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Mohammad Elyyan
Technical Service Engineer
ANSYS Inc.
1
Agenda
ANSYS Icepak Overview
Problem Description
System Model
Zoom-in Model
Summary
2
ANSYS Icepak
ANSYS Icepak is an integrated
electronics cooling solution for
IC packages, printed circuit
boards and complete electronic
systems.
flow
Conduction
Convection
Radiation
Conjugate heat transfer
Overview
3
Background
Case Study
System model
Zoom-in model
Summary
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Thermal-stress analysis of a
computer graphics card
Overview
5
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Interface to SIwave
SIwave and ANSYS Icepak exchange both power map
and temperature data
Power Map
Temperature
Current Density
(SIwave)
Overview
7
Background
Case Study
Temperature
(Icepak)
Problem Description
System model
Zoom-in model
Summary
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Sample Problem:
Thermal Analysis of Electronics Board in Down-hole
Equipment
Background
Electronics devices exist in down-hole tools to collect sensors data, drive
actuators, multiplexing, data storage
Wireline tools
Logging While Drilling (LWD/ MWD) tools
Permanent monitoring systems in oil wells
Challenge:
Overview
10
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Overview
11
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Modeling Strategy
Perform analysis in two steps
1. System level analysis
Fewer details
2. Zoom-in analysis
Board
Hotspot detection
Overview
12
Component
Background
Case Study
Problem Description
System model
System
Zoom-in model
Summary
Problem Description
WIRELINE TOOLSTRING
7 long, 2.5 dia
Overview
13
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
IGBT (11 W) x 3
PCB (11.1 W)
IGBT x3 : 11 W each
Mounted on single heat sink
Actuator (4 W)
Actuator: 4 W
Overview
14
Background
Case Study
Problem Description
System model
Core for
mounting
parts
Zoom-in model
Summary
SOIC 32
SOIC 32
6 Cu layers in PCB
Name
Q (W)
q jb (C/W) q jc (C/W)
QFP 144
SO8-1
SO8-2
SOIC 14
SOIC 20
SOIC 32
Diode
5
1
2
0.5
0.5
0.5
0.1
1.2
4
4
5
5
5
-
0.6
-
SO8-1
QFP 144
Layer
1
2
5
6
PCB
Thick (mil)
1.4
1.4
1.4
1.4
65.4
% Cover
28
87.8
91.6
13
-
SOIC 14
SO8-2
SOIC 20 (x2)
Diode (x6)
IC details
Overview
15
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Modeling: GeometryCAD
Icepak can accepts both MCAD and
ECAD data
CAD-to-Icepak conversion in ANSYS Design
Modeler (DM)
1.
2.
3.
Overview
16
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Modeling: GeometryPCB
Import board layout and trace data directly into Icepak
Board outline and components layout IDF import
PCB traces ANSYS Ansoftlinks, Gerber, BRD formats
IDF: Board Layout
EDA
(Cadence, Mentor,
Altium, Zuken, etc)
Overview
17
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Well fluid
Electronic
section
of Tool
Overview
18
Background
Case Study
Problem Description
System model
Domain
bottom BC
Zoom-in model
Summary
PCB
IGBT
PCB model
Actuator
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Well fluid
Top BC
Bottom BC
Side wall
Gravity
Open
Open
T=100 oC
-9.81
ii
Open
T= 00 oC
T=100 oC
-9.81
iii
Open
T=100 oC
T=100 oC
-9.81
iv
Adiabatic T=100 oC
T=100 oC
selected from
worst case
Overview
20
Background
Case Study
Problem Description
System model
Electronic
section
of Tool
Domain
bottom BC
Zoom-in model
Summary
Case i
Overview
21
Case ii
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Component
igbt.1
igbt.2
igbt.3
PCB
116.4
116.5
114.8
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Results: Case iv
Well extended above tool Htotal= 30
Top B.C. set to adiabatic wall:
Enforces circulation
Temperatures similar to case ii
Component Temperatures in oC
Case iv
110.5
110.6
110.3
116.5
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Overview
24
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Layer
1
2
5
6
PCB
Thick (mil)
1.4
1.4
1.4
1.4
65.4
% Cover
28
87.8
91.6
13
-
Orthotropic conductivity
Overview
25
Background
Case Study
Problem Description
Trace Distribution
System model
Zoom-in model
Summary
Layer
1
2
5
6
PCB
Thick (mil)
1.4
1.4
1.4
1.4
65.4
% Cover
28
87.8
91.6
13
-
Conductivity of Lumped
orthotropic PCB
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Component
Overview
27
% diff
U4-SO8
175.2
154.7
37.5
U8-SO14
U10-SO20_BW_A
U9-SO20_BW_A
U5-SOJ32_300
U6-SOJ32_300
U7-SQFP20X20_144
U14-SO8
igbt.1
igbt.2
igbt.3
144.1
139.1
136.4
136.4
125.6
159.6
204.1
110.3
110.3
109.9
136.1
138.1
134.1
129.5
122.1
139.3
176.6
110.3
110.4
109.9
22.0
2.6
6.8
23.2
15.9
51.4
35.9
-0.2
-0.5
-0.3
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Detailed PCB
Compact PCB
Overview
28
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Overview
29
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Overview
30
Background
Case Study
Problem Description
System model
Zoom-in model
Summary
Summary
Overview
31
Background
Case Study
Problem Description
System model
Zoom-in model
Summary