PFMEA Solder Paste Printing 03 Sept 2016 (Zul)

DOCUME
Total Pages
Customer
SPACELABS
Project No.
Solder Paste Printing and Solder Paste Inspection (SPI)

Machine
Project Name
Document No.
FMEA/MP/008
Document Title
(Include Cover Page)
Revision History
S/N
1
Reason for change

Initial Release
F-01-01 Rev. B
Effective Date: 22 Sep12
Review & Approved by: (Name & Signature & Date)
This is
Engineering
Wahyudi
Material
Production
Budiawan Wawan
Program
Quality Assurance
Ling CK
F-01-01 Rev. B
DOCUMENT COVER PAGE
es
ver Page)
ame
N/A
Process FMEA of DEK Screen Printing and KOH YOUNG SPI
Machine
Title
History
F-01-01 Rev. B
Date
Revision
Originator
2-Sep-16
Zulfadli
This is an electronics approval document, no signatory required.

NA
NA
F-01-01 Rev. B
Process Name
Solder Paste Printing and Solder Paste Inspection (SPI) M
Part Name
: N/A
Customer
: Spacelabs
Step / Opr. #
Process Function
Requirements
Power input single phase 210 230Volts
PCB loader Machine
Air pressure 4-6 bar
Solder Paste Printing Machine
Machine Installation
Solder Paste Inspection (SPI)

Machine

Machine
Out put link conveyor
Solder Paste Printing Machine Software Instintive Version 9 SP 13
Machine Software
Machine
Software Graphical User Interface

(GUI) Version 4.6.17.5304
Operation Temperature
Max 30 C
Environmental
Solder Paste Printing and Solder

Paste Inspection (SPI) Machine
Humidity Max 80 %
ESD Requirement
Machine grounding
Ground machine specification shall be

< 1 ohm impedance
Installation Manual
Operation Manual
Documentation
Solder Paste Printing and Solder

Maintenance Manual
Paste Inspection Machine
Electrical Drawing
Machine Operation Work Instruction
PCB data parameter on length X width

X Thickness shall be matched with
actual PCB
PCB fiducial mark shall matched with

stencil mark
Squeeze pressure setting shall be

within specification range (5-20Kgf)
Speed printing setting shall be within

specification range (25 - 150 mm/sec)
Loading program file name shall be

correct
Separation speed shall be 1 - 5

cm/minute
Separation speed shall be 1 - 5

cm/minute
Machine Programming
Print gap shall be zero
Separation distance shall be 0.2 - 5

mm
Auto cleaning frequency shall be 1 - 5

following individual model
Environment temperature shall be 22 26C
Loading program file name shall be

correct
Shall use actual gerber stencil from

stencil maker
Cad data load to the SPI machine

shall be correct with actual PCB and
current revision
Stencil thickness set shall be match

with actual stencil thickness
Solder paste volume checking set

within 50-150%

Machine
Solder short/bridge option shall be

thicked
Solder shape option shall be thicked
Solder area option shall be thicked
Smear area shall be less than 50%
setting barcode shall be activated
Machine Operation
Operator shall be certified to operate

PCB loader, Solder paste printing and
SPI operation
Machine Maintenance
Technicians hall be certified to carry

out preventive maintenance PCB
loader, Solder paste printing and SPI
operation
Machine Operation and

Maintenance gudeline (WI)
Machine Operation and Maintenance

gudeline (WI) shall be avaiable
Training
Work Instruction
Operator shall be certified to operate

PCB loader, Solder paste printing and
SPI operation
Machine operation can't be interupted
Magazine shall be suitable with PCB

size
PCB Loader operation
PCB Loader operation
PCB pusher speed shall be stable
PCB guide shall be matched with PCB

size
Magazine indexing pitch shall be

matching with PCB stacking
Cover machine printing shall be in

close condition
Before running shall be conducted first
test print using plastic lamination to
verify the solder paste result
Production only allowed to run after
QC buy off Passed
Wiper shall be installed correctly
Wiper shall be installed correctly
Wiper shall be in clean condition
IPA shall be within operation level

(within minimum and maximum control
mark)
Squeeze shall be match with PCB size
Squeeze shall not dented
Squeeze shall not curly

Squeeze shall be suitable as per

process type (Lead Free or Non Lead
Free)
Squeeze shall be suitable as per

process type (Water soluble and Non
Clean)
Support pin locations can't be hit to

components
Support pins mapping have to cover

the balance pressure to the overall
PCB surface (minimum cover 5
location : centre, upper left, upper
right, lower left & lower right)
Conveyor width shall match with PCB

width.
Squeeze direction shall install correctly
Squeeze shall be tighten properly.
Operation
Squeeze shall clean from solder paste

residue from previous running
Stencil identification shall be matched

with Product no
Stencil revision shall be match with

current PCB running
Stencil shall be clean from solder

paste or others residue
Stencil opening are not clogging
Prepare stencil for the model is

going to run
Stencil tension shall be within 20 - 50

Nm/cmSQ
Stencil shall be flat and no deep

scratches
Stencil shall no dented
Mesh stencil can not be spoilt
Stencil mark for PCB fiducial shall

identify clearly
Solder paste storage on refrigerator
with temperature controled within 010degC
Solder paste manual thawing duration

shall be meet requiremn on WI-MP06-03
Solder paste auto thawing duration

shall be meet requirement on WI-MP06-03
Solder paste shall be within shelf life

periode
Opened container solder paste only
allowed to use within 24 hours
Used (left over) Solder paste shall not

mix with fresh solder paste
Scoope back solder paste shall be
less than 24H
Solder paste printed on board max 1

hour before mounted with
componnents for LF solder paste
Solder paste handling
Solder paste printed on board max 4

hour before mounted with
componnents for Non-LF solder paste
Solder paste segregation for LF and

Non LF shall be clearly identified
Solder paste segregation for Water

soluble and No Clean shall be clearly
identified
Used solder paste shall be consumed

within 24 hours and remain solder
paste shall be scrapped
Spatulla used for solder paste
scooping shall be clearly identified for
LF and Non-LF

