192
TABLE
OF CONTENTS
(Concluded)
Page
APPENDIX
APPENDIX
REFERENCES
C - COMPUTER
IN SECTION
PROGRAM
FOR
V
...................
D - COMPUTER
PROGRAM
EXPLICIT
NUMERICAL
.....
EXAMPLE
DESCRIBED
197
USED TO FACILITATE
STUDY
............
iv
THE
206
233
LIST OF ILLUSTRATIONS
Title
Figure
Page
1.
Responses
2.
A phase change
3.
Correlation
of phase change temperature
atoms in the chain
.....................
of a phase change
device
device
...............
...................
with number
14
Correlation
of heat of fusion with number
the chain .........................
Correlation
of heat of transition
the chain .........................
Example illustrating
effect
for hexadecane-octadecane
of carbon
of carbon
atoms
in
16
with number of carbon
atoms
in
17
of composition
binary system
of heats of phase change

............
17
Specific
heat versus temperature
for C t _H24, C_ 2H26, and C a3H2 s
18
8.
Specific
heat
for C a4H30,
19
9.
Specific
heat' versus temperature
10.
Specific
heat
of tetradecane
(Ca4H3o)
.............
21
11.
Specific
heat
of hexadecane
(C_ 6H34)
.............
22
12.
Specific
heat of octadecane
(C _8 H38 )
.............
23
13.
Specific
heat of eicosane
14.
Liquid phase density
15.
Density
of te tradecane
(Ca 4 H30 )
...............
27
1O.
Density
of hexadecane
(C a 6 H34)
...............
27
17.
Density
of octadecane
(Ca 8 H38 )
...............
28
18.
Density
of eicosane
19.
Thermal
versus temperature
conductivity
for C 2 s Hs 2 ...........
(C2 o H42 )
of several
(C 2 o H42 )
Ca 5H32, and C_ 6H34
..............
paraffins
.............
................
of tetradecane
(C_ 4H30 ) ..........
20
24
26
28
30
(Continued)
Title
Figure
Page
20.
Thermal conductivity
of hexadecane
(Ca 6 Ha 4 ) ..........
31
21.
lq_ermal
of octadecane
(Ca a Ha s )
32
22.
Thermal conductivity
of eicosane (C2 o H42 ) extrapolated
for lower carbon number paraffins
...............
23.
conductivity
Correlation
paraffins
24.
of thermal
(CnH2n+2)
conductivity
..........
data for normal

34
C= a H24 through
C20 H42 versus

35
25.
Surface
tension forCl
26.
General
designations
27.
Phase change device application
28.
Typical single cell of phase change
29.
Symmetrical
30.
Coordinate
system and dimensions
for fin
31.
Coordinate
system and dimensions
for base
32.
Nodal grid designation
33.
Latent energy storage per unit base area versus

thickness of 0.0127 cm (0.005 in.) ...............
fin height
Latent energy storage per unit base area versus

thickness of 0.0508 cm (0.02 in.)
...............
fin height
34.
35.
36.
37.
33
....................
Absolute viscosity of paraffins

temperature
........................
halt-cell
from data
1H24 through
for nodes
C2oH42
and connecting
selected
used in analysis
conductances
for study
device
36
...........
.....
38
40
.........
41
............
42
..............
44
............
45
...........
47
....................
tor fin
66
Latent energy storage per unit base area versus fin height
thickness of 0.127 cm (0.05 in.) ................
for fin
67
lbr fin
68
Base temperature
rise at the termination
of melting versus W for
H = 1.26 cm (0.5 in,) and S: --' 0,127 cm (0.05 in.) .........
69
Base temperature
rise of the termination
at melting versus W for
H = 2.54 cm (1.0 in.) and $2 = 0.127 cm (0.05 in.) .........
7O
vi
Figure
38.
39.
40.
41.
42.
43.
44.
45.
46.
47.
48.
49,
50.
51.
(Continued)
Title
Page
Base temperature
H -- 5.08 cm (2.0 in.) and S 2 = 0.127 cm (0.05 in.) .........
71
Base temperature
H = 10.16 cm (4.0 in.) and S_ = 0.127 cm (0.05 in.) ........
72
Base temperature
nse at the termination
H = 20.32 cm (8.0 in.) and $2 = O. 127 cm (0,05 in.)
........
73
Base temperature
H = 1.27 cm (0.5 in.) and $2 = 0.0508 cm (0.02 in.)
........
74
Base temperature
rise at termination
H = 2.54 cm (1.0 in.) and $2 = 0,0508 cm (0,02 in.)
........
75
Base temperature
rise at termination
H = 5.08 cm (2.0 in.) and $2 = 0.0508 cm (0.02 in.)
........
76
Base temperature
rise at termination
H = 10.16 cm (4.0 in.) and $2 = 0.0508 cm (0,02 in.) ........
77
Base temperature
nse at termination
H = 20.32 cm (8.0 in.) and $2 = 0.0508 cm (0.02 in.) ........
78
Base temperature
nse at termination
H = 1.27 cm (0.5 in.) and $2 = 0.0127 cm (0.005 in.)
.......
79
Base temperature
rise at termination
H = 2,54 cm (1.0 in.) and $2 = 0.0127 cm (0.005 in.)
.......
80
Base temperature
rise at termination
H = 5.08 cm (2.0 in.) and $2 = 0.0127 cm (0.005 in.) ........
81
Base temperature
nse at termination
H = 10.16 cm (4.0 in.) and S_ -- 0.0127 cm (0.005 in.) .......
82
Base temperature
nse at termination of melting versus W for
H = 20.32 cm (8.0 in.) and $2 = 0.0127 cm (0.005 in.) .......
83
Base temperature
of melting versus I-f for
_t''= 1076.4 J/s-m 2 (341.4 Btu/h-ft 2 ) and $2 = 0.0127 cm
(0.005 in.)
........................
84
vii
Figure
52.
53.
54.
55.
56.
57.
58.
59.
60.
61.
62.
(Continued)
Title
Page
Base temperature
of melting versus H for
_1''= 1076.4 J/s-m 2 (341.4 Btu/h-ft 2 ) and S 2 = 0.0508 cm
(0.020 in.)
........................
85
Base temperature
_1" = 1076.4 J/s-m 2 (341.4 Btu/h-ft 2 ) and S 2 = 0.127 cm
(0.050 in.)
........................
86
Base temperature
el" = 2152.8 J/s-m 2 (682.9 Btu/h-ft 2) and S 2 = 0.0127 cm
(0.005 in.)
........................
87
Base temperature
_t" = 2152.8 J/s-m 2 (682.9 Btu/h-ft 2 ) and S 2 = 0.0508 cm
(0.020 in.)
........................
88
Base temperature
_l''= 2152.8 J/s-m 2 (682.9 Btu/h-ft 2) and S 2 = 0.127 cm (0.05 in.)
Base temperature
_1" = 4305.6 J/s-m 2 (1365.7 Btu/h-ft 2 ) and $2 = 0.0127 cm
(0.005 in.)
....................
,
89
90
Base temperature
_l''= 4305.6 J/s-m 2 (1365.7 Btu/h-ft 2 ) and $2 = 0.0508 cm
(0.020 in.)
........................
91
Base temperature
of.melting
versus H for
_t" = 4305.6 J/s-m 2 (1365.7 Btu/h-ft 2 ) and $2 = 0.127 cm
(0.050 in.)
........................
92
Base temperature
c]''= 6458.3 J/s-m 2 (2048.6 Btu/h-ft 2 ) and $2 = 0.0127 cm
(0.005 in.)
........................
93
Base temperature
_l" = 6458.3 J/s-m 2 (2048.6 Btu/h-ft 2 ) and $2 = 0.0508 cm
(0.020 in.)
........................
94
Base temperature
tl" = 6458.3 J/s-m 2 (2048.6 Btu/h-ft 2) and $2 = 0.127 cm
(0.050 in.)
........................
95
...
VIII
Figure
63.
(Continued)
Title
Page
Transient base temperature rise versus

H = 1.27 cm (0.5 in.) and $2 = 0.0127
fraction of PCM melted

cm (0.005 in.) ........
for
Transient base temperature

rise versus
H = 1.27 cm (0.5 in.) and $2 = 0.0508
fraction of PCM melted

cm (0,020 in.) ........
for

rise versus fraction of PCM melted
H= 1.27 cm (0.5 in.) and $2 = 0.127 cm (0.05 in.) .........
for

H= 2.54cm
(1 in.) and $2 = 0.0127 cm (0.005 in,)
........
for

H = 2.54 cm (1 in.) and $2 = 0.0508 cm (0.020 in,)
........
for

H = 2.54 cm (1 in.) and $2 = 0.127 cm (0.05 in.)
.........
for

H = 5.08 cm (2 in.) and $2 = 0.0127 cm (0.005 in,)
........
for
Transient base temperature rise versus fraction

H = 5.08 cm (2 in.) and $2 = 0.0508 cm (0.02
of PCM melted
in.) .........
for

H = 5.08 cm (2 in.) and $2 = 0.127 cm (0.05 in.)
.........
for
72.

H = 10.16 cm (4 in.) and $2 = 0.0127 cm (0.005 in.) ........
for
73.

H--- 10.16 cm (4 in.) and $2 = 0.0508 cm (0,02 in.)
........
for
Transient
base temperature
rise versus fraction
H = 10.16 cm (4 in.) and $2 = O. 127 cm (0.05
of PCM melted
in.) .........
for
75.

H = 20.32 cm (8 in.) and $2 = 0.0127 cm (0.005 in.) ........
for
76.

H = 20.32 cm (8 in.) and S 2 = 0,0508 cm (0.02 in.)
........
for
64.
65.
66.
67.
68.
69.
70.
71.
74.
ix
97
98
99
I00
101
102
103
104
105
106
107
108
109
110
Title
Figure
77.
78.
79.
80.
81.
82.
83.
84.
86.
88.
89.
for
111
112
Time required for PCM to melt for _l" = 1076.4 J/s-m 2

(341.4 Btu/h-ft 2 ) and S 2 = 0.0508 cm (0.02 in.)
.........
113
Time required for PCM to melt for q" = 1076.4 J/s-m 2

(341.4 Btu/h-ft 2 ) and $2 = 0.127 cm (0,05 in.) ..........
114
Time required for PCM to melt for q"= 2152.8 J/s-m 2

(682.9 Btu/h-ft 2 ) and S 2 = 0.0127 cm (0.005 in.) .........
115
Time required for PCM to melt for q"= 2152.8 J/s-m 2

(682.9 Btu/h-ft 2 ) and S 2 = 0.0508 cm (0.02 in.)
.........
116

(682.9 Btu/h-ft 2 ) and S 2 = 0.127 cm (0.05 in.) ..........
117
Time required
Btu/h-ft
for PCM to melt for ci" ---4305.6

2 ) and $2 = 0.0127
cm (0.005
J/s-m 2
in.)
118
........
Time required for PCM to melt for c_" = 4305,6 J/s-m 2

(341.4 Btu/h-ft 2 ) and $2 = 0.0508 cm (0.02 in.)
.........
Time required
Btu/h-ft
for PCM to melt and q" = 4305.6

2 ) and $2 = 0.127
cm (0.05
119
J/s-m 2
in.)
120
.........
Time required for PCM to melt for _1" = 6458.3 J/s-m 2

(2048.6 Btu/h-ft 2 ) and $2 = 0,0127 cm (0.005 in.)
........
121

(2048.6 Btu/h-ft 2 ) and $2 = 0.0508 cm (0.02 in.) .........
122
Time
required
(2048.6
90.
of PCM melted
in.) .........
Time required for PCM to melt for Cl" = 1076.4 J/s-m 2

(341.4 Btu/h-ft 2 ) and S 2 = 0.0127 cm (0.005 in.) .........
(1365.7
87.
Page

H = 20.32 cm (8 in.) and $2 = 0.127 cm (0.05
(1365,7
85.
(Continued)
Btu/h-ft
for PCM to melt for q" = 6458.3

2 ) and $2 = 0.127
cm (0.05
J/s-m 2
in.)
Energy ratio versus heat flux density for W = 0.127

and S 2 = 0.0127 cm (0.005 in.) ................
.........
cm (0.05
123
in.)
124
Figure
91.
92.
93.
94.
95.
96.
97.
98.
99.
I00.
101.
102.
103.
104.
(Continued)
Title
Energy ratio versus heat flux density for W = 0,127
and $2 = 0.0508 cm (0.02 in.) .................
Page
cm (0.05
in.)
125
Energy ratio versus heat flux density for W = O. 127 can (0.05
and $2 = 0.127 cm (0.05 in.) .................
in.)
126

and $2 = 0.0127 cm (0.005 in.)
................
cm (0.1 in.)

and $2 = 0.0508 cm (0.02 in.) .................
cm (0.1 in.)

and $2 = 0.127 cm (0.05 in.)
.................
can (0.1 ira.)
Energy ratio versus heat l]ux density for W = 0.508

and $2 = 0.0127 cm (0.005 in.)
................
can (0.2 in.)

and $2 = 0.0508 cm (0.02 in,) .................
can (0.2

and $2 = 0.127 cm (0.05 in.)
.................
cm (0.2 in.)
127
128
129
130
in.)
131
132
Energy ratio versus heat flux density for W = 1.016 cm (0.4 in.)
and $2 = 0.0127 can (0.005 in.)
................
133
Energy ratio versus heat flux density for W = 1.016 cm (0.4 in.)
and $2 = 0.0508 cm (0,02 in,) .................
134
Energy ratio versus heat flux density for W = 1,016 cm (0.4 in,)
and $2 = 0.127 cm (0.05 in.)
..................
135
Energy ratio versus heat flux density for W = 2,032 cm (0.8 in,)
and $2 = 0.0127 cm (0,005 in.)
................
136

and $2 = 0.0508 cm (0.02 in,) .................
cm (0.8 in.)
137
Encrgy ratio versus heat flux density for W = 2.032

and S 2 = 0.127 cm (0.05 in.)
.................
cm (0.8 in.)
xi
137
Figure
105.
106.
107.
108.
Title
Page
Base temperature
rise versus W for three different fusion temperatures
and H = 1.27 cm (0.5 in.) and $2 = 0.127 cm (0.05 in.) .......
139
Base temperature
rise versus W for three different
fusion temperatures
140
Base temperature
rise versus W for three different
fusion temperatures
141
Silveston's
in various
149
experimental
results
liquids ......................
in the neighborhood
109.
Region of influence
110.
Surface
tension
111.
Volume
change driven
112,
Heat transfer
113.
Zero-g ullage configurations
114.
Comparison
between predicted
and measured
for an example melt run ...................
115.
(Continued)
of L/d on heat transfer

..............
150
flow patterns
..............
152
characteristics
116.
Nodal pattern
117.
Example exit temperature

at inlet ..........................
Physical
of B_nard
cells
B-2.
Simplified
B-3.
Variation
thickness
thermal
...........
154
155
.................
for calculating
model
149
...........
patterns
convection
Physical model for heat transfer between

and a flowing fluid .....................
B-1.
of instability
front
location
158
a phase change device
bulk temperature
variations
fusion
161
of flowing
for a sinusoidal
fluid
163
temperature
165
......................
network
....
192
193
..................
of equivalent
thermal resistance with height
of 0.0127 cm (0.005 in.) ...............
xii
for a fin
194
B-5.
D-I.
Pagc
Title
Figure
B-4.
(Concluded)
Variation
thickness
of equivalent
of 0.0508 cm (0.02 in.)
............
for a fin
Variation
thickness
of equivalent
of 0.127 cm (0.05 in.) ................
for a fin
Skelton
flow chart
195
196
224
.....................
xiii
LIST OF TABLES
Table
Title
1.
Potential
2.
Capabilities
3.
Some Approximate
4.
Melting and Transition

Eleven Through Thirty
Fusion
Suppliers
of Selected
of Potential
Temperature
of Selected
Paraffins
for Selected
Comparison
of Heat of Fusion
Paraffins
.........................
Temperatures
Paraffins
for Certain
Paraffins
Heat Data for Certain
10.
Thermal
Conductivity
11.
Volumetric
12.
Computer
Density
Containing
11
Paraffins
12
13
...........
of Selected
for Several Grades
of Selected
16
Paraffins
.............
Paraffins
25
...........
29
of Expansion
(60F/15.6C)
........
Program for Base Exposed

.........................
to a Constant
Heat Flux
Computer
Program for Base Exposed
Temperature
.......................
to a Step Increase
15.
Values of Geometric
Variables and Heat Flux Density
the Numerical
Study
....................
Used in Computations
Some Reported Thermal Conductivity

Values
of Certain Paraffins in W/m-C (Btu/h-ft-F)
in
57
PCM and Metal Properties
xiv
37
52
14.
16.
........
15
of Selected
Coefficient
............
for Several Grades
Comparison
of Heat of Transition
Paraffins
.........................
Specific
.......
Data for tile Paraffins (Cntt2n+2)

Carbon Atoms
.............
7.
13.
.............
Price Data for Selected
Transition
Paraffins
Suppliers
6.
Page
64
.........
Chosen
for
for the Solid Phase

...........
64
160
LIST OF TABLES
Table
A-I.
h-2.
(Continued)
Title
Page
Fusible Materials with a Heat of Fusion Greater than 185.96 kJ/kg

(80 Btu/lb) Listed in Order of Increasing Melt Temperature
from
4.4 to 65C (40 to 150F)
..................
169
Comparisons
of Fusion Properties and Melt Temperature
Selected PCM's Reported in Reference
56 ............
171
of
Properties
of Six PCM's Studied in Reference
57 with a Fusion
Temperature
Between 273 and 373 K ..............
172
A-4.
Melt Temperatures
173
A-5.
Four
A-6.
PCM's Used in Tests Reported
A-7.
Comparative
A-8.
Melting Temperature
of Some Mixtures Investigated
Conditioning
Thermal Energy Storage ..............
A-3.
of Fifteen
Low Temperature
Data
Melting Temperature
Low Temperature
PCM's Recommended
in Reference
A-12.
A-13.
Melting
Hydrate
Temperature
Eutectics
in Reference
58
on Waxes and Inorganic
and Heat of Fusion

.....................
57
....
Hydrates
174
175
..........
176
........
for Air
177
and Heat of Fusion of Inorganic
Melting Point, Heat of Fusion, and Latent

Inorganic Hydrates
.....................
A-11.
PCM Candidates
Salt Hydrates
Heat Density
178
of Some
180
of Some Inorganic
Calorimetric
Data for Some Organic Thermal
Materials for Solar Heating
..................
181
Energy
Storage
182
Melting Temperature
and Heat of Fusion of Organic Materials for
Air Conditioning-Hydrocarbons
and Halogenated
Hydrocarbons
183
A-14.
Melting
Point and Heat of Fusion
184
A-15.
Melting
Organic
Temperature
and Heat of Fusion for Some AcetamideEutectics and Compounds
................
for Some Organic
XV
Eutectics
....
185
LIST OF TABLES
Table
A-16.
(Concluded)
Title
PCM Data for Some Alcohols,
Ethers ..........................
Phenols,
Page
Aldehydes,
Ketones,
and
186
......
187
.......
188
A-17.
PCM Data for Organic
A-18.
Calorimetric
A-19.
Melting Point and Heat of Fusion for Clathrates

and Semi-Clathrates
Melting Congruently
Above OC (32F)
.............
189
Melting
190
Acids and Miscellaneous
Data for Air Conditioning
Point for Organic-inorganic
Organic
Eutectics
Organics
Materials
...........
Computer
Program Used to Compute Fluid Temperature
it Flows Through a Phase Change Device .............
Required
Description
Input
Data for the Program
of Output
Listed in Table C-1
Data from Program
xvi
Variation
as
198
203
......
Listed in Table C-1
....
205
A DESIGN HANDBOOK
FOR PHASE CHANGE THERMAL
CONTROL AND ENERGY STORAGE DEVICES
I.
INTRODUCTION
A.
literature.
Phase change
thermal
These articles often
Definition
control
devices have been discussed
extensively
refer to a device of this type by different
names
in the
such as
thermal capacitor,
thermal
flywheel,
heat of fusion device, latent heat device, and fusible
mass device. However,
all these terms refer to a component
which is used to either
thermally
control
a medium
or store energy by utilizing a material
which undergoes
a
change of phase.
There
are a number
of phase
change
Solid-liquid
transformations
ice or water)
Liquid-gas
transformations
transformation
classes
(melting/freezing)
(vaporization)
(e.g.,
(e.g.,
transition
melting
(e.g., boiling
Solid-gas transformations
(sublimation)
(e.g.,
dioxide at atmospheric
pressure,
"dry ice")
Solid-solid transformations
to the monoclinic
form)
given by Lorsch
Liquid-liquid
transformations
(e.g., the transformation
liquids are immisible such as water and phenol).
or freezing
as
of
of water)
sublimation
of the
[1]
rhombic
of solid
form
occurring
carbon
of sulfur
when two
Very little energy is released or absorbed

by liquid-liquid
transformations,
and it
is questionable
whether
this
is a true
class of phase
change.
The
liquid-liquid
transformation
is neglected
in the remainder
of this work.
Liquid-gas
and solid-gas
transformation
classes have large volume changes associated
with them, a feature
which
requires heavy and complicated
pressure vessels or special design features, such as internal
bellows. For this reason, they also are not considered
herein. Solid-liquid
transformations
are of great
importance
because
most classes
of materials
undergo
this type
of
transformation
without
exhibiting
large volume
changes
while releasing
or absorbing
relatively
large quantities
of energy. The fourth transforlnation
is also of interest because
the energy
exchange
can be significant
and a number
of materials
display
this
phenomenon
in a temperature
range near their melting
point. Consequently,
for the
purpose
of this document,
phase
change
processes
are limited
to solid-liquid
and
solid-solid transformations.
B.
There are a number
Some of these are:
of
uses
Thermal
outlet)
Inhibition
electronics)
of thermal
Maintaining
constant
damping
thermocouple
of oscillatory
excursions
Control
Temperature
(e.g.,
(e.g.,
Lunar
(e.g.,
devices
have
Skylab
space
Roving
Pegasus
of
of
these
thermal
change
40F
(e.g., mushroom
most
1 depicts
a phase
heating
and
application)
(e.g., Skylab
indication
descriptions
Typically,
external
material
which it
applied
different
mechanisms
Figure
change
outputs
temperature
[2].
phase
been
radiator
Vehicle
III
applied.
fluid
drive control
coating
experiment-
reference)
Energy storage
(e.g.,
solar
illustrated
by the MIT house
Brief
device
cooling
vernatherm
thaw
applications
energy
storage
such
as
given
by
valve)
warning
indicator).
through
responses
for the first three
is passive
with no moving
1973
are
applications.
parts,
consisting
of an
.housing and the phase change material (PCM), with or without interspersed
filler
(Fig. 2). Usually this device is in intimate
thermal
contact
with the medium
is thermally
controlling.
Although
shown in a simplified form, this device can be
in an almost
infinite
number
of geometrical
configurations
with a myriad
of
filler configurations.
C.
Studies
following
to which
Humphries
Other
Applications
have
shown
that
Phase Change Material
to qualify
as a good
PCM the material
characteristics:
High heat
Proper
property
of fusion
melting
requisites,
point
per unit mass and volume

(or range).
but not requirements,
High thermal
High coefficient
for a good
diffusivity
of thermal
conductivity
PCM are:
should
possess
the
W/O
_m--
TC
WITH
TC
==
p-
TIME
a.
THERMAL
DAMPING
OF
OSCILLATORY
OUTPUTS
W/O
u
WITH
TC
TC
=<
TIME
b.
INHIBITING
THERMAL
EXCURSIONS
-------m--
gJ
eYk<
uJ
i.,
I,LI
TIME
c. MAINTAINING
Figure
1.
Responses
CONSTANT
TEMPERATURE
of a phase
change
device.
W/O
WITH
TC
TC
,/'_'-
EXTERNAL HOUSING
iiiiiiiiiii_iiiiiiiiiii;!iiiiiiiii!ii!iiii!i!i!ii!iiiiiiii!i[i_.,
-__
iiii!iii!ii!iiiii
iiii!iiiiiiiiiiiiiiiiiiiiiiiiiiiiiii!i!iiiii
! ! ! ! ! ! ! iiiiiiiiiiiiiii!il
'llllll//////////////////////////////////////////llllllllJ
Figure
Noncorrosive
Low coefficient
High flash point
Good
Minimum
Stable
Congruent
Little
Relatively
Nontoxic.
Economic
factors
wetting
2. A phase
characteristics
phase
(in solid-solid
change
or no supercooling
pure
of importance
Low cost
Present
device.
of expansion
of void spaces
change
and future
are:
availability.
state)
Thereare a numberof classes

of materialswhich havebeeninvestigatedfor useill
phasechangedevices.Someof the moreimportant are:
Inorganicsalt hydrates(e.g.,glauber'ssalt Na2SO

4"10H20)
Organiccompounds(e.g.,paraffinsCnH2n+2)
Eutectics of the above (e.g., 88 mole percentacetic acid + 12 mole

percentbenzoicacid)
Naturalelements(e.g.,sulphur,S)
Water.
Of these materials,paraffins havebeen the most widely used,primarily in the space

program.
D.
Scope of Study
This section
presents
an overview
of phase
definitions,
typical applications,
and general limitations
PCM property
data. Since most of the past devices
change devices;
that is, it gives
of this study. Section I1 presents
have used paraffin
as the PCM,
Section
II is primarilY
devoted
to this class of materials.
However,
a large volume of
nonparaffin
data excerpted
from other studies is given in the appendices.
These data
should
allow the designer
to use this document
without
resorting
to time consuming
literature
searches
for property
data. Section
lII details
the derivation
and use of a
nondimensional
computer
program.
Section
IV presents
results
of parametric
studies
performed
using this nondimensional
model. Using typical
paraffin
property
data and
thermal
boundary
conditions
commensurate
with earlier applications,
optimum
thermal
design of the containment
device is given parametrically.
Examples
for typical designs are
given to illustrate
use of these data. The intent of this study is to present sufficient
data
to allow the thermal designer to "short cut" time consuming
analyses by either using the
given numerical
model and altering it to suit his application
or, where possible, by using
the parametric
data directly.
At a minimum,
these data should allow the designer to get
starting
point estimates
for his design. Section
V outlines related
topics. These topics
include data which compare
analytical
and experimental
results, discussing some of the
discrepancies
between
the two. Section V also includes
effects. Other
containment
cases not covered
by the
also given
in Section
schemes
examples
for estimating
convective
used in Section IV are
V.
The reader should keep in mind that the treatment

of phase change devices given
in this document
is limited to thermal
aspects. As such, other topics of importance
such
as structural
and material
designs
and selection
are not addressed.
Also, specialized
subject
matter
such
as
the
kinetics
of
the
phase
change
process
and
chemical
phenomenon(e.g., supercooling,incongruentmelting,and dendrite formation) are not

discussed.Although convectionanalysisis discussed,
detailsof convectionstimulii suchas
buoyancyand surfacetensionforcesareignored.The readeris referredto surveyreports
by Grodzka[3,41 and a text by Chahners[5] for informationin theseareas.Dueto the
large nulnber of possibledesignconfigurations,this report addresses
only typical and
simplifiedschemes.
II.
PROPERTY
DATA
In several space-related
applications
of phase change devices, a paraffin
has served
as the PCM. Major emphasis
in this section
is given to those properties
which are
typically
needed
in a thermal
design
of selected
paraffins.
These include
the melting
temperature,
transition
temperature,
heat of fusion,
heat of transition,
specific heat,
density, thermal conductivity,
viscosity, and coefficient
of volume expansion.
property
specified.
Since hydrocarbon
properties
are dependent
on purity,
differences
in reported
values may be directly
related
to differences
in purity,
a quantity
often not
Although
this section is devoted to properties
of paraffins,
some of the properties
of certain
nonparaffins
are presented
in Appendix
A. These have been extracted
from
several different
references,
and, in some cases, some paraffins
and paraffin mixtures
are
included there also.
It is understood
aliphatic
hydrocarbons
principally
(CI_Ha4)
temperature
that
of
the
the
term
paraffin
methane
generally
series
denotes
CnH2n+2.
limited,
however,
to those members
of the family lying
and n-Triacontane
(C3oH_2)
because
the corresponding
has included that of previously
considered
applications.
A.
Sources, Availability,
and Estimated
any
Property
of the
data
between
rmlge
saturated
herein
are
n-Undecane
on melting
Cost of Selected Paraffins
Table
1, which is based on a reported
survey [6], shows a limited selection
of
companies
and laboratories
capable
of supplying
several selected paraffins
in quantities
adequate
to be used in phase change devices.
Also, the availability
of Sunoco
P-1 16
paraffin
paraffin
wax from the Sun Oil Co., C_4-C16

paraffin
mixture
from Enjay is noted in Reference
1.
Information
the suppliers
listed
products.
relative
to type, grade,
m Table
1 is outlined
from
Conoco,
and physical property

in Table 2 based on
and
a C_s-C,6
data availability
from
a review [6] of their
TABLE 1. POTENTIALSUPPLIERS
OF SELECTEDPARAFFINSa
Company
Address
AmericanPetroleumInstitute
StandardReferenceMaterials
Carnegie-Mellon
University
SchenleyPark
Pittsburgh,Pennsylvania15213
Aldrich ChemicalCo.,Inc.
940WestSaintPattiAvenue
Milwaukee,Wisconsin53233
AnalabsInc.
80 RepublicDrive
North Haven,Connecticut 06473
ChemicalSampleCo.
4692 KennyRoad
Columbus,Ohio 43221
Eastman(Kodak)Organic
Chemicals
2400Mt. ReadBoulevard
Rochester,NewYork 14650
Gallard-Schlesinger
Chemical
ManufacturingCorp.
584MineolaAvenue
CarlePlace,NewYork 11514
The HumphreyChemicalCo.
DevineStreet
North Haven,Connecticut 06473
LachatChemicalsInc.
20200AshlandAvenue
ChicagoHeights,Illinois 60411
PhillipsPetroleumCo.
Bartlesville,Oklahoma 74004
Polysciences
Inc.
PaulValley IndustrialPark
Warrington,Pennsylvania18976
a. FromTable9 of Reference6.
The cost of paraffinsis influenced significantly by purity, and it also varies
considerablywith source.The ultrahighpurity standardreferencematerialsavailablefrom
the American PetroleumInstitute (API) cost $95 for a 5 ml unit [6]. Someprice
estimatesfor two gradesof severalparaffinsare givenin Table3. All but the last three
entriesin Table3 correspondto pricesfor relativelysmallquantitiesof reasonablyhigh
purity paraffins, probably made available for laboratory rather than large-scale
commercialpurposes.The last three entriesdenote someparaffinmixtureswhich can be
obtainedin largequantities.
..0
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._
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<
-_
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r._
"tJ
1
<
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a.
TABLE
3.
SOME APPROXIMATE
PRICE
DATA
FOR
Approximate
Unit Cost
SELECTED
PARAFFINS
($/lb)
Quantity
kg (lb)
99
95
26.46 (12.00)
14.29 (6.48)
2.72 (6)
2.72 (6)
6
6
CloH22
C10H22
99
95
16.26 (7.38)
12.87 (5.84)
2.77 (6.1)
2.77 (6.1)
6
6
n-Undecane
n-Undecane
C11H24
CI 1H24
99
95
23.47 (10.65)
14.21 (6.44)
2.81 (6.2)
2.81 (6.2)
6
6
n-Dodecane
n-Dodecane
C12H26
C12H26
99
95
16.45 (7.46)
12.65 (5.74)
2.86 (6,3)
2.81 (6.2)
6
6
n-Tridecane
n-Tridecane
C13H28
Ct3H2s
99
95
34.99
22.29
2.86 (6.3)
2.86 (6.3)
6
6
n-Tetradecane
n-Tetradecane
C_4H3o
Cl4H3o
99
95
18.95 (8.59)
15.62 (7.09)
2.90 (6.4)
2.90 (6.4)
n-Pentadecane
n-Pentadecane
Cl 5H32
C1 sH32
99
95
41.34
30.13
(18.75)
(13.67)
2.90 (6.4)
0.68 (1.5)
6
6
n-Hexadecane
n-Hexadecane
El 6H34
35.27
20.08
(16.00)
0.68
CI 6H34
99
95
(9.11)
(1.5)
2.90 (6.4)
6
6
n-Heptadecane
n-Heptadecane
CI 7H36
CI 7H36
99
95
37.89
30.13
(17,19)
(13.67)
2.90 (6.4)
0.68 (1.5)
6
6
n-Octadecane
n-Octadecane
CIsH38
CI 8H3 s
99
95
18.65 (8.46)
30.13 (13,67)
2.95 (6,5)
0.68 (1,5)
6
6
n-Nonodecane
n-Nonodecane
C19H40
Ct 9H40
99
95
40.70
27.93
(18.46)
(12,67)
2.95 (6.5)
0.68 (1.5)
6
6
n-Eicosane
n-Eicosane
C20H42
C20H42
99
95
26.05
41.15
(11.82)
(18.67)
2.99
0.68
6
6
Formula
Purity
(percent)
n-Nonane
n-Nonane
C9 H20
C9 H20
n-Decane
n-Decane
Material
Po 116 Paraffin
mixture
Paraffin
I
a.
(15.87)
(10.11)
(6.6)
(1.5)
Reference
Not specified
0. 11 (0.05)
4536
0.11
Not specified
I
0.14
C_ 5-C16 Paraffin
Cl 4-C16
$/kg
(0.065)
(0.05)
(10,000)
Prices shown are approximate

based on 1974 publications.
All but the last three
entries shown in the table correspond
to prices quoted for the small quantities
indicated
which, more than likely, are for laboratory
applications
and are not
totally indicative
for large commercial
orders.
Also, it should be noted that
there is also variation in prices with supplier.
B.
Table
temperatures
4 contains
for the listed
Melting and Transition Temperatures

published
paraffins.
[7,8]
values
of
the
melting
and
transition
For
commercial
grades
of paraffins,
some
variations
in the phase
change
temperatur.es
are to be expected.
Impurities
even tend to cause some difference
in the
melting and freezing
temperatures.
Some reported
[6] experimental
results which show
the effect
of purity on the fusion temperature
for several grades of certain
paraffins
supplied by two manufacturers
are given in the lower two segments
of Table 5 together
with the corresponding
fusion temperature
for the high purity paraffins
available
from
API. Similar
Table 6.
results
and API data
for solid-solid
phase
transition
temperatures
are given in
For the seven paraffins

listed in Tables 5 and 6, correlations
of phase change
temperatures
corresponding
to API data with the number
of carbon atoms in the chain
are shown in Figure 3.
C.
Heat of Fusion and Heat of Transition
The
energy
values
associated
with
solid-liquid
and solid-solid
transitions
as
published
by API [71 or either by Timmermans
[8] are also listed in Table 4. The
effects of purity on these energy values based on comparisons
between measurements
[6]
on two commercial
grades (lower two segments
of Tables 7 and 8) and values reported
by the API for high purity paraffins are listed in Tables 7 and 8, respectively,
for several
paraffins.
For the seven paraffins listed in Tables 7 and 8, correlations
of the heat of fusion
and the heat of transition
with the number
of carbon atoms in the chain are shown in
Figures 4 and 5, respectively,
for the data available from API.
It is interesting
the heats
of fusion
hexadecane-octadecane
to note also the effect of the mixing of two different

and transition.
As an example,
the results
reported
binary system are shown in Figure 6.
D.
specific
between
data
C16H34,
10
Specific Heat
The specific
heat is temperature
dependent
in each phase with an increase
in
heat occurring
with an increase in temperature.
There is a change in specific heat
two phases. Data for all the paraffins
listed in Table 4 have not been obtained.
For some of the listed paraffins,

in Reference
8. These have been
the
paraffins
on
[6]
for a
in the
C 1 sH38,
specific heat data over a range of temperature

are given
plotted in Figures 7, 8, and 9. There are obvious gaps in
vicinity of phase transitions.

