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ISSN: 2278-0181
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1. INTRODUCTION
Rapid development in information technology allows
portable electronics to gain faster processing speed and
enhanced capabilities. However, thermal management in
the portable electronics environment is becoming
increasingly difficult due to high heat load and dimensional
constraints. Increasing the heat transfer area is preferred as
the simplest method to enhance heat dissipation rate,
because the use of better fluid to increase the heat transfer
coefficient is not an economical and practical solution. The
one of the controllable variable to enhance the convective
heat transfer rate from an extended surface is the geometry
of the fins.
Attaching fins increases the surface area but it also
increases the resistance to the flow of air. The heat transfer
coefficients based on base area of the fin arrays may be less
than that of the base plate. If the decrease in the heat
transfer coefficient is more than the increase in the surface
area, the heat transfer rate will decrease. The current trend
in electronic industry is microminiaturization of electronic
packages. The thermal design problem is recognized as one
of the factors limiting achievement of higher packaging
densities. Because of reduction in surface area available for
heat dissipation, optimization of fin surface area and
geometry becomes very important in natural and force
convection heat transfer.
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Q conv mc p (t out - t in )
(2)
t t out
Q conv h A s t b in
2
(3)
A s W L d H N xy
d 2 N xy
4
(4)
m c p t out t in
t t out
A s t b in
(5)
Aff W(H C) Nx H d
(6)
Re
Gd
(7)
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40
35
30
Nu
25
m=0.069 kg/s
m=0.089 kg/s
m=0.105 kg/s
m=0.119 kg/s
m=0.132 kg/s
m=0.143 kg/s
20
15
10
0
15
Sy/d
20
25
45
40
Nu
35
30
25
m=0.069 kg/s
m=0.105 kg/s
m=0.132 kg/s
Poly. (m=0.069 kg/s)
Poly. (m=0.105 kg/s)
Poly. (m=0.132 kg/s)
20
15
m=0.089 kg/s
m=0.119 kg/s
m=0.143 kg/s
Poly. (m=0.089 kg/s)
Poly. (m=0.119 kg/s)
Poly. (m=0.143 kg/s)
10
0
10
Sy/d 15
20
25
45
Nxy=33
Nu
40
35
30
Nxy=66
25
Nxy=44
m=0.069 kg/s
m=0.089 kg/s
m=0.105 kg/s
m=0.119 kg/s
m=0.132 kg/s
m=0.143 kg/s
20
3
Sy/d
12
20
Nu
10
Nxy=40
15
Nxy=120
Nxy=220
Nxy=80
10
1
1.5
2.5
Sx/d
3.5
4.5
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45
In-line-Cylinder Nxy=42
ii)
iii)
iv)
v)
In-line-Square Nxy=42
In-line-Diamond Nxy=42
40
Staggered-Cylinder Nxy=60
Staggered-Square Nxy=60
Staggered-Diamond Nxy=60
35
Nu
30
25
20
15
10
4000
5000
6000
7000
8000
9000
10000
11000
Re
vi)
0.1
Nomenclature
0.01
10000
100000
Re
Square
Cylinder
0.1
0.01
10000
100000
Re
Nxy=60-In-line
0.1
A
C
Cp
d
f
G
H
k
L
m
N
Nu
Q
Re
S
t
T
W
x, y, z
p
area, m2
clearance between fin tip and the roof, mm
specific heat of air, J/kg K
diameter of the pin-fin, mm
friction factor
mass flux, kg/m2 s
height of the pin-fin, mm
thermal conductivity, W/m K
length of the base plate, mm
mass flow rate of air, kg/s
number of pin-fin
Nusselt number
heat transfer rate, W
Reynolds number
spacing, mm
temperature, oC
temperature, K
width of the base plate, mm
set of Cartesian coordinates
overall pressure drop along the array, N/m2
dynamic viscosity, N s/m2
density, kg/m3
Subscripts
0.01
4000
5000
6000
7000
Re
8000
9000
10000
6.0 CONCLUSIONS
air
b
conv
ff
in
loss
out
rad
tot
ts
x, y
base plate
convection
free flow
inlet condition
loss of heat
outlet condition
radiation
total
total surface
directions
11000
147
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REFERENCES
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
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