Water Soluble and Non Clean

Water Soluble and Non Clean
Cover machine printing shall be in

close condition
Solder miss-printed shall be cleaned
correctly refer to solder paste type and
procedure
Machine
Security access level shall be suitable

with personnel function (Admin,
Technician and Operator).
Failed boards shall be taken out from

the machine.
Out put link conveyor
Out put link conveyor be suitable with

PCB size
Before load PCB into Screen printing

machine, the PCB serial number will
scanned auotmaticly use scaner for
traceability
MES SYSTEM
Aegis Scanning Process
before inspection solder paste by SPI

machine, the PCB serial number will
scanned auotmaticly use for
traceability
Aegis shall implement interlock system
Preventive Maintenance for Printing

Machine is monthly basis

Machine
Preventive Maintenance for SPI

Machine is monthly basis
Solder Paste Screen Printing

Machine shall be calibrated
yearly
Printing offset shall be calibrated and

within specification (Min CPK 1.33)
Preventive Maintenance
SPI Machine shall be calibrated the

LED Brightness and within
specification (3D Ch1 and CH 2 = 85
10 for 2D Ch1-3 = 95 10 and Ch4 =
130 10)
Calibration

Machine shall be calibrated
yearly

PZT and within Specification (100 2)

Jig Inspection and within specification
(1.5 %)
Emergency Switch
Emergency switch button shall be

functioning
Safety
Front and rear Cover Safety

switch
Front or Rear machine cover safety

switch shall be functioning
Potential Failure Mode
Power input lower than 210 Volt
Power input higher than 230 Volt
Potential Effects of Failure
Machine cannot power up for Production Run

causing Downtime

( fuse burnt due to over rating on voltage )
Severity
nspection (SPI) Machine

causing Downtime
DC power supply adapter will be damaged and

strain measurement cannot be performed
PLC Software of the PCB Loader can be

corrupted
Air pressure supply lower than 4 Bar
Air cylinder not function properly. It causes the

machine can't be run
Air pressure higher than 6 Bar
Air cylinder in the PCB loader machine spoilt.

It causes the machine cann't be run
Power failure
Power surge

causing Downtime


causing Downtime


corrupted



causing Downtime
Power failure
Power surge
Power failure


causing Downtime


corrupted



causing Downtime
Power surge
Power failure


causing Downtime


corrupted
Power surge
Upgrade software by machine vendor to

support run replacement new electrical part
on the machine due to end of life (EOL) the
part for replacement
Machine software can't control or operated the

new electrical part installed
Upgrade software by machine vendor to

support run replacement new electrical part
on the machine due to end of life (EOL) the
part for replacement
Machine software can't control or operated the

new electrical part installed
Room temperature > 30 C
Machine can't operate (Hang Up)
Humidity > 80 %
Machine can't operate (Hang Up)
It can cause different electrical potential in the

Screen Printing machine which triggering
electrostatic charge causing PCBA failure
10
It can cause different electrical potential in

theAOI machine which impact to personnel
injury if there is electrical shock
The impedance of machine grounding > 1
ohm
10
if there is electrical shock will cause the

fuses/components in the DageAOI damage
Machine unproper installation
Machine cant up or operation unstable
Machine unproper operation
Machine operation unstable
Not achive expected maintenance
Machine operation unstable or intermitten
wrong connection electric cable
Machine cant up or electric fuse burn
Machine malfunction
Machine cant operation
PCB width in the data program is too small

than actual PCB width
PCB can't be loaded into printing machine

causing production can't run
PCB will be slanted causing fiducial

recognition error and machine can't be run
PCB will be dropped causing PCB/PCBA

scratch or damage.
PCB length in the data program is too short

or too long than actual PCB length
PCB fiducial will not align with Stencil fiducial

causing recognition error and machine can't
run
PCB thickness in the data program is less

than actual PCB thickness
Squeeze pressure will be too strong causing

less solder paste printed and impact to
insufficient solder after reflow process
PCB thickness in the data program is over

than actual size
Squeeze pressure will be lower causing

excessive solder paste printed and impact to
excess solder after reflow process
PCB fiducial mark not match with stencil

fiducial mark
PCB fiducial will not align with Stencil fiducial

causing recognition error and machine can't
run
PCB width in the data program is too wide

than actual PCB width
Solder paste will not be clean swept causing

solder paste is not release smoothly to PCB
pad. It will be less solder paste printed on fine
pitch opening and excess solder on large
opening.

Stencil will be scratches and worn out faster
Speed printing setting less than 25 mm/sec

Speed printing setting over than 150mm/sec
Solder paste will not be clean swept causing

solder paste is not release smoothly to PCB
pad. It will be less solder paste printed on fine
pitch opening and excess solder on large
opening.
Wrong loading program
Machine can't recognize PCB fiducial causing

the machine can't run
Separation speed less than 1
The printing cycle time will be too long and

productivity decrease.
Squeeze pressure less than 5 kgf
Squeeze pressure over than 20 kgf
For fine pitch opening stencil, Solder paste is

not maximum release causing insufficient
solder
For large opening stencil, solder paste printed

will have solder tailing which causing excess
solder
Print gap more than 0
Print gap > 0 causing the PCB not touch the

stencil during printing and will create solder
issue
Separation distance less than 0.2mm
Separation distance less than 0.2mm causing

solder paste haven't fully released from stencil
while the table move down with high speed.
Separation distance over than 5mm
Separation distance over than 5mm causing

lower cycle time
No stencil cleaning or over than 5
No stencil cleaning causing the stencil dirty

and create solder issue as solder short,
splash, excessive solder, stencil clogged
Temperature less than 22C
Solder paste not roll during printing causing

insufficient solder
Temperature Over than 26C
Solder paste slump causing solder paste

smear, short
Wrong loading program
Machine can't recognize PCB fiducial causing

the machine can't run
SPI inspection high false reject
High false reject causing SPI inspection may