Data
arid C2oH42 are shown in Figures
given in Reference
9 for
10 through
13, respectively.
Ct4Hao
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100
30
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tk
60
,a
o
ui
ne
o
cc
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<[
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kiJ
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w
I,Z
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15
CARBON
Figure
3.
Correlation
of phase
in the
14
change
chain (from
ATOMS
I
20
IN CHAIN
temperature
with number
Fig. 1 of Reference
6).
oi" carbon
atoms
TABLE 7. COMPARISON
OF HEAT OF FUSIONFOR SEVERAL
GRADESOF SELECTEDPARAFFINS
Material
Heating
(Solid -+ Liquid)
kJ/kg (Btu/lb)
Cooling
(Liquid _ Solid)
kJ/kg (Btu/lb)
Purity
(Mole %)
or Grade
n-Undecane
142 (61.2)
142 (61.2)
99.96
0.03
n-Dodecane
216 (93.2)
216 (93.2)
99.969
+ 0.025
n-Tridecane
154 (66,5)
154 (66.5)
99,91
+0.06
n-Hexadecane
235 (101.5)
235 (101.5)
99.90
+ 0,06
n-Octadecane
244 (105.0)
244 (105.0)
99.90
+ 0.08
n-Nonadecane
187 (80.6)
187 (80.6)
99.90
+ 0.08
n-Eicosane
248 (107.0)
248 (107.0)
99,90
+ 0.08
n-Undecane
140 (60.4)
143 (61.7)
99
n-Dodecane
218 (94.0)
220 (94.9)
99
n-Tridecane
145 (62.5)
159 (68.5)
99
n-Hexadecane
237 (102.0)
235 (101,5)
99
n-Octadecane
248 (107.0)
245 (105.6)
99
n-Nonadecane
180 (77.5)
180(77.5)
99
n-Eicosane
249 (107.5)
245 (105.5)
99
n-Undecane
142 ( 61.4)
141 (61.0)
99.75
n-Dodecane
218 (94.0)
212 (91.5)
99
n-Tridecane
154 (66.2)
150 (64.8)
99
n-Hexadecane
239 (103.0)
235 (101.5)
99
n-Hexadecane
244 (105.0)
237 (102.0)
95
n-Octadecane
243 (104.6)
242 (104.5)
95
n-Nonadecane
182 (78.3)
179 (77.2)
95
n-Eicosane
255 (llO.O)
243 (104.8)
95
n-Eicosane
241 (104.0)
234 (101.0)
90
* Supplier
** Supplier
*** Supplier
A
B
C
15
TABLE 8. COMPARISON
OF HEATOF TRANSITIONFORSEVERALGRADESOF
SELECTEDPARAFFINS
Material
Heating
(Solid_ Solid)
kJ/kg(Btu/lb)
Cooling
(Solid_ Solid)
kJ/kg (Btu/lb)
n-Undecane
n-Tridecane
n-Nonadecane
n-Undecane
n-Tridecane
n-Nonadecane
n-Undecane
n-Tridecane
n-Nonadecane
439(18.9)
416(17.9)
514(22.2)
409(17.6)
433 (18.7)
513(22.1)
403 (17.4)
403 (17.4)
495 (21.4)
439(18.9)
416(17.9)
514(22.2)
405(17.4)
470(20.3)
516(22.3)
422(18.2)
406 (17.5)
499 (21.5)
Purity
(Mole %)
or Gra't e
99.96 0.03
"_
99.91 0.06
99.90 0.08
._ *
99
99
99
_**
99.75
99
95
TM
_***
* SupplierA
** SupplierB
*** Supplier
110
24O
100
SOLID
LIQUID
PHASE
CHANGE
.,_,o"J
IN
o/
m :b
ar
7O
1SO
eO
10
15
CARBON
Figure
16
4.
ATOMS
IN CHAIN
Correlation
of heat of fusion with number
chain [from Fig. 5(a) of Reference
of carbon
6].
atoms
in the
SOLID
i
+i
5O
A
t<
uJ
T
40
16
I
10
i
15
I&l
i
2O
CARBON ATOMS IN CHAIN
Figure
5.
Correlation
of heat or transition
with number of carbon
chain [from Fig. 5(b) of Reference 6].
atoms
in the
120
100
80
tlh
100
40
IAI
Z
w
Z
20
5O
SOLID
SOLID
PHASE
CHANGE
_O
!
_O'*
!
C16H34
HEXADECANE
Figure
WEIGHT
PERCENT
OCTADECANE
e
80
0
100
C18H38
OCTADECANE
6. Example illustrating effect of composition

of heats of phase change
hexadecane-octadecane
binary system (from Fig. 29 of Reference 6).
for
17
_RATURli.
-1M
2.11-
-40
i
--70
-00
-li0
-.40
UP
--30
-110
oF
-18
10
30
40
UO
11
N
0.41
_'.0
OJ
Cll HM
OA
1.S
0,,41
1.0
O.2
O.6
8QLOD--4OLm -o.
I_AN0rnoN
ke- SOLID--LIQUID
!
TRANSITION
I
I
- 0.1
J
0.S
c_m
u.
0.4
as
0.3
0.2
_-" IN)LID-LIQUID
TRANSITION
0.1
0
O.7
2.6
O.ll
O.S
2.O
0.4
lJ
0.3
_-- IOLIO--LIOUID
TItANSITION
1.0
SOLID-lOUD
TRAN_TION
-e_
0.2
0.6
0.1
I
II
-70
.-oo
'7
Figure
18
7.
Spocific
-N
"
,-40
...aug
-m
-lo
,,
lo
16
TIIMPIERATUR|,
heat versus temperature for Ca l H24, Cl 2 H=_, and C| 3 H_ s

(based on data given in Reference 8).
TEMPERATURE,
--40
2.5.
-30
i
-20
-10
10
20
30
i
40
'
UF
50
60
70
80
90
100
110
i
120
0.5
2.0
I
C14 H30
0.4
1.5
0.3
1.0
0.2
0.5
I.,,t.-- SOLID-LIQUID
I
I
I
TRANSITION
0.1
0.7
0.6
2.5
(J
O
0.5
2.0
0.4
I
uJ
"I"
u.
#/,
C15 H32
SOLID-SOLID
TRANSITION
uJ
I
I
0.5
<
I
I
I"*- SOLID-LIQUID
t
1.0
0.3
D
tt
- I
0.2
TRANSITION
tu
0.1
I
l
0.6
2.5
0.5
2.0
C16
H34
0.4
1.5
0.3
1.0
.ID-LIQUID
TRANSITION
0.2
0.5
0.1
I
-30
I
-20
I
- 10
I
0
I
10
TEMPERATURE.
Figure
8.
Specific
heat versus
(based
temperature
on
data
given
I
20
I
30
I
40
45
for C14 H3 o, C_ 5'H3 2, and C_ 6 H3'4

in Reference
8).
19
SOLID--SOLID
TRANSITION
I
"-_
I
I
I
30
M- SOLID--LIQUIDTRANSITION
I
I
! i I
I
40
50
6O
70
TEMPERATURE.
Figure
9.
90
100
Comparative
examination
9 indicates that the specific
i
110
Specific heat versus temperature

(based on data given in Reference
Measurements
of specific
heat
manufacturers
are reported
by Reference
values for the same materials from API.
Table
i
8O
for C2 sHs 2
8).
for several
paraffins
6. These are tabulated
using samples
from
in Table 9 together
of data shown in Figures 7 through

13 and
heat of paraffins is sensitive to impurities.
E.
two
with
listed
in
Density
The density of the liquid phase decreases

with temperature
and data for most of
the considered
paraffins
are shown in Figure
14. The values agree with those reported
in
Reference
6. For Ct4H30,
C16H34,
CIaH3a,
and C20H42, density data are also plotted
in Figures
15 through
18, respectively,
which are from Reference
9 and which include
some solid phase density
measurements.
For these paraffins,
density changes across the
solid-liquid phase transition
ranged from 5 to 8 percent.
F.
There
is a limited
amount
Thermal Conductivity
of
thermal
conductivity
data
available
Most reported
values are only for the liquid phase. For selected paraffins
limited amount
of liquid thermal
conductivity
data, which were reported
20
for paraffins.
Table 10 lists a
in Reference
6
ql-
u
o
u;
E
0
UJ
q,
uJ
I-
[._
21
=lo'qUn;8
'J, V3H
31:1133d$
o
i
C_
c.)
<...
,11-
o
O_
.)
o
u.
o
u_
n,.
8 =
I"
<
I
I.U
_L
n..
ud
Q.
ELI
I"
uJ
I-
_o
c_
Z
_o
W"
v)
Z
,<
I-
_a
.a
I
c.)
,.J
1
O
I
m.
ol
I
o.
I
Lq
Oo'a_/_
22
'_V3H
I
o
O141O3dS
I
Lq
_30"lbl/Fq '.J.VgH 31dlOgds

O
o
0
ao
O_
E
Ia
5
o
.I
a_
..J
C/3
u_
u_
@_
do-qVm8 'lVgH
u_
31dl:3gd_
23
:lo-qlVn_ll
'IV3H
3hllODdt
Ft
0
J
0
0
.J
I.i
K.T,.
i
q
I
el
q_
3o'lhVl_
24
!
tq
'IV=IH
OtlllO]J
0 _
0
e_
i _oooo
ddodddd
__
. ___
ddddddddd
___
Z
0
u.
<
Z
0
f-
0
u_
<
r_
.,,.0,,.00..0,.0..
0000000
....
0000000
0"00000000
0
[-
o0
u_
o_
0
0
o
u.l
0000000
,,000
0000000
-+1.
o_
u4
+1
___
0
+1
+1
+1
+l
+1
___
___o
_6
el
__OZ_
o
25
TEMPERATURE,
0
78O
2O
60
100
140
180
220
F
260
300
340
380
420
460
19
77O
48
76O
47
750
74O
18
73O
46
72O
710
44
7OO
10
LEQEN.__...2O
NO.
MAT'L
REF.
Cll
H24
[7]
C12
H26
[7]
C13
H28
[7!
4
S
C14
C16
H30
H32
(7]
[7]
C16
H34
[7]
C17
Hx
[7]
II
9
10
11
C18
C19
HM
H,40
[7]
[7]
C20
H42
[7]
C21
H44
[8]
12
13
C22
C23
H46
H40
[8]
(el
14
C24
HE0
[8]
15
C26
H52
|8]
16
C20
HE4
(8]
17
C27
H56
[8]
18
C20
HSe
(el
19
C20
He0
[8]
1
670
660
66O
S40
e2o
61o
6oo
59o
58O
-20
20
4O
60
41
4O
39
37
80
100
120
TEMPERATURE,
Figure
26
14.
Liquid
phase
density
140
160
180
200
of several
paraffins.
220
240
TEMPERATURE,
50
100
150
25O
200
300
i
54
_LO
52
8OO
,S
O
REF. 9 TEST LIQUID STATE

REF. 9 TEET SOLID STATE
780
0
0
7150
o
0
0
0
0
o
0
74O
44
0
720
44
7OO
SOLtD-LIQUID
TRANSITION
O
UO
42
O
i
0
-17.8
i
26
i
60
i
75
;
100
TEMPERATURE,
Figure
15.
Density
of tetradecane
i
12S
_,Cx4H30)
(from
Fig. 4 of Reference
9).
TEMPERATURE,F
50
lUl
15g
200
2tS0
300
N
m
el
62
"%
REF. S I'EST LIQUID |TATI_ =

REF.'9 TEST SOLID STATE
_00o
in
,,,,
0
0
44
O o
SOLID--LIQUID
P_IAgE TRANSITION
44
m
0
42
-178
TEMPERATURE,C
Figure
16.
Density
of hexadecane
(Cx6H34)
(from
Fig. 5 of Reference
9).
27
YIIMlUlERATUIq|.'F
M
M
m
lag
U
NO
040
mlo
.i
Pll @.I TIIIT I.QIUIID ITAT|

lUl@. Ii TIlIIT IIOU D IrlrATIi
i m
I!l
7N
)0
_o
m
0 o
0
48
,,----
IIOLID--LIGUIO
TNA/mlTION
O
o
n
-17.11
4m
i
Nio
II
_w, enATunm."c
Figure
17.
Density
of octadecane
(Cl aHaa)
_RATUIIIE.
o
II0
1W
(from
Fig. 6 of Reference
eF
11o
NO
IO
m8
OO0_
l[
FIIEF,| TIE_r UQUIO IITATIE

IIIF. II TEIT IIOUD ITATI
m
clD o
o
o
74_
SOLID--LIQUID
_m
TRANSITION
-17.11
TIIMPERATURL
Figure
28
18.
Density
of ei_:usane
tC 2 o H4 2
(from
Fig. 7 of Reference
9).
9).
TABLE 10.
THERMAL
CONDUCTIVITY
AT PHASE
OF SELECTED
CHANGE
Material
PARAFFINS
TEMPERATURE)
(EVALUATED
W/m-C
Btu/h-ft
-F
n-Undecane
0.1496
0.0865
n-Dodecane
0.1488
0.0860
n-Tridecane
0.1496
0.0865
n-Hexadecane
0.1505
0.0870
n-Octadecane
0.1505
0.0870
0.1505
0.O87O
n-Nonadecane
n-Eicosane
a. From
Table
8 of Reference
6.
as being available
from the API. Thermal
conductivity
data which
are presented
in
Reference
9 for the liquid phase of C_4H3o,
C16H34,
ClsH3s,
and C20H42, are shown
in Figures
19 through
23. Figure
23 shows a correlation
which was extrapolated
to
obtain thermal conductivities
for C20 I-I42.
The lack of thermal
conductivity
data for the solid phase poses some analytical
uncertainties
when attempting
to analyze
the phase change process.
This concern
and
related considerations
are treated in more detail in Section V.
G.
Viscosity
Absolute
viscosity
data for liquid paraffins
C1 i H24 through
given in Reference
7, are shown plotted as a function
of temperature
H.
C20H42,
in Figure
which
24.
are
Surface Tension
Values of the surface tension for liquid paraffins C11 H24 through C2 oH42, which
are tabulated
in Reference
7, are plotted versus temperature
in Figure 25. The data varies
linearly
with temperature
with an increase
of temperature
resulting
in a decrease
of
surface tension.
I.
Coefficient
of Expansion
Single values of the coefficient

of expansion
for four of the considered
are shown in Table 11 which were reported in Reference
6 as being from API.
paraffins
29
THERMAL CONDUCTIVITY,
W/m-PC
o
!
o
I
_J
ok
-n
m
o
THERMAL CONDUCTIVITY,
3O
Btu/h-ft-F
ilo4i_nlO
'ALIAILOI'IONO0
"lVlqUlH,L
._
_.
_.
Sen
O_FilM 'A,ILIAIJ.OIfIQNO011fllqlld|l_lL
31
do'_q/mQ
"A.LIAI13(IQNOD
IVWId|H,L
O0
d
3d'WlM 'A.LIAU,3NQNO31V|iH.L
32
:lo'3yq/n;8
'AJ.IAII_)I'IQNO_)
"IVWU
:IH1
c_
_"
=.
o
_.
o
c_
E_
0
O0
o_
I<
0 0
Z
<
uJ
|uJ
IQ
1-
_o
,.J
I
0
i-
,.J
0
I
v-,
c_
6
3o'W/M
'A.LIAIJ.3rIQN03
I
o
o
8
o
"IVINti:iH1
33
THERMAL
o
CONDUCTIVITY,
W/m--C
,
I
i.
i
II
EXTRAPOLATED
THERMAL
Figure 23.
Correlation
paraffins
34
(CnH2n+2)
CONDUCTIVITY,
of thermal
(from
Btu/h4t-F
conductivity
data for normal
Fig. 16 of Reference
9 ).
fM
se-
LID
c_
c_
;>
(,4
,I-
C_
U.
O
Q
u;
I-,<
CC
UJ
G.
eL)
,q-
.,.._
"o
o
o
r_
r_
<
I--4
LT.
O--
35
;,t/Jql C01. X NOISN=I..L
:I;./V:IUI
IZ
s..
l.l
_=
!
t_
t,,,
o
""
._
q,
,
s=
O
"_J
o
o
u4
i
WIN
36
'L_OL X NOISNY.L
=lOV-iHf'lS
TABLE
11.
VOLUMETRIC
COEFFICIENT
OF EXPANSION
(60F/15.6C)
Material
1/K
1/F
n-Undecane
10.1 10 -4
5.6 10 -4
n-Dodecane
9.9 X 10 -4
5.5 X 10 -4
n-Tridecane
9.4 X 10 -4
5.2 X 10 -4
n-Eicosane
8.5 10 -4
4.7 X 10 -4
a.
From
III.
Table
18 of Reference
TWO-DIMENSIONAL
CHANGE
A.
6 .
ANALYSIS
DEVICE
OF A PHASE
Introduction
The analysis of two-dimensional

conductive
heat transfer
within a phase change
device is outlined in this section. Since convection
may be present in certain applications,
the design of a phase change
device based solely on conduction
will in most cases be
conservative
(i.e., heat transfer
rate to and from material
will be lower than in a case
where convection
is present).
Additional
attention
is given
convection
and how it can be included in the analysis.
The
homogeneous
in Section
V to the effect
two-dimensional
transient
heat
conduction
equation
for
medium in the absence of sources, sinks, or phase change is
t\_xx=- + 0y2]
at
an
of
isotropic,
(1)
-4
In general, solutions of equation

(1) for typical applications
can best be obtained
via numerical
techniques,
other techniques
were outlined
by Muehlbauer
and Sunderland
[10]. For numerical
solutions of equation
(1), the partial derivatives
are approximated
by
finite difference
analogs.
A forward
difference
analog for the time derivatives
can be
used. With regard to the latter, there are two possibilities
for a transient
problem
[ 11]. If
all temperatures
appearing
in the spatial analogs are evaluated
at the old time level, the
formulation
is explicit,
and the resulting equation
for a node involves only one unknown
at the new time level. The solution for a system of nodes by this method is fairly simple
37
and
straightforward.
the
new
time
five unknown
solving
a set
notational
If all
level,
the
temperatures
formulation
temperatures
of simultaneous
appearing
is implicit.
at the new
equations
in the
The
spatial
resulting
time level. Solution

equal to the number
analogs
equation
are
evaluated
at
a node
involves
for a system
of nodes.
of nodes
involves
surrounding
nodes,
Figure
26 represents
a general
node
(I, J),
its
scheme
for interconnecting
thermal
conductances.
for
and
the
(I,J+l)
GV(I,J+I )
(I,J)
(I--1 ,J)
(1+1,,I)
GH(I,J)
GH(I+I,J)
GVlI,J)
(I,J-1)
Figure
26.
Physical
General
arguments
can
discussed.
The
summation
should
equal
the product
temperature.
approach
is
designations
With
of
of
reference
GH(I,J)[T(I-1,J)
be
for nodes
used
to
and
formulate
connecting
the
difference
38
analogs
heat
transfer
to node
(I, J) from
all
the nodal
capacitance
and the difference
to
- T(I,J)]
Figure
26,
+ GH(I+I
the
explicit
,J)[T(I+I
formulation
,J) - T(I,J)]
C(I,J)[_
- T(I,J)]
conductances.
+ GV(I,J+I)[T(I,J+I)
- T(I,J)]
previously
surrounding
in its old
based
on
this
and
nodes
new
physical
+ GV(I,J)[T(I,J-1)
(I,J)
z_t
- T(I,J)]
(2)
The implicit
formulation
GH(1,J)
- T(I,J)!
The tildes denote
is
IT (I-1 ,J) - T' (I,J)l
+GV(I,J+I)IT
+ GH(I+I ,J)[T
(I,J+l)-
temperatures
_ (l,J)]
(I+l,J)
C(I,J)[T
(I,J)
+ GV(I,J)
IT (I,J-1)
- T0,J)]
(3)
At
at the new time level.
Numerical
solution
of the explicit formulation
a restriction
on the allowable
time step given by
At _<
- T (1,J)]
given by equation
(2) is subject
c(I,J)
GH(I,J)
+ GH(I+I,J)
For a nodal arrangement,

governs the entire solution.
+ GV(I,J)
the node
having
(4)
+ GV(I,J+I)
the
smallest
to
time
step
given
by equation
(4)
The implicit
formulation
given by equation
(3) is not restricted
by a stability
requirement,
but the solution
is not as simple as one using the explicit formula.
In
general, it requires a matrix inversion
routine
and may be impractical
for a large number
of nodes.
A technique
for handling
the phase change when using the explicit formulation
involves keeping a record of the stored energy at each PCM node. The stored energy at
any time is compared
to that associated
with the initiation
and termination
of the phase
change. When the accumulated
energy
at a node lies between
these two values, the
temperature
prediction
is overridden
and the temperature
is forced to be equal to the
phase change temperature.
The technique
for handling
the phase change when using the implicit formulation
involves comparison
of the predicted
temperature
with the phase change
temperature.
When the predicted
temperature
first exceeds
the latter value, the predicted
value is
overridden
and the nodal temperature
is specified
to be the phase change temperature.
The energy
associated
with the excess of the predicted
value over the phase change
temperature
is calculated
and allowed
to accumulate.
Once this accumulated
energy
reaches a value sufficient
to accomplish
the phase change, the predicted
temperature
is
allowed to rise in accordance
with the governing conduction
equations.
39
B.
Physical Model
The physical
model selected
for study corresponds
to a phase
change device
application
which is depicted
in Figure 27. Basically, the phase change device consists of
a metallic
housing in the shape of a parallelepiped
which is filled with PCM and straight
metallic
fins which are included
to improve
the heat transfer
mechanism
between
the
housing and the PCM.
,,/
-,
j',(
.j
x
/"
._
"
1
x
_ !
_ " ' 'I
"
_,(
I
"
i!
,
"
x.
,,
_.
''
.x
,/
"_
"
___
PHASE CHANGE
MATERIAL (PCM)
_/--
BASE
(,
(
"
I
HEAT FLUX
Figure
27.
Phase change
device application
selected
for study.
When the phase change device is operating

as an energy sink (i.e., it is storing
energy),
either
a hot fluid or a hot surface is considered
to be in contact
with one
surface
of the housing resulting
in heat transfer
into the unit. Hereafter,
this surface
which is in contact
with the hot medium is referred
to as the base. The PCM is used to
absorb the energy primarily
via the phase change process. The stored energy may be later
rejected
by means of exposing
the base or the cover or both to a cooler medium, which
in some applications
may be the same medium
from which the energy was absorbed
earlier.
A typical single cell of the device is shown in Figure 28. It is assumed that planes
parallel to the fins and passing through
their centers represent
planes of symmetry
as do
planes parallel to the fins and located midway between two adjacent fins. Consequently,
the analysis is reduced
to that of a half-cell represented
by the schematic given in Figure
29.
4O
___OF
SYMMETRY
F
COVER
I
!PCM
S1
,_
Figure
The
Figure
29
program
following
with
is also
The
the
28.
thermal
base
modified
limitations
for the
of the
in Section
case
analysis
the
pertains
are given
change
device.
to
the
symmetrical
heat
flux
density.
of a constant
only
cell of phase
to a constant
is
two-dimensional
be composed
single
analysis
exposed
Conduction
Typical
BASE
base
by
the
heat
The
half-cell
shown
resulting
computer
in
temperature.
following
transfer
assumptions:
mechanism
within
the
half-cel!;
the overall
phase
change
device
is considered
to
of many
such cells. (The effects
of convection
are discussed
V).
The
that
problem
is two-dimensional;
end effects
are small.
The
cover
is perfectly
the
cell,
therefore,
is sufficiently
long
insulated.
41
I$
--_---- W
2
I-i
$1
Figure
29.
Symmetrical
half-cell
used in analysis.
The physical properties,

density, specific heat, and thermal conductivity
of
the metallic fin, cell base, and cell cover are considered
to be identical and
to have constant
values. Likewise,
the density,
specific heat, and thermal
conductivity
be identical
modified
To
cast
the
of the solid and liquid

and to have constant
to input
problem
temperature
phases of the
values. (The
variant
in a nondimensional
PCM are considered

to
model
may be easily
properties.)
formulation,
appropriate
dimensionless
parameters
are sought.
As a means of obtaining
the pertinent
dimensionless
parameters,
differential
equations
for the temperature
in the PCM, the fin, the base, and the cover are
presented
and nondimensionalized.
The differential
analysis is followed by a numerical
analysis which is used for the solutions,
the results of which are presented
in Section IV.
42
C.
Differential
Formulation
Since the principal

objective
of the differential
formulation
is to find the
appropriate
dimensionless
parameters
for the physical
model previously
described,
the
reader interested
only in using the results can go directly
to the next section
on the
numerical analysis.
The
differential
equations
pertinent
to each
region
of
the
model
are presented
below.
1.
conduction
PCM Region.
equation
_2T
ax 2
and the
[12] is
a2T
_)y2
The
energy
differential
equation
is the
usual
two-dimensional
1 OT
(5)
o_ Ot
two-dimensional
interfacial
boundary
_XX ]
condition
according
to Rathjen
and
Jiji
(6)
k
where
_--_)S
6(x,t)
-(_y)t
is the interfacial
location
or fusion
f_-Iy
front.
=_
Choosing
the width
W of the PCM
region shown in the symmetrical

half-cell in Figure 29 as the characteristic
x-dimension,
the PCM height H as the characteristic
y-dimension,
the PCM fusion temperature
Tf as the
characteristic
dimensionless
--
temperature,
quantities:
x = x/W
= y/H
and denoting
a characteristic
time by tc result
in the following
(7)
(8)
0 _
T/Tf
(9)
t' -
t/t c
(10)
43
In termsof these,equation(5) canbe written as

2a20__+
ax '2
and equation
(11)
ay '2
a tc
at'
(6) becomes
(12)
\ay
2.
Is
Fin.
T m = Tm(Y,t),
to
the
problem,
results
with
the
the
\ax'
temperature
conductive
of
heat
convective
OtCp Tft c k_ v']
distribution
transfer
heat
from
transfer
in the
fin as one-dimensional,
the fin to the PCM, which
in the
conventional
aT
km
coordinate
equation
(13) results
fin at x = 0, however,
is analogous
one-dimensional
Pm Cpm
O,y
system
aT m
km
fin
is given
in
(13)
at
Figure
30. The
second
term. on
from considering
conduction
in the PCM. The
is the same as that in the PCM at x = 0.
-_- S2
//
,//
/
//
.-
//
y
,//
V/////,""
Figure
44
i.e.,
in
aY 2
Treating
treatment
a2Tm
where
(_-7"y,
30. Coordinate
system
and dimensions
for fin.
the
temperature
left
in
in the
Nondimensionalization
of
equation
(13)
using equations
(7) through
(10)results
k {.2 hO
+ 2 km \S2Wj\Ox
3.
assuming
equation:
Cell Base.
the
_1"
base
Treating
and
fin
+km-_-
(14)
]O,y
the
in
cell
properties
base
to
\--a_y ] 0,0
be
as a lumped
the
+ kW
same
x,0
system,
result
i.e., T b = Tb(t),
in the
= Om
Cpm
S1
following
and
energy
dt
(15)
where it has been assumed that the base is exposed

to a constant
heat flux density,
_1".
The coordinate
system and physical dimensions
for the cell base are given in Figure 31.
The subscripts
x,0 on the third term on the left side of equation
(15) denote evaluation
at 0.5 S2 _< x _< W and y = O. In terms of the previously
defined dimensionless
variables,
equation
(15) becomes
_I"H
(I`$21
kT"--'-f
2W]
+ km
k
S2
/80m_ ]0,0 "(_"07_
2-W\-_y'
\_Y'}x',0 -Sl(
HI+
S .)H
2 ('_)
km (_m)
ot d0
b
(]_'_c)
dr'
(16)
In equations
(15) and (16) the overbar
spatially averaged over the x-length W.
Figure
31.
Coordinate
on the third term
system
o,
and dimensions
the left side denotes
a value
for base.
45
4.
cell
base
Cell Cover. Since the treatment

except
for the assumption
that
parameters
should
appear;
therefore,
of the cell cover is al_alogous to that of the

the cover is insulated,
no new dimensionless
the appropriate
equation
To this point the dimensionless

equations
contain
By selecting this characteristic
time to be given by
is omitted
a undefined
for brevity.
reference
time,
t c.
H 2
tc -
the
ratio
(17)
H2/O_tc becomes
reduced
set
of
equations
problem.
Summarizing
these
Geometric:
1.0 in equations
reveals
ratios
seven
(11),
salient
by category,
(12),
(14),
and (16).
dimensionless
with pure constants
ratios
Examination
for
omitted,
this
of the
class
of
yields
R 1 = H/W
R 2 = H/S 1
R 3 = W/S 2
k m
Material
Properties:
R4 -
R 5 = O_m/O_
hf
R6 Cp Tf
qtr
Thermal
Loading:
R7 k Tf
These ratios developed

with the differential
equation
formulation
of the problem are also
appropriate
for the finite difference
formulation.
Hence, the finite difference
equations
are cast in dimensionless
form with the seven aforementioned
dimensionless
parameters
appearing explicitly
and serving as focal points for a parametric
numerical
study.
46
D.
interest
Finite Difference
The finite difference

formulation
into a network
of nodal points.
Formulation
begins
For the
with a subdivision
of the region of
two-dimensional,
symmetrical
half-cell
shown in Figure 29, the nodal network

and nodal point designation
scheme are shown in
Figure 32. The approach
provides flexibility
for increasing
or decreasing
the number
of
PCM nodes in accordance
with the dictates
of size and shape, there being M by N PCM
nodes. Also note that all base nodes correspond
to J = 1 and all fin nodes correspond
to
I= 1. The number
of base or fin nodes is, of course,
directly
related
to the PCM
subdivision.
Figure
26 depicts
a general node (I,J), its four
notational
scheme for interconnecting
thermal conductances.
X
JIN+2
-I.I.
surrounding
COVER
I.I.
nodes,
and
the
Sl
J=N+I -
FIN
L
J'1
$1
t
Figure 32.
Nodal
grid designation.
Physical
arguments
can be used to formulate
the temperature
finite difference
equations.
With reference
to Figure
26 the net heat transfer
to node ([,l) from its
surrounding
nodes (during
time At) should
equal the product
of the nodal thermal
capacitance
and the temperiature
difference
occurring
during
the time increment.
The
explicit formulation
based on this approach in nondimensional
form is
47
GH'(I,J)
[0(I-1,J)-0(I,J)l
- 0(l,J)l
+ GV'(I,J+I)
+ GH'(I+I,J)
[0(I,J+l)-
[0(l+l,J)-0(l,J)l
C'(l,J)
0(I,J)]
formulation
[0(l,J-1)
[0"(l,J) - 0(I,J)l
(18)
R12
The implicit
+ GV'(I,J)
M2
At'
is
GH'(I,J)
[O(I-1,J)-
0'(l,J)]
- 0'(I,J)l
+ GV'(I,J+I)
+ GH'(I+I,J)
[O(I+l,J)-O(I,J)]
C'(I,J)
[ff(I,J+l)
+ GV'(I,J)
tO(I,J)
- 0(1,J)]
-0'(I,J)]
RI2
[0"(l,J-l)
(19)
M2 At'
In the nondimensionalization
of all thermal
conductances,
the nondimensional
value is
obtained
by dividing the respective
conductance
by kB which is the conductance
between
two general
PCM nodes.
Similarly,
nondimensional
thermal
capacitance
values are
obtained
by dividing the respective
dimensional
value by pS2Bcp which is the thermal
capacitance
of a general
PCM node.
It should
be noted
that
the nondimensional
conductances
and capacitances
that are entirely within the PCM have the numerical
value
of 1.0. All other dimensionless
conductances
and capacitances
have values other than
unity. As an example,
the dimensionless
horizontal
conductance
between the fin and the
lower left hand corner PCM node is
2
GH'(2,2)
(20)
1+_
2 R 3 R4
A dimensionless
C'(2, l) -
base nodal
M RIR4
R2 Rs
capacitance,
for example,
is
(21)
1. Computer
Programs.
Numerical
solutions
of the problem
described
herein via
computers
can be affected
by use of either the explicit formulation
given by equation
(18) or the implicit
formulation
given by equation
(19). The two general
approaches
together
with the inherent
advantages
and disadvantages
related to each are discussed in
48
the generalheat transferliterature;see,for example,Chapman[11] or Ozisik [13]. It is

well establishedthat solution of the explicitly formulatedsetof equationsis subjectto a
stability restriction which dictates the maximum allowable time increment. This
restriction is given by equation (4). For a small grid size, this requirementleadsto
excessivecomputertime.Whilesolutionsof the implicitly formulatedset of equationsis
not restrictedby a stability requirement,the method fnvolvesthe solution of a set of
simultaneousequationsequalin numberto the numberof nodes.For a smallgrid size,
largecomputerstorageis needed.
The problem
under
consideration
involves thin metallic
fins; most attention,
consequently,
has been given to the implicit approach.
The stability
restriction
dictated
by a node located in the fin resulted
in extremely
small time increments
for the explicit
approach.
A computer
program
based on the implicit
approach,
equation
(19), for the
problem described
in this section is given in Table 12. A modification
of the program to
accommodate
a sudden
change
in the base temperature
rather
than imposition
of a
constant
heat flux density
is given in Table 13. |n both programs,
a band algorithm
technique
given by Funderlic
[14]
is used to solve the equations.
A dimensional
computer
program
based on the explicit approach
is presented
and briefly discussed
in
Appendix
D.
2.
Instructions
for Using Computer
Programs.
To use the programs,
the following
steps are suggested:

a. Establish
the grid size (see Fig. 32) by specifying
M and N. M represents
the
number
of vertical columns and N represents
the number
of horizontal
rows within the
PCM. The ratio of N to M must equal R_. The accuracy of the transient
results may be
affected
by the choice of M and N, particularly
in the early part
user should conduct
a sensitivity
study by altering M and N along
of the transient.
The
with DT (Step f) in a
systematic
manner until the results appear to be unaltered
to within an acceptable
level
by further changes. The influence
of the choice of M and N is discussed and illustrated
in
Section IV along with discussion of the parametric
study.
defined
constant
needed.
b. Determine
appropriate
values for the dimensionless
ratios R1 through
R7 as
in the analysis. Note that Rv is denoted
as R 8 in the program.
Also, for the
temperature
case Rv is not.needed,
but a temperature
difference
(DELT)
is
This difference
is defined by
DELT
TB
= _
- 1
TF
c. The dimension
N as indicated
below.
card must
be set correctly.
The
dimensions
depend
on M and
A(LL,L1)
TI(MI,N2)
49
T2(LL)
GH(M2,N2)
GV(M1,N2)
C(M1,N2)
F(LL)
TEXC(LL)
D(LL)
MELT(LL)
where
LL = (N2) (M1)
LI = (2) X (M1 + 1)
M1 =M+I
M2 = M+2
N2 = N+2
d. Input required parametersin accordancewith Formats998 and 999. The
requiredinputs are shown by the Read statements.NR is reservedfor a referencerun
number.
e. The programis written with the initial PCMtemperatureat Tf. If it is desired
to run for other valuesof initial temperature,setTIN by
TIN = Tinitial/Tf
f. Selecta nondimensionaltime set by specifyingDT. It is suggested
that the
magnitudeof this time incrementbe exploredfor its influenceon the accuracyof the
results.Note the discussiongivenin Stepa also.
g. Set ITT. This quantity controlsthe printout of results.The programis written
to yield output at the endof the first time incrementandthen on intervalsgivenby
(ITT-1) (DT)
50
The output includes

