A Report On

MICRO AND NANO MANUFACTURING

Submitted by
Shinde Ajit Kumar
Raulwar Abhijeet Ajit
(Mechanical Engineering)

MSPMs
Shri Shivaji Polytechnic Institute, Parbhani
Maharashtra State Board of Technical Institute,
Mumbai 2016-2017.

E-mail: abhiraulwar@gmail.com

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ABSTRACT
Manufacturing, in a general term referring to industry, is to make products
that have been designed for certain application purpose. The meaning of manufacture
has ever changed, especially during last 20 years, in terms of what are being made, how
they are made, how the manufacturing is organized, etc. Desire for better quality of life,
good health and high efficiency has been one of the major drives recently to the
development of micro and nano-technology products. As a consequence, issues
concerning the length scale in manufacturing have been often mentioned and researched.
This report provides a brief introduction to the different micro manufacturing
process (micro cutting, micro drilling, micro turning, micro joining) and nano
manufacturing process( top-down approach, bottom-up approach) and their applications.

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CONTENTS
Sr.No.
1.
2.
3.
4.
5.
6.
7.

Name of topic
Introduction
Classification
Diamond Turning
Micro Joining
Nano manufacturing
Conclusion
Reference

Page No
04
05
06
07
08-14

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INTRODUCTION
MICRO MANUFACTURING:
Micro manufacturing is the set of processes or techniques used to
fabricate micro components and micro systems or to create a micro features on
macro/micro parts.
Micro products are widely used owing to their compactness, low
material requirement, low power consumption, high sensitivity and many other
advantages over macro products. Micro manufacturing used in various industries such as
electronics, telecommunication, medicine, defense and automotives. It is one of the
fundamental technologies that lead the market of miniaturized products and which
involves material removal, material deposition, or constant volume process(by changing
the shape and size of material) which are widely used for the production of micro
components.
Micro components are extensively used in vehicles, aircraft,
telecommunication, IT industries, home appliance, medical devices and implants.
Presently, market demand exists not only for small parts but also for small and complex
features on large components such as cooling holes in a turbine blade, micro fins on a
large surface for increasing heat transfer and similar others. Hence, the objective of the
miniaturization is either to create a small part with better capabilities or to create small
feature on a large component to enhance its functionality. The mobile phones is good
example of miniaturization.

CLASSIFICATION:
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Many researchers have classified micro manufacturing technologies in various

ways. Masuzawa (2000) has classified micromachining technologies according to their
working principle. Madou (2001) has listed miniaturization techniques with their
respective characteristics, organizing them as traditional or non traditional methods and
lithographic or non lithographic methods. Other authors have classified them into various
categories such as removal, deposition and molding technologies (Smith 2000).
Figure shows a simplified classification of micro manufacturing processes
similar to the one reported by Masuzawa (2000).

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DIAMOND TURNING:

FIG. DIAMOND TURNING.

Optical lenses have also found many applications owing to progress in a
manufacturing small size and precision are the primary requirements for a lens when it is
used in the micro domain. Micro Diamond turning also known as single point diamond
turning (SPDT) is one of the most suitable machining process for a micro optical device
fabrication. SPDT is widely used to manufacture high quality aspheric optical elements
from glass, crystal, metals, acrylic and other materials.
Lenses of some complex shapes are made by the molding process.
Nickel-phosphorous alloy is the commonly used material for mold making. These molds
are precisely prepared by SPDT. Some of these molds are used to make precision contact
lenses, including a spherical lenses to correct special vision problems. Intraocular lenses
also used for a replacement for the cornea and inserted within the eye. Optical elements
produced by SPDT are used in optical assemblies of telescopes, TV projectors, cameras,
cell phones, DVD players, missile guidance system , scientific research instruments and
numerous other systems and devices. Tool alignment is an essential precondition for
achieving the desired quality in SPDT

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Micro joining:

Fig. Fabrication Microjoining using LASER beam

Micro joining (welding, soldering, laser beam, brazing, and
adhesive bonding) is a part of the manufacturing and assembly processes. Joining can be
mechanical connection, electrical connection, and optical coupling. The continuing
miniaturization of engineering devices brings new challenges to the technology of micro
joining in terms of cost reduction, enhanced performance, reliability. Micro joining deals
with the joining of parts with characteristic dimensions less than a few hundred
micrometers but more than hundreds of nanometers.
Most micro joining processes were developed around the 1995s. The
combination of thermo compression and ultrasonic wire bonding, called thermo sonic
wire bonding, was reported in 1970. This technology of wire bonding is one of the key
chip-level interconnection technologies in microelectronic products. Later, electron beam
welding, which suitable for macro, micro and even nano scale joining because of the
precise beam quality, fixturing and controls integrated with the system, was developed.
Microjoining has been an integral part of micro manufacturing for many decades in the
microelectronics, medicine, aerospace and defense industries.

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Nano manufacturing:
Nano manufacturing is both the production of nano scaled
materials, which can be powers or fluids, and the manufacturing of parts bottom up
from nano scaled materials of parts or top down in smallest steps for high precision.
Nano manufacturing techniques:

Top-down approach:
1) Scanning probe lithography
2) Focused beam lithography
3) Nanoimprint lithography
Bottom-up approach:
1) Chemical vapor deposition
2) Physical vapor deposition
3) Dip-pen nanolithography
4) Self assembly

Top-down approach:
A top-down approach (also known as stepwise design and in some
cases used as a synonym of decomposition) is essentially the breaking down of a system
to gain insight into its compositional sub-systems in a reverse engineering fashion. In a
top-down approach an overview of the system is formulated, specifying, but not detailing,
any first-level subsystems. Each subsystem is then refined in yet greater detail, sometimes
in many additional subsystem levels, until the entire specification is reduced to base
elements. A top-down model is often specified with the assistance of "black boxes",
which makes it easier to manipulate. However, black boxes may fail to elucidate
elementary mechanisms or be detailed enough to realistically validate the model. Top
down approach starts with the big picture. It breaks down from there into smaller
segments.
Starts from large piece of material and gradually reducing it to a
nano structures. This used by the semiconductor industry. This approach offers reliability
and device complexity. However it uses energy in large amount and produces more work.

1) Scanning probe lithography :

Scanning probe lithography (SPL) describes a set
of nanolithographic methods to pattern material on the nanoscale using scanning
probes. It is a direct-write, mask-less approach which bypasses the diffraction limit and
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can reach resolutions below 10 nm. It is considered an alternative lithographic technology

often used in academic and research environments. The term scanning probe
lithography was coined after the first patterning experiments with scanning probe
microscopes (SPM) in the late 1980s.
Its Mechanical approach to realize patterning. Different configurations
are available such as scanning tunneling microscope and atomic force microscope.

Fig. Scanning Tunneling Microscope

Fig. Atomic Force Microscope.

2. Focused beam lithography:
Focused ion beam, also known as FIB, is a technique used particularly in
the semiconductor industry, materials science and increasingly in the biological field for
site-specific analysis, deposition, and ablation of materials. A FIB setup is a scientific
instrument that resembles a scanning electron microscope (SEM). However, while the
SEM uses a focused beam of electrons to image the sample in the chamber, a FIB setup
uses a focused beam of ions instead.
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FIB can also be incorporated in a system with both electron and ion beam
columns, allowing the same feature to be investigated using either of the beams. FIB
should not be confused with using a beam of focused ions for direct write lithography
(such as in proton beam writing). These are generally quite different systems where the
material is modified by other mechanisms.

As the diagram shows, the gallium (Ga+) primary ion beam hits
the sample surface and sputters a small amount of material, which leaves the surface as
either secondary ions (i+ or i-) or neutral atoms (n0). The primary beam also produces
secondary electrons (e). As the primary beam rosters on the sample surface, the signal
from the sputtered ions or secondary electrons is collected to form an image.
At low primary beam currents, very little material is sputtered and
modern FIB systems can easily achieve 5 nm imaging resolution (imaging resolution with
Ga ions is limited to ~5 nm by sputtering and detector efficiency). At higher primary
currents, a great deal of material can be removed by sputtering, allowing precision milling
of the specimen down to a sub micrometer or even a nano scale.