escapee
Separation speed over than 5
Cad data wrong revision
SPI machine program is not matched with

actual PCB causing false rejected.
Stencil thickness data in program not match

with actual stencil thickness
SPI machine reading will be not accurate

causing false rejected
Volume set less than 50 %
SPI machine will not detect insufficient solder

paste causing escapee from SPI inspection
Volume set less than 150 %
SPI machine will not detect excess solder

paste causing escapee from SPI inspection
Solder bridge unthicked
SPI machine will not detect solder paste

bridging causing escapee from SPI inspection
Solder shape unthicked
SPI machine will not detect solder paste tailing

causing escapee from SPI inspection
Solder area unticked
SPI machine will not detect solder paste missalignment causing escapee from SPI
inspection
Smear set over than 50 %
SPI machine will not detect solder paste

smearing causing escapee from SPI
inspection
Barcode in activate
Serial No is not recorded in the SPI machine

causes missing traceability
Operator not certified
Operator will not operate the machine correctly

and causing machine broken, accident,
products failure
Technicians not certified
Technician will not carry out machine

preventive maintenance
Machine Operation and Maintenance gudeline Machine operation and maintenance not
(WI) shall not avaiable
proper
Operator is not trained and certified
Operator will not operate the machine correctly

and causing machine broken, accident,
products failure
During operation the machine interupting by

loaded PCB into magazine
It may cause accident, PCB broken
PCB warpage
Solder crack due to PCB flexure
PCB cannot load into magazine
Solder crack due to PCB flexure
PCB drop can cause components broken

and/or PCB scratches
Magazine width setting is too tight
Magazine width setting is too loose
Magazine width setting is too loose

PCB slanted can cause PCB stuck and
production cannot run
PCB pusher is not push smoothly
PCB loading process to conveyor slow down,

it causes decrease productivity.
PCB pusher too fast moving
The PCB loader machine will operater faster

than normal condition. It will cause break or
damage PCB.
PCB stuck & production can not running
PCB broken due to PCB hit the PCB guide
PCB drop cause components broken and/or

PCB scratches
PCB slant and hit by the pusher causing PCB

Broken / Scratches
PCB guide width is too tight
PCB guide width is too loose
PCB magazine indexing pitch over than PCB Pusher will miss to push one or more PCB
stacking
stacking that cause decrease productivity
PCB magazine indexing pitch lower than PCB Pusher will push on slot which is no PCB
stacking
cause decrease the productivity
Cover machine printing is not closed during

running
Machine printing can't run if the cover is not

closed as there is cover sensor in the
machine
Not conducted first test print using plastic

lamination before production running
If there is solder paste printing problem (missprint, miss-alignment etc) will cause to clean
actual PCB.
Production running without QC buy-off

Passed
Rejected PCBA may escapee from each

process to next process.
Wiper will not move & process cleaning will not

perform causing opening stencil clogged
Wiper will not move & process cleaning will not

perform causing solder paste spread on the
PCB
Wiper Installed reverse
Wiper improper lock
Machine error & production can't run
Process cleaning not optimum causing

opening stencil clogged
process cleaning not optimum causing solder

paste spread on the PCB
IPA level more than maximum control mark
IPA Overflow
IPA level less than minimum control mark
Machine error & production can't run
Squeeze size too short than PCB length
Squeeze not cover whole PCB surface

causing missing solder
Squeeze size too long than PCB length
Would require to much solder paste and

causing to shorten solder paste life
Squeeze dented
During printing squueze wiping not clean and

solder paste leftover on the stencil surface and
creating solder issue.
Squeeze curly
Preassure of squeeze imbalance causing

squeeze wiping not clean causing solder paste
leftover on the stencil surface and create
solder issue
Squeeze not match with process type (Lead

Free or Non Lead Free)
Solder paste contamination between led free

and non lead free
Wiper not in clean condition
Squeeze not match with process type (Water Solder paste contamination between Water
soluble and Non Clean)
Soluble and No Clean
Support pin hit the bottom side components
Component broken
PCB surface not flat causing the solder issue

such as:missing solder, inssufficient solder,
execessive solder , solder short
PCB warp and bow during printing solder

issue as:missing solder, inssufficient solder,
execessive solder , solder short
PCB can not load in and process causing

production stop
PCB slant and causing intermittent the fiducial

reading

Squeeze can not installed causing production

stop
Sgueeze preassure inconsistent causing

machine error
Sgueeze preassure inconsistent causing

squeeze wipe not clean and will creat solder
issue
Squeeze dirty
Solder paste contaminated by old solder paste
Install wrong stencil
Machine can't recognize the stencil as the

PCB not matched with stencil causing
machine can't run.
Install wrong stencil revision
The solder paste printed will not matched with

the current PCB causing the solder paste may
not printed at PCB pads correctly.
Opening stencil clogged causing the solder

paste may printed insufficient amount.
Solder paste spread out to PCB surface

causing the solder splash and solder short
after reflow soldering
Solder paste residue may contaminated the

fresh solder paste causing solderability issue
Opening stencil clogged causing the solder

paste may printed insufficient amount.
Support pins only cover one side of PCB

surface
Conveyor widht too tight
Conveyor widht too loose
Squeeze wrong direction
Sgueeze loose
Stencil dirty by solder paste residue
Opening stencill clogged
Solder paste printed will be slumped causing

solder ball
Solder paste printed will be scavenged

causing excessive solder
Solder paste printed will be bridging causing

solder short after reflow soldering process
Stencil tension more than 50 Nm/cmSQ
Stencil tension too much tight causing it easy

to break when applied squeeze pressure
Stencil has scratches
solder paste thickness willl be less than stencil

thickness causing insuficient solder after
reflow soldering process
Stencil dented
solder paste thickness willl be over than

maximum specification thickness causing
excessive solder after reflow soldering process
Mesh stencil spoilt
Stencil tension is low, it causes solder paste

printed inconsistently. The impact is solder
slumped generating solder balls.
Stencil recognation mark error
Machine can't recognize the stencil fiducial