TIME
Nondimensional
time measuredfromstartof melting
TRISE
- (TBase- Tf)/Tf
UCOEF
- Nondimensional
absolute
(use
temperatures)
overall heat
transfer
coefficient
defined
by
R7
UCOEF
TBase - Tf
FMELT
- Fraction
of PCM melted
SQF
- Energy
stored
in fin
SQB
- Energy
stored
in base
SQT
- Energy
stored
in top
SQS
_ Energy
stored
ill solid
Energy
stored
in liquid
SQL
QLAT
.... Energy
QTOT
- Summation
used to change
EIN
- Total
RATIO
- QTOT/EIN
at given time (or solidified
for freeze
phase
of SQF, SQB, SQT, SQS, SQL and QLAT
energy
transferred
into base which
- check on energy
is dependent
on q" and
time
balance.
All the energy values which were listed are nondimensional

and evaluated
initial values of zero. The energy value used in the nondimensionalization
energy
case)
with respect to
is the latent
for a single PCM node.
The programs
given in Tables 12 and 13 can be altered slightly to accommodate
freezing for the case of a constant
heat flux density withdrawal
at the base and a step
reduction
in the base temperature,
respectively.
The changes needed to accomplish
this
are:
a.
In the parameters
b.
In
statements
the
third,
at the beginning,
second,
and
first
replace
lines
QLATM
above
by -QLATM.
statement
150,
change
the
to
51
TABLE
1 2.
COMPUTER
PROGRAM
HEAT
_m
C
C
*_
m,m
tO
20
52
BASE
EXPOSED
TO
A CONSTANT
DENSITY
CONSTANT
HEAT
RATE
BROQRAM
DIMENSION
A(i26a7)_
Ti{3s_2;s
T2(i26)J
3H(_a_2)a
QV3
is_2l_C(3_2)a
_1%26)_
TEXC(%26}_
D(i26)a
qEkTl%26)
IMPLICIT
REAL_BI&-H_O-Z}
R5
(K/OEN_CP)/(<w/_ENW_CPw)
_***mm_m,m,m
FOR
FLUX
_m__
REAO(5_998)
Ri_R2_3_R_RS_R6_R8
READ(5_9991
NR_N_4
COMPUTATIONAL
_ARA_ETERS
_*_
TIN'%,O
DTO'O005
ITT-Ni
CW 1.0
TMELT
%*0
ITTT
" 1
TPHASE
R6
AN N
AM M
QLATM AMMAN
AM_ AM + %*0
M_
M+i
NIBN+_
N2N2
LL=N_*MI
L_ 2*MI
+ i
k M2
CD = (Ri_2)_(AMm_2)
INITIAL
VALUES
_QS " 0.0
SQF " 0'0
SQB 0'0
SQT=o*o
5QL 0'0
QLAT
0'0
EBOT=o*o
TTCB=O,O
MM 0
TBOT 0*0
TIME
0'0
O0 iO I I_LL
F(I}
i*O
MELT(I}-O
TEXC(I}
0.0
90 20 jmi_N2
DO 20 I %_M1
Ti(I_J)
TIN
R6
HMELTiCPW_THELT
TABLE
12.
(Continued);
C
**_*_
HORIZONTAL
CO_DQCTaNCEB_VERTICAL
C
aCAPAClTANCES
_
_
ARE CALCULATEO
*_*_***
5V(%ai)
0,0
DO 30 d=2aNi
O0 30 I=2s_i
GH(I_J)
= %'0
C(IaJ)
" 1,O
30
_0
50
CONOOCTANCE8
GV(I_J)
" %'0
O0 _0 j 2_N1
C(laJ)
(R_AM}/(2,0_R5_R3}
GViisJ)
= (AH*R_I/(2,0*R3)
QH(2Jj)
- 2'0/($'0
A(I/(2'O*R3*R_))
GH(M2sj)RO,O
GH(i_J)
" 0,0
DO 50 I 2sM1
Cila$)
(A_Ri_R_)/iR2_R5)
C(laN2)'C(lai}
GV(II2)
- 2,01(%,0
+ (Ri*AM/(R2_R_))i
QV(IJN2I-GVII_2)
_VtI_i)
= 0,0
GH{I_N2}-GH(I_%)
GHII_i)
= 0,0
QM(IsN2)IOoO
_Hi_2;llmO,O
GH(2_I)
2,0_R_/((R2/Ri)_(i'O/(2'Q*R3)
_Hi2_N2)GH(2_I)
_V(I_2!
R_/(R3_(%'O/AM
Ri/R2}}
QV(I_N2)'SV(i_2i
DO 55 I'%_i
5_ TTCB=TTCBC(I_i)
m,_,
TEMPERATURES
aT EACH NODE
*RITE(6_7500)
R$_ R2_ R3_ R_
60 TIME
= TIME
+ DT
O0 70 I i_LL
DO 70 J %_L%
70 AII_J)
=0,0
OO _0 d=2_Ni
O0 80 I %_Mi
K (J=i)*Mi
+ I
A(K_L'Mi)
GV(I_J)
A(K_L)
= -GH(I+I_J)
= _V(I_J)
I*CO))'OHII_J)
A(K_L'i)
" GH(I_J)
A(K_L+%)
= QH(II_J)
80 O(Ki
. .C(I_JI_TI(I_J)/{CD_DT)
CALCULATE)
R5_ R6_
_
RS_
%,O/aM))
QV(I_J$)=(C{I_J
N_
NR
|/lot
53
TABLE
12.
(Continued)
O0 90 X=%_M%
KmNI'Mi+|
A(|aLI
" "GH(I+IJ%)
- @H(|al)
= GV(Ia2)
I_CD)
A(IsL+i)
GH(I+I_I
)
A(IaL'i)
" GH(I_I)
A(I_L+MI)
- GV(|,2)
A(KaL)
m "GH(IaN2)
" QH{II_2)
" GV{IsN2)
" C(IoN2}/
i{OTmCO)
A(KaL-I)
- BH(IaN2)
A(K_L+I)
GH(I%J42
)
90 A(KaL=MI)
aV(l_42)
_0 110
Im%_Mi
K'I_I_MI+|
DIE)
= -C(I_i)_Tt(I_i)/(DT_CDI
- RB/(RI_A_}
liU DtK)
-C{IsN2)_TI{IaN2I/(OT_CDI
D{I}
" =C(ial}_Ti{%
_I}/{CD_OT|
- R8/(2,0_3'_1)
CALL
BANSOL(AsLL,LlsDsLL)
UO IZO I = I_LL
120
T2iI)
D(I)
C
_
QUALITY
CALCULATE)
_
O0 150 J2sNI
DO 150 I2_Mi
_'{J'I)_Mi
+ I
IFiMELT{K)oEq,i)
30 lO 150
IF(T2(KI,GT,TMELT)TEXC(K)
TEXC{K)
+ iT2(<}
- T_E_T)
IF(T2(K),_T,TMELT)F(K)
" i,O - TEXCIK_/(R6_T_E.T)_
T2
I(KITHELT
IF(TEXC(K),GE,I'P_ASE)T2{K)TMELT+TEX
C(<)'T=_ASE_F
$(K)J.O_MELT(K)'I
_50 CONTINUE
O0 160
d l_N2
t60
170
18_
%75
.54
TiiI_J)
- T2(K)
QLAT
0'0
DO i/O J 2_Ni
O0 I/O
I 2_H1
K (J'i)_Mi
+ I
QLAT
QLAT
+ { 1.0
- FiK);
IF(A6St_LATM
" Q_AT},Lr,Q,_OOi)
IF(TIME.EQ,DTIITTT
ITI'T + i
IFITIME,EQ,DT)30
T3 180
IF(ITT,NE,ITTT)ITTT
= ITTT
+ $
IF{ITT.NE,ITTT)G3
1'0 _WO
ITTT
" i
DO i75
Ii,_l
EBOT=EBOT+(C(I_i)_
(TI([_i)-TIN))
FBOT=TIh(EbOT/TTCB)
EBuT=O,O
TRISE
- TBOT
- T_ELT
QO
TO
IBO
TABLE
12.
(Continued)
UCOEF
- R8/(TBOT
- THELT)
wRITE(6sBOOO)TIM_TRIBE_UCOEF
_
ENERGY
BALANCE)
_m.
DO 200 J = 2. N1
200 SQF - SQF + (C{$.J)*(Tt(%sJ)
- TIN)/R6)
_0 2%0
I - %_M$
BQT'SQT+(C(I_N2I.(T%(IJN2)'TIN)/R6)
210 $Qd " SQB + (C(I.%)_(T%_?s%)
- TIN)/R6)
QO 220 J - 2_N%
UO 220
I - 2_M%
K = (J'i)_M%
+ I
$QS-SQB+(Cw_(T2(<)-TIN)+FiK)/R6)
220
SQL'SQL+(CW_(T2(<)-TIN)_(i,O-F(K))/R6)
QTOT
- SQF + S_B + SQS + $QL + QLAT
+S_T
EIN = (AM_m2_RI_RBIR6)_(i.O
(%.OI(2.Q*R3))),TIME
RATIO
- QTOT/EIN
FMELT-QLAT/QLATM
WRITE(6ai5OO)S_F,B_BaSQTaS_S_SQLJQLATa_TOT,EIN_RATIOn
i FMELT
$_F
" 0,0
SO_ 0'0
SQT=o,O
SQS " 0'0
SQL " 0'0
TBoT
0'0
2_U
IF(A_S(QLATM
- O_AT),QT'o*uo0%)
GO TO 60
99_ FORMAT(7FiO.5)
999 FORMAT(313)
iOOO
FQRMAT(1H
_I3sIX,NF10,5)
1500
FORMAT(iH
_tSQF
=t_FiO,5_5X_ISQB
=sFiO,5j5X_OSQT
I*FIO,5s5X_
ISQS
-_FIO,5_SX*_SQL=_sFIO,5_/_LiT
E_FIO.5_SX_QTOT
-_.FiO.5_SX_EIN
-_FiO,5_5_=_ATIO
3_F%O'5_SX_IFMELT=_
FiO'S)
2000
FORMAT(iHi)
300U
FO_MAT(tH
_ 13. Nr%0.5)
_000
FORMAT(iH
_T35_'_ORIZONTAL
CONOUCTANCE _ )
5000
FORMAT(ZH
_T35_'VERIICAL
CONOUCTANCE')
6000
FORMAT(%H
_T35_THERMAL
CAPACITANCE
_)
7OOu FORMAT(IH
)
750Q'FORMAT(iHi_Ri=_F7.3_3X_2-t,F6,%_3X_R3=_FS,i_3X
I_R_=_sF7,i_3X_R5=I_FS,$s3X_R6=_FS,3_3X_IRS=I_F6,3
2_3X_M=I_I2_3X_=_I3_3X_RuN
NO, =_I@)
BOO0
FORMAT(IHO_TIME
=_,FT,5_SX_TRISE
"_FT,5_SX_IUCOEF
I =_F10,5)
CALL EXZT
Ergo
SUBROUTINE
BANSgL(C_N_M_V_IO)
OIMENSION
CIID_MI_V(I))
IMPLICIT
REAL*B(A-H_O-Z)
L (M+i_/2
Li=L-i
=o
=_
=_
TABLE
12.
(Concluded)
00 2 IR %mLi
LRmL"
IR
DO 2 I " %sLR
O0 i
J 2_M
% CIIR_Jmt)
C(IRJJ)
NPi
N + i '= IR
MPI = M + i " I
C(NP_MP1)
0.0
Z C(IR*M)
C(NPi,Mm%)
N% " N " i
DO 9 I " i_Ni
IPIV " I
IRE " I + i
DO 3 IR " IRE eL.
IF(ABS(CIIR_i)),_E,kBs(CCIPIV,iI|)
IPIV
IR
3 CONTINUE
IFIIPIV,EQ*I;
0,0 TO 5
T = V1)
V(I)
- V(IPIV)
V(IPIV)
- T
OO 4 J isM
T (IaJ)
C(laJi
C(IPIVJJi
N C(IPIVsJ)
" T
5 V{I)
v|I)/C[I_1)
DO 6 d 2aM
6 C(IaJ}
C(I,J)/:(Is%)
OQ 8 IR - IRE_L
T C(IR8%)
V(IRi
V(IR)
" T_'V(I)
DO 7 J m 2aM
7 C(IRad"_)
C(IR_J)
= T_C(Imd|
8 C(IR*MI
0,0
IF(L*EQ'N)
BO TO 9
L m L + l
9 CONTINUE
V(N)
V(NI/C(N,,1)
JM - 2
O0 12 ICE 1_'_2
IR N " ICE
O0 %0 J =' 2*JM
IRM% " IR m I + J
10 V(IR)
- VIIR)
. :(IRaJ)_VIIRMI)
IF(JM,E@,M)
GO TO I%
JM - JM + 1
1% CONTINUE
RETURN
END
$6
O0
TO 3
TABLE
C **_
13.
COMPUTER
PROGRAM
FOR BASE
INCREASE
IN TEMPERATURE
EXPOSED
TO A STEP
CONSTANT
BASE TE_mERkTURE
PROGRAM
DIMENSION
A12_3aT),
T1(3,82),
T2(2#3),
QH(;_82)j
QV(3
1,82),
C(3,82),
F(E_3},
TEXC(2_3),
D(2_3),
ME_T(2_3)
IMPLIC|T
REAL*8(A=H*O-Z)
C _*
C
R5 =
_**_,_
(K/OEN_CP)/(<_/DENW_CP_)
C _*
READ(5,_98)
RI_R2,
R3*R_*RS*Rb,DELT
READ(5,999)
NR,M_N
COMPUTATIONAL
PAqkMETERS
_*_
J R6
"
HMELT/CPW_TMELT
OT 0.00050
ITT6
C_ 1,0
TMELT = l*O
ITTT
1
TPHASE R6
AN N
AM M
@LATM
_M*AN
M_ m
M+_
M_ M_
N_mNel
N2N+_
C *_*
10
20
k = M2
CD (Ri**2I*(AM*_E)
INITIAL
VALUES
_QS 0.0
SQF 0,0
SQQ 0'0
SQTo'O
SQL 0'0
QLAT
O'O
EBOTo,
0
TTCBO'O
TBOT 0'0
TIME
0,0
QTOT1
0'0
O0 10
I taLL
F(I)
1'0
MELT(I)O
TEXC(II
0,0
DO _0 IiaM1
TI(I*t)mTINDE6T
_0 _0 JB_aN_
TIII_JI
TIN
57
TABLE
13.
(Continued)
C
_*_
HORIZONTAL
CON3JCTA.wCESaVERT|CAL
C
_CAPACITANCES
*_
C _*
ARE CALCULATED
_*_
_V{i_i)
= 0.0
00 30 J=2JN%
oO 30 %mZiM%
OH(I_J)
i=O
C(IJJ)
l*O
30 QV(IJJ)
I*O
O0 _0 d 2aN%
C(isJ)
(R_*AMI/(2,O_R5mR3)
GV(iaJI
(AM*RW)/(2'omR3)
GH(2aJ)
2.0/(%,0
_ AM/{2'O_R3_Rw)}
GHIM2_J)O=O
_0 GM(laJ)
0.0
DO 50 I 2sMi
C(I_N2IC(IJil
QV(la2)
2,01(%,0
QV(IaNEIGV(Is8)
GV(Ia$)
0,0
5u
GHIIsN2ImGH{I_%
_H(%_1]
0,0
GH(%_N_)O.O
GHi2_%)
58
(Ri_A_/(R2"R_))}
_,O_R_/((R_/R_)_(I'O/(_'O_R3}
GVii;2I
R$1(R3_(i,OIAM
GV(i_N2)GV(I;2)
CO4DU:TANCES
i =OI&MII
Ri/R2))
Cti_N2)=C(%_%}
_O 55 I'%_M_
55 TTCB=TTCB+C{I_%)
_
TEMPERATURES
_T EACH NODE CALCULATE)
e_
wRITE
(6_7250)
N_
wRITE(6*?500)
R%_ R2_ R3_ R_
R5*
R6_ DELT_
60 T|_E
= TIME
+ DT
00 70 I I_LL
O0 70 J = i_Li
70 A(I+J)
=0,0
O0 80 J2_Ni
O0 80 I i_M%
K (J'2)_Mi
+ I
IF
(J'NE_)
QO TO 75
O(K)
C(Z_J)_Ti(I_J)/ICo*DT]-QV(I_J)_T%(I_J=%)
QO TO 7_
75 D(K) "C(I_J)
_ Ti{I_J)/(CDeDT)
ALK_L'M%)
_Vll_J}
79
AiK_L+_I)
- GV(I,Jl)
_*
TABLE
_{_aLl
-GfflI+ImJl
1_Cu}l-_i(IJJ)
A(K_L-%I
= GH([sJ)
_O
A(KsL+_)
= Q_lI+_aJ)
dO 90 I=_sml
K= N*mi+I
AIK_L)
" "GH(I_N2)
&(OT_CO)
AIKaL'_)
= GH(I_N2)
AIKsL+$)
= GH(I+I_2
_J AIK_L=_1%)
= GV(InN_)
11_
12_
*_
13,
"
(Continued)
GV(laJi
_(I$_N2)
GVII_j&)=ICIIaJ)/IOT
@VIIsN2)
" C(I_N2)/
DIK)
- .CIIsN2),TILI_N2i/(uT,CO}
CALL
_ANSOL
(A_L_sL%_DoLL)
QQ _20
I = CsLL
r2(ll
= O(ll
dUALITY
CALCOLATZD
_
O0 150 J=2_N1
_0 150 I=2_H1
K=IJ'2)_
+ I
IFimELTiKI.EQ,I)
33 TO $50
IF(T2(K),GT.TMELT)TExC(K)
= TExC(K)
+ IT2(<)
=
IF(T2(K),GT,T_ELT}F(K)
= _*0 = TEXC(_)/iRB_TME.T)_
liK)=T_ELT
IFITECIKI.aE.TP4_BEIT2(KI=TmELT+TEXC(<
I_KI=O,O;_ELT(K)=I
15v
CO,wTI_w_E
O0 %60 J = 2_N2
DO %60 I I_%
K = (J'2)_M_
+ I
160
TI(I_J}
- T2(KI
dLAT
= O'O
dO %70 J= 2_N1
O_ C70
I = 2_1
K (J=_}_
+ I
IBOT
O'O
_0 175
Il_Ml
_75
E_oT=EBOT+(C(I_
I)_(T%II_I)'fI_))
TBjT=TIN+IEBOT/TTC3)
EBuT-O.O
TRISE
= TBOT
" T4ELT
_
ENERGY
BALANCE)
_
SQF = 0,0
SOd O'O
5dl' = 0'0
5Q5 O'O
SQL O'O
DO 2_0 J = 2_NI
200 S_F = SOF + (CiI_JI_(T%(t_J}
TMELT)
T2
)-T_HA_
TINI/RB)
59
TABLE
220
220
280
2_0
tSO0
998
999
2000
7250
7500
BOO0
13.
(Continued)
O0 220
Z = 1,H1
SQT=SQT+(C(I*N2)_(T_(Z,N2I'TZN)/R6)
SQB = SQB + (C(ZBt)_(Tt(Z*_)
= TZN)tR6)
00 220
d E_Nt
DO 220
I 2_M1
K m (J'2)_MI
+ Z
SQS=SQSe(C_(TEtK)-TZN)_FtK)/R6)
SQLeSQL+(CW_(T2(K)=TIN)_(2*O'F(K))/R6)
QTOT2
- SQF + $_a
+ SQS + SQL + QLAT eS_T
QRATE (QTOT2=QTDT_)/DT
UCOEF
(QRATE_RS)/((TBOT'THELT)_(H_2)_RI_
1/(2_R3))
QTOTI=QTOT2
FMELT
QLAT/IAH_IN)
IF
(ABB(QLATM
= :6AT),LT*O,O002)
QO TO tSO
IF
(TIHE*EQ*DT)
[TTT
ITTT
+
IF
(TZHE*EQ'DT)
30 TO 180
ZF |ZTT.NE*ZTTT)
ZTTT
ZTTT
+ 2
IF
(ZTT*NE*ITTT)
30 TO 2_0
ZTTT 1
*RITE
(6,8000)
TI_E,TRISE*UCOEF
WRITE
(6a1500!
S3aS@B,SQT,SGIS,SQL,@LAT,
gI':TEarMELT
ZF(ABS(GLATH
= QbAT).QT,O,000t)
GO TO 60
FORMAT(IH
,20X,
IS_r
='*FlO*5*5Xa*g@B
"*FIO'5*SX**SQT
I =*aF20.5,5X,
/*tlX*'SQS
'*FIO*5,SX*'SC]L
=IaFIO*5*4X
2*'QLAT
',FlO.5,
tm ;Ox*
*QTOT *,FtO,5,_X,
IF_IEL.T
=l
3.F10.5)
FORMATi 7F20.5)
FORMAT(3Z3)
FORMAT(1Htl
FORMAT
(1HI_XafRUN
NO* _s I_)
FORMAT_INOogXe_RI
=Jo?7"3e3X_R2
"_,'R6"2o3_o'R3
JP
l#FS'2_3X#'R_
-l_:7.1#/_lOX_'R5
='*FS*I_SX_'R6
='-_F5'3
2,_X,_DELT
=_,F6._,3K,_M
. i,
Z2,SX,
IN el,|_)
FORMAT(1HO_gX**T_E
=**F7'5*5X**TRZSE
*_FT*5,
SX
1,'UCOEF
=_,F10,5)
WR_TE (6,2000)
CALL EXIT
END
SUBROUT|NE
8ANSD6 ( C_ NNEH, MNF'W_ V, I'D )
IMPLICIT
REAL_S( _=H, O-Z_
DIMENSION
C(ID_M)mVIZD)
L (MNEW+I)/2
Li
L .. 1
00 2 _R 1_L1
LR " L = ZR
DO _ _ _LR
O0 1.
J 2_HNE_
% C(ZR_'J'$)
= C(IR_J)
NPI NNCW
$ IR
MPI
HNE_/ + I " Z
6O
TABLE
5
6
7
8
%1
(Concluded)
CINP_aMPI)
" 0,0
CIIRaMNEW)
" CIN_%aMP1)
N_ " NNEW " 1
O0 9 I laN2
ZPIV
I
IRE " I + %
00 3 IR " IRE
ak
IFIABS(C(IRai)I,_E,ABS(CIIPIV*I)))
IPIV IR
CONTINUE
IF{IPIVIEQeI)
QO TO 5
T " V(I}
V(l)
V(IPIV)
VIIPIV)
m T
DO _ J %mMNEW
T " C(laJ)
C(laJ)
m C(IPIVaJ)
C(IPIVaJ)
- T
V(I}
- V(1)/C(la%)
O0 6 d 2_MNEW
C(IsJ)
- C(ImJl/:(lat)
00 8 IR " IREaL
T C(IRal)
V(XRI
V(IR)
- T_V(X)
00 7 J 2mMNEW
C(XRsJml)
C(XR_J)
m T*C(X_J)
C(IRJMNEW)
m OmO
IF(LmEQ,NNEW)
30 TO 9
LmL$
CONTINUE
V(NNEW)
V(NNEW)/C(NNEWJ_)
JM 2
00 11 ICE i_1
IR - NNEW m ICE
2mJM
IRMi " IR " i J
V(IR)
- C(IRaJ).V(IRMi}
IF(JM,EQ,MNEW)
G3 TO ii
JM JM i
CONTINUE
RETURN
END
O0
iO
13.
V(IR)
%0
QO TO
61
IF(T2(K).
LT.TMELT)TEXCfK)=TEXC(K)-(T2(K)-TMELT)
IFfT2(K).
LT.TMELT)F(K)=
1.0-TEXC(K)/(R6*TMELT);
IF(TEXC(K).GE.TPHASE)T2(K)=TMELT-TEXC
T2(K)=TMELT
(K)+TPHASE;F(K)=0.0
;MELT(K)
=l.0.
c.
In statement
170, change
d.
In the line above
sign to give QLAT
statement
= QLAT-(1.0-F(K)).
220 and statement
220,
make
changes
to give
SQ S= SQS +(CW * (T 2 (K)-T 1N )*(1.0-F(K)/R6)

220 SQL=SQ L+(CW*(T2(K)-TIN)*F(K)/R6)
An extensive
parametric
study for the case of melting
with the initial PCM
temperature
at the fusion temperature
was conducted
using the computer
program given in
Table 12. This parametric
study is discussed in more detail and the results are presented
in
Section IV.
IV.
GENERAL
A.
Presented
in this section
are some
PARAMETRIC
STUDY
Introduction
details
and typical
results
of a parametric
study
for a particular
phase change
device application.
Since there are many phase change
device applications,
each having its own unique
constraints,
it would be unrealistic
to
propose
that the results obtained
for a particular
set of conditions
and constraints
could
be quantitatively
extrapolated
to other
conditions
and constraints.
However,
results
obtained
for a particular
case such as those presented
herein may afford valuable insight,
qualitatively,
into such considerations
as trends and acceptable
operating ranges.
1
shown
The parametric
study consisted
of a thermal analysis of the symmetrical
half-cell
in Figure 29 with the base exposed
to a constant
heat flux density.
The model
and assumptions
are described
in Section
B.
Section
62
Numerical
III.
results
have
been
111.
Scope and Definitions

obtained
using
the implicit
formulation
described
in
A band
comparison
to
routine.
algorithm
[141 was used to reduce
that which would
have been required
tile required
conaputcr
storage in
using a general
matrix
inversion
Of the seven dimensionless

variables
previously
given, some of
parameters
were considered
to be fixed for the computations.
Independent
all seven parameters
would render the problem untractable.
By selection
of a particular
dimensionless
parameters
typically
used in most
commonly
used as the
computations.
For the
computations
for these
Table 14, the values for
PCM and
metal
for the
housing
and
the physical
variation
of
fins,
the
three
denoted
by R4, Rs, and R6 are all fixed. Since aluminum
was
of the previous phase change device applications
and paraffin was
PCM, properties
corresponding
to these materials were used in the
results presented
herein, the representative
properties
used in the
materials
are given in Table 14. With the property
values given in
the fixed dimensionless
ratios are
R4 = 1069
R s = 753
and
R6
= 0.381
Values of the geometrical

variables
and the heat flux density chosen for tile numerical
predictions
are based on a survey of past applications.
Tile values are listed in Table 15.
For the range of variables
outlined
in Table
15, there are 300 possible
combinations
which
indicates
the need for an equal number
of computer
runs to obtain
results
encompassing
these conditions.
Because of the large number of computer
runs involved, it
was not practical
to conduct
a sensitivity
study for each run on the choice of M and N
and DT, a suggestion
outlined
in Section
III under
the instructions
for using the
computer
programs.
The choice of M and N was made such that the node size S for the
range of geometric
variables given in Table 15 never exceeded
an approximate
value of
0.254 cm (0.1 in.). This value, for some cases, was not sufficiently
small to avoid there
being an effect on the character
of the transient
results. This is discussed
later in this
section.
Specifically,
for the results
shown
hereafter
in this section,
the parametric
computations
were performed
for the case of melting only. The entire cell was considered
to be initially at the fusion temperature
of the PCM and in the solid phase.
If one assumes that the phase change is reversible, the results can also be applied
to freezing.
There
is evidence,
however,
that
the rate
of freezing
is typically
underpredicted
by the model.
However,
in most designs,
these
data will indicate
conservatively
slower
freeze
rates than
actually
occur.
Additional
discussion
of the
freezing case is presented
in Section V.
63
TABLE 14. PCMAND METAL PROPERTIES

USEDIN COMPUTATIONS
kg :lbm
Material
m''3
Metal
80
PCM
TABLE
kJ
kg-C
\ f-0"-]
2707
One Half-Fin
Fin Thickness,
Btu
(0.21)
(50)
2.09
(0.50)
Spacing,
s c-m-C
160.9
S_
Density,
ci"
Melt
Temperature
K
(R)
291.7
(525)
\ Ibm/
(93)
0.15
(0.087)
232.4
AND HEAT
STUDY
(100)
FLUX
DENSITY
cm
(in.)
1.27
(0.5)
2.54
(1.0)
5.08
(2.0)
10.16
(4.0)
20.32
(8.0)
cm
0.127
0.254
0.508
1.016
2.032
(in.)
(0.05)
(0.1)
(0.2)
(0.4)
(0.8)
cm
(in.)
0.0127
(0.005)
0.0508
(0,020)
O. 127
(0.050)
cm
0.0635
(in.)
(0.025)
1076.4
2152,8
4305,6
6458.3
(341.4)
(682.9)
(1365.7)
(2048.6)
Heat Flux
kg
OF GEOMETRIC
VARIABLES
CHOSEN FOR THE NUMERICAL
$2
Base Plate Thickness,
'_
\Ibm:F/
0.88
Heat of
Fusion
Conductivity
(169)
15. VALUES
Cell Height,
Thermal
Specific
Heat
Density
s-m 2
Btu
h-ft 2
The problem
is transient
in character.
The computer
program provides a printout
of a number
of computed
quantities
at time intervals
which can be chosen as any
multiple
of the time increment
used in the numerical
expressions.
The quantities
computed
at each time included
the temperature
difference
between
the base and the
melt
temperature
(ATb),
an overall
heat
transfer
coefficient
(U), the latent
energy
which
represents
the amount
of PCM which has melted (QLAT), and the sensible energy stored
in the fin (SQS), the base (SQB), the cover (SQT), the solid PCM (SQS), and the liquid
PCM (SQL). Computations
automatical';:
terminate
when all the PCM has melted.
For the geometry
considered
unit area of the base is expressed
by
64
here,
the
latent
energy
associated
with the PCM per
F_'-
2phfH
(22)
2 + S2/W
This parameteris defined becauseit is useful in expressingthe latent energystorage

capabilityof the device.In usingequation(22) to determinethe latent energystorage
capability,the appropriateareato usewith this equationis the insideplan areaof the
device.This leadsto a negligibleerror sinceequation(22) is basedon a symmetricalcell
and the two outermostend cellsof the deviceare unsymmetrical.The latent energyis
linearlyrelatedto H for fixed valueso S2 andW.
C.
Results
For the range of H, W, $2, and the physical properties

considered
in
equation
(22) is represented
graphically
in Figures 33 through 35. Also shown
for infinite W which corresponds
to the case for which the entire housing is
PCM without
fins. The effect of increasing fin thickness is readily apparent
by
the curves shown in Figures 33 through 35.
An important
consideration,
especially
in temperature
control
temperature
rise of the base. Ratios of the base temperature
rise at the
melting
to the absolute
fusion temperature
of the PCM for the range
considered
herein
are shown
plotted
versus W in Figures
36 through
examined
range, the base temperature
rise increases with an increase in W.
set of parameters,
the data indicate
that the temperature
rise approaches
this study,
is the case
filled with
comparing
design, is the
termination
of
of conditions
50. Over the
For a specified
an asymptotic
value which corresponds

to expected
behavior since the problem should reduce to that of
a one-dimensional
case as W becomes
large. It is also expected
that the temperature
rise
would increase at very small values of W as the problem approaches
that for the heating
of a metal slab. Computations
were not performed
for these very low values of W. It
should also be noted that some of the values for the base temperature
rise which are
shown are too large to be of much practical
significance;
some of these are included,
however,
to indicate
trends and to facilitate
approximate
interpolation.
For some of the
larger heat-flux-density
cases, the curves are terminated
at lower values of W than they
are for the lower heat-flux-density
cases because the resultant
temperature
rises are much
too large for practical considerations.
In Figures 36 through
50 as well as in all subsequent
figures showing results of
the parametric
study, computed
data are represented
by solid circles. Curves have been
faired through
the points; it should be recognized,
however, that the value for points on
the curve between two computed
values are only approximate.
The
Figures
51
indicate
the
attributable
discussed in
data shown in Figures 36 through

through
62. For some geometries
presence
of a relative maximum
to the two-dimensional
character
more detail in Appendix
B.
50 are cross plotted

versus fin height in
within the considered
range, the curves
and a relative minimum.
This feature is
of the problem.
This characteristic
is
65
375O
S2 = 0.0127 cm (0.005 in.)
350O
3250
3000
2750
2500
2250
t'N
=E
2OO0
I,LI
1750
1500
1250
W
cm
CURVE
(in.)
IOO0
1
750
5OO
co
oo
2
3
2.032
1.016
(0.8)
(0A)
4
5
0.508
0.254
(0.2)
(0.1)
0.127
(0.05)
250
10
12
H,
14
16
18
20
22
cm
H, in.
Figure
66
33.
Latent
energy storage per unit base area versus

thickness of 0.0127 cm (0.005 in.).
Im nelgnt
Ior Im
3750
4.0
3500
S2 = 0.0508 cm (0,02 in.)

3250
3000
2750
250O
225O
,=l
,r., 2O0O
:2.
I,g
1750
1500
1250
1000
CURVE
1.0
750
500
250
0
0
cm
(in.)
oo
oo
2
3
2.032
1.016
(0.8)
(0.4)
4
5
0.508
0.254
(0.2)
(0.1)
0.127
(0.05)
10
12
14
16
18
20
22
H,
;m
H, in.
Figure 34.
Latent

thickness of 0.0508 cm (0.02 in.).
tin height
for fin
67
3750
3500
3250
3000
2750
/
4.0 t
S2 = 0.127 cm (0.05 in.)
3.5
3.0
2500
2250
2.5
,750
2.o
CURVE
11)
12
H,
W
cm
(in.)
oo
oo
2.032
(0.8)
1.016
(0.4)
4
5
0.508
0.254
(0.2)
(0.1)
0.127
(0.05)
14
16
18
20
22
cm
H, in.
Figure
68
35.
Latent

thickness of O. 127 cm (0.05 in.).
fin height
for fin
)1
Uo
Jj.
-- UO
)1
14o q.LV
69
r<
o,_
)4
?0
_10
--'_
14o ql_
r_
c_
(D
(1J
O
U_
O
c_
d
A
_o
cr_
oo
0_
r%
o
II
3:_n
_4
_lo
-- UO
)l
Uo
_/
qlv
?1
72
oE_
.o
c--
-'
c_
tt
i
,t
;
-.,JO
73
_ w
o
_ q
o
L,
r_
0J
o_=
0oo
"_o
,.,4
t_
o
_ el.
o
I
o
I
o
)1
Ho J'l
- HO
"
)1
Uo qlV
74
II
m
C:b
O
'._,
00
O
\
_Z_
II
O
C'4
c
_D
_N
_o
,:E
._
v
U
6_
I
O
I
O
"75
c_
,_ _
"t::I "-:'.
_.
o
Bo
*"
t'-i
_E
E_
o
I|
0,,_
o
o
:_
Uo Jl
- UO
"
)1
Uo q.l.V
76
_0
EE
O00
=O
0
_
O
_d
_d
,4
o,_
7"/
;>
-_ <5
i
_-"
0
oo
o
O0
._,._
Na
Nm
...q
)i
Ho #1
- HO
'
)1
I:lo qlV
78
m.
o
(D
;;;> ,-4
In
o
o
o
_c;
t_
o
I "_
No
II
Il
,d
II
I
o
)I
HO
'
I:1o
qj._,
79
L,
o.
0
0
-'-_0
o,...4
0
0
o
,z
c4
c_ 0
2,*
el
0
t"-
0
0
)1
I:10
I:10_
)1
8O
_1
I:1o qJ.V
CD
0
emt_
0
t_
.,.._
II
_6
81
oo
m.
82
)1
Ido _J.
)1
H0 qJ.V
>
ii
83
II
_,
_oo
>d
QQ
4"O
I:
ii
84
_:_
_0
0
II
L.
,,,_
,q.
_O
O0
_O
0
-II
o_-. _ ._._
N'_
-'_
f_
i
q..._
c
e,- .-
_E
'-J
L.
,r'O
II II
'or_"
o
0
x
)1
Uo ;z
_10
"
Uo
qlV
85
GO
0
N
cO
F-
ro
-t
0
_D
t'N
'1"
CO
m
t'N
Ec5
v.-
Oc;
li
It
._-_
I
0
- UO_-N
Uo q.LV
$6
oo
tl
r,D
>d
Ln
_E
0_
=c:;
0
.I.
_=
>1
_1
Uo,
Jl
Uo
qlV
UO_
87
_.
_.
_!
_.
)4
Uo Jl
- UO _
)4
Uo ql_
88
II
/
I
Uo q_v
89
OD
II
qf-
*:3'
--
(f)
::._
_0
O
LN
it_".0
o d
oE
_a-a0
_f
_z
u3
_N
I
w-
_-
I
r.
I
_
I
v.-
I
*-
9-
)g
31
90
I
O
UO
UO
O
t L
'
U
qJ.V
I
O
I
O
I
O
I
O
I
O
gO
C,
O0
--
r,D
'q'
_o
r_
_oc_
oo
o,-,"z"
_:
_ """
II
"-
_
.-_
Nm
'_
t--
r"
t_
I..0
O0
,1:1" C'
I!
II
:'
N
0" _')
0
0
C_
N
-frO
N
EIo, _1
Eio ql_
91
Lr_
0
c:;
II
_Q
_0
>d
E_
c_
c_
.'o-_
i
0
!
0
0
)1
--
)1
92
I
O
Uo
UO
JJ.
'
Uo qJ._7
fl
c_
II
II
I
m.
e_
o.
e
_.
m.
v-
q'-
_1o, JJ.
UO _
_1oq.L_7
93
00
II
e,D
I-i
_E
N
_o
oO
_d
O
z"
LN
II
q
0
}1
- HO
N
94
Uo
Jl
'
Ido ql_
I:1
GO
r_
(-%
oo
II
to
Ln
Er'0
o
"
II
.,-q
0
A
t_l
t"-,I
E_
95
The basetemperaturerisesshown in Figures36 through 62 correspondto the

terminationof melting. If the entire amountof PCMis not melted,the temperaturerise
of the basemay be considerablylessthan that reflectedin Figures36 through62. Asan
indication of the transientbehaviorof the basetemperature,certaintransientdata are
plotted in Figures63 through 77. For somecases,the basetemperaturerise remains
relativelylow over a largepercentageof the phasechangeprocessand risesrapidly near
the end of the process.In other cases,the rise occurs nearly uniformly throughout
the
phase change
process.
In either case, designs
through
62 should be conservative,
especially
based on the data

if the design does
shown in Figures 36
not require
complete
melting
of the PCM. However,
as indicated
by these data, in cases where base plate
temperature
control
is the object,
it may be more desireable
to limit phase change
in order to avert unreasonable
fin spacing and/or heights.
Some of the curves shown in Figures 63 through
77 exhibit fluctuations
in the
transient
base temperature.
For those curves where a sharp rise occurs in the computed
base temperature
(e.g., the upper
curve in Figure 63), the accuracy
with which the
predictions
describe
the actual physical variation
is questionable,
particularly
during the
early part of the transient.
The computing
model attempts
to predict the behavior
of a
continuous
system with use of a limited number
of finite size nodes. Since the phase
change is handled
in the model by forcing an entire node to remain at the phase change
temperature
until sufficient
energy has accumulated
to account for the phase change, one
would expect
some stepping
in the results unless the nodes are made very small. This,
however,
is related
to the choice
of M and N, which
in turn dictates
computed
requirements.
Since the problem
examined
in the parametric
study involved a step input
of a constant
heat flux at the base, the initial level to which the computer
temperature
rises is dependent
on the node size. The influence
of N on the computed
results is
illustrated
in Figure 63 for three runs, in Figure 64 for one run, and in Figure 65 for one
run. For these selected runs, computations
are shown for N values of 5 and 10. When 5
is used, a horizontal
row of nodes represents 20 percent
of the PCM. Obviously,
the
precise
detail
of the transient
variation
is affected
in each case, but the principal
difference
is at the beginning;
it appears that increasing N results in a smoothing
out of
the fluctuations
and shortens
the initial plateau.
The general trend of the results remains
consistent
and there appears to be only a slight effect in the latter stages of a run. For
reference
purposes
the values of N used in the computations
are given for the respective
curve in Figures 63 through 77.
The time required
for the PCM to melt is depicted
graphically
in Figures 78
through
89, These
times exceed
those
which
would
be required
by purely
latent
considerations
because of the effect of sensible heating.
Since there is a certain
amount
of sensible energy storage,
ratios of the total
stored energy at the termination
of melting to the latent energy required to change phase
of the PCM are shown plotted
versus heat flux density at the base in Figures 90 through
104.
A few additional
computer
runs were made
to examine
the influence
of the fusion temperature
the base at the termination
of melting. The results
Figures 105 through
107.
96
for selected values of the parameters

on the predicted
temperature
rise of
of these computations
are shown in
20O
190
el" = 1076.4 J/s-m2 (341.4 Btu/h-ft 2)
180
S2 = 0.0127 cm (0.005 in.)