3. Nano imprint lithography :

The term "Nanoimprint Lithography" (NIL) was coined in the scientific
literature in 1996, when Prof. Stephen Chou and his students published a report
in Science. although hot embossing (now taken as a synonym of NIL) of thermoplastics
had been appearing in the patent literature for a few years already. Soon after
the science paper, many researchers developed different variations and implementations.
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At this point, nanoimprint lithography has been added to

the International Technology Roadmap for Semiconductors (ITRS) for the 32 and 22 nm
nodes.
Nanoimprint lithography is a method of fabricating nanometer scale patterns. It
is a simple nanolithography process with low cost, high throughput and high resolution. It creates
patterns by mechanical deformation of imprint resist and subsequent processes. The imprint resist
is typically a monomer or polymer formulation that is cured by heat or UV light during the
imprinting. Adhesion between the resist and the template is controlled to allow proper release.

Fig. Nano imprint lithography

Bottom-up approach:
A bottom-up approach is the piecing together of systems to give
rise to more complex systems, thus making the original systems sub-systems of the
emergent system. Bottom-up processing is a type of information processing based on
incoming data from the environment to form a perception. From a Cognitive Psychology
perspective, information enters the eyes in one direction (sensory input, or the "bottom"),
and is then turned into an image by the brain that can be interpreted and recognized as a
perception (output that is "built up" from processing to final cognition).
In a bottom-up approach the individual base elements of the
system are first specified in great detail. These elements are then linked together to form
larger subsystems, which then in turn are linked, sometimes in many levels, until a
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complete top-level system is formed. This strategy often resembles a "seed" model, by
which the beginnings are small but eventually grow in complexity and completeness.
However, "organic strategies" may result in a tangle of elements and subsystems,
developed in isolation and subject to local optimization as opposed to meeting a global
purpose.
1)

Chemical vapor deposition:

Fig. Thermal CVD Reactor

Chemical vapor deposition (CVD) is a chemical process used to
produce high quality, high-performance, solid materials. The process is often used in
the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is
exposed to one or more volatile precursors, which react and/or decompose on the
substrate surface to produce the desired deposit. Frequently, volatile by-products are also
produced, which are removed by gas flow through the reaction chamber.
Micro fabrication processes widely use CVD to deposit materials
in various forms, including: mono crystalline, polycrystalline, amorphous, and epitaxial.
These materials include: silicon (SiO2, germanium, carbide, nitride)
carbon(fiber, nanofibers, nanotubes,diamond and grapheme), fluorocarbons, filaments, tu
ngsten, titanium nitride and various high-k dielectrics.

2) Dip-pen nanolithography:

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Fig. Dip-pen nanolithography

Dip pen nanolithography (DPN) is a scanning probe lithography technique
where an atomic force microscope (AFM) tip is used to create patterns directly on a range
of substances with a variety of inks. A common example of this technique is exemplified
by the use of alkanet thiolates to imprint onto a gold surface. This technique allows
surface patterning on scales of under 100 nanometers. DPN is the nanotechnology analog
of the dip pen (also called the quill pen), where the tip of an atomic force
microscope cantilever acts as a "pen," which is coated with a chemical compound or
mixture acting as an "ink," and put in contact with a substrate, the "paper.
DPN enables direct deposition of nanoscale materials onto a substrate in a
flexible manner. Recent advances have demonstrated massively parallel patterning using
two-dimensional arrays of 55,000 tips. Applications of this technology currently range
through chemistry, materials science, and the life sciences, and include such work as ultra
high density biological nanoarrays, and additive photo mask repair.

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Conclusion
Micro and Nano manufacturing of micrometers and nanometers can be
achieved by mechanically machining substrates from engineering materials, or by
mechanically machining molds for use in the mass production of microstructures
and nanostructures made from polymeric materials.
By micro drilling , optical lenses can made accurately with high quality.
By micro joining, joining of to materials can join most accurately by mechanical
connection, electrical connection.
nano manufacturing materials exhibit unique properties at these scales.
It increases toughness of product, it gives hardness to product and it has low
thermal co-efficient of expansion.
Reference
Micro manufacturing process Edited By V.K Jain.
Wikipedia.
Kadam Sir (lecturer at SSPI Parbhani college).

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