causing machine can't run.
Solder paste store at temperature that over

than 10 degC
Solder paste need to be scrap if store at

temperature more than 10 degC for more than
3 month
Solder paste manual thawing less than

duration at WI-MP-06-03
solder paste still have moisture which can

causes solder void
Solder paste manual thawing less than

duration at WI-MP-06-03
solder paste still have moisture which can

causes solder void
Solder paste expired use in production line
Creating solderability issues in reflow

soldering process
Production use opened container solder paste Creating solderability issues in reflow
that already exceed 24 hour
soldering process
Stencil tension less than 20 Nm/cmSQ
Production mix the used (left over) solder

paste with fresh solder paste

soldering process
Solder paste left in the stencil more than 24

hours

soldering process
Solder paste dried causing component

missing during mounting process due to less
flux tackiness
Solder paste dried causing solder no-wetting

after reflow soldering process
Solder paste dried causing component

missing during mounting process due to less
flux tackiness
Solder paste dried causing solder no-wetting

after reflow soldering process
LF PCBA contaminated with Non-LF solder

paste
Wrong solder paste used, causing reflow

profile not suitable with solder paste. It will
impact to solderability issue.
Wrong solder paste used. If PCBA No-clean

process is using water soluble solder paste will
causing PCB corrosion due to no washing
process performed in No-clean process
Wrong solder paste used. If PCBA water

soluble process is using no-clean solder paste
will causing solder white residue due to
washing process is applying on Clean (water
soluble) process
Production consumed solder paste that

already exceed 24 hours

soldering process
Wrong using Spatulla
Solder paste contamination between led free

and non lead free
If Spatulla No-clean process is used for water

soluble process will causing PCB corrosion
due to water soluble solder paste
contaminated to the no-clean solder paste
Solder paste printed on board more than 1

hour
Solder paste printed on board more than 4

hours
Solder paste mix between Solder paste LF

and Non LF
No identification for Solder paste Water

soluble and No Clean

If Spatulla Water soluble process is used for
no-clean process will causing PCB white
residue due to no-clean solder paste
contaminated to water soluble solder paste
Cover SPI machine is not closed during

running
SPI Machine can't run if the safety cover is

opened
Solder paste miss-printed is improper

cleaning
Creating solder ball and solder splash.
SPI machine access level has no password
Machine parameter and program can't be

controlled it may cause some error updating.
Failed board is not taken from the machine
SPI machine can't be run if the failed board

not taken from the machine.
Link conveyor width setting is too tight
PCB cannot eject from SPI causing production

can not run
Link conveyor width setting is too loose

Scanner for Screen Printing machine can not

Serial number of PCBA can not record as
scanned the serial number on PCB before
traceability
screen printing process
machine Camera on the SPI Machine can not

Serial number of PCBA can not record as
scanned the serial number on PCB before
traceability
solder inspection process
Aegis system interlock is not performed
un complete process due to non traceability

recorder
Preventive maintenance is not following PM

schedule (exit from schedule planned)
un-stable solder paste screen printing result
Preventive maintenance is not following PM

schedule (exit from schedule planned)
un-stable solder paste measurment result
The Solder paste Print offset has out of

tolerance
The result of printing the solder paste will not

centre on pad PCB
The camera specification has out of tolerance
The measurement result of solder paste on

PCB will not accurately measured
The ilumination specification has out of

tolerance

The reference specification has out of

tolerance

The emergency Switch button not working
may will be effect to machine and operator

accident
10
The Front or Rear cover switch not working
may will be effect to machine and operator

accident
10
PROCESS FAILURE MODE EFFECTS ANA

Process Responsibility :
MDT Team
Potential Cause(s) /
Mechanisms of Failure
Occurrence
Class
Key Date
Moderate
Electric main supply from power

generator is lower than specification
(210 Volt)
High

generator is higher than specification
(230 Volt)
Main electric supply suddenly cut

down
High
Incoming supply or lightning may

cause sudden increase in the power
input
High
Incoming supply or lightning can

input
Moderate
Moderate
High
Main supply lower than specification

(4 bar),
Air supply is higher than 6 bar.
Moderate

(210 Volt)
High

(230 Volt)

down
High

input
High

input
Moderate

(4 bar),
Moderate

(210 Volt)
High

(230 Volt)

down
Moderate
High
Moderate
High

input
High

input

(4 bar),
Moderate

(210 Volt)
High

(230 Volt)

down
High

input
High

input
Moderate
High
Moderate
High
new electrical part installed can't

operation as normal
High
new electrical part installed can't

operation as normal
High
Air Conditioner not working
High
Air Conditioner not working
Electrical leakage in the electrical

installation of power source DageAOI
Extreme

Extreme

High
High
Machine vendor not provide manual

book for guiden
High

book for guiden
High

book for guiden
High

book for guiden
High

book for guiden
Moderate
technician failed set PCB width size in

PCB data parameters
Moderate

PCB data parameters
High

PCB data parameters
Moderate
technician failed set PCB length size

in PCB data parameters
Moderate
technician failed set PCB thickness in

PCB data parameters
Moderate
technician failed set PCB thickness in

PCB data parameters
Moderate
the original Stencil mark not clear
High
The Technician / Engineer was not

evaluation the good setting of
squeeze pressure to achive good
squeeze swept during printing
process
High

squeeze pressure on the stencil
during printing process
High

squeeze pressure on the stencil
during printing process
High

squeeze speed to achive good
squeeze speed during printing
process
High

squeeze speed to achive good
squeeze speed during printing
process
Moderate
program reciepe not clear

identification
Moderate

separation speed to achive good
solder paste printing result and good
machine cycle time
High

solder paste printing result on the fine
pitch opening stencil
High

solder paste printing result on the
large opening stencil
High
The Technician / Engineer not check

the gap between stencil and PCB
during setup stencil
High

separation distance to achive good
solder paste printing result during
printing process
Moderate

separation distance to achive good
solder paste printing result during
printing process
High

evaluation the good setting of auto
cleaning frequency to achive good
stencil cleaness
High
Air con setting very cool
High
Air Con not function properly
Moderate
the program recipe not clear

identification
Moderate
Not use actual gerber stencil from

stencil maker
High
High
High
High
High
High
High
High
High
the stencil CAD data not clear

identification
Engineer/Techncian failed to set

paremeter in machine program
during create program


Engineer/Techncian failed to thick




Engineer/Techncian failed to check

barcode in machine program during
create program
High
Engineering not conducted training