H = 1.27 cm (0.5 in.)
170
160
150
140
130
#:
O
o=lo
=
o
x
k-
<3
W cm (in.)
1
/
10
I
s
!
I
20
10
s I
10
"
00
0.1
20
0.2
0.3
0.4
0.5
FRACTION
Figure
63.
Transient
for H = 1.27
base
temperature
cm (0.5
in.)
and
0.6
0.7
0.8
0.9
1.0
MELTED
rise versus
S 2 = 0.0127
fraction
of PCM
cm (0.005
melted
in.).
97
200
190
180
el" = 1076.4 J/s-m 2 (341.4 Btu/h-ft 2)
S2 = 0.0508 cm (0.020 in=)
H = 1.27 cm (0.5 in.)
170
160
150
140
130
120
,,,'Iv
O
o,,-i
o"
o
110
o
100
9O
80
70
60
50
W cm (in.)
40
30
2.032 (0.8)
20
1.01 6 (0.41
10
0.1
0.2
0.3
0.4
0.5
FRACTION
Figure
98
0.6
0.7
08
0.9
1o0
MELTED
64. Transient base temperature

for H = 1.27 cm (0.5 in.) and S 2 = 0.0508 cm (0.020 in.).
200
190
180
1" = 1076.4
170
S2 = 0.127
--
J/s-m 2 1341.4 Btu/h-ft
2)
cm 10.050 in.)
H = 1.27 cm (0.5 in.}

160
150--
"-'Iv
140
--
130
--
120
--
110
--
n,-
p')
C_
t,,X
100--
90--
80--
70
--
60
--
50
--
40
--
W cm (in.)
t10
/
2O
10
0
0
Figure
65.
Transient
for
H = 1.27
base
cm
temperature
(0.5
in.)
rise
and
$2
versus
= 0.127
fraction
cm
(0.05
of
PCM
melted
in.).
99
20O
190
180
1"= 1076.4 J/s-m 2 (341.4 Btu/h-ft 2)
170
S2 = 0.0127 cm (0.005 in.)

H = 2.54 cm (1 in.)
160
150
10
140
130
W cm
(in.)
1
x
10
8O
70
10
3O
20
2O
40
10
0
0
0.1
0.2
0.3
0.4
0.5
FRACTION
Figure
66.
Transient
for H = 2.54
100
base
temperature
cm (1 in.)
and
0.6
I
0.7
I
0.8
I
0.9
I
10
of PCM
melted
MELTED
rise versus
$2 = 0.0127
fraction
cm (0.005
in.).
200
190
1"= 1076.4 J/s-m2 (341.4 Btu/%ft 2)
180
S2 = 0.0508 cm (0.020 in.)

H = 2.54 cm (1 in.)
170
160
150
140
130
_1 V
nO
o1o
n-
120
10
110
100
V"
9O
<1
v
W cm (in.)
80
70
10
6O
50
40
10
3O
20
20
10
0
0
0.1
0.2
0.3
0.4
0.5
FRACTION
Figure
67.
Transient
for H = 2.54
base
temperature
cm (1 in.)
and
0.6
0.7
0.8
0,9
1.0
of PCM
melted
MELTED
rise versus
$2 = 0.0508
fraction
cm (0.020
in.).
101
2OO
190
180
170
160
tl" = 1076.4 J/s-m 2 (341.4 Btu/h-ft 2)
S2 = 0o127 cm (0.050 in.)
H = 2.54 cm (1.0 in.)
150
140
130
120
,_,1 v
oc
O
N
110
10
0
X
90
8O
W cm (in.)
70
10
50
40
30
10
20
2O
10
0254
0
0.1
0.2
0.3
0.4
27 (0.05)
0.5
FRACTION
Figure
68.
Transient
for H = 2.54
102
base
temperature
cm (1 in.)
and
0.6
0.7
0.8
0.9
1.0
of PCM
melted
MELTED
rise versus
S 2 = 0.127
fraction
cm (0.05
in.).
2OO
_1" = 1076o4 J/s-m 2 (341.4 Btu/h-ft 2)
S2 = 0,0127 cm (0.005 in.)
190
H = 5.08 crn (2.0 in.)

180
170
160
W cm (in.)
150
140
130
120
n_
0
o
110
o
100
o
Ipi
9O
80
70
60
5O
40
4O
30
20
10
0
0
0.1
I
0.2
I
0.3
I
0.4
|
0.5
FRACTION
I
0.6
I
0.7
I
0.8
I
09
!
1o0
MELTED
Figure 69. Transient base temperature

for H = 5.08 cm (2 in.) and $2 = 0.0127 cm (0.005 in.).
103
200
190
1"= 1076o4 J/s-m 2 (341.4 Btu/IPft 2)
180
S2 = 0.0508 cm (0.02 in.)

H = 5.08 cm (2 in.)
170
160
N
150
15
140
130
120
nO
110
W cm (in.)
m"
11111
v
80
70
50
40
30
20
2O
40
10
0.1
0.2
0.3
0.4
0.5
I
0.6
I
0.7
I
0.8
I
0.9
I
1.0
fraction
of PCM
cm (0.02 in.).
melted
FRACTIONMELTED
Figure
104
70.
Transient
base temperature
for H = 5.08 cm (2 in.) and
rise versus
$2 = 0.0508
200
190
180
1" = 1076.4 J/s-m 2 (341.4 Btu/h-ft 2)

S2 = 0.127 cm (0.050 in.)
H = 5.08 cm (2.0 in.)
170
160
150
140
Vl_
130
120
15
CC
110
O')"
100
t-"
90
W cm (in.)
80
7O
60
50
20
40
30
20
10
0
0
0.1
0.2
0.3
0.4
0.5
FRACTION
Figure
71. Transient
base temperature
0.6
0.7
0.8
I
0.9
I
1.0
MELTED
for H = 5.08 cm (2 in.) and S_ = 0.127
cm (0.05
of PCM melted
in.).
105
400
380
360
_1" = 1076.4
J/s-m 2 (341.4
S2 = 0.0127
cm (0.005
H = 10,16
Btu/h-ft
2)
in.)
cm (4 in.)
340
320
N
300
3O
280
260
W cm (ino)
240
0
220
0
0
40
200
180
160
140
4O
120
100
8O
8O
60
160
40
2O
0
0
0ol
[
0.3
0.2
I
0.4
I
0.5
FRACTION
Figure
72.
for
106
Transient
H =
10.16
base
cm
temperature
(4
in.)
and
I
06
I
0.8
[
0.9
[
1.0
MELTED
rise
$2
I
0.7
versus
= 0.0127
fraction
cm
(0.005
of
PCM
in.).
melted
200
_1'" = 1076.4
190
J/s-m 2 (341.4
S2 = 0.0508
H = 10.16
180
cm (0.020
Btu/h-ft
2}
in.)
cm (4 in.)
170
160
30
150
140
130
W cm (in.)
120
v
i ,.,,
o..
0
110
100
C)
TX
9O
40
80
70
60
50
40
40
30
20
10
0
0
0.1
0.2
0.3
0.4
0.5
0.6
FRACTION
Figure
73.
Transient
for
H =
base
10.16
cm
temperature
(4
in.)
S:
08
0.9
1.0
PCM
melted
MELTED
rise
and
0.7
versus
= 0.0508
fraction
cm
(0.02
of
m.).
107
200
190
1" " 1076.4 J/s-m 2 (341.4 Btu/h_ft 2)
S2 = 0.127 cm (0.050 in.)
H - 10.16 cm (4 in.)
180
170 --
160-150--
140--
130-N
120--
_1_
30
110 --
W cm (in.)
100--
Iv)
O
Im
90--
80--
70
6O
50
40
40
3O
20
10
0
0
0.1
0.2
0.3
0,4
0.5
FRACTION
Figure
74.
Transient
base
for H = 10.16
108
temperature
cm (4 in.)
and
0.6
0.7
0.9
I
1.0
of PCM
melted
0.8
MELTED
rise versus
$2 = 0.127
fraction
cm (0.05
in.)
8O0
el" = 1076.4 J/s-m 2 (341.4 Btu/h-ft 2)
S2 = 0.0127
cm
(0.005
in.)
H = 20.32 cm (8 in.)
72(
680
64O
600
N
560
\
6O
520
480
W cm (in.)
O
440
O
O
O
v-
400
80
360
320
280
8O
240
200
160
160
120
320
80
0.17
40
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
FRACTION
Figure
75.
Transient
for H = 20.32
base temperature
0.8
0.9
1.0
MELTEU
cm (8 in.) and S: = 0.0127
of PCM melted
cm (0.005
in.).
109
200
Cl''=
1076.4
J/s-m 2 (341.4
S2 = 0.0508
190
H = 20.32
cm (0.02
Btu/h-ft
2)
in.)
cm (8 in.)
180
170
160
N
150
6O
140
W cm (in.)
130
120
Vl_
n,,
110
100
O
X
90
80
7O
8O
60
5O
4O
3O
10
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
FRACTION
Figure
76.
Transient
for
110
H = 20.32
base
cm
temperature
(8 in.)
rise
and
$2
I
1.0
MELTED
versus
= 0.0508
fraction
cm
(0.02
of
PCM
in.).
melted
200
_1" = 1076.4
190
J/s-m 2 (341.4
S2 = 0.127
H = 20.32
cm (0.050
Btu/h-ft
2)
in.)
cm (8 in.)
180
170
160
150
140
N
130
60
120
Vl
V
W cm (in.)
n,.
O
110
"
100
O
X
8O
70
8O
60
5O
4O
3O
2O
10
0.4
0.5
0.6
0.7
0.8
0.9
0
0
0.1
0.2
0.3
FRACTION
Figure
77.
Transient
for
H = 20.32
base
cm
temperature
(8
in.)
MELTED
rise
and
I
1.0
versus
S_ = 0.127
fraction
cm
(0.05
of
PCM
melted
in.).
111
2O
70
-_1" = 1076.4 J/s-m2 (341.4 Btu/h-ft 2)

S2 = 0.0127 cm (0.005 in.)
18
60-16
14
50
40
30
--
20
--
12
J:
10
10--
o
0
10
12
14
16
18
20
22
H,
cm
H, in.
Figure
78.
Time
(341.4
112
required
Btu/h-ft
for PCM
2 ) and
to melt
$2 = 0.0127
for c]" = 1076.4

cm (0.005
in.).
J/s-m z
18
_1'"= 1076.4 J/s-m 2 {341.4 Btu/h-ft 2)
6O
82 = 0.0508 cm (0.02 in.)
16
14
5O
12
4O
10
e.,
4,,,
3O
2O
10
I
2
I
4_
I
6
I
8
I
10
I
12
H,
I
14
I
16
I
18
2O
22
cm
H, in.
Figure
79.
Time
(341.4
required
Btu/h-ft
for PCM
2 ) and
to melt
$2 = 0.0508
for _1" = 1076.4

cm (0.02
J/s-m 2
in.).
113
10
_1" -- 1076.4 J/s-m 2 (341.4 Btu/h-ft 2}
35
S2 -- 0.127 cm (0.05 in.)
30
8
25
6
-_ 20
,g
T
W cm (in.)
15
4
10
5 --
0
0
10
12
14
16
18
20
22
H,
cm
H, in.
Figure
114
80. Time required for PCM to melt for _1" = 1076.4

(341.4 Btu/h-ft 2 ) and S 2 = 0.127 cm (0.05 in.).
J/s-m 2
10
35
el" = 2152.8
J/s-m 2 (682.9
S2 = 0.0127
cm (0.005
Btu/h-ft
2)
in.)
30
8
25
6
20
e-
4-J
W cm (in.)
15
4
3
10
5
1
0
0
10
12
14
16
18
20
22
H,
cm
H, in.
Figure
81. Time required for PCM to melt for _'t" = 2152.8

(682.9 Btu/h-ft 2) and $2 = 0.0127 cm (0.005 in.).
J/s-m =
115
3O
8
_1" = 2152.8 J/s-m2 (682.9 Btu/h-ft 2)

S2 = 0.0508 cm (0.02 in.)
7 -
25
6 20
5 -
._
J=
15
,,- 4
3 -
W cm (in.)
10
2 -
5
1 -
0 -
1
4
I
6
I
8
I
10
I
12
H,
I
14
i
lt"
I
18
20
cm
H, in.
Figure
82.
Time
(682.9
116
22
required
Btu/h-ft
for PCM
2 ) and
to melt
$2 = 0.0508
for _t''=
cm (0.02
2152.8
in.).
J/s-m
3O
8
_i" = 2152.8 J/s-m 2 (682.9 Btu/h-ft 2)

S2 = 0.127 cm (0.05 in.)
7-
25
6-2O
5-
/-
4 -
._ 15
3 10
2 -
W cm (in.)
1--
O-
0
0
I
2
I
4
I
6
I
8
I
10
I
12
H,
I
14
1
16
I
18
22
cm
H, in.
Figure
83.
Time
(682.9
required
Btu/h-ft
for
2 ) and
PCM
to melt
$2 = 0.127
for _t" = 2152.8

cm (0.05
J/s-m 2
in.).
117
el" = 4305.6 J/s-m 2 (1365.7 Btu/h-ft 2)

14
S2 = 0.0127 cm (0.005 in.)
3.5
12
lO
W cm (in.)
2.5
e-
1.5
0.5
0
0
10
12
14
16
18
20
22
H, cm
I
0
I
1
1
2
I
3
I
4
I
5
I
6
I
7
I
8
H, in.
Figure
84.
Time
(1365.7
118
required
Btu/h-ft
for PCM
_) and
to melt
S: = 0.0127
for _'t" = 4305.6

cm (0.005
in.).
J/s-m
_1" = 4305.6 J/s-m 2 (341.4 Btu/h-ft 2)
S2 = 0.0508 cm (0.02 in.)
14
3.5
12
10 -
2.5
8 -
6 W cm (in.)
1.5
4 -
2-
0.5
I
2
I
4
I
6
I
8
I
10
I
12
H,
I
14
I
16
I
18
20
22
cm
H, in.
Figure
85.
Time
(341.4
required
Btu/h-ft
for PCM
2 ) and
to melt
$2 = 0.0508
for _t" = 4305.6

cm (0.02
J/s-m 2
in.).
119
_1'"= 4305.6 J/s-m 2 (1365.7 Btu/h-ft 2)

S2 - 0.127 cm (0.05 in.)
14
3.5
12
10
2.5
8
.I
.ll
4"*
1.5
0.5
0
0
10
12
14
16
18
20
22
H, cm
H, in.
Figure
86.
Time
(1365.7
120
required
Btu/h-ft
for PCM
2 ) and
to melt
$2 = 0.127
and
ct" = 4305.6
cm (0.05
in.).
J/s-m 2
18
4.5
16
tl" = 6458.3 J/s-m 2 (2048.6 Btu/h-ft2l

S2 - 0.0127 cm (0.005 in,)
14
3.5
12
3
10
,,:
2.5
1.5
0.5
0
0
10
12
14
16
18
20
22
H, cm
i
i
2
I
8
H, in.
Figure
87. Time required for PCM to melt for _t" = 6458.3 J/s-m 2
(2048.6 Btu/h-ft 2 ) and $2 = 0.0127 cm (0.005 in.).
121
4.0 -14
_1'""6458.3
J/s-m 2 (2048.6 Btu/l_ft 2)
S2 - 0.0508 cm (0.02 in.)

3.5-12
10
3.0
2.5
...- 2.0
Q
4,J
1.5
1.0
2 0.5
I
2
I
4
I
6
I
8
I
10
I
12
I
14
I
16
I
18
I
20
I
22
H, cm
[
H, in.
Figure
88.
Time
(2048.6
122
required
Btu/h-ft
for PCM
2) and
to melt
S 2 = 0.0508
for _1" = 6458.3

cm (0.02
in.).
J/s-m
3.5
_1" = 6458.3 J/s-m 2 (2048.6 Btu/h-ft 2)
12
S2 = 0.127 cm (0.05 in.)
3.0
10
2.5
8
2.0
6
1.5
1.0
t
W cm (in.)
0.5
10
12
14
16
18
20
22
H,
H, in.
lzigurc
89.
Time
(2048.6
required
Btu/h-ft
for PCM
2) and
to melt
$2 = 0.127
for _1" = 6458.3

cm (0.05
J/s-m
in.).
123
1.7
W = 0.127 cm (0.05 in.)

S2 = 0.0127 cm (0.005 in.)
1.6
1.S
20.32 (8)
1.4
O
O
tO
1.3
10.16 (4)
1.2
5.08 (2)
1.1
1.27 (0.5)
t
I
2
1.0 J'-
Hcm (in.)
I
4
1
3
I,
5
I
6
el", kJ/s"m2
I
300
400
600
800
1000
1200
1400
1600
1800
2000
Cl", Btu/h -ft2
Figure
90.
Energy
(0.05
124
ratio
in.)
and
versus
heat
flux
$2 = 0.0127
density
cm (0.005
for W = O. 127 cm
in.).
1.35
W=0.127cm(0.05in.)
S2 =0.0508
cm(0.02in.)
1.30
20.32(8)
1.25
I<(
,,.I
1.20
O
IO
IO
1.15
(4)
5.08 (2)
1.10
.27 (0.5)
t
H cm (in.)
1.05
1.0
el", kJ/s"m2
|
300
I
400
I
600
I
,
800
I
1000
I
1200
I
1400
I
1600
I
1800
I
2000
_", Btu/h-ft 2
Figure 91.

(0.05 in.) and $2 = 0.0508 cm (0.02 in.).
cm
125
1.30
W = 0.127
cm (0.05
in.)
S2 = 0.127
cm (0.05
in.)
1.25
1.20
(8)
,
.J
1.15
0
p0
10.16
(4)
1.10
2.54 (1)
t
1.05
Hcm
(in.)
1.0
1
_1", kJ/s-m 2
I
300
I
400
600
800
I
1000
I
el", Btu/h-ft
Figure
126
92.
I ,.,
1200
1400
1600
1800
2OOO
Energy ratio versus heat flux density for W = 0.127 cm

(0.05 in.) and $2 = 0.127 cm (0.05 in.).
'
1.7
W = 0.254 cm (0.1 in.)
S2 = 0.0127 cm (0.005 in.)
1.6
(8)
1.5
1.4
I-
(4)
Cl
I0
lcl
1.3
5.08 (2)
1.2
2.54 (1)
1.27 (0.5)
1.1
t
H cm (in.)
1.0
1
I", kJ/s-m 2
I
300
400
600
l
800
1000
1200
1400
I
1600
1800
2000
Cl", Btu/h -ft2
Figure
93.
Energy
(0.1
ratio
in.)
and
versus
S:
heat
= 0.0127
flux
density
cm (0.005
tbr W = 0.254
cm
in.).
127
1.35
1.30
1.25
1.20
o
1.15
1.10
1.05
1.ol
1
,I
5
1", kJ/$-m2
300
400
600
800
1000
1200
1400
1600
I
1800
1", Btu/h-ft2
Figure
94.
Energy
(0.1
128
ratio
in.)
and
versus
heat
S2 = 0.0508
flux
density
cm (0.02
for W = 0.254
in.).
cm
II
2O0O
1.35
W = 0.254 cm (0.1 in.)

S2 = 0.127 cm (0.05 in.)
1.30 l
1.25
1.20
20.32 (8)
O
(0.5)
1.15
(4}
1.10
2.54 (11
t
H cm (in.)
1.05
1.00
el", kJ/s-m2
300
400
600
800
1000
1200
1400
I
1600
1800
2000
_1", Btu/h-ft 2
Figure
95.
Energy
(0.1
ratio
in.)
versus
and
heat
S 2 = 0.127
tlux
density
cm t0.05
for W = 0.254
cm
in.).
l 2 t_
W = 0.508 cm (0.2 in.)

S2 = 0.0127 cm (0.005 in,)
(8)
(40
5.08 (2)
2.54 (1
.27 (0.5)
t
H cm (in.)
(i", kJ/s-m2
300 400
600
800
1400
1600
1800
2OOO
1000
1200
_1", Btu/h-ft 2
Figure
96.
Energy
(0.2
130
ratio
in.)
and
versus
heat
$2 = 0.0127
flux
density
cm (0.005
for W = 0.508
in.).
cm
1.7
_/=
0.508
S2 = 0.0508
cm (0.2 in.)
cm (0.02
in.)
(8)
O
kO
O
1.27
(0.5)
10.16
2.54
(4)
(1)
5.08 (2)
T
H cm (in.)
q fB , kJ/s-m 2
1
300
400
600
800
1000
1200
1400
_1", Btu/h-ft
Figure
97.
I
1600
I
1800
II
2000
Energy ratio versus heat llux density tbr W = 0.508 cm

(0.2 in.) and Sa = 0.0508 cm (0.02 in.).
131
1.7
W = 0.508 cm (0.2 in.)

S2 = 0.127 cm (0.05 in.)
1.6
H cm (in.)
k.
<
,.I
0
I.0
I0
1.0
I
1
Cl", kJ/s"m2
300
400
600
800
1000
1200
1400
1600
1800
_", Btu/h-ft 2
Figure
132
98.
Energy
(0.2
ratio versus heat flux density

in.)and
$2 = 0.127
cm (0.05
for W = 0.508
in.).
cm
11
2OO0
(8.0)
10.16 (4.0)
0
ko
k0
5.o8 (2.o)
2.54 (1.0)
1.27 (0.5)
t
H cm (in.)
W = 1.016 cm (0.4 in.)

S2 = 0.0127 cm (0.005 in.)
1", kJ/s-m2
300
400
600
800
1000
1200
1400
1600
1800
I
2000
1", Btu/h-ft 2
Figure
99.
Energy
(0.4
ratio
in.)
and
versus
heat
$2 = 0.0127
flux
density
cm (0.005
for W = 1.016
cm
in.),
133
is
I
W = 1.016
cm (0.4 in.)
S2 = 0.0508
(0.020
in.)
o
I0
I0
H cm (in.)
1.1
1
cl", kJ/s'm 2
I
300
400
600
_JO0
1000
1200
I
1400
II
1600
1800
2OOO
1", Bt"/h-ft2
Figure
134
100.
Energy ratio versus heat flux density for W = 1.016 cm

(0.4 in.) and $2 = 0.0508 cm (0.02 in.).
1.8
W = 1.016 cm (0.4 in.)

S2 = 0.127 cm (0.05 in.)
1.7
1.6
1.5
1.4
1.3
t
Hcm (in.)
1.2
1.1
I", kJ/s-m2
800
1000
1200
300 400
1400
1600
I
1800
I
2O00
1". Btu/h-ft2
Figure
101.
Energy
(0.4
ratio
in.)
and
versus
heat
flux
$2 = O. 127
density
cm (0.05
for W --- 1.016
cm
in.).
135
2.5
.32 (8.0)
W = 2.032 cm (0.8 in.)
S2 = 0.0127 (0.005 in.)
2.3
2.1
10.16 (4.0)
1.9
0
1.7
5.08 12.01
1.5
__
2.54 (1.0)
1.27 (0.5)
1.3
H cm (in.)
1.1
(1", kJ/s-m 2
300
400
600
800
1000
1200
1400
1600
i
1800
_", Btu/h-ft 2
Figure
136
102.
Energy ratio versus heat flux density

(0.8 in.) and $2 = 0.0127
cm (0.005
for W = 2.032
in.).
cm
I
2000
2.5
20.32 (8.0)
W '= 2.032 cm (0.8 in.)

S2 = 0.0508 cm (0.02 in.)
2.3
2.1
1.9
5
0
ko
0
1.7
5.08 (2.0)
10.16 (4.0)
1.5
1.3 -_
1.2i(0.5 )
H cm (in.)
1.1 |
I
2
I
3
I
4
I
5
I
6
1", kJ/s-m2
I
1
300 400
I
600
I
800
I
1000
I
1200
I
1400
I
1600
I
1800
I
2000
(1". Btu/h'ft 2
Figure
103.
Energy
(0.8
ratio
in.)
and
versus
heat
S 2 = 0.0508
flux
density
cm (0.02
for W = 2.032
cm
in.).
137
2.3
W = 2.032 cm (0.8 in.)
S2 - 0.127 cm (0.05 in.)
2.1
1.9
I-,.
,<
.,,I
cl
1.7
I-
o
I-o
5.08 (2.0)
2.54 (1.0)
1.5
20.32 (8.0)
10.16 (4.0)
(0.5)
1.3
1.1
1
el", kJ/s-m2
I
300
I
400
I
600
I
800
I
1000
I
1200
I
1400
I
1600
I
1800
(1", Btu/h'ft 2
Figure
138
104,

(0.8 in.) and $2 = 0.127 cm (0.05 in.).
cm
I
2000
i
0
I
_
@4
o
EIo
)1
HO
o.
o
;.L
'
El
qJ.V
139
c_
\\
II
_a
.,.-i
0
In
\\ \
\
\
5
\
\
c_
_.._
0
m
\
0
E tl
e_
n
Uo
_j.
- HO
'
)1
Ho qJ.V
140
9_.
C_
0
X
0
!_
\\\
0
_.._
\
\
E
_d
+"
II
\
\
\
\
\
_E
\
0
it
--
Uo
_.L
- 140
"
_I
_Io qJ.V
|41
Some representative
examples
illustrating
how the results can be used by a
designer
are given in the following
section.
For conditions
significantly
different
from
those used in the computations
(Tables
14 and 15), it is suggested
that the program
described
in Section
111 be used to determine
the required
design
information.
D. Examples
Some hypothetical
examples
which a thermal
designer
use of the results are outlined as follows. All examples assume
housing
design
Example
and materials
as discussed
may encounter
illustrating
the designer has selected a
earlier.
1
Given:
The
and the designer

melt temperature
temperature
heat
rise ratio
ATb
5.56
Tf
291.67
Case a
flux density
is specified
to be
1076.4
J/s-m s (341.4
Btu/h-ft 2)
wishes to limit the temperature

increase
to 5.56 K (10R).
The
is 291.67 K (525R),
using these inputs the maximum
permissable
is computed
19.05
The designer
PCM
base
to be
wishes
10-3
to use a fin thickness
of 0.0127
cm (0.005
in.).
Find an acceptabh:
geometry
to satisfy the given conditions.
From Figure
51, a height of 2.54 cm (1 in.) can be used with a half-fin spacing of
0.127 cm (0.05 in.) to achieve the desired conditions.
Determine
the energy
latent energy
storage
stored. From equation

(22) or from Figure 33, the
is 4506 kJ/m 2 (397 Btu/ft2).
The results shown in
Figure 90 show that the total energy stored at the termination

for these conditions
is approximately
5 percent
higher than
energy stored, the difference
being sensible energy storage.
Case b
- The designer
wishes to use a fin thickness
Find an acceptable
geometry.
From Figure
of 10.16 cm (4 in,) with a half-fin spacing
used.
of 0.127
cm (0.05
of melting
the latent
in.).
53, it is seen that a fin height

of 0.254 cm (0.1 in.) can be
Determine
the energy stored.
From equation
(22) or from Figure 35, the
corresponding
latent energy
storage is 15 128 kJ/m 2 '(1333 Btu/ft2),
At
the termination
of melting,
the total stored
energy exceeds
the latent
value by approxinmtcly
142
5 percent
as shown
in Figure
95.
Example
2
Given:
The
designer
is limited
by space
to a plan area
for the phase
change
device
of 0.0697 m 2 (0.75 ft2); the heat flux density is specified

to be 2152.8 J/s-m 2 (682.9
Btu/h-ft 2); the duty cycle of the controlled
medium requires latent energy 948.9 kJ (900
Btu) of storage. For these conditions,
latent energy storage per unit area is
P'r
E_
948.9
0.0697
Case a -
1.3614
The designer
104 kJ/m 2 (1200
wishes
Btu/ft 2)
Find the geometry.

From Figure
approximately
7.62 cm (3 in.)
shown.
of 0.0127
cm (0.005
in.).
33, it is noted that the required height is

regardless
of fin spacing over the range
Determine
the base temperature
rise. Assume a half-fin spacing of 0.254
cm (0.1 in.) and a height
of 7.62 cm (3 in.). From
Figure
54, the
corresponding
base temperature
of melting is
AT b "_ 0.132
Case b - The designer
291.67
selects
-----38.5 K(69R)
a fin thickness
of 0.127
cm (0.05
in.).
Find the geometry.