Operator
High
Engineering not conducted training

Technician
Moderate
Engineering not provide work

instruction for machine operation and
maintenance
High
Production can't operate the machine
High
Operator loading pcb during machine

run
High
During setting the magazine is not

using actual PCB
High

using actual PCB
Low

using actual PCB
High

using actual PCB
High

using actual PCB.
High
Screw is not tighten
Moderate

using actual PCB.
Moderate
Screw is not tighten
Moderate
Throtle valve setting too low
Throtle valve setting too hight
Moderate
During setting the PCB guide is not

using actual PCB
Moderate

using actual PCB
High

using actual PCB
High

using actual PCB
Moderate
Select the indexing pitch not refer to

actual PCB stacking
Moderate
Select the indexing pitch not refer to

actual PCB stacking
Operator opened the safety door

during machine running
Moderate
Not using plastic lamination before

production run
High
Production not submit the PCB to

IPQC for buy off
Moderate
No guideline for wiper installation

guidline
Moderate

guidline
High
High
Moderate

guidline
Moderate
Use the other side of recycle wiper

due to no stock available
Moderate
Use the other side of recycle wiper

due to no stock available
Moderate
Overload during top up IPA to

container
Moderate
not following the IPA top up schedule
Moderate
Wrong setup sequeeze during

conversion
Moderate
Wrong setup sequeeze during

conversion
Moderate
Moderate
Sequeeze not store properly
Pressure setting too high (higher than

20 kgf)
High
1. Wrong selection squeeze base on

process running (Lead free or Non
Lead Free)
2. Squeeze identivication not clear
( Lead free or Non Lead free)
High
1. Wrong selection squeeze base on

process running (water soluble Lead
free or Non Lead Free)
2. Squeeze identivication not clear
( Water soluble Lead free or Non
Lead free)
High
No guiden for set up support PIN

mapping on Screen printing table
High
No guide for set up support PIN

High
No guiden for set up support PIN

Moderate
Wrong set PCB width size in data

parameter
Moderate

parameter
High

parameter
Moderate
Wrong loading squeeze during set up

conversion
Moderate
Untighten locked squeeze during

setup conversion
Moderate
Untighten locked squeeze during

setup conversion
High
Squeeze not clean properly after

production finish
Moderate
No stencil identification
Moderate
No stencil identification for stencil

revision
Moderate
stencil not clean properly after

production finish before storage
High
stencil Auto cleaning on the screen

printing machine not setting to auto
cleaning
High
inproper cleaning after production

finish before storage
Moderate
inproper cleaning after production

finish before storage
Moderate
Stencil worn out causing the stencil

tension out of specification
Moderate

Moderate

Moderate

Moderate

Moderate
Used metal spatula during scope up

solder paste from stencil
Moderate

Moderate
Stencil mark covered by foreign

material
Refrigerator spoilt
The thawing time is not following

procedure
Wrong writing of timinig taken out

from refrigerator
The thawing time is not following

procedure
Wrong writing of timinig taken out

from refrigerator
High
Poor control in FIFO system
High
Not follow solder paste control timing

stade in the procedure
High
High
High
High
Operator fail to follow MAI process
High
Line down and Operator didn't scoop

back the solder paste to container
High
Line down and Operator didnt follow

procedure WI-MP-06-03
High
Line down and Operator didn't clean

solder paste on the board.
High

High

High
No clear indetification between LF

and Non LF solder paste
High
No clear indetification between LF

and Non LF solder paste
High
No clear indetification between water

soluble and Non clean solder paste
High
No clear indetification between water

soluble and Non clean solder paste
High
Production returned back to freezer

and re used for production
Moderate
Spatulla no identification clearly of LF

and Non-LF
Moderate
Spatulla no identification clearly of

Water soluble and Non-Clean
process
Spatulla no identification clearly of

Water soluble and Non-Clean
process
High
Operator is not follow operation

instruction to closing the safety cover
Moderate
Operator wasn't cleaned properly and

not inspection after cleaning process
High
Acces level with personnel function is

not set
None
Operator is not follow operation

instruction
Moderate
During setting the link conveyor widht

is not using actual PCB
High
During setting the link conveyor widht

is not using actual PCB
High
Scanner is spoilt or LED as lighting is

OFF
High
Camera is spoilt or LED as lighting is

OFF
High
Server down causing aegis scanning

process can not performed
Moderate
Moderate
Missed to follow Preventive

Maintenance Schedule
Moderate
Missed to follow Preventive

Maintenance Schedule
High
Call Supplier for carry out for

calibration over due the schedule
High

High

High

High
emergency switch button functioning

intermittent
High
Cover safty switch functioning

intermittent
RE MODE EFFECTS ANALYSIS

: Zulfadli
: Zulfadli, Waldeman, Muh. Hasyim, Wahyudi, Anggun J,
M. Ridwan, Isnawan, Edy Siswo
: 2 Sept 2016
Current Process Controls Prevention.
Capacitor bank has install in the main power source.

Use UPS (uninterruptible power supply).
Capacitor bank has been installed in the main power source.

The high voltage will be stabilzed by Capacitor bank
Pre-inform by Power supplier if there is a schedule in power

supply cut.

Use UPS (un-interruptible power supply) as back-up supply.
The power generator is connected to ground to netralized
high voltage due to lightning.

Set the range setting of air supply 6.5-7 bar in main

compressor. Stated in WI-MP-05-82
Air pressure regulator installed in PCB loader machine and

set at max 5 bar.
Bambang K,



supply cut.




set at max 5 bar.


supply cut.




set at max 5 bar.


supply cut.


Only machine vendor to upgrade machine software
Only machine vendor to upgrade machine software
Monthly Preventive maintenace
Monthly Preventive maintenace
Overall electricall installation in PT OSIE have been

connected to Ground with specification < 1ohm as required
by ESD S.20.20 standard. PT OSIE has certified S.20.20
standard in ESD implementation.


Keep maunal Book on the one folder at SMT Engineering

Cabinet

Cabinet

Cabinet

Cabinet

Cabinet
use actual PCB for fill in PCB size in the PCB data
parameters
parameters
parameters
parameters
parameters
parameters
check during setup using the actual PCB
during setup technician / engineer check the squeeze

pressure on the stencil and ensure squeeze clean swept
solder paste on the stencil and set the squeeze pressure on
the good setting after evaluation done

pressure on the stencil and ensure squeeze not to strong
press stencil during printing process and set the squeeze
pressure on the good setting after evaluation done

pressure on the stencil and ensure squeeze not scratch the
stencil and set the squeeze pressure on the good setting
after evaluation done
during setup technician / engineer check the squeeze speed

during printing process and set the squeeze speed on the
good setting after evaluation done
during setup technician / engineer check the squeeze speed

during printing process and set the squeeze speed on the
good setting after evaluation done
create program reciepe following model name / model

number mention at MAI
during setup technician / engineer check the separation

speed during printing process and set the separation speed
on the good setting after evaluation done


Check gap between stencil and PCB during setup stencil

and set gap to 0



Facility have setting rom temperature between 22-26 C
Prevent Maintenance every weekly maintenance
The program naming follow actual model no.
Using actual the stencil Gerber maker
Use actual CAD data from chip mounter machine
Programmer Engineer/Technician are trained and certified
Programmer Engineer/Technician are trained and certify
Programmer Engineer/Tecnician are trained and certify
All New operator shall be conduct machine operation

training
All New Technician shall be conduct machine preventive

maintenance training
engineeing shall be create work instruction each new

machine for machine operation and maintenance
Operator trained and certify
Setting the magazine using actual PCB on top and bottom

magazine to ensure the setting is matching with PCB width.


Operator to set the magazine been trained and certified.

Operator to set the magazine been trained and certified.
Technician to set the throtle valve been trained and certified.
Technician to set the throtle valve been trained and certified.
Setting the PCB guide using actual PCB to ensure the

setting is matching with PCB width.
Select the indexing pitch using actual PCB stacking
Select the indexing pitch using actual PCB stacking
Safety door is equipped with sensor
IPQC buy off the first piece PCB
Operator is trained and certified
Technician that install wiper been trained.
Control buffer stock of wiper minimum 20pcs
Control buffer stock of wiper minimum 20pcs
IPA leveling mark on the container as guideline to top up the

IPA
weekly top up IPA as part of preventive maintenance
inspection checklist
Record sequeeze size on "PARAMETERS SETTING
VERIFICATION PRINTING PROCESS" Form no. F-04-73
Record sequeeze size on "PARAMETERS SETTING

VERIFICATION PRINTING PROCESS" Form no. F-04-73
Squeeze storage inside of polyfoam box
set the squeeze pressure within pressure spec (5 - 20 kgf)
put clear identification for Lead free or non lead free
put clear identification for Lead free or non lead free
Using PCB Tamplate during set up support PIN Mapping
Using PCB Tamplate during set up support PIN Mapping
Using velable mask for marking support pin during set up
Setting the PCB size using actual PCB to ensure the setting
is matching with PCB width.
put squeeze PIN orientation at squeeze holder
Training technician and Machine Operator
Training technician and Machine Operator
Cleaning Squeeze after production finished
Put clear identification label at front Stencil base on product

or model name
Put clear identification label for stencil revision at front

Stencil base on revision numbers
Cleaning Squeeze after production finished

1. setting auto cleaning mode at screen printing machine
2. setting auto cleaning frequency as per product running (1
- 10)
cleaning stencil use ultrasonic stencil cleaner
cleaning stencil use ultrasonic stencil cleaner
Stencil preventive maintenance every 3 month
Replace spatula material from metal to Plastics
cleaning stencil use ultrasonic stencil cleaner every

production finished
Conduct monthly preventive maintenance (F-GE-04-15).
Use chemichal control sticker (F-04-05) to control the

duration of manual thawing already meet the specification
Identification FIFO system using color sticker in each solder
paste jar/tube
Using shelf life material tracking record (F-GE-04-18)
Retraining the operator how to handle the fresh solder paste

and used.
Retraining the operator how to handle the solder paste.
Operator trained WI-MP-06-03
Engineering setting user level with personnel funtion
Setting the out put link conveyor widht using actual PCB on
top and bottom magazine to ensure the setting is matching
with PCB width.
Setting the out put link conveyor widht using actual PCB on
top and bottom magazine to ensure the setting is matching
with PCB width.
Initial set up before production run using Scanner
Initial set up before production run using SPI machine
Initial set up before production run using AOI machine
Created Preventive Maintenance schedule and checklist to

control the PM was performed as per planning generated.
Created Preventive Maintenance schedule and checklist to

control the PM was performed as per planning generated.
Every equipment which required calibration is listing in the

Calibration Master List. There is reminder 2 months earlier
before calibration due date to Calibration Coordinator and 1
month alert notice before calibration due date to equipment
owners (users). As stated in QP-04-12, Equipment
Calibration.

Calibration.

Calibration.