From Figure 35, it can be seen that there
range of fin height-spacing
combinations
which will satisfy
energy storage requirements.
is a wider
the latent
Determine
rise. First, assume a fin height of 10.92
cm (4.3 in.) and a half-fin spacing of 0.127 cm (0.05 in.). From Figure
56, the corresponding
temperature
rise of the base at the termination
of
melting is approximately
AT b "_ 0.027
291.67
-- 7.88K(14R)
Determine
rise for a second acceptable
geometry.
Second, assume a fin height of 8.38 cm (3.3 in.) and a half-fin spacing of
0.508 cm (0.2 in.). From Figure 56, the corresponding
temperature
rise of
the base at the termination
of melting is approximately
AT b _
0.06
291.67
--_ 17.5K(32R)
143
Example3
Given: In a phasechangedevicethe designerwishesto utilize 0.0127cm (0.005
in.) thick fins and he wants to limit the basetemperaturerise to 13.89K (25R).
Consequently,the basetemperatureriseratio is not to exceed
ATb
13.89
Tf
291.67
Case a
- 48
A heat
10 -3
flux density
of 1076.4
J/s-m 2 (341.4
Btu/h-ft
2) is required.
Determine
acceptable
geometry
and the corresponding
latent
energy
storage capacity.
From Figure 46, a height of 1.27 cm (0.5 in.) can be
used with a half-fin spacing up to approximately
0.48 cm (0.19 in.). The
corresponding
latent energy
kJ/m 2 (206 Btu/ft 2).
storage
capacity,
Determine
acceptable
geometry
and
the
storage capacity.
From Figure 51, heights
half fin spacing of 0.254 cm (0.1 in.) and
used for a half-fin spacing 0.127 cm (0.05
limits on the latent energy storage capacity,
Figure
33, are 6923
kJ/m 2
(610
Btu/ft
Btu/ft 2 ), respectively.
Case b- Assume
an imposed
heat flux density
from
equation
(22),
is 2338
corresponding
latent
energy
up to 3.81 cm (1.5 in.) for a
up to 9.65 cm (3.8 in.) can be
in.). The corresponding
upper
from either equation
(22) or
2) and
17 114 kJ/m 2 (1508
of 4305.6
J/s-m 2 (1365.7
Btu/h-ft
2 ).
Determine
an acceptable
geometry
and the corresponding
latent energy
storage
capacity.
From either
Figure 46 or 57, the fin height cannot
exceed
1.27 cm (0.5 in.) for a half-fin spacing 0.127 cm (0.05 in.). From
equation
capacity
Example
(22)
or Figure
33, the corresponding
is 2247 kJ/in 2 (198 Btu/ft2).
Case a -
144
energy
storage
Given:
A phase change device is required
to have
5.08 cm (2.0 in.) and its base is to be exposed
to a heat
(682.9 Btu/h-ft 2 );
store
latent
as much
The
designer
energy
wishes
a fin height
flux density
of 0.0127
of no more than
of 2152.8 J/s-m 2
cm (0.005
in.) to
as possible.
Determine
the
spacing
of
temperature
0.3175
rise is
base
temperature
cm
(0.125
rise
in).
if the
From
designer
Figure
48,
selects
the
a half-fin
maximum
base
ATb --- 0.21 291.67 = 61.3K(llO.3R)

which is too largefor mostpracticalconsiderations.
Determinethe basetemperaturerise for a half-fin spacingof 0.127 cm
(0.05 in.). From Figure48, the maximumbasetemperatureriseis
AT b -----0.095
Case b - Assume
the designer
--_ 27.7 K(49.9R)
selects
a fin thickness
of 0.0508
cm (0.02
Determine
rise for a half-fin spacing
(0.125 in.). From Figure 43, the maximum
base temperature
cm
Determine
rise for a half-fin
spacing of 0.127
base temperature
rise is
cm
AT b "_ 0.043
Case c
in.)
of 0.3175
rise is
AT b -- 0.088
Assume
291.67
291.67
a fin thickness
25.7K(46.2R)
12.5 K (22.6R)
of 0.127
cm (0.05
in) is selected.
Determine
rise for a half-fin spacing
base temperature
of 0.3175
rise is
cm

rise for a half-fin spacing of 0.127
From Figure 38, the maximum
base temperature
rise is
cm
AT b -- 0.060
Determine
(0.05 in.).
AT b = 0.030
Example
X 291.67
291.67
291.67
--_ 17.5K(31.5R)
-- 8.8K(15.8R)
Given: A phase
flux density
of 2152.8
change device
J/s-m 2 (682.9
is to be designed to have its base exposed to a heat

Btu/h-ftz).
Space constraints
restrict the plan area
145
to 0.0557 m2 (0.6 ft 2) and tile maximumbasetemperatureat 5400 s (1.5 h) is not to

exceedthe PCMfusiontemperatureby more than8.33 K (15R). Consequently,
ATb
8.33
Tf
291.67
28.6
An estimate
of the required
2152.8
latent
10 -3
energy
5400/1000
storage
capacity
is
11 625 kJ/m 2 (1024
Btu/ft 2)
Determine
the acceptable
geometry
to satisfy these conditions.
An examination
of
Figures 33 through
35 reveals that the maximum
acceptable
height is 6.35 cm (2.5 in.)
and that the required
height must be greater than this as the fin spacing is decreased
and
as the fin thickness is increased.
Case a - Consider
a fin thickness
of 0.0127
conditions
cannot be met for this case (at least considering
be seen in Figure 54.
height
Case b - Consider
a fin thickness
of 0.0508
of 7.62 cm (3.0 in.) and a half-fin spacing
cm (0.005
geometries
in.). The specified

used herein) as can
(0.02 in.). Figure 55 shows that a fin

of 0.127 cm (0.05 in.) will facilitate
maintenance
of the base temperature
rise constraint.
An examination
of Figure
indicates
that the latent energy storage capacity is also satisfied. Figure 67 shows that
time required for the PCM to melt is 5760 s (1.6 h.).
V.
RELATED
34
the
TOPICS
In the preceding
section, attention
has been
paraffins
and to an extensive
numerical
study of a
results of the parametric
study should be helpful to
for applications
compatible
with the model, but the
given to certain properties

of several
particular
phase change device. The
the designer of phase change devices
user needs an awareness of features
that may require more specialized

treatment
in a critical design. Some of these important
features
which are discussed
in this section
include:
(1) filler, (2) convection,
(3)
solid-phase
thermal
conductivity,
and
(4) consideration
of an application
with a
nonuniform
thermal boundary
condition.
A.
the
146
The principal reason

PCM. Most nonmetallic
Filler
for using a filler is to improve the flow of energy to or from

PCM's, particularly
the paraffins,
have very low thermal
conductivities;consequently,largethermalgradientsmaybc requiredto effect the desired

heat transfer betweenthe PCM and the heated or cooled sttrfaccof the phasechange
device. Incorporation of the metallic filler within the PCM region yields a composite
mediumwith a higher effective thermalconductivity. If the applicationimposesa size
limitation on the phasechangedevice,utilization of a filler reducestile volumeavailablc
for the PCM.Consequently,when consideringthe energystoragecapacity,tile largeheat
of fusion of the displacedPCMis replacedby the specificheat-temperature
riseproduct
for the filler.
Fillers are discussedin References2, 15, and 16. Sometypes which havebeen
consideredare:
Aluminumpowder
Aluminumfoam
Aluminumwool
Aluminumhoneycomb
Copperfoam
Alumina(A12Oa)foam
Alumina(A12Oa)powder
Aluminumfins (straight).
Basedon testsinvolving aluminumwool, aluminumfoam. copperfoam. and almninum

honeycomb,it is reported[15] that honeycomboffersdistinct advantages
overthe other
threetypes.The resultsof a numberof performancetestson honeycomb are given.
Straight fins offer some advantage
over honeycomb
in certain cases since better
thermal
contact
between
the filler and the housing of the phase-change
device may be
possible. Fins can be welded to the housing or they may be provided integrally
with the
housing via milling or casting.
The
numerical
study
treated
in
straight-finned
arrangements.
Likewise
the
pertains to applications
with straight fins.
Sections
I11 and IV applies
experimental
work presented
specifically
in Reference
to
2
The designer
should
evaluate
the advantages
and penalties
of using a filler.
Fabrication,
thermal
contact
resistance,
added weight, reduced
energy storage capacity,
and improved
effective
thermal
conductivity
are all interrelated
factors. The effects of
straight-fin
spacing, height, and width on the thermal
performance
of the model treated
in Sections
III and IV are reflected
in the results.
Some comparative
insight into the
effect of the use of honeycomb
in Reference
15.
filler may be obtained
from
the results
of tests presented
147
B.
Convection
The physical
model and the parametric
numerical
study which are presented
in
Sections
III and IV are based on the conductive
mode of heat transfer only within the
PCM. If motion
occurs within the liquid phase of the PCM, the heat transfer is affected.
This behavior
may require
special consideration
for applications
where the liquid is
subjected
to surface or body forces of sufficient
magnitude
to initiate and sustain the
motion.
For the considerations
given herein,
there
appears
to be no previous
or
contemporary
treatment
of the formidable
problem
of an exact analysis of convective
motion in enclosed
cells of liquid. Some experimental
correlations
exist for certain cases,
and these have been applied
with some success to phase change
problems.
A brief
background
review and some considerations
related to PCM studies are presented
in the
following paragraphs
to aid the user in his study of convective
effects.
1. Brief Review of Convective
Considerations.
If one neglects body force fields
other
than gravity
and surface
forces other
than surface
tension,
convective
motion
within the liquid of a PCM could still be due to one or more of the following effects:
Nusselt
number
Buoyancy
Surface
tension
forces
Density
change
as the PCM undergoes
forces
a phase
change.
In early studies
of buoyancy
driven convection,
Lord Rayleigh
[17] related the
numbers
(Nu) to the product
of the Grashoff
number
(Gr) and the Prandtl
(Pr). The product
of the latter two is known as the Rayleigh number (Ra).
Numerous
experimenters
have
conducted
studies
that
were
related
to
hydrodynamic
instability
caused
by buoyancy
as it effects the heat transfer
process,
including
the studies
cited in References
18 through
29. O'Toole
and Silveston
[30]
verified
the Nusselt
number
versus Rayleigh
number
correlation
for a fluid confined
between
two parallel
plates (Fig. 108). A number
of authors,
including
Edwards
and
Catton
[31] later showed
the effect of L/d ratios for closed cells (Fig. 109), where L is
the cell height and d represents
fin cell spacings.
The critical Rayleigh
number is defined
as the value at which convection
begins.
In the region below the critical value, the heat transfer is substantially
by conduction
only (i,e., Nu = 1). The critical value, which depends on the boundary
conditions,
is 1708
for a fluid confined
between
two infinite horizontal,
isothermal,
conducting
walls; it is
720 for the case of a fluid confined
within a nonconducting
walled container
[29]. As
shown for a bounded
cell (Fig. 109a), this critical value tends to increase as the cell sides
approach
one another
(i.e., as L/d increases),
and it also tends to increase as the walls
become more conducting
(Fig. 109b).
Although
scientists
time, quantitative
studies
created in B6nard's classic
148
have been aware of surface tension driven convection

for some
of this phenomena
appear
to be scarce. The flow patterns
experiment
[32], which produced
cellular circulation
patterns
,9!
1.8
D 6_ z_
1.7
1.6=1
1.51.4-
uJ
WATER
1.31.2-
1.1-
ETHYLENE
0
A
SILICONE
HEPTANE
SILICONE
GLYCOL
OIL AK3
OIL AK350
1.0z
0.9'
_J
0.8
1000
1500
RAYLEIGH
Figure
108.
II
2000
Silveston's
experimental
in various
liquids
NUMBER,
3000
Ra
results
in the neighborhood
(Fig. 11 of Reference
2).
of instability
10 7
il
10 j-
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IL/d)
a
Figure
109.
Region
RATIO
(Uil_
b
of influence
of L/d
on heat
transfer
(Fig.
12 of Reference
2).
149
in a very
[33l,
shallow
Pearson
liquid,
[341,
were
Striven
initially
[35],
attributed
and
was due to surface

tension
driven
convection.
attributed
to Marangoni
[37],
and the term
with this phenomenon.
The
[38],
nature
is that
in the shear
temperature,
of
force
which
= Oo
Since
the
Marangoni
temperature
by
a subsequent
qualitatively
that
a depression
from
the
"b"
is negative,
decrease
occurs
hot
zone
Larkin
[41]
photographed
this
verification
of the phenomenon.
in
an
the
in the
and
effect
however,
this
Block
phenomenon
of this phenomenon
is
is commonly
associated
Young,
gas/liquid
increase
surface
surface
toward
for
HOT
by
that
(;oldstein
intcrfacc
and
produced
Block
variations
of surface
tension
on
_23_
accompanied
away
discovery
Flow"
as discussed
a frec
effects;
proved
+ bT
coefficient
flow
buoyancy
later
along
the surface.
This is due to the dependency
is estimated
by Gambrill
1391 to be linear:
the
to
across
[36J
Tile initial
"Marangoni
['low,
variations
to
Sternling
temperature
tension.
Hershey
at a local
the
a number
in
cold
hot
zone
spot,
(Fig.
of configurations,
at the
[40J
surface
has
causing
l l0f
the
Mc(Jrcw
producing
is
shown
liquid
and
d"amatic
FLUID
(7 C O H
O'c ,_ O H
OH
"_
:"-.-I'!S:'":.'.:':':..':,::'-:':.:':':':--'.'5"gT.:-i{i,/l"
l.'.:-"::::'.'-"-.'-":.'::".'..:"::.::'!i::::'!:!'-"
COLD FLUID
Figure
The
Marangoni
Ma
110.
level
number,
Surface
of
surface
Ma, which
-do
dT
dT
dy
tension
is given
convection
driven
patterns
convection
(Fig.
13 of Reference
is
correlated
2).
by
using
the
by
L2
(24)
p12 0_
150
tension
The critical
as 80.
Marangoni
Nields
might
be
[42]
better
parameter,
number
has
for a fluid
stated
that
determined
by
the
fixed
onset
correlating
between
a rigid and free surface
of convection
the
Nusselt
in a standard
number
with
is given
one-g
a
field
normalized
R, given by
R -
Ra
Racr
Ma
+ _
Macr
(25)
This assumes
that buoyancy
and Marangoni
driven
convection
are additive.
Grodzka
[43],
however,
noted
that experimental
data on buoyancy
and Marangoni
surface
effects indicated
that such an additive relation
does not hold. Regardless,
the
convective
currents
caused by Marangoni
flow in a standard
one-g gravitational
field are
usually
small compared
to those
caused
by buoyancy.
For most
fluids at normal
temperatures,
Pearson
[341 has shown that a liquid thickness
of 1 cm or less must be
attained
before Marangoni
effects overshadow
buoyancy
effects.
For
number,
systems
with
small
characteristic
dimensions,
the
nondimensional
Bond
Bo, is given by
Bo =
This number
Gravity
Surface
Forces
Tension
is sometimes
Forces
used
pgL 2
(26)
to evaluate
the
relative
importance
as compared
to buoyancy
effects.
From equation
(26),
number indicates a high degree of surface tension effects.
it
follows
of Marangoni
that
a low
effects
Bond
Although
surface tension effects exist at all unlike interfaces,
only the liquid/gas
interface
(as opposed
to liquid/liquid
and liquid/solid
interfaces)
is expected
to produce
appreciable
resulting
flows. However,
no proof
of this conjecture
was noted
in the
literature
surveyed.
Volume
change driven convection
can be caused by the phase change
process.
During freezing, the new layer of frozen material at the interface
tends to contract,
since
the solid density is usually greater than the liquid density. Consequently,
the liquid near
the front
will flow toward
the interface
to fill the volume
shrinkage
caused
by
solidification.
During melting, the liquid at the interface
tends to flow away to allow for
the volume
created by melting. Tien and Koump
[44] have stated that this effect will
cause both the freezing and melting process to be retarded.
This retardation
is due to the
ingress
Ill)
of warm
fluid during
freezing
and
the
egress
of warm
fluid
during
melting
(Fig.
151
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I
LIQUID
FREEZING
Figure
If
liquid
into
the
drawn
Tien
fictitious
that
l I l.
effects.
can be
change
circulation
and
a
Volume
is
interface,
where
10
percent
Since
paraffins
inferred
that
flow
in
have
solid
reduction
the
experience
only
an even
smaller
in
2).
warm
fluid
could
be
process.
a
percent
freezing
14 of Reference
processes,
melting
shown,
is 25
in
(Fig.
melting
the
also
density
patterns
the
augmenting
[44]
the
driven
created
thereby,
Koump
system
only
MELTING
computational
greater
rate
exercise
than
occurs
due
a 5 to 10 percent
volume
effect
can be expected
in
the
liquid
to
volume
for
density,
change
increase
on melting,
it
paraffins
for similar
conditions.
In summary,
static
phase
one-g
only
by
buoyancy
are negligible,
2.
have
the
change
principal
process
driven
currents
except
Zero
been
for very
Gravity.
in
space
modes
of heat
are conduction
for
thin
Since
reasonable
films,
and
a number
flight
transfer
that are
and convection.
of
situations,
container
volume
sizes.
change
of
attention
is
in a typical
is caused
Surface
tension
may
be ignored.
effects
applications
some
involved
Convection
phase
change
devoted
effects
devices
here
to
[2]
zero-g
performance.
When
several
comparing
differences
are
gravitational
force
zero-g
environment.
bombardment,
and
Restricting
hermetically
sealed
arid
remains
The
lessening
152
of
the
three-dimensional
the hypothetical
container
that
shields
as the
primary
or
in
is nearly
balanced
Effects
caused
antipenetration
gravity
environs
noted
only
and
elimination
to
of
of
reduced
buoyancy
Earth
orbital
transfer
space
with
In
Earth
process.
that
of
orbit,
the
the
Earth,
reduced
by the centripetal
orbital
by
reduced
pressure,
force,
creating
an effective
radiation
field,
meteoroid
spacecraft
also
phase
is isolated
important
effect
near
heat
be
maneuvers
change
from
aboard
alien
are
device
exterior
possible.
under
consideration
thermal
effects
by
nonmaneuvering
vehicle,
to be
insulation
then
reduced
effect.
gravity
on
convection.
the
heat
Typical
transfer
mechanism
measurements
is in the
of
the
net
gravitational
acceleration
force on a spacecraft
indicates
acceleration
1 10 -7 g. Using nonadecane
paraffin
properties,
a typical Rayleigh
level of gravitational
acceleration
is
levels of the order

number
of this low
Ra = 0.01 L a AT
(27)
Equation
(27) indicates
that, for reasonable
container
sizes (i.e., less than 15 cm (6 in.)
cell depths),
the temperature
difference
across the liquidus portion
of the cell must be
444C (830F)
to produce
buoyancy
driven
convection.
Since this temperature
difference
is well in excess of normal
operating
values, buoyancy
stimulated
convection
may be considered
negligible.
At one-g,
Marangoni
flow or surface
tension-driven
convection
unimportant;
however,
at zero-g this is not necessarily
true. As discussed
flow caused by surface tension at a liquid/vapor
interface
may occur.
is normally
earlier, liquid
A group of experiments,
performed
during
the mission of NASA's Apollo-14,
revealed that the surface tension driven phenomena
in zero-g is a reality and can produce
significant
convection
[45,46].
Using data from these experiments,
Grodzka
[46] has
plotted
tlae relation
existing between
the Marangoni
number
and the ratio of effective
thermal
conductivity
to actual conductivity
(Fig. 112). These data show a rapid increase
in the convective
level at a Marangoni
number slightly greater than 300. The temperature
difference
in the Krytox test liquid was only 2.5C (4.1F) in this instance.
Close examination
of these data stimulates
some questions.
Applying
these data to
nonadecane
paraffin
contained
in a cell with a 15.24 cm (6 in.) characteristic
dimension
at a Marangoni
number
of 300,
a Keff/K
of 12 is predicted
high convective
level. The temperature
difference
across
to reach this convective
level is only 0.001 lC (0.002F);
a Rayleigh number
of 4.32 X l0 s is predicted
at one-g.
in Figure
112. This is a very
a parallel plate system required

however, for this same system,
From this, a Keff/K of only 2.5
is indicated,
which is a convective
level well below that predicted
by the tentative
surface
tension data. This conflicts with earlier investigators,
who reported
that for this condition
at one-g, Marangoni
driven convection
is unimportant.
This could be explained,
at least
partially,
by the fact that the Apollo 14 data were taken for a free surface, whereas the
Figure 108 correlations
were taken for top and bottom bounded
cells.
Using nonadecane
paraffin
the Marangoni
number is given by
Ma = 2374
This
indicates
(0.006F)
that
properties,
evaluated
at the phase
change
temperature,
ATL
(28)
for reasonably
is necessary
for the
sized
onset
cells,
a temperature
of Marangoni
driven
difference
convection
of only
0.003
in a paraffin
filled
153
device
at zero-g.
This
fact,
along
that Marangoni
convection
can be
Since
freezing
be
the
(where
implied
that
magnitude
buoyancy
the
of
with the
appreciable
volume
driven
at zero-g
are
volumetric
then
change
convection
effects
convective
processes.
Consequently,
are negligible
for zero-g
operation.
device
tfigh levels
at zero-g.
reduced
indicated
effects
discussed
is negligible)
are
for
effects
modes
to Marangoni-driven
as for
pure
1 12,
were
and
heat
in
pure
suggests
low
melting,
conduction
on the
occurring
convection
Figure
earlier
as well
negligible
the volumetric
Heat
transfer
in
as
transfer
a phase
well
process
change
conduction.
25
KRYTOX
143 AZ
d = 0.2 cm
J
K = 845
s-m-K
20
C) !
,_Tcr = 0.6C
15
|0
Cl
0
0
100
200
300
MARANGONINUMBER,
_ do
_A
Ma =
400
500
Td
dT
pvor
A T/_Tcr
Figure
154
112.
Heat
transfer
characteristics
of Be'nard
cells
(Fig.
15 of Reference
for
it may
2).
as
A secondaryeffect of reducedgravity which can significantly alter tile heat

ll-dnsItq[',l_,_ccss
is the ullage,gaspositioJl.In a typical rectangularcell containingullage
volumv, the,ullagegasmay configureitselt in any of a number of possiblemodes.A
uulnbcr of possiblecell ullage locations arc given by Reference2, those of more
importance are shown in Figure 1 13. When heating/cooling
from
the bottom,
only
configmations
heating/cooling
rate
of
heat
occurring
c'ould
'_arm
Fig.
in
113),
from
trausfcr
the
the
(Fig.
113)
could
induce
heat
decreasing
thc
t()
property
form
in
quanlitative
transfer
would
alter
the
top or sides, configurations

due
to the
insulating
effect
liquid
thereby
have
ullage
illsulficicnt
the
bc caused
by the Marangoni
zones.
Also, bubbles
could
paraffins
the
and
of
data
process
under
apparent
being
center
are
a, b, d,
of the
currents.
In
llow phenomon
causing
the
be entrapped
in the freezing
the
the
convective
normal
good
of
awlilable
given
thermal
cell
on
wetters,
(configuration
these
phenomena
however,
and e would
ullage
gas.
a zero-g
bubbles
solid
conductivity
surface
the
process;
of
which
the
all reduce
the
Small
bubbles
field,
this
motion
to migrate
(configuration
PCM.
in zero-g
c of
when
Fig.
to determine
toward
d of
Fortunately,
tends
113);
the
to force
however,
effect
on
conditions.
"_:i:i.O':-:.'.:'9i'.:.i.;"
]
ULLAGE
".-.:. ,.":..:..:,..;,_t_A..
PCM
I'!O'::... :_":".'.'d:':
,::,!:".'::':"::::':O:
d
Figure
113.
Zero-gullagecoufigurallons(Fig.
16 of Reference2).
155
Grodzka
[4] has examined
effects of the space environment
on the microscopic
processes.
She concluded
that complex
coupling
effects between
phase change kinetics
and Various possible complex
coupling effects between phase change kinetics and various
possible modes of convective
motion cannot be predicted
accurately
without actual flight
data. She also concluded
that the magnitude
of magnetic
and electric fields likely to be
encountered
in the Earth's
orbit
are not expected
to alter phase change
behavior
significantly
from
that
observed
on Earth.
Finally,
she stated
that radiation
fields
encountered
in Earth orbit are expected
to have little effect, except perhaps in the case
of an organic PCM where long time exposures
will result in the buildup
of impurity.
Although
the later statement
applies to a paraffin,
no definitive
information
on this
effect could be found in the literature
surveyed.
findings,
Although
insufficient
some observations
reduced
have been
gravity
data are available
made as to the mechanisms
to corroborate
these
of heat transfer
in a
phase change device. When a free surface is present

and thermal
conditions
are proper,
Marangoni
convection
may
be present.
Insufficient
data are currently
available
to
determine
quantatively
the influence
of this phenomenon.
In the absence
of surface
tension
effects,
conduction
is the primary
process
governing
heat
transfer.
The
conduction
process may, however,
be altered
by the ullage gas location.
Furthermore,
secondary
effects
of property
degradation
due to radiation
may occur if tile PCM is
organic.
3. PCM Related
Considerations.
Regarding
buoyancy-driven
convective
currents
in Ilhe liquid during the melting of a PCM, a major factor is the positioning
of the heated
surface.
If the heated
surface is located at the bottom
of a PCM cell during melting,
convection
may
significantly
augment
the heat
transfer.
Conversely,
the role of
convection
is minor, vanishing
for one-dimensional
cases, when the heated surface is at
the top of the cell. The contribution
of convection
in the liquid to the heat transfer
during solidification
depends
on positioning
of the cooled surface, but it also depends on
the amount by which the initial liquid temperature
exceeds the fusion temperature
of the
PeN.
closed
Prensner
and
cells.
Their
Hsu [47] reported

work
revealed
on
the
studies of natural
convection
possibility
of
a number
in air within
of different
geometry-dependent
convective
patterns,
even under steady state conditions.
Such studies
attest to the formidable
task of analytically
predicting
the transport
mechanism
occurring
during
natural
convection
within a bounded
fluid. When considering
convection
within
the liquid during melting of a PCM, the problem
is further complicated
by the fact that
one of the boundaries
is moving (i.e., the interface).
Even if accurate
predictions
of the
convective
mechanism
were possible,
another
unpredictable
feature
PCM devices is the tendency
tot the PCM to melt up the fin with
subsequently,
falling to the heated surface.
occurring
the solid
in finned
PCM core,
While the aforementioned

difficulties
appear pessimistic,
some success has been
reported
[2, 48] on approximately
accounting
for convection
during the melting of a
paraffin.
The approach
made use of the correlations
given by O'Toole and Silveston [30]
which are:
156
1700
_< Ra _< 3500
Nu = 0.00238
3500
< Ra _< l0 s
Nu = 0.229
Ra 'zs 2
Nu = 0.104
(Ra)'3S(Pr)
10 s < Ra
<
19 9
Ra 'sl
6
(29)
'84
Although
the correlations
given by equation
(29) were determined
from data on steady
state heat transfer
through
horizontal
layers of fluid, they were used as a means of
estimating the convective
effect within the liquid of finned PCM cells similar to the one
modeled
in Section
llI. The scheme
involved
continuous
replacement
of the thermal
conductivity
of the liquid by an effective
thermal
conductivity,
which was calculated
by
Keff
It was
because
= Nu
(30)
recognized
that this scheme
would
not yield true
the convective
mechanism
therein was being artificially
a hypothetical
medium
with a larger
thermal
conductivity
than
temperatures
in the liquid
replaced
by conduction
in
that
of the liquid PCM.
Figure
114 shows
some experimental
data
for the interface
location
during
melting of a paraffin
inside a cell similar to the one modeled in Section Ill. Also shown
are numerical
predictions
for conduction
only and for inclusion
of convection
in t_e
manner
previously
described.
The numerical
predictions
shown
in Figure
114 were
achieved
with an explicit formulation
which was subject to a stability
requirement.
For
nodes
located
in the
fin,
this requirement
demanded
excessive
computer
time;
consequently,
temperatures
along
the
fin
were
approximated
with
the
aid of
measurements
from thermocouples
attached
to the fins. With the approximate
inclusion
of convection,
the predictions
were
promising.
The
predicted
interfacial
positions
followed the same trend as the experimental
data. Although
magnitudes
did not exactly
agree, the difference
appeared
to be due to a shift in time and might have been
associated
with starting
conditions.
Use of this approach
for including
convection
is
discussed more extensively
in Reference
2. Also presented
is a more detailed discussion of
the computer
program
and several comparisons
between
predictions
and experimental
data. The
values
computer
program
is also listed
and briefly
4. Solid Phase Thermal

Conductivity.
for paraffins
apply to the liquid phase.
discussed
in Appendix
Nearly all published

Since the mechanism
D.
thermal
conductivity
of heat conduction
is
typically
different
in solids than in liquids, one should expect some difference
between
the thermal
conductivity
value for the solid phase and that for the liquid phase of a
PCM.
transient
In studies reported
interfacial
location
in References
2 and 49, attempts
to analytically
predict the
during the phase change of a paraffin
were more successful
157
8:
3.0
6
E
Iz
I-z
2.0
.1
..I
.J
U.I
(.)
=J
ul
<
Z
0
<
z
Q
I<
u
0
<
u
0
0
0
.-I
o/
tZ
O
E
-1
Z
0
EXPERIMENTAL
DATA
z
Q
1.0
z
0
i
1/1
IL
2
o
PREDICTED
WITH
APPROXIMATE
INCLUSION
CONVECTION
--
_"
0
0
0.2
- CONOUCTION
I
0.4
1 14.
Comparison
0.6
TIME,
Figure
OF
_ J
_CTEO
158
i1
I
0.8
MODEL
I
1.0
between predicted
and measured
for an example melt run.
fusion
front location
I
1.2
for the case of melting than for the case of solidification.

Two plausible explanations
for
the lack of success with solidification
existed. One explanation
was simply that the true
value of the thermal
conductivity
of the solid phase may not have been used in the
analysis. Knowledge
of the thermal
conductivity
of the solid is more critical in analyses
of solidification
than in those of melting. Another
possible explanation
was related to the
character
of the solid-liquid
interface
during the phase transition.
During melting,
the
interface
appeared
smooth.
During solidification,
however,
it was covered with numerous
projections
called dendrites.
Their presence may have affected
rate. The discrepancy
may also have been due to a combination
Thomas
and
Westwater
[50]
studied
tile nature
and
melting
of
n-octadecane.
Measured
interfacial
predictions
by as much as 100 percent;
the difference
the interface.
the interfacial
heat
of both effects.
of the
interface
transfer
during
freezing
velocities
exceeded
analytical
was attributed
to irregularities
at
Bailey and Davila [51] monitored

the position of the solid-liquid
interface
during
solidification
of hexadecane
and octadecane.
Bailey and Liao [52] found that effective
solid
thermal
conductivities,
which
yielded
agreement
between
predictions
and
experimental
measurements,
Dyer
nonadecane
and
and
exceeded
Griggs
[49]
hexadecane;
published
values
by
factors
ranging
from 2.5 to 3.
measured
interfacial
positions
during
solidification
of
they
also
determined
the
values
of solid
thermal
conductivity
which
forced
agreement
between
the
measurements
and
numerical
predictions.
Tne
work
was
extended
to
include
measurement
of
the thermal
conductivities
of solid nonadecane
and hexadecane.
The measured
values did not agree
with the values required
to force agreement
between
experimental
and analytical
results
(Table
16).
As previously
mentioned,
values of thermal
conductivity
for the solid
paraffins
are less prominent
in the literature
than are those for the liquid phase.
the available values are summarized
in Table 16 for reference.
In
accuracy
summary,
analytical
predictions
of the
due to the aforementioned
effects.
The
phase of
Some of
solidification
of paraffins
designer
needs
to exercise
suffer
some
judgement
in the selection
of an appropriate
thermal conductivity
value to use for the
solid phase.
Uncertainty
associated
with the effect
of interfacial
irregularities
(i.e.,
dendrites)
renders the problem less ameriable to an exact treatment.
C. Example Application with a Nonuniform

Boundary Condition
Thermal
The parametric
study, which is presented
in Section IV, pertains
to a numerical
analysis
of a symmetrical
half of a single PCM cell. The results can be extended
to
multicell
phase change devices by appropriate
scaling provided that the thermal boundary
condition
imposed on the full-scale device is uniform
and agrees with the type analyzed.
159
TABLE 16. SOMEREPORTEDTHERMALCONDUCTIVITYVALUESFORTHE

SOLIDPHASEOF CERTAINPARAFFINSIN W/m-C
(Btu/h-ft-F)
raffin
Paraffin
Wax
McAdams[531
Nonadecane
Hexadecane
Octadecane
0.24
(0.14)
0.49
(0.28)
Bailey and Liao

[521 a
Dyer and Griggs
[491 a
0.35
(0.20)
Dyer and Griggs

[49]
0,26
0.35
(0.15)
(O.2O)
Powell
Challar
0.41
(0.24)
0.52
(O,3O)
and
_0.19
[541
(-0.11)
a. Value used to force agreement
between
analytical
and experimental
results.
One application
of phase change devices involves heat transfer between
the device
and a flowing fluid. In such applications,
the thermal condition
existing at the separating
surface between
the PCM and the fluid is not necessarily
uniform.
An analysis of the heat
transfer
between
the fluid and the PCM is not a simple problem.
The entire apparatus
including
PCM, housing, and flow passage could be subdivided into a thermal network
of
nodes and interconnecting
thermal
resistances,
and an appropriate
numerical study could
be performed.
Such an approach,
however,
could involve
a large number
of nodes,
particularly
if much internal
detail is needed. For a specific case, this approach
may be
the most desirable
as well as productive;
however, it certainly
does not appear feasible to
attempt
to generalize
it into an extensive
parametric
study, not only because of the vast
nature of the task but also because
of the large number of parameters
which would be
involved. The unwieldiness
of the problem is evident from the integral analysis presented
by Baily and Liao [55] even where some simplifying
assumptions
were incorporated.
An
approximate
approach
which utilizes input from the parametric
study is outlined
in the
following paragraphs.
The model under consideration
is depicted
in Figure 115. Fluid flows through the
flow passage
and makes intimate
thermal
contact
with a surface separating
it from a
device filled with a PCM. For this model, it is assumed
that the lower side of the flow
passage
160
is insulated
or that
a symmetrical
PCM device
is also located
on the other
side.
PCM
CON
II
II
I
I
./_
tl
.,,_v/
IL,/ /
//
" FINS IN THERMAL

CONTACT
WITH FLOW PASSAGE WALL.
THE
II
F,owJJ
Figure
/F,U,OF,OW
115.
An energy
Physical
balance
model for heat transfer between

device and a flowing fluid.
on a differential
length
a phase change
of the flow passage
yields
the following
equation:
aT m
p ApCp
0t
Neglecting
any effect
heat transfer between
transfer
IS INSULATED
BOTTOM;
.........
PASSAGE
differential
DEVICE
between
.
_T m
+ mCp a x -
due
the
Ox 2
kB(T m-T
(31)
s)
to the surface separating

the PCM and fluid, the instantaneous
surface and the PCM can be equated
to the instantaneous
heat
the flowing
h(T m - Ts)
02T m
kAp
fluid and the surface.
This equality
can be expressed
by
(32)
= U0(T s - Tf)
The right-hand
side of equation
(32) represents
the instantaneous
heat transfer
per unit
area between
the surface and the PCM. The two-dimensional
character
of the problem has
been masked
by use of an overall heat transfer
coefficient
based on the difference
between
the surface temperature
and the PCM fusion temperature.
Equation
(32) can be
rearranged
to yield the surface
temperature
as
161
Tm
Tf
Ts - 1 + (U0/h) + 1+ h/U0
Equation (33)
greatly exceeds
The
implies
h.
that T s_ T m when
elimination
neglection
of heat
(33)
of T s in equation
conduction
the
(34)
solution,
flowing
can be solved
however,
fluid
computer
and
the
programs
input
overall
(listed
with
U0
for
IV) provided
cells
U 0 values
may
is probably
be acceptable
much
less significant
PCM. If this hypothesis

the
those
variation
of Tm.
is valid, the
The
cases for which
solutions
Tmi+l
at
The space
the
derivative
heat
heat
first subscript
and
(34)
and temporal
heat
heat
transfer
transfer
with
of U 0 as part
the
of Tm;
h for the
PCM.
The
of the output.
heat transfer per unit area between

surface temperature
and the fusion
apply to a symmetrical
cell, use of
conduction
transfer
between
between
in the following
assumptions
variations
coefficient
the
may serve as a convenient
can be approximated
paragraphs
adjacent
surface
and
PCM
the
aid in analyzing
are restricted
to
are meaningful.
by
(35)
can be approximated
Tmi+l
(33)
,n - Tmi,n
,n - Tmi+l
_x
162
that
discussed
of equation
aid
At
aTm
The
lateral
U0 values
the aforementioned
The time derivative
aTm
since
the
a value
This value is determined

by dividing the instantaneous
the surface and the PCM by the difference
in the
temperature
of the PCM. Although
the computations
the
U0
spatial
of the convective
in Section
U 0 and T s _ Tf when
m 0 )
1 + Th/O
for both
coefficient
exceeds
fluid give
hB (
1 +Tfh/U 0
numerically
requires
greatly
(31)
in the flowing
+ rh Cp aT m p Cp A _)Tm
at
ax
Equation
by
,n-1
(36)
Ax
denotes
time while
the second
subscript
denotes
space.
Insertion
equation
of
(34)
Tmi+l
the
and
some
,n
I_p
cpA
difference
expressions
rearrangement
result
1
+ _fiaCP+
L_
Equation
t + At
(37)
from
adjacent
The
the
node
fluid
axis
must
functional
input
from
phase
of
that
The
change;
alteration
node
The
of
at
nodal
and
(36)
into
p Cp A
At
Tjni,n
,n-I
time
t and
temperature
Figure
a node
pattern
in the
the
and
the
fluid
at time
temperature
is illustrated
of
in Figure
distribution
116)
The
of
the
value
of
character
in the
transient
U 0.
the
One
tht_
116.
fluid
(i.e.,
w_riation
to determine
use
the
at
each
in the
on
/low
the
employed
of
is determined
U 0 for
the
of
(e.g.,
the
fraction
location
computation
laminar,
amount
computational
method
U 0 as a function
fraction
of
U 0 is dependent
consequently,
of
representing
representation
dl Cp
AT Tmi+l
temperature
initial
of
knowledge
change.
(35)
(37)
tile
the
axis
etc.).
involved
equations
to the flow passage

(i.e., temperatures
along
the vertical
convective
heat transfer
coefficient
for the flowing
fluid
phase
sequential
B Tf
+ h/U0)
of
t + At.
of
at the inlet
The internal
undergone
computations
at time
horizontal
turbulent,
has
incorporate
undergone
the
estimated
fully-developed,
which
and
require
along
temperature
of Fig.
116).
be
temperature
Ax
in
1 + h/UoJ
computation
previous
at x-
computations
temperatures
Ax
facilitates
Ill
laB
given
in
of
scheme
in
the
of
PCM
and
PCM
should
following
which
used
in
has
the
of Tin.
5
m 4
e_
z
u_
I-
3
2
_
0
4
n
(x DIS'I'_NCE
Figure
116.
Nodal
pattern
for calculating
INDEX)
bulk
temperature
of flowing
fluid.
163
A computer
program
which
facilitates
computations
of the type
previously
outlined
is listed in Appendix
C. Exploratory
calculations
have been made, but the
predictions
have not been corroborated
by any experimental
data. The program
was
developed
and intended
as a tool for investigating
the effect of the phase change process,
flow rate, and internal
convective
heat transfer coefficient
on the temperature
at the exit
of a flow passage which exchanges
energy with the phase change device. Without some
history of comparison
with experimental
data, the integrity
of the results can only be
conjectured
at this stage.
The
following
parameters
were
used
in
two
computer
runs
to
examine
the
influence
of the internal
convective
heat transfer
coefficient
inside the flow passage. The
results were generated
for the case of a sinusoidal variation
of the fluid temperature
at
the inlet of the flow passage. Initially, the flow was stagnant with the fluid in the passage
and the entire phase change device considered
to be at the fusion temperature
of the
PCM.
Length
of phase
Width
PCM thickness
Flowing
Flow
PCM fusion
temperature
U 0 variation
with
of phase
Btu/h-ft2-F
Temperature
change
device
device
31.7
cm (1.04
ft)
- 7.6 cm (3 in.)
- 3.8 cm (1.5 in.)
fluid -
rate -
change
Water
1.89 gm/s
(15 lb/h)
- 32.2C
fraction
or U 0 = 488.36
variation
(6.283
t) F with
with t (s)
of
Convective
heat
transfer
h = 283.86 J/s-m2-C
(50
Btu/h_ft 2 .o F).
PCM
- 434.03
of fluid
t (h)
(90F)
melted,
U0=
86.02-76.45
f J/s-m2-C
at passage
or Tinle t = 43.33
inlet
+ 5.56
Tinle t = 110 + 10 sin

sin (2.26
X 104 t) C
coefficient
inside flow passage
Btu/h-ft2-F);2nd
Run: h = 28.39
Ist Run:
J/s-m2-C
(5
The results for the fluid temperature

at the exit of the flow passage are shown in
comparison
to the inlet temperature
variation
in Figure
117. For both
heat transfer
coefficients,
the temperature
drop
across the passage decreases
as the PCM melts (as
would
be expected).
The relative
influence
of the heat transfer
coefficient
on the
temperature
drop across the passage is evident.
i64
_0
I-
,<
%oo
a.
u_
IQ
_9
-i
_L
I--
c_
<_
o
o
o
.1
U
_w
w
a:
_v
II
e.
--I
==
ae_
- il
o
0
I.t,I
o
n,
L
0
0
I.LI =1
55
-8
,..I II
u. U
40
el
40
4
_0
,4O
4O
4
0
.._
0
4 0
4
I-
o
0
0
40
40
oj
rz
Ol
o
i.o
:_o'3 u nzvu 3dlN=ll
I
e"
I
e"
-Io '31:1fllV_l
3diN31
165
APPENDIX
PROPERTY
APPENDIX
Tabulations
of certain properties
for a number of phase change materials are given
in this appendix.
They have been included
principally
to serve as a convenient
reference
for the user; they are not intended
to be exhaustive.
For more detail regarding
the
advantages
and disadvantages
of the listed materials,
the referenced
literature
should be
consulted.
Following
Table
A- 1.
is an index
Fusible
Btu/lb)
for the tabulations:
Materials
with a Heat of Fusion Greater
than
Listed in Order of Increasing
Melt Temperature
(40 to 150F).
(Table
3-1 of Reference
185.96 kJ/kg (80

from 4.4 to 65C
15).
Table
A-2.
Comparisons
of Fusion Properties
of Selected
56 (From Table 3 of Reference
56)
Table
A-3.
Properties
of Six PCM's Studied in Reference
57 with a Fusion
Between 273 and 373 K (From Table 2 of Reference
57)
Table
A-4.
Melt Temperatures
Table 6 of Reference
Table
A-5.
Four Low Temperature