Calibration.
currently no system control prevention
currently no system control prevention
ALYSIS
Prepared By
im, Wahyudi, Anggun J,

o
Bambang K,
Approved By
Detection.
RPN
Doc. No.
PCB Loader will not be able to power up.
20
The capacitor bank will automatically stabilize the higher

voltage
28

supply cut.
60

voltage
42

voltage
48
Daily check of air supply in PCB loader by using Daily

Preventive Maintenance Record (F-GE-04-15)
40

56
Current Process Controls Detection
20

voltage
28

supply cut.
60

voltage
42

voltage
48

40

56
20

voltage
28

supply cut.
60

voltage
42

voltage
48

40

56
20

voltage
28

supply cut.
60

voltage
42

voltage
48
software will error
24
software will error
24
Manual cek using humiditymeter
24
Manual cek using humiditymeter
24
ESD Personnel measures the Electrical and

machine/equipment grounding regularly every 6 month and
recorded in the form F-ESD-05-07
40

40

42
Validation Machine by IQ Validation
32
32
32
32
32
Conveyor is Auto width adjustment following PCB widht data
20
20
28
machine detection PCB Fiducial mark error
20
Technician check PCB gap during setup
30
Solder Paste Inspection machine will error during detected

exessive solder
20
Camera sensor of machine will detect un-matched fiducial

mark
20
1. Record fix value the squeeze pressure in the "

PARAMETERS SETTING VERIFICATION PRINTING
PROCESS " (F-04-73)
2. Buy off by IPQC after technician setup complete
63

PROCESS " (F-04-73)
63

PROCESS " (F-04-73)
63
1. Record fix value the squeeze speed in the "

PROCESS " (F-04-73)
63
1. Record fix value the squeeze speed in the "

PROCESS " (F-04-73)
63
1. Record program name in " PARAMETERS SETTING

VERIFICATION PRINTING PROCESS " (F-04-73)
45

45

63

63

63

63

45

21
Manual check room temperature refer to room temperature

control monitor
70
Manual check room temperature refer to room temperature

control monitor
70
Technician check & verified before load the program
10
30
42
Programmer Engineer/Technician check during programming
42
42
42
42
Programmer Engineer/Tecnician check during programming
42
42
21
48
Identify the certify operator at ID Badge
96
log in training record on the training centre
96
documented during machine validation (IQ)
36
At SPI machine only the certify operator has own user and
pasword can log in to machine
63
Provide stanby magazine for PCB loading preparation
96
Leader checks the magazine setting before load the PCBs
96
96
27
96
63
42
45
30
Technician check & verified after complete setting
45
63
45
54
63
63
30
30
SPI alarm active( red tower lamp on and buzzer on)
42
Visual detection by IPQC during buy off
45
Production/engineering/IPQC buy off 1st 5 pcs/panel use

form F-MP-04-16
96
Technician check & verified after complete installation
24
24
30
control wiper inventory stock using stock card
24
control wiper inventory stock using stock card
24
Technician check & verified after top up IPA.

As part of weekly preventive maintenance inspection
checklist
30
Machine sensor will active if the level IPA lower than control
limit
20
IPQC Checked / Buy Off after setup complited (Form F-0473)
30
30
Weekly Preventive Maintenance
45
30
Technician check & verified during setup conversion
96
96
42
42
48
20
Detection PCB Fiducial Mark
20
28
30
Machine detection fedback squeeze pressure
20
Machine detection fedback squeeze pressure
20
Technician check & verified after cleaning complete before

storage
48
Detection Stencil Fiducial Mark
30
Buy off PCB after solder paste printing proces every setup
setup complited
45
detection by SPI Machine for insufficient solder
24
detection by SPI Machine for excessive solder
42
Technician check & verified the stencil cleaness before load

stencil into screen printer machine
63
Technician check & verified the stencil cleaness before load

stencil into screen printer machine
36
measuring stencil tension before setup or loading into screen

printing machine
36

printing machine
36

printing machine
36

printing machine
36
Technician check & verified the stencil before load into

screen printer machine
36

36

printing machine
36

30
Temperature control performed every shift (3 times a day) - FGE-04-19
28
IPQC verification before solder paste use for production

process. (QP-04-25) (F-MP-05-05)
42

process. (QP-04-25) (F-MP-05-05)
28

process. (QP-04-25) (F-MP-05-05)
42

process. (QP-04-25) (F-MP-05-05)
28

process. (QP-04-25) (F-MP-05-05)
28

process. (QP-04-25) (F-MP-05-05)
28

process. (QP-04-25) (F-MP-05-05)
28

process. (QP-04-25) (F-MP-05-05)
28
Production record duration of line down
42
42
42
42
Production and IPQC check and buy off use form F-MP-0416 revC
28
28
28
28
Production fill in Chemical Control Sticker use form F-04-05

revC
14
36
36
Put identification on spatula LF and Non-LF
Put identification on spatula Water soluble and Non-Clean

process
Put identification on spatula Water soluble and Non-Clean

process
36
SPI alarm active( red tower lamp on and buzzer on)
42
PCB/PCBA after cleaning submit to QC for inspection before

used.
45
Operation menu in operator level can not edit program.
24
Machine stop and PCB will not transfer out
SPI machine stop and system alarm on
30
Technician checks the link conveyor setting before load the

PCBs
63
the connecting conveyor machine software will not work to

turn ON conveyor motor to transfer PCB to screen printing
machine, then AOI machine will stop (can not run)
24
SPI machine software have message error appears on the

screen, then AOI machine will stop (can not run)
24
Message error appears on the next process station
42
To control the preventive maintenance by using form F-GE04-15
45
To control the preventive maintenance by using form F-GE04-15
45
Calibration masterlist will reminder to Calibration Coordinator

2 month earlier and 1 month notice alert to equipment owners
(users) before calibration due date. As stated in QP-04-12,
Equipment Calibration.
32

32

32

32
Press Emergency button switch then Machine sudenly stop
30
Open front and Rear machine cover then Machine sudenly

stop
30
: Zulfadli
:
Responsibili
ty / Target
Date
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Install electric surge protector at

Edy Siswo/ WW52- 2016
individual panel
Action Implemented
Sev.
Recommend
ed action.
: FMEA/MP/008
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A

individual panel
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A

individual panel
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
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N/A
N/A
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N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A

individual panel
Software is centralized and

controlled by DCC as stated in
WI-GE-05-08, on Software
Revision Control.
Wahyudi/ WW31- July