7 of Reference
57)
Table
A-6.
PCM's
of Fifteen
57)
Used in Tests
PCM's
Reported
Low
PCM's
Reported
Temperature
Recommended
Temperature
PCM Candidates
in Reference
in Reference
in Reference
58 (From
(From
57 (From
Table
Table
1 of Reference
58)
Table
A-7.
Comparative
Data on Waxes and
Inorganic
Table
A-8.
Melting
Thermal
Table
A-9.
Melting Temperature
and Heat
Table 3-3 of Reference
1)
Table
A-10.
Melting Point, Heat of Fusion, and Latent

Hydrates (From Table 3-4 of Reference
1)
Table
A-11.
Melting
Eutectics
Hydrates
(From
Temperature
of Some Mixtures
Investigated
Energy Storage (From Table 3-1 of Reference
Temperature
(From Table
of Fusion
for
1)
of Inorganic
and Heat
of Fusion
3-5 of Reference
1)
Heat
of
Reference
Air
59)
Conditioning
Salt Hydrates
(From
Density
of Some
Inorganic
Some
Inorganic
Hydrate
167
TableA-12. CalorimetricData for SomeOrganicThermal EnergyStorageMaterialsfor

SolarHeating(From Table3-6 of Referencel)
TableA-13. Melting Temperatureand Heat of Fusion of Organic Materials for Air
Conditioning-Hydrocarbons
and Halogenated
Hydrocarbons(From Table3-7
of Reference1)
TableA-14. Melting Point
and
3-7 of Reference
Heat
of Fusion
for Some
Organic
Eutectics
(From
Table
A-15.
Melting
Eutectics
Table
A-16.
PCM Data for Some Alcohols,

Phenols,
(From Table 3-7 of Reference
1)
Table
A-17.
PCM Data for Organic

Reference
1)
Table
A-18.
Calorimetric
Data
Reference
1)
Table
A-19.
Melting Point and Heat of Fusion for Clathrates

and Semi-Clathrates
Congruently
Above 0C (32F)(From
Table 3-9 of Reference
1)
Table
A-20.
Melting
1).
168
Table
1)
Temperature
and
Heat of Fusion
for Some Acetamide-Organic
and Compounds
(From Table 3-7 of Reference
1)
Point
Acids
and
Miscellaneous
for Air Conditioning
for Organic-Inorganic
Aldehydes,
Organic
Eutectics
Ketones,
and
Ethers
Organics
(From
Table
3-7 of
Materials
(From
Table
3-8 of
(From
Table
Melting
3-10 of Reference
TABLEA-I. FUSIBLEMATERIALSWITH A HEATOF FUSIONGREATERTHAN

185.96kJ/kg(80 Btu/lb) LISTEDIN ORDEROF INCREASINGMELT
TEMPERATURE
FROM 4.4 TO 65C (40 TO 150F),

TABLE 3-1 OF REFERENCE
15).
Melting Point
C (OF)
Material
Tetradecane
Formic
Ca 4 H3 o
Ca s H32
246.1 (106)
(51)
185.8 (80)
17
(62)
185.8 (80)
18
(64)
236.8
21
(69)
185.8 (80)
Ca 7 H36
22
(71)
213.6
Acid CH 3 CHOHCOOH
26
(79)
185.8 (80)
28
(82)
243.8
29
(84)
195.1 (84)
29
(84)
104.3 (88)
32
(90)
220.6 (95)
33
(91)
202.0 (87)
35
(95)
197.4 (85)
37
(98)
246.1
(106)
38
(lOO)
229.9
(99)
39
(102)
204.3
(88)
40
(104)
257.7(111)
40
(104)
202.0
(87)
41
(105)
213.6
(92)
41
(105)
199.7 (86)
41
(106)
218.3
41
(106)
197.4 (85)
2 COOC2 H s
Acid CH3 CO2 H

Cl 6 H34
Chloride
n-Heptadecane
C 18 H38
13-Methyl
Pentacosane
Nonadecane
C27 H34 02
(C13 H27 COO)3 C3 H3
2-Dimethyl-n-docosane
Eicosane
C26 Hs 4
Ca 9 H4o
Trimyristin
C24 Hs o
C20 H42
1-Tetradecanol
CH3 (CH2)a 2 CH2 OH
Camphenilone
Caprylone
C9 HI 40
(CH 3 (CH2)6 )2 CO
Bromide
Heneicosane
C22 H4 s BR
C2 _H44
7-Heptadecamone
C17 H340
1-Cyclohexyloctadecane
4-Heptadecanone
(102)
Ethanolate
Octadecane
Palmitate
(89)
Ester
LiCI'4C2 H6 o
Docosyl
7.8 (46)
11
Hexadecane
Methyl
227.6 (98)
206.7
CH3 (CH2)l
d-Lactic
(Btu/lb)
(50)
Acid Ethyl
Lithium
kJ/kg
10
Myristic
Acetic
Heat of Fusion
5.6 (42)
Acid HCOOH
Pentadecane
(FROM
C24 H28
Ca 7 H34 O
(92)
(105)
(94)
169
TABLEA-1. (Concluded)
MeltingPoint
C (oF)
Material
Heat of Fusion
kJ/kg (Btu/lb)
42 '(107)
44 (111)
202.0
(87)
209.0
(90)
44 (112)
248.5 (107)
227.6
(98)
TricosaneC23H4s
45 (113)
47 (117)
232.2
(100)
3-Heptadecanone
Cl 7H340
48 (118)
216.0
(93)
2-Eptadecanone
C17Ha4 O
48 (119)
216.0
(93)
50 (122)
51 (123)
239.2
(103)
211.3
(91)
51 (124)
253,1
(109)
51 (124)
218.3
(94)
52 (126)
232.2 (100)
54 (129)
236.8
(102)
54 (129)
216.0
(93)
55 (131)
213.6
(92)
56 (133)
57 (135)
255.4
(110)
59 (138)
234.5 (101)
60 (140)
61 (142)
222.9
64 (147)
64 (148)
239.2
65 (150)
250.8
8-Heptadecanone
C_7H340
CyanamideCH2N2
Docosane
Cz2H46
MethylEicosanate
C2zH4202
Camphene
Cz o Ht 6
9-Heptadecanone
Tetracosane
C24 Hs 0
Elaidic
Acid C1 sHa402
Methyl
Behenate
Pentacosane
C24H4602
C2 s Hs 2
Ethyl
Lignocerate
C26 Hs 2 O2
Hypo
Phosphoric
Acid H4 P_ 04
n-Hexacosane
Myristic
C26 Hs 4
Acid
Heptacosane
C _ a H27 COOH
C27 Hs 6
Ethyl Cerotate
C2 sHs 602
Octacosane
C2 s Hs s
Nonacosane
C29 H60
Stearic
Acid Cx 7 H3
Triacontane
170
C_ 7Ha40
S CO2
C30 H62
199.7 (86)
(96)
253.1 (109)
(103)
199.7 (86)
(108)
r-.
o_
eq
C_
_2
n_
"_
t'5
o0
_0
O0
-A
o
,'a.)
e_
e.i
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Z_O_
n_
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P_
.._
t_
0
_A
oo
eq
o
0
[.o_
%
o
'0
)
_0
171
o,:5
[..
,-,4
.<
,:5o
o,o
0".
,_
0",
,..4t.4
O0
O0
O0
oq
oo
do
----
do
t-:. r-:.
_r-
oo
88
c,n
-,-;
U4
-_ I_11 ,z.
,
Z
r._
O0
O0
O0
<Z
[..,.,
,..,,.,_
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rO
Z_
U4
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;.-1
Z
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U..,I
e,_
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0.
"--"
r!
,,o
o",
_.
r_
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(-!.
r!.
U=
r._
,
Om
==
[..
.,
.,:',
Z
0
o
=7
4
U,3
,..4
lXl
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o
0
172
0
r_
TABLE A-4.
MELT TEMPERATURES
OF FIFTEEN
LOW TEMPERATURE
CANDIDATES
(FROM TABLE 6 OF REFERENCE 57)
Melt Temperature
K (R)
PCM
n-Dodecane
263.4 (474.1)
Transit-Heat
257.2 (463.0)
Formic
Acid/Formamide
(75.5/24.5)
256.4 (461.5)
Transit-Heat
252.2 (414.0)
Acetic
Acid/Formic
Acetic
Acid/Water
Acid (53.1/46.9)
250.7 (451.3)
(58%)
246.8 (444.2)
n-Decane
Formic
243.3 (437.9)
Acid/Potassium
Formate
Heptanone-4
Hydrazine
(75/25)
241.7 (435.1)
240.2 (432.4)
Hydrate
(N2 H4 " H2 O)
233.2 (419.8)
Monomethylhydrazine
220.8 (397.4)
Tricaproin
213
(383.4)
Tributyrin
198
(356.4)
Ammonia
195
(351.0)
194
(349.2)
Ammonia
PCM
Hydrate
(NH 3 H20_
173
.m
cq
do
_q
_c_
__
_o
=%
oo
Z
o,
OO
oO
0
a:2
h_
0
=o3
_S
Oc_
""
O
"1
r_
_
oO
,,_ oo
0
od
A
_c_
5o
z_"
_m
O
0
0
0
(D
5_
N_
"a'_
e_
<
0
m_
e_
a _
o
(:2)
O
O_
O%
e;
C_
C',l
cq
o
d
c_
<
t3
t"3
_D o
e_
0
C,I
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<
174
g
0
0
oO
oo
_zlE
0
x
O0
r_
[a.1
Z
r..r.1
r.,r..1
r,a.1
z_
,-o_.
,.o_-.
,.ooo
,o.-
t"_..
kD,'_
00,...._
O'xO0
00,''_
P".k.D
P"-O0
_"-k._D
I".O0
O_
O_
dd
dU
CU
-_1_
_z
o_
.,,-4
[-,
_,.-,
o_
Z,.a
[,,r.a
e_
dd
dd
<
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[.-,
==
=o
_
0
==
_
_,_
_._
e-,
e_
175
r,.k_
_-_
ol
Z
u_
u_
oO
e..
e_
u_
,o
oc_
e_
co
r.,_o
E
0
_d
0
,o
<
0
o
,_
e_
0
e_
_g
_._
t'.l
_
c_
"_
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c,.)
e,
0
o
,--4
[3
_._
Z
o I
<
e-,
o
._
<
<
o_ ,
.-
"
"
_'_
ilm
_._
e_
==
_ ._ "_ _
"_.
<
0
_"
_r'_
r,_
,_
,.0
o
<
176
<
TABLE
A-8.
MELTING TEMPERATURE
OF SOME MIXTURES
INVESTIGATED
AIR CONDITIONING
THERMAL
ENERGY STORAGE (FROM
TABLE 3-1 OF REFERENCE
1)
Mole
Relative
Weight
Composition
Weight
(gram)
Melting
Point
(%)
c (F)
NAz SO4
142.04
37.2
10 H:O
180.15
47,4
58.44
15.4
380.63
100.0
Na2 SO4
142.04
37.8
10 H20
180.15
48,0
N H4 C1
53.49
14,2
375.68
100.0
Na2 SO4
142,04
37.6
10 H20
180.15
47.6
1/2 NaC1
29.22
7.7
1/2 NH4 C1
26.75
7.1
378.16
100.0
Na2 SOa
142.04
35.8
10 H20
180.15
45.4
74.55
18.8
396.74
100.0
NaC1
Total
Total
Total
KCI
Total
FOR
18 (64)
lO (50)
13 (55)
7 (45)
177
178
E
_
>
>
f_
',D
I"_
_-
C_
C_
C_
O_'
_:_
e_
,_,
.._
<
_'_
E
0
_.)
179
TABLE A-10. MELTINGPOINT,HEATOF FUSION,AND LATENTHEATDENSITY

OF SOMEINORGANICHYDRATES(FROMTABLE3-4
OF REFERENCE1)
Heatof Fusion
(Literature)
MeltingPoint
C (F)
Material
__3('Btu_
-fir]
CaC12
6H20
28.9(84)
170.2(73.3)
2.86
X l0 s (7688)
MgCI2'6H40
117.2(243)
172.3(74.2)
2.69
X l0 s (7226)
Ca(NO3
)2 ' 4H20
42.8(109)
142.1(61.2)
2,59
X l0 s (6954)
Mg(NOa)2 " 6H20
95.0(203)
159.8(68.8)
2.34X
Zn(NO3)2" 6H20
36.1(97)
130.0(56.O)
2.69
AI(NO3)3" 9H20
70.1(158)
155.6(67)a
a. Experimental
180
LatentHeatDensity
value
10 s (6271)
X l0 s (7219)
TABLE A-I I. MELTINGTEMPERATUREAND HEATOF FUSIONOF SOME

INORGANICHYDRATEEUTECTICS(FROMTABLE 3-5
OF REFERENCE
1)
Heat of Fusion
Wt.%
Composition
CaClz
37
Ca(NOa )2
H20
23 approx.
40
CaCI2
MgC12
H20
41
10
49
CaCI2
K CI
NaC1
H20
48.0
4.3
0.4
47.3
Ca(NO3 )2 " 4H20

2n(NO3)2
" 6H20
45
55
Ca(NOa)2
Mg(NOa)2
Melting Point
C (F)
kJ(Btu_
kg \ lb
13 (56)
174.5 (75.1)
Experimental
25 (77)
129.7 (55.8)
Calculated
67
33
30 (86)
136.0 (58.5)
Calculated
Ca(NOa )a " 4Ha O

AI(NOa)2
' 9H20
72
28
35 (95)
138.9 (59.8)
Calculated
Mg(NO3)2
AI(NOa)2
" 6HaO
" 9H20
53
47
61 (142)
148.1 (63.8)
Calculated
Mg(NOa)2
2n(NOa)2
' 6H20
" 6H20
18
82
32 {90)
130.1 (56.0)
Calculated
" 4H20
" 6H20
25 (57)
27 (81)
181
0
0
0
<
0
0
0
0
0
0
t3
0
0
t_
F.-,
<
C',l
U3
_5
<
0
_,
o
0
t_
t'3
0
_'4
t3
t3
6
_0
[..,m
<
og
Fa_
"7
t'3
"7
0
t",l
"7
0
_
0
t'3
0
m_
_5
t3
e-,.
o)
b-
>.
0
0
r-,
0
.x::
0
0
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-1
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e-
<
<
<
-...,
_",i
e--
<
t,_
r_
--1
-_8
_._
182
TABLE
A-13. MELTING TEMPERATURE

AND HEAT OF FUSION OF ORGANIC
MATERIALS
FOR AIR CONDITIONING-HYDROCARBONS
AND
HALOGENATED
HYDROCARBONS
(FROM TABLE 3-7
OF REFERENCE
1)
Heat of Fusion
Compound
Melting Point
C (o F)
kg\
Ib /
(97.1)
n-Tetradecane
5.9 (42.6)
225.5
n-Pentadecane
9.0 (48.2)
162.9 (70.1)
n-Hexadecane
18.2 (64.8)
233.9 (100.7)
n-Hexadecylbromide
14 (57.2)
l-Heptadecane
11.2(52.2)
131.1 (56.5)
l-Octadecane
17.9 (64.2)
129.1 (55.6)
1-Pentadecyne
10 (50)
1-Hexodecyne
15 (59)
p-Xylene
13.2 (55.8)
159.9 (68.9)
Tridecylbenzene
lO (50)
168.3 (72.5)
Tetradecylbenzene
16 (60.8)
173.3 (74.6)
2-Nonyl
12 (53.6)
naphthaleno
3-Chlorobiophenyl
17 (62.6)
183
TABLE A-14. MELTING

EUTECTICS
POINT AND HEAT OF FUSION FOR SOME ORGANIC

(FROM TABLE 3-7 OF REFERENCE
1)
Heat of Fusion
Mole %
Compound
184
Melting Point
*C (F)
kJ (Btu_
a Chloroacetic
Phenol
Acid
31.0
69.0
16.5 (61.7)
144.1 (62.1)
/3 Chloroacetic
Phenol
Acid
35.0
65.0
11.8 (53.2)
138.2 (59.5)
o_Chloroacetic
p Cresol
Acid
28.0
72.0
13.4(56.1)
141.6 (61.0)
Chloroacetic
o Cresol
Acid
30.9
69.1
15.8 (60.4)
189.6 (81.7)
Acetic Acid
Benzoic Acid
88.0
12.0
9.5 (49.1)
184.6 (79.5)
Naphthalene
Diphenyl Methane
25.0
75.0
14.5 (58.1)
109.0 (46.9)
r..)
Z
.<
N2
<
_z
<
o_
0,.-,
_
_
O
_
_
O
_i_
_1_
I_
.<
<
"_
__
.=
oo
zd_
o_
ON
<
t_
t_
ZZ
[--,_
Z
O
0
u4
<
.-.1
<
<
<
N
.<
;.,,.,
185
TABLE
A-16. PCM DATA FOR SOME ALCOHOLS,

PHENOLS, ALDEHYDES,
KETONES,
AND ETHERS (FROM TABLE 3-7 OF REFERENCE
1)
Heat of Fusion
Melting
Alcohols
and Phenols
1-Decanol
1-Undecanol
Glycerol
m-Cresol
6.1
15
18
12
(43.0)
(59.0)
(64.4)
(53.6)
2-Chlorophenol
3,3 Dimethyl Cyclohexanol
7
11
(44.6)
(51.8)
11.8
14
15
12.6
14
(53.2)
(57.2)
(59.0)
(54.7)
(57.2)
Aldehydes,
Ketones,
200.4 (86.2)
94.0 (40.5)
and Ethers
1,4 Dioxane
2-Decanone
n-Tridecanol
Parahlehyde
2,5 Dichloroaceiophenone
186
Point
c (F)
Compound
145.3 (62.6)
104.4 (45.0)
TABLEA-17. PCMDATA FORORGANICACIDS

ORGANICS
(FROM TABLE
AND MISCELLANEOUS
3-7 OF REFERENCE
1)
Heat of Fusion
Melting Point
C (F)
Compound
Organic
k_J(Btu
kg
lb
Acids
Formic
Acid
8.4 (47.1)
276.7 (119.0)
Acetic Acid
16.6 (61.9)
201.3 (86.6)
Acrylic
12.3 (54.1)
154.9 (66.6)
Acid
n-Octanoic
Acid
16.3 (61.3)
148.2 (63.7)
n-Nonanoic
Acid
12.3 (54.1)
128.1 (55.1)
Oleic Acid
14
(57.2)
Other
Diethyl
Dimethyl
lsophthalate
11.5 (52.7)
Adipate
8.5 (47.3)
1,2 Ethylene
m-Cresyl
Diamine
Acetate
2,5 Dimethyl
Analine
8.5 (47.3)
12
(53.6)
14.2(5"7.7)
187
O0
0
0
0
oo
0
O_
_
0
0
_
0
O_
O
o
0"I
X
O_
_I_
<
(_
%
<
oo
,-_
I_.
oo
_l-
e_
_O
t_
O_
0
Z--
t_
0
Ou_
o_
_-.
O
_5
O
0.)
o_
- or..)
c4
t'-.l
r-0
,?
_/
_
>
t_
O
,--,
_r
c_
o
O I
_o
oo
0
.l
<
0
o6
"7
<
oo
_d
C_
C_
o
o
0
C
o
o
O
>
'E'
U_
_.N
,.._
._ d6
_. zZ
_2
ZN
c7
188
cr
=i
TABLE A-19. MELTING

SEM1-CLATHRATES
POINT AND HEAT OF FUSION FOR CLATHRATES

MELTING CONGRUENTLY
ABOVE 0C (32F)
(FROM
TABLE
3-9 OF REFERENCE
AND
1)
Heat of Fusion
Melting Point
C (F)
Composition
Type I Clathrate Hydrates
H2S 6.1 H20
H2S 6.1 H20
CO2 "6.0H20
C12 7.3 H20
SO2 '6.0H20
SO2 6.1 H20
C2 H40 6.9 H 20
0.4 (33)
29.5 (85)
9.9 (50)
9.7(50)
7,0 (45)
12.1 (54)
11.1 (52)
Type II Clathrate Hydrates

C4HsO 17.2 H20
(Tetrahydrofuran)
C4H80 2H2S - 17 H20
(CHa)3COH'2H
2S" 17H 20
kJ (Btu_
kg \ l-b--]
246.9 (106.3)
Calculated
4.4 (40)
255.2 (109.0)
Experimental
21.3 (70)
7.3 (45)
276.1 (118.9)
Experimental
1
1
Amine
Semi-Clathrate
(CHa)3N"
101/4H
Hydrate
20
Tetrabutylammonium
Salt Semi-Clathrate
Hydrates
Bu4NF 32H20
Bu4NCI' 32H20
Bu4NBr" 32H20
Bu4NNO3 32H20
BugNOH 32H20
Bu4NHCO3
32H20
(Bu4N)2 HPO4 ' 64H20
(Bu4 N)2 C2 04 64H20
Bu4NCHO2
32H20
Bu4NChaCO2
32H20
Bu4NC6HsCO
2 32H20
Tetraisoamylammonium
5.9 (43)
24.9
15,7
12.5
5.8
30.2
17.8
17.2
16.8
12.5
15,1
3.5
(77)
(60)
(54)
(42)
(86)
(64)
(63)
(62)
(54)
(59)
(38)
238.5 (t02.7)
Experimental
184.1 (79.3) Experimental

209.2 (90, 1) Experimental
Salt Semi-Clathrate
Hydrates
i-Aln4 NF 40 H20
i-Am4 NCI. 38 H 20
i-Am4NOH 40 H20
i-Am4 NCHO2 40 H 2 O
31.2(88)
29.8 (86)
31
(88)
15-20 (59-68)
189
TABLE
A-20.
MELTING
(FROM
POINT
TABLE
Urea
Mole
ORGANIC-INORGANIC
3-10
OF
REFERENCE
% A
17.5
15.9
23.5
33.4
Ntt 4 1
25.5
45.2
NH4NO3
47.5
54.7
Nit 4 SCN
39.5
48.4
LiNO 3
1G
18
LiNO 3
45.5
NaNO
KNOs
23
16
48.1
29.5
Sr(NO3
_2
)2
Ba(NO3 )2
K2 CO s
NH 4 CI
Nt|4
('!
46 (115)
32 (90)
76 (169)
104 (219)
84 (183)
110 (230)
92 (198)
48
10.5
33.8
140 t286)
67 (153)
96 (205)
14.8
102 (216)
MolcT_
NH4NO 3
NIt 4 SCN
(214)
76 (169)
66 (151)
25
15
38
Urea
101
24.3
22
9.4
s )2
Ca(NO3
Melting
Point
C (F)
Wt. % A
NH 4 Br
EUTECTICS
1)
Eutectics-Binary
NH4CI
Ca(NO
Eutectics-Ternary
Wt. 7_, A
2.4
2.5
Melting
Point
C(F)
Mole%B
Wt.%B
46
53
35 (95)
46
20 (68)
34 (93)
31
34
4O
NH4 NO3
LiNO 3
LiNO 3
40
7
46
51
32
NIl4 NO 3
NaNOs
41
47
9.7
35 (95)
NH4NO
KNO 3
44
49.9
5.7
43 (109)
LiNO 3
NaNOs
24
26
LiNO3
NaNO
45
49
LiNO 3
KNO 3
16
LiNO a
KNO3
45
LiNO 3
(atNOa)2
18.1
1.5
LiNO 3
LiNO3
Cai NO3 )2
16.5
41
44.5
Sr(NO3
)2
12
23
45 (113)
LiNO a
_la( NO3 )2
16
ll
17
68 (154)
LiNO 3
Ba(NO3
KNO 3
)2
44
46
22.3
27.7
l
7
92 (198)
73 (163)
17.5
3
20.5
4
18
20
NII4 NO3
NaNO
NaNO
KNO a
KNOs
KNOs
190
FOR
Ba(NO3
)2
Ca(NO3
)2
Ca(NO3
Ba(NO3
)2
)2
8.5
l0
7.1
13
65 (149)
56 (133)
3.5
4.6
100 (212)
17
9.5
62 (144)
43
19
11.5
4
14
24
5.5
27
4
9.2
10.3
14.4
2O
96 (205)
62 (144)
82 (180)
68 (154)
42.5
89 (192)
125 (257)
19.3
80 (176)
TABLE
A-20.
Acetamide
A
NH4NOa
LiNOa
NaNOa
KNOa
(Concluded)
Eutectics
Mole % A
Wt. % A
32
20
15
6
39
23
20
9.8
Melting Point
C (F)
38
25
59
72
(100)
(77)
(138)
(162)
191
APPENDIX
THERMAL
RESISTANCE
VARIATION
Some of the results of the parametric

study which are shown in Section V exhibit
interesting
trends.
Specifically,
some plots of the temperature
of
melting versus fin height
Several curves in Figures
this behavior is presented
Heat
The
flows
physical
directly
through
the fin and
the geometry.
demonstrate
a relative
51 mrough 62 indicate
in this appendix.
maximum,
a relative minimum,
or both.
this behavior. A plausible explanation
of
model, which was treated

in Section
IV, is shown
from the bottom
into the PCM. Heat also flows
top.
The
relative
thermal
resistances
s,
Figure
192
l-.--w
B-1.
Physical
"
of these
TOP
model.
paths
in Figure B-I.
into the PCM
is dependent
on
Some insight into the thermal resistance behavior may be gained by means of a
simple but nonexact
viewpoint.
Suppose
tile effect of tile top is ignored and the PCM
and fin are each represented
by a single node. Tile resulting
thermal
network,
including
thermal
resistances,
for the heat flow between
the bottom
and the PCM is indicated
in
Figure
B-2. The equivalent
thermal
resistance
for this arrangement
is related
to tile
parameters
by
Keq K w B =
The
right-hand
parameters
side
covered
1.0/[2W/H
of
+ 2 (K/Kw)HS/(2H_
equation
in the
(B-l)
parametric
was
study.
1069 was also used. The results are plotted

geometry
on the equivalent
thermal resistance
evaluated
The
(B-l)
+ WS(K/Kw)]
for
thermal
the
range
condttctivity
of geometrical
ratio
(K/K w) of
in Figures B-3 through B-5. The effect of

for the simplified network
is shown by the
curves.
H/KS2B
W/2KwHB
FIN
NODE
AIIL
BOTTOM
Pcr._NODE
NODE
H/2KwWB
Figure
B-2.
Simplified
thermal
network.
193
1.4
1.2
1.0
x
u
J
Z
ItM
,J
0.8
<c
=Z
I,M
3:
IIZ
ul
_1
0.6
<
>
3
LEGEND
S2 = 0.0127 cm (0.005 in.)
W.cm (in.)
1 0.127
(0.05)
2 0.254
(0.1)
3 0.508
(0.2)
4 1.016
(0.4)
5 2.032
(0.8)
0.4
0.2
3
2
1
5
0
0
I,
0
6
10
12
14
PCM HEIGHT (cm)
I
2
I
4
16
18
I
6
20
22
I
8
PCM HEIGHT (in.)
Figure
B-3.
Variation
of equivalent
fin thickness
194
thermal
of 0.0127
resistance
cm (0.005
in.).
with
height
for a
0.4
CO
X
iii
_j
z
I-.
m
O')
LM
nr"
.=1
I,M
-III-z
ill
LEGEND
>
:3
O
S2 = 0.0508
ill
W,cm
0.127
0.254
0.508
1.016
2.032
1
2
3
4
5
12
14
16
18
20
Variation
fin
22
(cm)
PCM HEIGHT
B-4.
in.)
10
PCM HEIGHT
Figure
cm (0.02
(in.)
(0.05)
(0.1)
(0.2)
(0.4)
(O.8)
of
equivalent
thickness
of
(in.)
thermal
0.0508
resistance
cm
(0.02
with
height
for
in.).
195
0.3
LEGEND
S2 = 0.127 cm (0.05 in.)
W,crn (in.)
1 0.127
(0.05)
2 0.254
(0.1)
3 0.508
(0.2)
4 1.016
(0.4)
5 2.032
(0.8)
m
v
x
J
z
<
I-
f/J
MI
,J
<
:E
n,.
u.i
-r
I,IZ
uJ
..I
:)
0
u,I
0
0
16
18
20
22
PCM HEIGHT
Figure
B-5.
Variation
of equivalent
fin thickness
196
10
12
14
PCM HEIGHT (cm)
(in.)
thermal
of O. 127
resistance
cm (0.05
in.).
with
height
for a
APPENDIX
COMPUTER
An
example
PROGRAM
FOR EXAMPLE
application
of
a phase
DESCRIBED
change
device
with
IN SECTION
a nonuniform
thermal
boundary
condition
is discussed
in Section
V. The equation
used to compute
the
temperature
variation of the flowing fluid is equation
(37). The computer
program shown
in Table C-I was written
to facilitate
the calculation
of the mean fluid temperature
from
equation
(37). This program
occupies
approximately
7 K words of storage. The data
shown
in Table
C-2 is required
the
function
the
inlet temperature
functions
subroutines
for U 0 and
for each run. In addition,
COEFF
and TEMP.
of the fluid.
the
inlet
Note
that
temperature.
COEFF
there
The
the user must

calculates
are provisions
function
supply
routines
in
U 0 and TEMP generates

for up to three
used during
different
any run is chosen
by the data entered

in the data card (Table C-2). There are provisions for multiple runs
within
one computer
job. The program
reads nine cards, processes
the run, and then
returns
to read nine more. If none are present,
the program
terminates.
For each run,
header information
is printed,
such as flow rates, and fluid and PCM properties.
Two
time steps are printed simultaneously,
one on the left-hand
side of the page, the other on
the right-hand
side of the page. A description
of the output data is given in Table C-3.
At the end of each run, the total energy stored, QTOT, is printed.
197
TABLEC-I.
COMPUTER
VARIATION
PROGRAM
AS IT FLOWS
USED
TO COMPUTE
FLUID
A PHASE
CHANGE
THROUGH
TEMPERATURE
DEVICE
REAL
LENQTH*MLUMPaMDOT
INTEQER
IInE*TZMECT
DIMENSIUN
IM_AN(2aSOO)aQTAB(50"DI,O_O2(SUOIaTLUM_(2
1*500)
9998
100
COMMON I_UPFaLINCTaOLDTMEaNOOECT
READ
(5_ZOU_ND.9999)
TFREEZ
FORMAT
{Plu._}
READ
I5,Zlu)
laTIMELNsTM_S'rP
110
150
190
160
170
180
199
_00
SPHEAToMOOT*HTXFE_,dIDT_:*_NSTMaXBTEP
FORMAT
(_FZO.2/2FIO_,FtO.5/F13.Z,_O._
READ
(5,15u_
RHO_XBECT
FORMAT
_FIO.2}
READ
(5,190)
SPAC,VIBCaPRAN*CO_
FORMAT
(_FZo.2)
READ
(5_%6u)
MEISHT,HTFUBaBPHL_P_CON_t_PaRMOLMP
FORMAT
LPI_.b_F_O.2)
READ
(5,17o)
IWRITaISUPX
FORMAT
(_150;
READ
(5,18u)
ITMPZNaIUORTN
FORMAT
(_Z_OI
WRITE
{6_1_
FORMAT
('1')
WRITE
{_2uO_
FORMAT
I'O',T_ga_______,
WRITE
(6,2_o_
LEN3THaXSECT
_0
FORMAT
_'
'_I3B_CAPACITOR
I_FLOw
PASb. AREA =_F7,_#
t
wRITE
(6,_o)
HEI_HTaSPAC
_30
FORMAT
t,
tI3BIIDZMENOION
1 FT=*_TBU_'FLOWPASS
HEISHT
WRITE
(6_2_ul
*IDTH
2_0
FORMAT
('
'*]_9_
H-_IOTH
WRITE
(6_ZZOJ
_10
FORMAT
_'
',T_9,___#_____
wRITE
WRITE
_50
FORMAT
Z/HR.t_T8
WRITE
_EN_Td
S_.FT_,TI$$_,'_'!
_
PC_
-l,rT._**
=lFTo_0
(6,_uo_
(6*_b0;
_OOT_VISC
(' '_138,
tF_UID
U *'viSCOSITY
"*FTo#a
{6,_bo_
SPHEATa?RAN
='_/'3,
HEI3HI
=_F7.3_
rIT*',T115_*
198
(6_2_u)
HTFUSaCON_P
('
',13B,_CM
FI'*TBO,
tTHERM
CONO
_EAT
=_=3_
t_ro'_T115,,_,l
FORMAT
('
'*138*=_ROPERTIE$
i?ECZ=I;iMl
1BTU/LB-P_TIO_IPRAND
NO =_F7*3,
TltS',_e'l
WRITE
(6,21ol
RHO,CONO
270
FORMAT
('
',I_9_
DENSITY
"1,7_3,_
._/UB
I*'THERM
_OND =_,F7,3_
BTU/HR=FT.Ft,T115_,_,)
WRITE
(_,21o_
WRITE
(6,2u0)
WRITE
FORMAT
1BTU/CU_
FT._.TBC
_Od
_krE
"_F7.3,'
I .6/r,T'HR''*T115*'_')
E60
_SO
=_F5.3_'
FT'_T$O
D _ F_
-',FS.0_'
_ CTU/MR-FT-F?
LB
TABLEC-1. (Continued)
2,Tl15s_'l
WRITE
|b*2_O)
SPHLHP,TFREEZ
290
FORMAT
t'
'*13BaPROPERTIE8
RPECIrI;'
HT =',F5,3,
_
1BTU/LB'PaT_OalFREEZE
TEHP
=o_,
,3, o rllaT115,
l_v)
_RITE
(6_3u0)
RHOL_P
300
FORMAT
('
'sT_gaODENSZTY
=taF7s3al
_3t_B
FTOaTltSs
t
1_ o )
WRITE
(6,2_0)
WRITE
(6,200)
WRITE
16a310)
XGTEPaITHPIN
310
FORHAT
t'
'.138,
ORUN
K'_TE_
=J#F_o_,o
F_naT8_
1,TEMP-;N
_TN
! o,llmTlt5,
t_t)
WRITE
(6,3_0_
THESTPaIUORTN
320
FORMAT
s'
'sT38,.OpARAHETERS
TIHE'STP
=*F7'3.
HR9
1,TBO,
oUO=RIN
: oIl_TllSa_)
WRITE
(6,3_0)
TIHELN
330
FORMAT
_'
'_T_9_u_
TIHE
LENGTH
=lF7.3at
HRS'aT_IS_e
_
WRITE
(6_o)
CleRHO_6ECT_SPHE_TtTHESTP
C_=HDOT_PHEATIXSTEP
NODECT=L_NUTH/XSTE?+2
TIMECT-TIM_L_/THESTP
VOLU_E=WZOIH_XSTE?_HEIGHT
M_UHP=RMULMP_VO_U_E
UCONST=II(HE_QHTt(2_CON6HP))
DIA=_o_BPAU
REYNO-DIA_DOT/IRHO_XsECT_VISC._
ZHTgW=I
IF
(HTXF_R'E_,O,O)
ZHTBW=O
DO t J=IaNUDECT
TffiEAN(I_d)=TFREEZ
TkUHP(Iad}=TFREEZ
% QTAB(J)=U'
IRITSW=IWRIT'1
IBUFF'O
_INCT=25
O_DT_E=_9'O
O0 3 TI_=I_TIHECT
TmTIME_a_E_T_
IF
ClRITUW'E_*IWRIT)
ZRITSW=O
30
TMEAN(_al)=TbMPZN(ITMPINaT)
DO _ NOD_=_ODECT
X=(NODE-_IeX_TEp
UO-COEFFIGIAB(NODEI_VOEUHE_HTFUBprR_rN_IUDRTN)
IF
(FRACIN'LT.O._gl
O0 TO 3C
T_UMP(2aNO_E_=OLD_(NODE)/(M_UHP_SPHLM=iIeI_U_P(I_NODE)
TMPPCM=T_UMP(2aNODE)
UO=UCON=I
_0
TO _u
TRPPC_=TFREEZ
199
TABLEC-1. (Continued)
40
IF
(IHTSW,LQ.I)
QO TO 20
QRATZmXttDLA_REYNOePRAN)
HTXFER=|_ONO/DIA)vHEATIQRATZ)
EO C#-(HTXFbR_wIDTH_UO)/(UOeHTXFE_)
CS=l/(CleCe+_)
TMEANI2*NO_E)=C_(C_TMPPCM+C2_T_EA_(_aNO_E-t)C;
I_THEANItaNUDE)|
QAmC2_ITflEANt2aNODEIRTHEANI2_N3_E_I)I
GBmCI_ITeEANtgaNODE)-THEANIleN3_Ei))
G"-I_IGMGU)_THESTPvXSTEP
QTAB(NOD_)=_TAB(NODE)+Q
OLDG(NO_L)=Q
IF
(IRITBN'K_.ZWRIT)
CALL
PRNTZT(TqEk_(_SNOOE)agTAB
I INODE)/_HAGT_UOaT/THEAN(2_l)_X_OD[s_TXFLR_IBU_X|
CONTINUL
DO 2 J-Z,NUDECT
TkUMP(laJ)mTkUHPI2eJ,)
2 _MEAN(iadI"TMEANI2aJ)
3 CONTINU(
BTOT'O
DO 10 J'_aNODECT
QTOTmQTOle_TAB(_)
WRITE
(6,1_01QTOT
FORHAT
(bXa*_TOT
_aFtO_2)
GO TO 9S_
9999
CALL EXZl
END
SUBROUTINE
P_NTIT(THEANa_TABaF_T_aJ3,TarE_P_N,XaNDDE
laHTXFRaIBUPX)
DZHENSIO_
1._ANtISOO),_TABIISO3)aFRCT_tlSOO)aU01(500)
laHTXFR_I_OU)
COMMON ;_UPFaL/NCT,OLDTMEaNODE:T
ZF (_$UPX_b_.O.AND.NODEeNE.NODE_T)
R,_JRN
IF
(FRCT_oUT,IeO)
FRCTNmt*O
IF
(IBUFF*k_.O)
_0 TO 10
IF
(OLDT_E'E_,T)
30 TO 20
%BUFF"O
O_DT_E=!
_0
TO 3u
TMEAN_(_UO_)'TMEAN
QTABIINUO(_=_TAB
FRCTNIIN_D_)=FRCTN
UOIINOOL_-UC
HTXFRI(NUD_)=HTXFR
RETURN
t0
IF
(OLDT_E.E_.T)
_0 TO tO
IBUFF*I
OLDT_E=T
PRNTTH-UkDI_
PRNTTP=TbffiP|N
_0
TO 2u
200
TABLE
C-1.
(Continued)
30
C
C
C
C
C
C
C
C
C
IF
(klNio_E.65)
30 TO 60
WRITE
(6,1uol
PRNTTHaPRNTTP_TaTE_PIS
100
FORMAT
_'O',Tg_tTI_E
aoaF6o3jTE8_OTE_m_
sO_F7.2,
I_'TIME
='aPS.3aTlO3aOTEMPIN
.oJF2.2)
wRITE
(6#1_0J
O0 TO 40
50
WRITE
16alZOI
?RNTTH_PRNTTPaTaTE_PZ_
110
FORMAT
C'I',TgsOTIME
=o_Fs.3_T_BJtTE_a_
"I,F7*E_TB_
laITIME
=',_6.3,T103aOTEHPZN
=u,F?,2)
Iba2OJ
WRITE
140
FORMAT
('O',lgj*X*aT16stTEHPtat28_*_OpT3b_CHAN3E_T47
taluOO_TSba'HTXFEROsTlOaXtoT8B,
UtEHmOpTlOO_'Q'aTtO9
2alCHANQE'alI19_IUDO_TI_6atHTXFER
)
LINCT=_
_0
IF
(LINCT.LT.73)
30 TO 60
WRITE
16,1bO_
160
FORMAT
_'l'_19aXaT16_tTEMPlaT_B;2teT36a'_HAN3E_T_7
%_UO#T551'HTXFERt/TBO#_X_TBB_oTE_II_T_OU_T%09
_VCHANG_'#i_lgalUOUaTI26#IHTXFER)
klNCT=2
60
LINCT-LINCI%
WRITE
(6,1b0)
X_THEANI(NODEI_gTA_t(_O._E_P_PRCTNI(NODE)
LaUOI(NO_)_HT
XFRI(NODE)aXaTHEkN_T&]pFRCTNaUO*_TXF_
150
FORMAT
('
'_SFJOoZal%XaSF%0'2)
RETURN
END
FUNCTION
CUEFF(_T&B_VO_UHE_HTF_S_FRACrTN_IOORTN
}
VO_H6Tm_IA_/HTrUS
FRACTN=AUBtVULHLT/VOLUME)
IF
(FRACTN'G_.O.99)
RETURN
GO TO (I_2*3)_IUORTN
CONTZNU_
_
UBEH SUPPLIED
UO vARIATION
_3UTI_[
_
_
_OEB BETWEEN
gTATEMENTS
_K_*
_
8ELECTbD
WHEN IUORTN'I,
ZF (FRAC[NoQT.o_5)
_0 TO _0
COEFF=lU6,ZE'242,56_FRACTN
RETURN.
10 COEFF-5_.3_-35.37_FRACTN
RETURN
CONTINUE
_
A S_OnO
uO VARIATION
ROUTINE
_
MAY UO _T_EEN
STATEMENTS
_K3*
_
SEL_T_O
WHEN IUORTN=_.
COEFF=5uu.u
RETURN
3 CONTINUE
_
A T_IR_
uO VARIATION
ROUTINE
CAN 30
_
AFTEH
STATEMENT
3.
_
SEL_CTD
WHEN IUORTN=3o
RETURN
T8_
201
TABLEC-I. (Concluded)
C
C
10
80
30
_0
2
C
C
3
C
10
_0
202
END
FUNCTION
T_MPIN(ITHPZN,T)
O0 TO (l*2a3),ZTHP_
CONTINUE
_
USER SUPPLIED
INLET
TE_PERATJRE
_v_
ROUTIN_
GO_8
BETWEEN
8TATE_ENTS
_v_
1&2'
8LECTED
_HEN
ITEMPINIt'
ZF (T,er,l.5J
QO TO 10
TEMPIN-1.3B_T
RETURN
IF
(T*QT'5'5!
_0
TO EO
TEHPINmSO,6_'12,927_T_9,BZb_T_T
RETURN
IF
(T*EI'IO.5!
80
TO 30
TEePZNI_UE.O_$ZNI(3$I415/15)eT)
RETURN
IF
(T,Gr,I_,O)
GO TO _0
TEHPIN-l_8_,_65-157t533_T+3,Bge_T_T
RETURN
TEMPIN"O14,7"_O,96_T
RETURN
CONTINU_
_
A SEUOND
TEHPERATURE
VARIATION
_e
ROUISN_
_AY
GO BETWEEN
STATEHENT|
_e
2&3.
8_CTED
_HEN
ITE_PIN=_,
TEHPIN"_OO'O_O,OvT
RETURN
CONTINUE
_.k
TH_RU
_N6ET
T.EHPERATURE
vArIATION
_
ROU_N_
_Ay
GO AFTER
8TATEHE_T
_v
3,
_LCTED
WHEN ITEMPIN_3:
RETURN
END
FUNCTION
H_AT(GRATZ)
IF
(_RAT&,UT'.01)
GO TO 10
EX"'O*26
HEAT"2,_RATZ_EX
RETURN
IF
(_RATZo_T..03)
EXI-O,O_
HEAT_7,_b_URATZv_EX
RETURN
HEAT_7,5_I
RETURN
END
30
TO
20
o.
0
i
0
i
r_
"7
<
Z
_Q
L_
u-]
.5
io
--1
e-,
<
E
LD
,.3
"3
.,.._
'_
:::3
P_
o--
,_
._
<
"_ -._H_
__
z_
._ m __
C2
;a4
:_ _ _ _ _
_ __._ _
- _:_ _ _'_ _ %_'_
_
._
ri
,.-,
O0
i
, .-
"7--
000
"7,-----
r"
+-' ,.-_
<._<<
0000
"7 ....
0
"1
_)
203
.._
e,,
,,,_
o
"6
_z
_8
o
_o
2O4
o o
TABLE C-3. DESCRIPTION

OFOUTPUTDATA FROMPROGRAM
LISTEDIN TABLEC-1
DataName
Description
Units
TEMPIN
Fluid inlet temperature
oF
X location
ft
TEMP
Temperature
at X
Accumulated
heat transfer
in the capacitor
oF
into the PCM
Btu
at X
CHANGE
Fraction
UO
U0
HTXFER
Convective
undergone
change of phase
Btu
h.ft 2 .o F
Btu
heat transfer
fluid and flow passage
coefficient
wall
between
h.ft 2.F
205
APPENDIX
COMPUTER
PROGRAM
USED TO FACILITATE
D
THE EXPLICIT
NUMERICAL
STUDY
The computer
program
used to facilitate
the explicit numerical
study is outlined
and described
in this appendix.
A copy of the program
for a melting run with inclusion
of convective
effects is given in Section
D.1; the corresponding
notation
is described
in
Section D.2; and the steps are discussed in Section D.3.
After
listing
D.I would not run

indicated
in Section
this program,
it was discovered
that
the program
described
in Section
for the case of M = 1. The statements

causing this incompatibility
D.1 by an arrow placed at the left of the appropriate
statement.
are
A copy of the computer

program
for a solidification
case is given in Section D.4.
A comparison
of the appropriate
statements
with those shown in Section D.3 generally
illustrates
the modification
to accommodate
M = 1.
The
for changing
206
statements
which were included
in the solidification
program
to allow
the effective
interfacial
area for nodes experiencing
melting are underlined.
D.1. COMPUTERPROGRAMFOR MELTING
1
2
3
4
5
6
7
8
9
10
II
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
4O
41
42
43
44
45
46
47
48
49
50
51
52
57
54
DIMENSION RV(5,31) , RH(5,3|)

, C(5,31)
, QS(5,31),
DIMENSION T2(5,31)
, F(5,31)
, Q(5,31)
, QRAT(5,31),
DIMENSION TMI(9),
TM2(9), TM3(B), TM4(9), TIM(B)
DIMENSION QRA2(5, 31)
COMP
UTATI ONAL PARAMETERS
N=27
M=4
AM=M
MM=M+I
NN:N+2
NJ=N+3
NI=N+4
ND=9
NDP=8
TAU=I .I
KCOUNT=
1
MCOUNT=
1
MFIN=500
EPS=I .E-06
KCHK=IO00
JOE=I
DT=I .OE-04
TAU2=( I0. *DT) + ( DT/3. )
PHYSICAL PROPERTIES
TAMB=80.
TIN=73.5
HTOP=I.E-08
HBOT=5.0
G=(32.2*3600 .*3600. )
WAX
DEN=47.2
TK=O.087
CP=O.5
TTR=73.04
HTR=22.108
TMELT=89.8
HMELT=73.357
TREF=50.0
BETA=O.00045
VIS=14.3
CL=CP
TKL=TK
BOTTOMPLATE DENOTEDBY 1
DEN1=171.0
TKI =93.0
CP1=0.22
FIN DENOTEDBY 2
DEN2=171.0
TK2=93.0
CP2=O.22
TOP PLATE DENOTEDBY 3
DEN3:72.5
TK3=O.09
CP3=O.33
TI(5,31)
T3(1,31)
207
55
GEOMETRY PARAMETERS
56
W:0.75/12.0
57
H=2.625/12.0
58
B=5.0/12.0
59
S=W/(2.0*AM)
60
SI=0.032/12.0
61
S2=0.008/12.0
62
S3=0.25/12.0
63
F2JM=I.O/(32.0*S*I2.0)
64
VERTICAL RESISTANCES
65
RV(I,2)=(SI/(TKI*S2*B))+(2./(HBOT*S2*B))
66
DO I0 I=2,MM
67
I0 RV(I,2)=(SI/(2.*TKI*S*B))+(I./(HBOT*S*B))
68
RV(I,3)=(S/(TK2*S2*B))+(SI/(TKI*S2*B))
69
DO 20 I=2,MM
70
20 RV(I,3)=(I./(2.*TK*B))+(SI/(2.*TKI*S*B))
71
DO 30 J=4,NN
72
30 RV(I,J)=((2.*S)/(TK2*S2*B))
73
DO 40 J=4,NN
74
DO 40 I=2,MM
75
40 RV(I,j)=(I./(TK*B))
76
RV(I,N+3)=(S3/(TK3*S2*B))+(S/(TK2*S2*B))
77
DO 50 I=2,MM
78
50 RV(I,N+3)=(S3/(2.*TK3*S*B))+(I./(2.*TK*B))
79
RV(I,N+4)=(S3/(TK3*S2*B))+(2./(NTOP*S2*B))
80
RV(2,N+4)=(S3/(2.*TK3*B*(S+(S2/2.))))+(I./(HTOP*B*(S+(S2/2.)))
81 -_-_"DO
60 I=3,MM
82
60 RV(I,N+4)=(S3/(2.*TK3*S*B))+(I./(HTOP*S*B))
83
HORIZONTAL RESISTANCES
84
RH(2,N+3)=((S2+S)/(2.*TK3*S3*B))
85 "_--_'-DO
70 I=3,MM
86
70 RH(I,N+3)=(S/(TK3*S3*B))
87
DO 80 J=3,NN
88
80 RH(2,J)=(S2/(2.*TK2*S*B))+(I./(2.*TK*B))
89
DO 90 J=3,NN
90 _DO
90 I=3,MM
91
90 RH(I,J)=(I./(TK*B))
92
RH(2,2):((S2+S)/(2.*TKI*SI*B))
93 --------I=-DO
I00 I=3,MM
94
I00 RH(I,2)=(S/(TKI*SI*B))
95
RH(2,N+3)=RH(2,N+3)+RV(I,
N+3)
96
NODAL CAPACITANCES
97
C(I,2)=((DENI*SI*S2*B*CPI)/2.)
98
DO IlO I=2,MM
99
II0
C(I,2)=(DENI*SI*S*B*CPI)
I00
DO 120 J=3,NN
I01
120 C(I,J)=((DEN2*S2*S*B*CP2)/2.)
102
C(I,N+J)=((DEN3*S2*S3*B*CP3)/2.)
103
C(2,N+3)=(S3*B*(S+(S2/2.))
*DEN3*CP3)
I04"_G_'DO
130 I=3,MM
105
130 C(I,N+3)=(DEN3*S3*S*B*CP3)
106
DO 140 J=3,NN
107
DO 140 I=2,MM
108
140 C(I,J)=(DEN*(S**2)*B*CP)
109 _QI=(C(3,a)*(TTR-TREF))
II0
Q2=QI+((DEN*(S**2)*B*HTR))
208
111 _Q3=Q2+((C(3,4))*(TMELT-TTR)
)
112
Q4=Q3+((DEN*(S**2)*B*HMELT))
113
INITIALIZATION
OF PERTINENT QUANTITIES
114
TIME=O.O
115
QWAX=O.0
116
QBW=O.0
117
QSW=O.0
118
QTW=O.0
119
QTOP=O.0
120
QFTR=O.O
121
QTTR=O.0
122
VI=O.O
123
V2=O.0
124
DMO=O
.0
125
DO 150 J=2,NJ
126
DO 150 I=I,MM
127
150 TI(I,J)=TIN
128 _
I F(TIN.LT.TTR)QSIN=(C(3,4)*(TIN-TREF))
129 _
IF(TIN .GT .TTR.AND.TIN. LT .TMELT) QSIN=Q2+(( C(3,4) )*(TIN-TTR))
130 _
IF(TIN .GT.TMELT)QSIN---Q4+((C(3,4))*(TIN-TMELT))
131
DO 160 I=I,MM
132
160 T1 ( I ,N+4)=TAMB
133
DO 170 J=3,NN
134
DO 170 I=2,MM
135
17O QS(I,J)=QSlN
136
DO 180 I=I,MM
137
Q(I ,2):0.0
138
180 Q( I ,N+3)=0.0
139
DO 190 J=3,NN
140
190 Q(l ,j):O.O
141
DO 199 J:2,NI
142
DO 199 I=I,MM
143
F(I,O):O.O
144
199 QRAT(I ,J )=0 .0
145
I=I ,ND)
READ(5,11) (TMI (I),
146
READ(S,1 I) (TM2(1),
I=I ,ND)
147
READ(S,11) (TM3(1),
I=I,ND)
148
I:I ,ND)
READ(S,11) (TM4(1),
149
READ( 5,11 ) (TIM(1),
I=I ,ND
150
11 FORMAT
(8FIO.O)
151
WRITE(6,22) TIME,W,H,N,M
152
22 FORMAT(IX ,5HTIME= ,El5.8,IOX,2HW=,El5.8 ,lOX ,2HH=,El5.8 ,lOX,2HN=,l2,
153
15X,2HM=,I2)
154
WRITE (6,33)QI,Q2 ,Q3,Q4
155
33 FORMAT(IX,3HQI=,EI5.8,1OX,3HQ2=,EI5.8,1OX,3HQ3=,EI5.B,IOX,3HQ4=,EI
156
5.8)
157
WRITE(6,44)
158
44 FORMAT(2X,4HI J,5X,19HVERTICAL RESISTANCE,6X,21HHORIZONTAL RESIST
159
ANCE,6X ,I 7HNODALCAPACITANCE,6X ,I 1HTEMPEP_ATURE
,5X ,7HQS( I ,J) )
160
DO 200 J=2,NI
161
DO 200 I=I,MM
162
IF(J.EQ.N+4)
GO TO 1
163
GO TO 2
164
1 QS(l ,J)=O.O
165
RH(I,j)=I.E08
166
C(I,J)=O.0
167
2 IF(I.EQ.I}RH(I,J}=I.E08
168
IF(J.EQ.2.0R.J.EQ.N+3)QS(I,J)=O.O
169
IF(I.EQ.I)QS(I,J)=O.O
170
WRITE(B,55)I,J,RV(I,J),RH(I,J),C(I,J),Tl(I,J),QS(I,J)
171 55 FORMAT(IX,12,1X,12,5X,EIB.B,IOX,EIB.8,1OX,EIB.8,6X,EI6.B,4X,EI5.8)
172 200CONTINUE
173
DO889J=3,NN
174
889 T3(I,J)=TI(I,J)
175
COMPUTATION SECTION COMPUTATION SECTION COMPUTATION SECTION
176
3 TIME=TIME+DT
177
DO 210 J=3,NJ
178
QP_AT(I,J)=((TI(2,J)-TI(I,J)_RH(2,j))+((TI(I,J-I)-TI(I,j))/RV(I,J)
179
+((Tl(l,J+l)-Tl(l,J))/RV(l,J+l))
180
QP_AT(MM,J)=((TI(M,J)-TI(MM,J))/RH(MM,J))+((TI(MM,J-I)-TI(MM,J))/RV
181
(IVLM,J))+((TI(MM,J+I)-TI(MM,J))/RV(MM,j+I))
182
210 CONTINUE
183
DO 211 J=3,NJ
184_D0
211 I=2,M
185
QRAT(I,j)=((TI(I-I,J)-TI(I,J))/RH(I,J))+((TI(I+I,J)-TI(I,J))/RH(I+
186
l,J))+((Tl(I,J-l)-Tl(I,j))/RV(I,J))+((Tl(I,J+l)-Tl(I,J))/RV(I,J+l)
IB7
)
188
211 CONTINUE
189
212 DO 220 J=3,NJ
190
DO 220 I=I,MM
191
220 QS(I,J)=QS(I,J)+(QRAT(I,J)*DT)
192
DO 240 I=2,MM
193
240 T2(I,N+3)=TI(I,N+3)+((QP,
AT(I,N+3)*DT)/C(I,N+3))
194
T2(l,N+3)=T2(2,N+3)
195
DO 250 J=3,NN
196
DO 250 I=2,MM
197
IF(QS(I,J).LT.QI)T2(I,J)=TREF+(QS(I,J)/C(I,J))
198
IF(QS(I,J).GE.QI.AND.QS(I,J).LE.Q2) T2(I,J)=TTR
199
IF(QS(I,J).GT.Q2.AND.QS(I,J).LT.Q3) T2(I,J)=TTR+((QS(I,J)-Q2)/C(I,
J))
200
IF(QS(I,J).GE.Q3.AND.QS(I,J).LE.Q4) T2(I,J)=TMELT
201
WHEN GOING FROM MELT TO FREEZE OR VICE-VERSA CHANGE THE FOLLnWING CARD
202
IF(QS(I,J).GT.Q3.AND.QS(I,J).LT.Q4) F(I,J)=(QS(I,J)-Q3)/(DEN*(S**2
203
)*B*HMELT)
204
IF(QS(I,J)GT.Q4) T2(I,J)=TMELT+((QS(I,J)-Q4)/C(I,J))
205
WHEN GOING FROM MELT TO FREEZE OR VICE-VERSA CHANGE THE FOLLOWING CARD
206
IF(QS(I,J).GE.Q4)F(I,J)=I.0
207
IF(QS(I,J).LE.Q3) F(I,J)=O.O
208
250 CONTINUE
209
SPECIFICATION AND/OR DETERMINATION OF FIN TEMPERATURES
210
THE FOLLOWING DO LOOP ASSUMES FIN TEMPERATURES FOR ITERATION
211
DO 255 J=3,NN
212
255 T2(l,J)=T3(l,J)
213
DO 260 L=I,NDP
214
IF(TIME.GE.TIM(L).AND.TIME.LE.TIM(L+I)) GO TO 4
215
260 CONTINUE
216
4 FAC=(TIME-TIM(L))/(TIM(L+I)-TIM(L))
217
T2(I,2)=TMI(L)+((TMI(L+I)-TMI(L))*FAC)
218
T2(I,8)=TM2(L)+((TM2(L+I)-TM2(L))*FAC)
219
T2(I,IB)=TM3(L)+((TM3(L+I)-TM3(L))*FAC)
220
T2(I,21)=TM4(L)+((TM4(L+I)-TM4(L))*FAC)
221
DO 270 I=I,MM
210
222
270 T2(I,2)=T2(I,21
223
UNSPECIFIED
FIN TEMPERATURES
DETERMINED BY STEADY STATE EQUATIONS
224
256 MCOUNT=MCOUNT+I
225
DO 280 J=3,NN
226
T3(I,J)=T2(I,J)
227
IF(J.EQ.8.0R.J.EQ.15)
GO TO 5
228
IF(J.EQ.21) GO TO 5
229
T2(I,J)=((T2(I,J-I)/RV(I,J))+(T2(2,J)/RH(2,J))+(T2(I,J+I)/RV(|,J+I
230
)))/((l./RV(l,J))+(l./RH(2,J_+(l./RV(l,J+l)))
231
5 CONTINUE
232
280 CONTINUE
233
IF(MCOUNT.GT.MFIN)
GO TO 8
234
DO 281 J=3,NN
235
DIF=T2(I,J)-T3(I,J)
236
IF(ABS(DIF).GT.EPS)
GO TO 256
237
281 CONTINUE
238
IF(JOE.EQ.2) GO TO 285
239
JOE=JOE+I
240
DO 888 J=3,NJ
241
DO 888 I=T,MM
242
888 QS(I,J)=QS(I,J)-(QRAT(I,J)*DT)
243
DO 282 J=3,NJ
244
QRA2(I,J)=((T2(2,J)-T2(I,J))/RH(Z,J))+((T2(I,J-I)-T2(I,J))/RV(I,J)
245
)+((T2(l,J+l)-T2(l,J))/RV(l,J+l))
246
QRA2(MM,J)=((T2(M,J)-TZ(MM,J))/RH(MM,J))+((T2(MM,J-I)-T2(MM,J))/R_
247
(MM,J)_+((T2(MM,J+I)-T2(MM,J))/RV(MM,J+I))
248
282 CONTINUE
249
DO 283 J=3,NJ
250 "---'4"DO 283 I=2 ,M
251
QRA2(I,J)=((T2(I-I,J)-T2(I,J))/RN(I,J))+((T2(I+I,J)-T2(I,J))/RH(14
252
I,J))+((T2(I,J-I)-T2(I,J))/RV(I,j))+((T2(I,J+I_-T2(I,J))/RV(I,J+I)
253
)
254
283 CONTINUE
255
DO 284 J=3,NJ
256
DO 284 I=I,MM
257
284 QRAT(I,J)=(QRAT(I,J)+QRA2(I,J))/2.0
258
GO TO 212
259
285 MCOUNT=I
260
DO 286 I=I,MM
261
286 QRAT(I,2)=((T2(I,2)-TI(I,2))*C(I,2)/DT)
262
DO 287 I=I,MM
263
287 QS(I,2)=QS(I,2)+(C(I,2)*(T2(I,2)-TI(I,2)))
264
DO 290 I=2,MM
265
QBW=(T2(I,2)-T2(I,3))/RV(I,3)+QBW
266
290 QTW=(T2(I,N+3)-T2(I,N+2))/RV(I,N+3)+QTW
267
QBT=QBW+((T2(I,2)-T2(I,3))/RV(I,3))
268
DO 300 J:3,NN
269
300 QSW=QSW+((T2(I,J)-T2(2,J))/RH(2,J))
270
DO 310 I=I,MM
271
310 QTOP=((T2(I,N+3)-TAMB)/RV(I,N+4))+QTOP
272
DO 311J=3,NN
273
311 QFTR=QFTR+QRAT( 1 ,J)
274
DO 312 I=I,MM
275
312 QTTR=QTTR+QRAT( 1 ,NJ)
276
QWAX=(QBW+QTW+QSW)*DT+(QWAX)
277
RATIO=QSW/QBW
211
278
ERROR=((QBT-(QBW+QSW+QTW+QTOP+QFTR+QTTR))*100.0)/QBT
279
DO 930 J=3,NN
280
DO 930 I=2,MM
281
V2=V2+(F(I,J)*(S**2)*B)
282
930 CONTINUE
283
DAVG= ((2.O'V2)/(W'B))'12.0
284
QMELT=((V2-VI)*DEN*HMELT)/DT
285
Vl=V2
286
V2=O .0
287
DELT=ABS(T2(1,2)-TMELT)
288
PR=(VlS*CL)/TKL
289
RA=((DEN**2)*G*CL*BETA*DELT*(DAVG**3))/(VIS*TKL*1728.O)
290
IF(T2(I ,2).LE.TMELT) RA=O.O
291
IF(RA.GT.I.E05 )TK=(TKL*O.104*(RA**O.305)*(PR**O.084))
292
IF(RA.GE.3500.O.AND.RA.LE.l.EO5)TK= (TKL*O.229"(RA**0.252) )
293
IF(RA.GE.1700.0 .AND.RA.LT.3500.0) TK= (TKL*O.00238"(P4_**0.816)
294
TKR=TK/TKL
295
DO 945 I=2,MM
296
IF(F(I,3).LT.O.25) GO TO 945
297
RV(I ,3)=(I./(2.*TK*B))+(SI/(2.*TKI*S*B))
298
945 CONTINUE
299
DO 946 J=4,NN
300
DO 946 I=2,MM
301
IF(F(I,J).LT.EPS) GO TO 946
302
RV(I,J)=(I./(TK*B))
303
946 CONTINUE
304
DO 947 I=2 ,MM
305
IF(F(I,NN) .LT.O.75)
GO TO 947
306
RV(I,N+3)= (S3/(2.*TK3*S*B))+(I./(2.*TK*B))
307
947 CONTINUE
308
DO 950 J=3,NN
309
IF(F(2,J).LT.O.25) GO TO 949
310
RH(2,j)=(S2/(2.*TKZ*S*B))+(I./(2.*TK*B))
311
949 CONTINUE
312 "---_'DO 950 I=3,MM
313
IF(F(I,J).LT.EPS) GO TO 950
314
RH(I,J)=(I./(TK*B))
950 CONTINUE
315
316
IF(KCOUNT.EQ.KCHK) GO TG 6
317
KCOUNT=KCOUNT+I
318
GO TO 7
319
6 WRITE(6,66) TIME, QWAX, ERROR
320
66 FORMAT(IX ,5HTIME= ,El5.8,lOX ,5HQWAX=,El5.8 ,lOX,6HERROR= ,El5.8)
321
DO 313 J=3,NN
322
AJ=J-3
BJ=J-2
323
324
IF(F(2,J).GT.F2JM) DFLO=(Bj*S*I2.0)
325
DFIN=(AJ*S*I2.0)
326
IF(F(2,J).LT.EPS) GO TO 314
327
313 CONTINUE
328
314 DO 315 J=3,NN
329
AJ=J-3
330
IF(F(MM,J).LT.I.O) DMID=((AJ*S)+(F(MM,J)*S))*I2.O
331
IF(F(MM,J).LT.I.O) GO TO 316
332
315 CONTINUE
333
316 WRITE(6,67) DFIN, DFLO, DAVG, DMID
212
334
335
336
337
338
339
340
341
342
343
344
345
346
347
348
349
350
351
352
353
354
355
356
357
358
359
360
361
362
363
364
365
366
367
67 FORMAT(IX,5HDFIN=,EI5.8,10X ,5HDFLO:,El5.8,10X,5HDAVG: ,El5.8,10X,SH

DMID= ,E15.8)
DDOT=(DMID-DMO)/DT
DMO=DMID
WRITE(6,68) RA, TKR, QMELT, DDOT
68 FORMAT(1X,3HRA=,El5.8,10X,4HTKR=,El5.8,10X,6HQMELT= ,El5.8,10X,5HDD
OT:,EI5.8)
WRITE(6,77) QBW, QSW, QTW, QBT, RATIO
77 FORMAT(IX,4HQBW=,El5.8,3X,4HQSW= ,El5.8,3X,4HQTW= ,El5.8,3X,4HQBT=,E
15.8,3X ,6HRATI0=,EI5.8)
WRITE(6,88)
88 FORMAT(2X,IHI,2X,IHj,IOX,IIHTEMPERATURE,IOX,15HFRACTION MELTED,IOX
,lIHENERGY RATE,IOX,13HENERGY STORED)
DO 320 J=2,NJ
DO 320 I=l,MM
WRITE (6,99)I ,J,T2(I,J),F(I,J),QRAT(I,J),QS(I,J)
99 FORMAT(IX,12,1X,12,8X,EI5.B,8X,EI5.8,8X,EI5.8,8X,EI5.8)
320 CONTINUE
KCOUNT=I
7 QBW=O .0
QSW:O.O
QTW=O.0
QTOP=O .0
QTTR=O .0
QFTR=O .0
DO 330 J=2,NJ
DO 330 I=I,MM
330 TI(I,J)=T2(I,J)
JOE=I
IF(TIME.LT.TAU) GO TO 3
8 WRITE(6,111) MCOUNT
Ill FORMAT(IX,13)
STOP
END
213
D.2.
DESCRIPTION
OF PROGRAM
NOTATION
AJ
J-3, used in computing
AM
value of integer
length
BETA
volume
BJ
J-2, used in computing
C(I,J)
thermal
CL
constant
pressure
specific
heat
of wax,
Btu/lbmF
CP
constant
pressure
specific
heat
of wax,
Btu/lbmF
CP1
constant
pressure
specific
heat
of bottom
CP2
constant
pressure
specific
heat
of fin,
CP3
constant
pressure
specific
heat
of top plate,
DAVG
average
DDOT
interfacial
DELT
absolute
interface,
DEN
wax density,
lbm/ft a
DENI
bottom
density,
DEN2
fin density,
DEN3
top plate
DFLO a
approximate
interfacial
location
for nodes
amount melted being equal to F2JM, in.
DFIN
interfacial
position
being melted, in.
214
M converted
of section,
of wax,
capacitance
point
R "1
of node
velocity
plate
to floating
interface
of liquid
value
F
location
ft
expansivity
height
interface
of
(I,J),
based
for nodes
location
Btu/F
plate,
Btu/lbmF
on amount
adjacent
temperature
Btu/lbmF
Btu/lbmF
melted,
to centerline
difference
in.
(I = MM), in./h
between
bottom
plate
and
lbm/ft
lbm/ft a
density,
lbm/ft 3
for nodes
adjacent
adjacent
to fin (I = 2) based
to fin (I = 2) based
on any
on
amount
DIF
temperature
difference
during
iteration
when
temperatures,
o F.
DMID
interfacial
DMO
DMID
DT
time increment,
EPS
arbitrarily
ERROR
percent
F(I,J)
mass fraction
of process
FAC
time ratio used in linearly

interpolating
particular
time in terms of bracketed
data
F2JM
fraction
acceleration
PCM section
HBOTz
heat
position
evaluated
used in comparing
solving steady state
for node
at previous
time,
to centerline,
in.
in.
h.
set small number

error
adjacent
new and old temperatures

equations
for unspecified
fin
in computed
of node
of S which
transfer
energy
(I,J)
ft/h
balance
which
corresponds
of gravity,
height
used as a comparator
based
on transfer
has undergone
to
phase
specified
values.
fin
rates,
change
percent.
since start
temperatures
at a
1/32 in. (arbitrary)
(see Fig. 40), ft.
coefficient
between
external
fluid
and
bottom
plate,
Btu/h_ft 2-F
HMELT
heat
of fusion,
Btu/lbm
HTOP a
heat
transfer
HTR
heat
of transition,
integer
coefficient
between
external
fluid and top plate,
Btu/h-ft2-F
Btu/lbm.
designation
of vertical
designation
of
column
in which
a mode
is located
(see
in which
a mode
is located
(see
Fig. 40)
integer
horizontal
row
Fig. 40)
JOE
counter
in time
KCHK
integer used to control

of KCOUNT)
used in refining
the
heat
printing
transfer
computation
of results
at desired
before
times
progressing
(see definition
215
KCOUNT
integercounterusedto print our resultsat timeswhenKCOUNT= KCHK
numberof wax nodesin a horizontalrow
MCOUNT
counterusedin determiningunspecifiedfin temperatures
MFIN
maximum value of MCOUNTwhich when exceededcausesprogramto

stop
MM
M+I (seeFig. 40)
numberof wax nodesin a verticalcolumn
ND
numberof datapointsfor measuredfin temperatures
NDP
ND-1
NI
N+4
NJ
N+3
NN
N+2
PR
Prandtlnumber
Q(I,J)
unnecessary
variable-- replacedwhereneededby QS(I,J)
QBT
instantaneous
heat transferratethroughbottom, Btu/h
QBW
instantaneous
heat transferrate throughbottom to wax only, Btu/h
QFTR
instantaneous
rate of heat transferto fin, Btu/h
QMELT
energywhichaccnuntsfor amountof wax meltedat any time, Btu
QRAT(I,J)
the instantaneous
net rate of heattransferto nodeI,J, Btu[h
QS(I,J)
the energystoredby node I,J aboveTREF for wax andabove0 for metal
nodes,Btu
QSIN
the energy stored by node l,J above TREF correspondingto initial