2016
N/A
N/A
Software is centralized and

controlled by DCC as stated in
WI-GE-05-08, on Software
Revision Control.
Wahyudi/ WW31- July

2016
N/A
N/A
provide temperature Alert

system
IT Team continuesly
N/A
N/A
provide temperature Alert

system
IT Team continuesly
N/A
N/A
Electrical source grounding

installation during setup or
machine re-installation will
check and ensure the grounding
measuremetn below 1 Ohm and
recorded in the form F-ESD-0507
Indra / Continously
N/A
N/A
Electrical source grounding

installation during setup or
machine re-installation will
check and ensure the grounding
measuremetn below 1 Ohm and
recorded in the form F-ESD-0507
Indra / Continously
N/A
N/A
N/A
N/A
N/A
N/A
Machine Vendor provide soft

copy
Zulfadli / WK-34 2016
N/A
N/A

copy
N/A
N/A

copy
N/A
N/A

copy
N/A
N/A

copy
N/A
N/A
N/A
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N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
use MES System
MES Team / Continuesly
N/A
N/A
1.Operator who is responsible to

operate screen printing and SPI
machine shall be dedicated and
trained by Engineering.
2.Enginnering create user name
at SPI Machine computer for the
certify operator
Waldeman
WW25-2016
N/A
N/A
Technician who is responsible to

handle preventive maintenance
shall be dedicated and trained
by Engineer.
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Provide stand by magazine

atleast 1 unit each PCB Loader
Zulfadli / Continuesly
N/A
N/A
Engineering shall be training

operator machine
Ahmad / WK-35 2016
N/A
N/A

operator machine
Ahmad / WK-35 2016
N/A
N/A

operator machine
Ahmad / WK-35 2016
N/A
N/A

operator machine
Ahmad / WK-35 2016
N/A
N/A
N/A
N/A
N/A
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N/A
N/A
N/A
N/A
IPQC perform buy off first 5 pcs
IPQC
(continuesly)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
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N/A
N/A
N/A
Egineering provide Squeeze

weekly maintenance
Zulfadli / continously
N/A
N/A

weekly maintenance
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Using PCB Tamplate during set

up support PIN Mapping
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
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N/A

weekly maintenance
N/A
N/A
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N/A
N/A
N/A
N/A
N/A
Provide individual user name

and password at SPI computer
Zulfadli
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Regular Maintenance to check

Camera Inspection condition by Zulfadli / continously
monthly basis
N/A
N/A
NA
NA
Regular Maintenance to check

scan camera condition by
monthly basis
NA
NA
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
To implement Metrology Out-ofTolerance procedure for any

Ibnu / Start WW29-2016
equipment calibration of out
tolerance
N/A
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tolerance
N/A
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tolerance
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tolerance
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maintenance record
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maintenance record
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Occ.
Det.
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1 SEVERITY
2 OCCURANCE
Risk
Extereme
High
Moderate
Low
None
3 DETECTION
Occurence of Effect
Failure
Rate
in 2
in 3
in 8
in 20
in 80
in 400
in 2000
in 15K
1
1
1
Process is not in statistical control. Similar processes have
experienced problems
1
1
Process is in statistical control but with isolated failures.
Previous processes have experienced occasional failures or out- 1
of-control conditions
1
Process in statistical control
1
Process is in statistical control. Only isolated failures associated
with almost identical processes
1 in 150K
Failure is unlikely. No known failures associated with almost
identical processes.
1 in 1.5M
Failure is almost inevitable
Capability
(Cpk)
< 0.33
> 0.33
> 0.51
< 0.67
> 0.83
> 1.00
> 1.17
> 1.33
Rating
10
9
8
7
6
5
4
3
> 1.50
> 1.67

PFMEA Solder Paste Printing 03 Sept 2016 (Zul)

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DOCUME

Solder Paste Printing and Solder Paste Inspection (SPI)

(Include Cover Page)

Reason for change

Effective Date: 22 Sep12

Review & Approved by: (Name & Signature & Date)

Effective Date: 22 Sep12

DOCUMENT COVER PAGE

Effective Date: 22 Sep12

This is an electronics approval document, no signatory required.

Effective Date: 22 Sep12

Solder Paste Printing and Solder Paste Inspection (SPI) M

Power input single phase 210 230Volts

PCB loader Machine

Air pressure 4-6 bar

Power input single phase 210 230Volts

Solder Paste Printing Machine

Air pressure 4-6 bar

Power input single phase 210 230Volts

Solder Paste Inspection (SPI)

Power input single phase 210 230Volts

Solder Paste Inspection (SPI)

Air pressure 4-6 bar

Out put link conveyor

Power input single phase 210 230Volts

Solder Paste Printing Machine Software Instintive Version 9 SP 13

Software Graphical User Interface

Solder Paste Printing and Solder

Ground machine specification shall be

Solder Paste Printing and Solder

Machine Operation Work Instruction

PCB data parameter on length X width

PCB fiducial mark shall matched with

Squeeze pressure setting shall be

Speed printing setting shall be within

Loading program file name shall be

Separation speed shall be 1 - 5

Separation speed shall be 1 - 5

Print gap shall be zero

Separation distance shall be 0.2 - 5

Auto cleaning frequency shall be 1 - 5

Environment temperature shall be 22 26C

Loading program file name shall be

Shall use actual gerber stencil from

Cad data load to the SPI machine

Stencil thickness set shall be match

Solder paste volume checking set

Solder Paste Inspection (SPI)

Solder short/bridge option shall be

Solder shape option shall be thicked

Solder area option shall be thicked

Smear area shall be less than 50%

setting barcode shall be activated

Operator shall be certified to operate

Technicians hall be certified to carry

Machine Operation and

Machine Operation and Maintenance

Operator shall be certified to operate

Machine operation can't be interupted

Magazine shall be suitable with PCB

PCB Loader operation

PCB Loader operation

PCB pusher speed shall be stable