temperaturethroughoutnetwork, Btu
QSW
instantaneous
heat transferrate from fin to wax, Btu/h
216
TIME
instantaneous
TIN
initial
TK
wax
value of time,
temperature
thermal
h.
of all nodes,
conductivity
for convection),
(artificially
allowed
to account
Btu/h-ft-F
TKL
thermal
conductivity
TKR
ratio
TMELT
fusion
TREF
arbitrary
TTR
transition
TI(I,J)
temperature
of node
I,J at time t, F
T2(I,J)
temperature
of node
I,J at time t+At,
T3(I,J)
temperature
of node 1,J in fin at beginning
finding steady state solution, F
TAU2
arbitrarily
TK1
thermal
conductivity
of bottom
TK2
thermal
conductivity
of fin, Btu/h-ft-F
TK3
thermal
conductivity
of top plate,
TIM(L)
time value
TM 1(L)
measured
TM2(L)
first measured
TM3(L)
second
TM4(L)
third
VIS
viscosity
of effective
of liquid,
thermal
temperature
Btu/h-ft-F
conductivity
to thermal
conductivity
of wax, F
reference
temperature
temperature,
defined
bottom
(should
time value
plate
plate,
control,
Btu/h-ft
data
temperature
fin temperature
of each iterative
step used in
h.
-F
Btu/h-ft-F
to input
fin temperature
of liquid,
TIN),
used in print-out
fin temperature
measured
be less than
corresponding
measured
to vary in liquid
of measured
(input
(input
data),
(input
(input
data),
data),
data),
fin temperatures,
F
F
lbm/h-ft
217
VI
volumeof wax meltedat time t, ft a
V2
volumeof wax meltedat time t+At,
width
1. This
assumes
of wax cell, ft
that
some
detectable
on the film. The
any amount melted.
2. This was included
to be
temperatures
were specified
3. This has been
being insulated.
218
ft a
included
but
finite
number
thickness
DFIN
general
but has
as input data.
must
have
is the height
not
set at a small value
been
melted
before
it could
be
corresponding
to a node with
used
to essentially
to date
as bottom
correspond
to the
plate
top
D.3.
those
DISCUSSION
OF COMPUTER
In the following discussion,

references
designated
on the copy of the program.
LINES
PROGRAM
are made
FOR MELTING
to line numbers
corresponding
to
DISCUSSION
1-4
required
dimension
statements
for subscripted
variables;
values should be
(MM, NI) for all double
subscripted
variables
except
T3 for which they
should
be (1, NJ); values should be ND for single subscripted
variables.
NOTE: Q(MM,NI) is superfluous
and can be omitted with lines 136-140.
5 -23
specification
of computational
24-54
specification
of physical
55-63
specification
of geometry
64--82
computation
of all vertical
83 -95
computation
of all horizontal
thermal resistance values RH(I,J);note
that line
95 is a special definition
which amounts
to bypassing node (1,N+3)
which
was done to overcome
stability
criterion
required by this small corner node
96--108
computation
109-112
computation
of energy stored by a wax node relative to TREF for the start
and end of phase transition
and the start and end of fusion, respectively
113--144
initialization
of pertinent
quantities;
the initial value of tile stored energy
depends
on the relationship
of the initial temperature
to the reference
temperature
TREF;
note that lines 136- 140 are superfluous
and can be
omitted;
some initialization
of certain
parameters
is done in the DO loop
between lines 160 and 172 which are set primarily
to avoid random
printout
and are not essential to the computation
done in the heart of the program
145-150
input
data
corresponding
151--172
printout
computed
173 -174
initially
defines T3(I,J)
temperatures
T 1(l,J)
of all nodal
parameters
properties
parameters
thermal
capacitance
values fm measured
time values
of initial
quantities
resistance
values
fin
and
values
C(I,J)
bottom
values for checking

purposes
for informational
purposes
for all fin nodes
RV (I,J)
and
plate
and
sets these
temperatures
printout
equal
and
of certain
to the initial
219
175
beginningof maincomputationscheme
176
time is stepped
177-188
loops which compute

and
based on old temperatures
given by
q(l,J)
forward
by At
store the net rate of heat transfer
to nodes (l,J)
TI(I,J);
the rate of heat" transfer
to node (I,J) is
+ T(I+I,J)-T(I,J)
RH(I,J)
= T(I-I,J)-T(I,J)
RH(I,J)
+ T(I,J-I)-T(I,J)
RV(I,J)
this expression
must be modified
accordingly
which are not surrounded
by four neighbors
189-191
computation
g_en by
Qstored
192-193
computation
T2(I,J)
of totM
energy
stored
by
node
+ T(I,J+I)-T(I,J)
RV(I,J+I )
for nodes
(I,J)
since
near
a boundary
the start
which
is
2., _At
tirr.e
of new
= TI(I,J)
top
plate
temperatures
T2(I,N+3)
from
the expression
_t(l,J)At
C(I,J)
194
sets the corner plate node (1,N+3) temperature

equal to that
node (2,N+3);
omission of the corner node in the computation
done to avoid stability problems
due to its small size
195-208
computation
of new wax node temperatures
from the energy stored by the
nodes and their
capacity
and/or
phase change enthalpy
values; when the
stored energy lies between
Q1 and Q2 the new temperature
is forced to be
the transition
temperature
and when it lies between
Q3 and Q4 the new
temperature;
is forced to be the fusion temperature;
also the fraction of the
of the second
scheme was
node which has undergone

phase change is calculated
from the relationship
of the stored energy to Q3 and Q4, note that certain designated
cards need
to be changed
when running
the program
for freezing
as contrasted
to
melting
209-210
220
beginning
of determination
of fin temperatures
211-212
all
new
fin
temperatures
are
set
to
T3(I,J)
which
simply
represents
an
assumed value always corresponding

to the previously
computed
value except
at the very beginning at whicb time it is set as the initial temperature
213--220
interpolation
scheme which assigns new temperatures
to the three nodes on
the fin and one on the bottom
plate corresponding
to positions
where
temperature
measurements
were made; the new temperatures
are linearly
interpolated
from the input data
221-222
assigns
223
beginning of iteration
process to determine
unspecified
fin temperatures
from
steady state equation;
fin nodes were not treated
as transient
cases due to
their
extremely
small capacitances
that
would
impose
a severe stability
criterion
224 -237
iteration
process
used to determine
unspecified
fin temperatures;
in each
iteration,
T2(1,J)
is computed
from
steady
state
equations
and
then
compared
with T3(1,J)
which corresponds
to the calculated
temperatures
during
the previous
iterative
step; the interation
is continued
until the
differences
between
computed
fin temperatures
and their
corresponding
values for the previous
iterative
step are all acceptably
small; should the
iteration
exceed MFIN counts the program is directed
to stop
238
when
counter
JOE
equals
2,
considered
to be the solution
advances to line 259
239
increase
240-242
the energy stored at each node (l,J) is reset back to its original value; this is
to allow for an improved
computation
of the net heat transfer
rate to each
node to be made and then a recomputation
of the stored energy and the
corresponding
new temperatures
243-254
computation
T2
255-257
calculation
of net heat
based on old temperatures
258
return
to line 189 which consists of redirecting
the computation
through
that of computing
improved
new temperatures,
energy storage values, and
fractional
melted values by using the improved
(averaged)
heat transfer
rate
(Lines 255-257);
this corrective
technique
is only employed
once
all nodes
along
of counter
of net
the
bottom
plate
the
same value
the new temperatures

at the particular
time
of new
temperature
at all nodes
are
and the program
JOE to 2
heat
transfer
rate
to each
node
using
transfer
rate to each node as the
TI and new temperatures
T2
new
temperatures
.:verage
of that
221
2594278
computation
of various
obtained at time t+At
279-282
computation
of volume
of melted
283
computation
of average
liquid depth
284
computation
of energy
285-286
resetting
287
determination
of absolute
value
plate and the fusion temperature
288
computation
of the Prandtl
289-290
computation
of the Rayleigh
291-293
determination
correlations
294
computation
295-315
recomputation
of thermal
thermal conductivity
rather
316
counter
check
which
controls
printing
computation
of interfacial
position
317
counter
advance
318
by-pass
of printing
319-320
write
321-332
computation
centerline
333-335
write
336--337
calculation
of interfacial
velocity and renaming interfacial
for determining
its change at the next time step
338-351
write
222
of V1 and
heat
transfer
required
V2 for next
quantities
from
from
the volume
statement
statement
statements
of
melted
to melt the wax which
has melted
time step
of temperature
difference
between
bottom
number
number
of effective
results
temperatures
wax
of effective
liquid conductivity
of O'Toole and Silveston
of ratio
the new
liquid
due
conductivity
to convection
to actual
resistances
in the liquid
than the actual value
except
when
for printing
results
interface
position
for printing
results
and corresponding
for
out
by
using
value
using
of desired
by
the
results
effective
as
well
as
line 316 is executed
columns
formats
next
for printing
to
fin
and
position
results
next
to
to provide
352--358 reinitializationof pertinentquantitiesfor next time step

359-361
setting new temperaturesfor current time step to be old temperaturesfor

the next time step
361
reinitializationof counter
363
comparisonof time to upper limit value which when exceededresultsin

stoppingthe program
364-365
printing out of valueof counterusedin fin temperatureiteration
366
STOP
367
END
223
SPECIFY
PARAMETERS
I _._,.,_,_
_o,_,ON_.
_oI
I '-'_'
LINE 176
STATEMENT
I'''''''''''"
EVALUATE
ENERGY STORED
NODE (I,J) FROI_I _(13)
BY |
VALUES EXCEPT FOR FINS AND

I COMPUTER BOTTOM
T2 FROM PLATE
ENERGY STORED
I_-, !
!
I
,
COMPUTE HEAT TRANSFER
i
RATES FROM T2 VALUES _l'(l_J)
ym
NO
;- J
DETERMINE
OEPENDENT QUANTITIES
VARIOUS HEAT TRANSFER VALUES
iNTERFACIAL
POSITIONS
I
I
YES
RESISTANCES
IN LIQUID
RECOMPUTE THERMAL
O
PRINT
RESULTS
JOE -T2(I_J)
1
TI(I,J)-
I _TO,i
Figure D-1.
224
Skelton
flow chart.
t
I
D.4.
C
COMPUTER
PROGRAM
TEST
230-15
DIPIENSION
1,31)
FREEZE
RVi5a31),
DIMENSION
l(Sa3t)
T2(5,31),
r(5,3t},
DIMENSION
TM1(25),
TM2(25I,
pIMENSION
COMPUTATIONAL
N=27
VR(Sa31)a
PARAMETERS
TEBT
3/4
RH(Ss31)s
FOR
SOLIDIFICATION
INCH
CELL
C(5J31)s
ORAT(S,31),
TH3(25)$
O5(5_31)s
T1(5
T3(Is31),QRA2
TM4(25)s
TIM(25)
HR(Sa31)
AM=H
NNmN+2
NJiN3
NI=N+4
NO=23
NDP=22
TAU=I,5
KCO_NT=I
MCOjNT=I
HFINmSO0
EPS=I,E'06
KCH<=1900
JOE't
OT'O,O0005
TAU2=IIO,_OT)(DT/3,)
AR=_O,
C
UN=I=O'EP$
PHYSICAL
PROPERTIES
TAMSm80,
TIN'IO0,
_TOP=toEOB
HBOT=5=
G=(32e17_3600'_3600,)
WAX
0EN=47,2
TK=O=087
C_=0=5
TTR=73=O_
HTRu2_=t08
THE_T=89,8
H_EET=73=357
TRER=50=
BET&=O,O0045
VIS=l_e3
C_';P
TKL=TK
BOTTOM
PLATE
0EN1=171,
T<1=93'
CPt=0.22
DENOTED
BY
225
FIN
DENOTED
DEN2-%71.
T<2=93.
BY
CP2=0.22
PLATE
DENOTED
BY
3
DEN3=72*5
TK3=O,09
CP3=0.33
GEOMETRY
PARAMETERS
w=Oo75/%E,O
H=2*625/12'0
B=5o0/%2,0
SmW/[2o_AM)
S1=O'O32/%E*O
S2=0*008/12.0
S3=0.25/%2.0
F2jM'%oO/(32.0_S_12.0)
VERTICAL
RESISTANCES
RV{I_2)=(Si/(TKI_S2*B)I*(2,/{HBOT*S2_B})
DO
10 I-2JMM
10
RVIIsE)=(S%/iE.*TKI*S*B))+(I./(HBOT_S*B))
TOP
RV(ts3)=(S/(TKE_S2,B))(St/(TK%*B2_B))
DO 20
I-2sMM
20
RV(I_B)=(%./(2._TK_B))+(S%/(2o_TK%_S_B))
O0 30
J=_J_
RV(Isd)=((E,mSl/(TK2mS2mS))
DO
_0 Jm*sNN
DO _0
I'2$MM
RV(IaJ)=(%*/(TK_B))
RV(%s_+3)=(S3/{TK3_S2_B)I(S/(TK2_B2_B)}
_0
50
I'2_MM
RV(Is__)
= (S3/(2,_TK3_S_B}}
RV(IsN+3}-(B3/(2,_TK3_S_B))(1,/(Eo_TK_8})
30
_0
;'
50
(lo/(HTOPm$_8))
RV(2_+_)=(S3/(2._TK3_B_(S+(S2/2*))))(%'/(HTOP_B_(S
1($2/2.)}})
C
HORIZONTAL
DO lO
70
80
90
226
_ODAL
RESISTANCES
I=2sMM
RH{I_2)
= {S/(TKt=St_B))
RH(I_+3)-(S/(TK_S3_B)}
DO
BO J=3_N_
O0
80 I=2_MM
RH(ZsJ)
- (I./(TK_B))
DO 90
J-3, NN
RH(E_J)=
(S2/(_.*TK2_S_6))
RH{E_2}-{(S2+S}/(2*_TKI_S%_B))
RH(2_+3)=RH(2_N+3I+RV($_N3}
CAPACITANCES
C(%_2)-((DENI_SI_S2_B_CPI)/2.)
DO
110
I-2_MM
(1./(2._TK_8})
C(IJ 2)=(OENI_SI*S_B_CPt)
DO I 20 J=3aNN
120 C(I_ J)=((DEN2*S2_S=B_CP2)/2,)
C(I_ N+3)=((DEN3*S2*S3*B*CP3)/Z=)
DO I 30 Im2sMM
130 C(I_ N+31=(DE
N3_S3_S*B*CP3)
C(2a N+3)=($3
*B_(S+(S2t2,))_DEN3_CP3|
DO I $0 Jm31N N
DO 1 _0 I=2oM M
CII, J)m(DEN*
QI (C(2_3)
_(TTR=TREF))
Q2mQ I((DEN,
Q3 Q2 + (( CI2s3))_ITMELT-TTR))
Q_BQ 3+((DEN_
Qu_NTITIE_
INIT
ZATIQN
OF PERTINENT
TIME =0=0
Q_AX=O*O
OB_-O,O
OS_-O,O
QTw=O'O
QTOP=O.O
QFTR=O,O
110
%50
160
tTO
V1"O'O
V2"O'O
DMO'O,O
DO 150 J-21NJ
DO 150
I-I_MM
Tt(I_jI'TIN
I;tTI _,LT.TTR)QSI_-ICI2_3)=ITIN'TREF})
QSIN-Q_+ICIZ_3I*ITIN
IF(TI N.GT.TTR.AND.TIN.LT.TMELT)
-TTR)
)
IF(TI N.OT.TMELT)QSIN=Q_IICI2_3))_ITZN-TMELT))
DO 160 I=I_MM
TIII_N_)mTAMB
DO 170 j=3_NN
DO 170 I=2_MM
_SII_J)-QSIN
03 199 J=2_NI
DO tg_ I-I_M
Fll_J)-O,O
QRA/(I_J)=O,O
I=%_ND)
I-I_ND)
READIS_II}
(TM211)_
I=i_ND)
I-t_NO)
I=I_ND)
FORMAT(8FIO,O)
DO 9%0 KTC=%_
ND
TIMIKTC)-TIM(KTC)/3_O0,
wRITE(6_22)
TI_E_M_N_M
227
22
FORMAT(IXsSHTI_Em_Ei5,BaiOXs_H_msEi5,8_iOXa2MH=aEiS,8
i_iOXs2MN-_I2stSX_EHM=aI2)
WRITE(6a33}@%s@_jQ3_G_
33 FORMAT(IXs3MQ%'sEIB,B_IOX_3HQ2-_EIb,_sIOX_3MQ3=_EISo8
iIIOX13MG_=lEiS.B)
wRITE(6s_!
FORMAT(2XJ_MI
JsSx_%gHVERTICA6
RESI_TANCEs6X
I$2%HHORIZONTAL
RESISTA_CEJ6X_%7HNODAL
CAPACITANCEa6X
2sI%HTEMPERATUREs5xslFIQS(I_J))
O0 200 Q-2sNI
DO 200 I-i_MM
IF(J,E_,N+_}
GO TO 1
GO TO 2
I QSII_J}=O,O
RH( IsJ)-1.E08
C(I _J)=O.O
2 IF( I,EQ,II
RH(I_J)-%,EO8
IF( J,EQ,2,0R,j,EQ,N3)
QSII_J)-O,O
IF( I,Eu,I)
QSllsJ)=O,O
wRI TE{6s55)IsJ_RVII_J)_RHII_J)_CII_J)_T%{I_JI_Q$II_J)
55 FOR _ATI%x_I2_%X_I2_SX_EIB,_IOX_E%5,8_IOX_EIB,B_6X
200
CON TIthE
DO _OO J=3_NJ
DO _00 I=2_MM
VR(IsJ)=RV(Isj)
NO0 MR( IsJ)m_H{I_J)
DO
_89 T3( I_J}-TII%_J)
COMPUTA TIO_
SECTION
COMPUTATION
SECTION
COMPUTATION
SE CTI_N
3 TI_ _=TIMEDT
DO
ORA T(I_J)=((TI(2_J)=TI(I_J|)/RH(_sJ)I+((TI(IsJ=I|=TI|I
)IRV(%_J))((TI{I_J%)-TI{I_J)}/RV(IaJ%))
QRA T(MM_J)={(TI{M_J)-T%{MM_J))/RH(MMsJ))+{(T%(HM_J-I)
l-TZ
2+1) )
TI_UE
IF(
DO 211 J=3_NJ
00
T(I_J)-((T%(I-%_J}=TI(I_J])/RH(I_J}}+((T%(II_J)-TI
J))/RH{I+%_J))*((T%(I_J'I)-T%{I_J))/RV(I_J))*((TI(I
2_J %}'TI(I_J})/_V{I_JI}}
211 CO_ TI_uE
212
DO 220
J'3_J
DO 2_0
I=%_M
220
QS{ I_Q}=QS(I_J)(QRAT(I_J)_DT)
PO 2_0
I=2_F_
2_0 T2{
228
C
C
C
C
C
C
C
C
C
T2(1sN3)-T212_N3)
DO 250 J-3JNN
DO 250
I-2sMM
IF(_S(IsJ),LT,_I)
T2(IsJ)-TREF+(QS(IaJ)/C(IsJ))
IF(_S(I_j},GE._I,AND,OS(IsJ),LE,Q2)
TZtI_J)=TTR
IF(_S(I_J},GT,O2,AND,_S(I_J),LT,Q3}
T2(I_J)=TTR+((gS(Z
l_J)-Q2)/C(Zsjl)
IF(;S(IJJ).GE.g3.AND,QS(I_J).LE,Q41
T2(I_J)=T_ELT
wHEN 30ING
FROm MELT TO FREEZE
Oh VICE'VERSA
CHANGE THE
FOLLOWING
CA
I=(_S(I_J)._T'Q3,AND,QS(I_Ji,LT,Q_I
F(IaJ)-(Q_'QS(I
I_J))/(DEN_KS_2)_3*HMELT)
IF(_S(IsJ)eGE,Q_)
_(IaJ)=O,O
IF(QS(I_J}.GT.o_)
T2(IsJ)=TMELT+((OS(IsJ)'Q_I/C(ZaJ))
wHEN 30ING
FROM
MELT
TO FREEZE
OR VICE-VERSA
CHANGE THE
FOLLOWING
CA
IF(_S(I_J).LE,_3)
_(I_J)-1,0
250 CONTINUE
SPECIFICATION
ANO/OR
_ETERHIN_TION
OF FIN
TEMPERATURES
THE FOLLOWI_3
00 LOOP ASSJMES
FIN
TEMPERATURES
FOR
ITERATION
00 255 J=3_NN
255
T2(1/J)-T3(1sJ)
00 _60 L=IaNDP
IF(TIME,GE,TIM(L),AND,TIME'LE'TIM(L+I))
GO TO *
260
CONTINUE
F_C=(TIME-TIM(LI)/(TI_(Li)-TIM(L))
T2(t/2}-TMI(L)((TMI(L+t}-TM%(_}}_FAC)
T2(t_8)-TM2(L)((TM2(L+t)-TM2(_))mFAC)
T2(i_IS)-TM3(L)+((TM3(L+%I-TM3(L))_FAC)
T2(l_21)-TM_(L)+((TH_(L+lI-TM@(L))_FAC)
DO 270
I-I_MM
_70
T2(I_2)-T2($_2)
UNSPECIFIEO
FIN
TEMPERATURES
OETER_INEO
BY STEADY
STATE
EQUATIONS
_5_
MCOJNT=MCOUNT+I
DO _80 J=3_NN
T3(I_j)-T2(I_J)
IFCJ,EG,8,0R,J,EQ,15)
O0 TO 5
I_{J'EQ.21)
GO 10
TZ(I_J)'((T2(I_j-i)/Rv(t_J))(T2(2_J)/RHi2_J))iT_(I#J
II)/RV(I_JI)})/((I,/RV(I_JI)(I,/RM(2#J])+(t,/RV(t_J
2t))}
5 CONTINUE
280 CONTINUE
I_(MCOUNT,GT,MFINI
GO TO $
DO 281 J-3_NN
DIF=T2(I_J)'T3(I_J)
IF(ABS(DIF),GT,EPS}
_O TO 25_
281CONTINWE
IF(JOE,EQ,2}
_0 TO 285
229
_SB
282
283
2d#
2B5
,
_03
WOi
286
287
JOE-JOEI
DO 888
dm3sNJ
DO 88_
I-lsMM
QS(IsJJ-QS(IsJ)'{_RAT{IaJI_DT)
DO 282
J-3sNd
QRA2(I_J}-(IT2(2_JJ-T2(laJI)/R_t2sJ))+((T2(loJ'I)'T2(1
IsJ))/RV(IsJ)I+((T2(I_j+I)'T2(lsJ)I/RV(ls_+I)}
QRA2(MM_JIm((T2(Pi_J)-T2(MMs_|)/RH(MM_J))+((T2(HMsQ'I)
I-T2(M_$J))/RV(MH_j))+((T2(MMsJ+%I'T2(MM,
Q_|/RV(MMsJ
2+1l!
CONTINUE
IF(MoEQ,1IGO
TO 283
O0 Z83 Jm3_NJ
DO 283
I=2lM
Q_A2(IsJI-((T_(I-laJ)T2(I,J))/RM(IsJI}+((T2(I+lsJ}'T2
%(I_J}}/RH(II,JI}e((T2iI_J'iI'T2(IsJ)}/RV(I*JII((T2(I
2sJ+il'T2(IsJ))/RV(I_J+%})
CONTINUE
DO 2B_ J-3_NJ
O0 28_ I-i_MM
ORAT(IaJ)-(QRAT{I_J)QRA2(I_J))/2.Q
80 TO _12
MCO_NT=I
DO _01 j*3INJ
DO _tO% I"2_MM
IF(F(I_J)'GT'ERS.ANO'F(I_J)'LT'UN}
GO TO _OZ
IF{_(I_J}'GT'_N}
30 TO _03
QO TO #Oi
RV(I_J)=VR{I_J}
RH(I_J)-HR(I_j)
_0 TO _01
RV(I_JI)-VR(I_J+%)/A_
RH(I+I_J}-HR{II_J)/AF
CONTINUE
DO 286
I=I_MM
QRAT(I_2)-((T2(I,2)*T%(I_2})_C(I_2)/DT)
DO 287
I-%_MM
QS{I_2)-QS(I_2}+{C{I_2}_(T2(I_8)'T%(I_2}))
DO 290 I-2_MM
QBN={T2(I_2)=T_{I_3))/RV(I_3)QBW
290
30O
310
311
230
QBT=QB_((T2(%_2)=T2(I_3))/RV(I$3})
DO 300 J-3_NN
OSW'QSW+((T@(%_J)'T2(2_J))/RH{2_J})
DO 310
I-I_MM
QTDm-((T2(I_N3}-TANS)/RV(I_N_))+QTOP
DO 311J_3_NN
QFTR*QFTR+QRAT(I_J)
DO 312
I-I_M
312
QTTR=QTTR+QRAT(I_J)
Q_AX-{QBw+QTwQSW)_OT(QWAX)
RATIO=QSW/QB_
ERROR=((OBT-(QBW_SH+QTH+QTOP*;FTR*_TTR))_IOOeO)/QBT
DO 930 J=3sNN
DO 930
I=2_MM
VE=V2+(F{I_J)*(S_2)_B)
930
CONTINUE
OAV3=((2,O_V21/(W_BII_12,0
OMELT=I(V2"V1)_DEN_HMELT)tDT
QFREZ=gMELT
Vl'V2
VE=O'O
IF(KCOUNT,EO.KCHK)
O0 TO 6
KCOUNT=KCOUNTI
GO TO 7
6 WRITE(6s66)
TIME_
OWAXs ERROR
66 FORHAT(1XsSMTIHE=aE15,BaIOX_SH;WAX=sE15,_lOXn6HERROR=
lsE15,8)
DO 313 J=3_NN
AJ=J=3
BJ=J=2
%F{F(2_J),GT,F2_M)
DFLOntBJ_S_12,O)
DFIN=(Aj_S_12,01
IF(F(2_J),LT,ERS}
GO TO 31_
313
CONTINUE
31_
DO 315 j=3JNN
AJmJ=3
IF(F(MMsJ),LT,
1,0) DMIQ=((AJ_S)+(FIMM_J)_S})_12'O
IFIFIM_J),LT,
1,0) GO TO 316
315
CONTINUE
316
WRITE(6_67)
OF IN_ DFLO_ OAVOa
_MID
67 FORMAT(IXaSHDF
IN=sE15,8_lOXs5MDFLO=_E15,B_lOX_SHOAVg=
lsEIS,SsIOX_5HO
_I0=*E15'8)
DOOT=(DMIO'DMO
}/DT
DMO=DMID
WRITE(6_69)
QFREZ_
DDOT
6g FORMAT(IX_6HQFREZ-_EIS'B_lOX_SHOOOT=_Et5'S)
WRITE(6#77)
QBW_
@5W_ QTw_
QBT_
RATIO
77 FORMAT(1X_MQBW=_15,B_3X_HOSwm_E15'8_3X_HQTw=_E15'8
l_3X_MOBT=aE15,B_3X_6HR_TIOm_E15,a)
WR%TE(6_881
88 FORHATI2X_tMI_2XalHJ_IOX_lIMTEHPERATURE_lOX_I5HFR_CTIO
IN _ELTEO_lOX_llHENERGY
RATE_IOXaI3HENERGY
$TDREOI
DO 320 J=E_NJ
DO 320
I=t_MM
wRITE (6_ 99 } I_ J_ T2( I_ J)_F( I_ J }* ;RAT( I_j)_QS(I_J)
99 FORMAT( 1X_ I2_ 1X_ IE_ 8X_ 215'8_8X_
E15'8_
8X_15'
8_ 8X
1_E15,8)
320
CONTINUE
KCOUNT=I
23 1
7 QB_=O,O
QSh=O,O
QTw=O,O
QTQPaO.O
QTTR_O*O
QFTR=O,O
DO 330
JR2sNJ
DO 330
I=l_M
:330 T1 ( |a J) =T2(I,J)
JOE=I
I_(TZME,LT,TAOI
8 WRZTE(6_II_)
111 FO_MAT(lxsI3)
STOP
E_D
232
GO
_OU_T
TO
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and
Space
Company
NAS8-25577,
September
R.
O.:
- Final
Report
April
1958.
p. 204.
Lockheed
of Density
Eng.,
in a
in Cellular
Final
or
Convection.
Report
the
D148619,
Solidification
1970, pp.
(Apollo
Vol.
in a
of
11-16.
14). Marshall
The Apollo
14 Heat Flow
Results
of Data
Analysis.
D225333,
NASA
Contract
1971.
47.
Prensner,
D. S. and
Spaces.
Proceedings
1972, pp. 339-368.
48.
Griggs, E. I.: Thermal

Capacitor
Study.
Research
Reports,
1971 NASA-ASEE
Summer Faculty Fellowship
Research Program, September
1971, pp. 208-220.
49.
Dyer, J. D.
Nonadecane
Measurements.
Engineering,
236
Hsu, G. R.: Thermal

Conveciton
in Laterally
Bounded
Air
of the Eighth
Southeastern
Seminar
on Thermal
Sciences,
and Griggs, E. I.: Study

and
Hexadecane
Including
Report
ME-49. Tennessee
June
1975.
of
the Solidification
and Melting of
Solid
Phase
Thermal
Conductivity
Technological
University,
College of
REFERENCES
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50.
Thomas,
L. J. and Westwater,
J. W.: Microscopic
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During Melting and Freezing.
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vol. 59, no. 41, 1963, pp. 155-164.
51.
Bailey, J. A. and Davila, J. R.: An Investigation

of the Solidification
of a Metal
and Two n-Paraffins
Using an Acoustic
Technique.
Applied Science Research,
no.
25, 1971, pp. 245-261.
52.
Bailey, J. A. and
No. 5. Submitted
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53.
McAdams, W. H.: Heat

1954, p. 450.
54.
Powell, R. W. and Challar, A. R.: Thermal

Conductivity
Engr. Chem., vol. 53, no. 7, July 1961, pp. 581-582.
55.
Bailey, J. A. and Liao, C. K.: Thermal

Capacitor
Design
Thermal
Analysis.
Final Report
submitted
to NASA-MSFC
Agreement
NCA8-52 with North Carolina State University.
56.
Bentilla,
E. W. and Shlosinger,
A. P.: Research
and Development
Study
on
Thermal
Control
by Use of Fusible Materials.
Nortllrop
Corporation
Report
No.
NSL 65-16,
Interim
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under
Contract
NAS8-11163
to NASA-MSFC,
February
1965.
57.
Pizzolato, P. J. and Farmer,

Martin Marietta Corporztion,
58.
Young,
C.
Improvement
59.
Anonymous:
Study of Structural
Active Cooling and Heating tteat Sink Systems
for Space Shuttle.
McDonnell
Douglass Corporation,
MDC E0479, Octobe_ 197i
Liao, C.: Thermal

Capacitor
to Astronautics
LaboratolT,
Alabama,
1973.
T. K.;
Study,
Transmission.
Design Rationale.
hlterim
Report
George C. Marshall Space Flight
McGraw-Hill
R. A.: Phase Change

March 1973.
Series
in Chemical
of n-Octadecane.
Thermal
Harper,
_1. D.; and
Ingrain,
E.
Brown Engineering,
February
1973.
Engineering,
Rationale;
Part IIunder Cooperative
Control
H.:
Ind.
Development.
PCM-Heat
Transfer
237
TECHNICAL
I.
REPORT
NO.
NASA
a
2.
TP-
ACCESSION
REPORT
NO.
STANDARD
3.
RECIPIENT'S
S,
REPORT
TITLE
CATALOG
PAGE
N0,
1074
TITLE ANOSUBTITLE
A Desig- Handbook
Storage Devices
7.
GOVEIRNMENT
for Phase
Change
Thermal
Control
and Energy
6.
DATE
November
1977
PERFORMING
ORGANIZATION
8. PERFORM
AUTHOR(S)
William R. Humphries
and Edwin I. G,riggs*
9. PERFORMING
ORGANIZATION
NAMEANDADDRESS
George C. Marshall Space Flight Center
Marshall Space Flight Center, Alabama
CODE
NG ORGANIZATION
REPORt
M-230
O.
WORK
UNIT
11.
CONTRACT
13.
TYPE
NO,
OR GRANT
NO.
35812
OF
REPOR%&
PERIOD
COVERED
12. SPONSOmNO
AGENCYNAMEANDAOORESS
National
Aeronautics
Washington,
15.
SUPPLEMENTARY
Prepared
*Associate
18.
D.C.
and Space
Administration
Technical
20546
14.
Paper
SPONSCRING
AGENCY
CODE
NOTES
by Structures
Professor
and Propulsion
of Mechanical
Laboratory,
Engineering,
Science
and Engineering
Tennessee
Technological
University,
Cookeville,
TN.
ABSTRACT
This document
devices.
Fundamental
Performance
in zero3
_ives a comprehensive
survey
mechanisms
of heat transfer
and one-g fields are examined
of the thermal
aspects of phase change material
within
the phase change
device are discussed.
as it relates
to such a device. Computer
models
for phase change

materials,
with metal
fillers, undergoing
conductive
and convective
processes
are
detailed.
Using these models,
extensive
parametric data are presented
for a hypothetical
configuration
with a rectanl_tlar
phase change
housing,
using straight
fins as the filler, and paraffin
as the phase
change
material.
These
data are generated
o,,er a range of realistic
sizes, material
properties,
and
thermal
boundary
conditions.
A number
of illustrative
examples
are given to demonstrate
use of the
parametric
data. Also a complete
listing of phase change material
property
data are reproduced
herein
as an aid to the reader.
17.
KEY
WORDS
18,
DISTRIBUTION
STAR
19.
SECURITY
CLASSIF.
("_ thl=
eep_t_
20.
SECURITY
CLASSIF.
(of thl=
pale
STATEMENT
Category
34
21.
NO.
Unclassified
Unclassified
OF
PAGES
254
* For sale by the National Technical Information Service. Si}rlrl_f eld

*U.S.
GOVERN_,E:ff
PRINTI_;C
OFFICE:
1977
735-o78/45
22.
PRICE
$9.00
%/_r_n_a 22161

Nasa

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Melting and Transition

Scope and Definitions

with number of carbon

of heats of phase change

heat versus temperature

for C t _H24, C_ 2H26, and C a3H2 s

heat' versus temperature

Liquid phase density

Ca 5H32, and C_ 6H34

(C_ 4H30 ) ..........

data for normal

C20 H42 versus

Phase change device application

Typical single cell of phase change

system and dimensions

system and dimensions

Nodal grid designation

Latent energy storage per unit base area versus

Latent energy storage per unit base area versus

Absolute viscosity of paraffins

Transient base temperature rise versus

fraction of PCM melted

Transient base temperature

fraction of PCM melted

Transient base temperature

Transient base temperature

Transient base temperature

Transient base temperature

Transient base temperature

Transient base temperature rise versus fraction

Transient base temperature

Transient base temperature

Transient base temperature

Transient base temperature

Transient base temperature

Time required for PCM to melt for _l" = 1076.4 J/s-m 2

Time required for PCM to melt for q" = 1076.4 J/s-m 2

Time required for PCM to melt for q"= 2152.8 J/s-m 2

Time required for PCM to melt for q"= 2152.8 J/s-m 2

Time required for PCM to melt for q" = 2152.8 J/s-m 2

for PCM to melt for ci" ---4305.6

Time required for PCM to melt for c_" = 4305,6 J/s-m 2

for PCM to melt and q" = 4305.6

Time required for PCM to melt for _1" = 6458.3 J/s-m 2

Time required for PCM to melt for q" = 6458.3 J/s-m 2

Time required for PCM to melt for Cl" = 1076.4 J/s-m 2

Transient base temperature

for PCM to melt for q" = 6458.3

Energy ratio versus heat flux density for W = 0.127

Energy ratio versus heat flux density for W = 0.254

Energy ratio versus heat flux density for W = 0,254

Energy ratio versus heat flux density for W = 0.254

can (0.1 ira.)

Energy ratio versus heat l]ux density for W = 0.508

can (0.2 in.)

Energy ratio versus heat flux density for W = 0.508

Energy ratio versus heat flux density for W = 0,508

Energy ratio versus heat flux density for W = 2,032

Encrgy ratio versus heat flux density for W = 2.032

Zero-g ullage configurations

of L/d on heat transfer

Example exit temperature