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Fig. 1. With half-wave conduction of an SCR, the average and RMS load
currents are a function of IPK and the half-cycle time.
(Eq. 2)
where P is the triac power (W), VO is the triac knee voltage
(V), ITRIACAVG is the average load current (A), RS is the triac
slope resistance () and ITRIACRMS is the root-mean-square
(RMS) load current (A).
VO and RS are given in the NXP Semiconductors datasheets on the ITRIAC / VTRIAC curve. If the values are not available, they can be obtained from the ITRIAC / VTRIAC curve as
described under the heading Calculating VO and RS. ITRIACAVG
is calculated from the applications RMS load current using
Eq. 2. (This assumes full-wave conduction and sinusoidal
load current, which will give worst-case power dissipation.)
The value for ITRIACRMS is measured in the application.
If half-wave conduction is necessary, as shown in Fig. 1
I TRIAC AVG = 2 2
I TRIACRMS
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(Eq. 3)
(Eq. 4)
I TRIACRMS = IPK / 2.
(Eq. 5)
Calculating VO and RS
Calculating TJMAX
Analysis of RTHJ-A
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TRIAC RELIABILITY
Note that there are some important caveats in the way
the thermal resistance is specied because it depends on
the package type and the practicality of isolating a metallic
thermal reference point. For example, for plastic packages
without a metal mounting base, the expression RTHJ-MB +
RTHMB-HS is replaced by a single parameter of RTHJ-H
, since
J-HS
the heatsink is the nearest metallic reference point. Also,
for low-power plastic packages where a heatsink would not
be used, only RTHJ-LEAD is specied, because the leads are the
nearest metallic reference point. Most of the heat would be
conducted through the leads to the pc board, with a little
radiated directly from the package to ambient. Finally, for
some surface-mount packages without a mounting base but
with a solder point instead, RTHJ-MB is replaced by RTHJ-SP.
The table lists the NXP triac packages and the means
of specifying their thermal resistance. It shows thermal
resistance values where they are xed by the package type
or mounting method. If a thermal resistance is inuenced
by the triac die, the specication becomes specic to that
particular device, so it will be given in the datasheet.
I TRIACRMS
RMS
= 2 2
7.883
= 7.005 A.
38
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TRIAC RELIABILITY
conditions. It can be regarded as an innite heatsink with a
temperature of 70C.
C. Therefore, RTHJ-A = 1.5C/W + 1.4C/W
+ 0 = 2.9C/W.
Using Eq. 6, TJMAX
= TA + P RTHJ-A
MA
= 70C + 10.22 W 2.9C/W
= 100C.
This is below TJMAX
of 125C and, therefore, acceptable.
MA
I TRIACRMS
RMS
= 2 2
Value (C/W)
SOT54
(TO-92)
RTH
60
J-LEAD
RTH
(free air)
J-A
SOT78
(TO-220)
See datasheet
J-MB
RTH
0.30
RTH
0.5
RTH
1.4
RTH
1.4
RTH
2.2
RTH
0.8
RTH
1.6
RTH
4.5
RTH
(free air)
60
MB-HS
MB-HS
MB-HS
MB-HS
MB-HS
MB-HS
MB-HS
J-A
RTH
See datasheet
J-MB
RTH
0.4
RTH
2.0
RTH
2.0
RTH
5.0
RTH
(free air)
100
MB-HS
MB-HS
MB-HS
MB-HS
J-A
SOT186A
(plastic TO-220)
RTH
(with grease)
See datasheet
RTH
(no grease)
RTH
(free air)
55
J-HS
J-HS
J-A
SOT223
150
RTH
MB-HS
SOT82
RTH
J-SP
RTH
J-A
1.4
= 1.226 A.
See datasheet
(free air, minimum pad area, FR4 pc board)
150 typical
SOT404
(D2PAK)
RTH
J-MB
MB
RTH
(free air, minimum pad area, FR4 pc board)
See datasheet
SOT428
(DPAK)
RTH
J-MB
MB
RTH
(free air, minimum pad area, FR4 pc board)
See datasheet
75 typical
J-A
J-A
55 typical
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TRIAC RELIABILITY
This is effectively the heatsink thermal resistance, since
the pc board is the heatsink in this case. As an approximate
guide, this thermal resistance can be obtained with a copper pad area of 500 mm2 (refer to the NXP application note
Surface Mounted Triacs and Thyristors, document order
number 9397 750 02622).
Please note that the actual thermal resistance will be reduced by other, nondissipating components in close proximity to the triac, while it will be increased by any components
that dissipate power. It is essential to measure the prototype
to discover the true thermal performance.
I TRIACRMS
RMS
= 2 2
1.3
= 1.117 A.
A heavy-duty electric drill uses a universal (brush) motor whose speed is controlled by a half-wave phase-control
circuit. Calculate the maximum power dissipation in the
SCR and calculate the heatsink thermal resistance required
to maintain the junction temperature below TJMAX.
Peak motor current during normal running = 5 A.
A surface-mounted triac is required for mounting within the
trigger switch. Maximum ambient temperature is 50C.
The SCR is air-cooled by the motor cooling fan. The
BTH151S-650R is chosen for its high repetitive surge
guarantee for the repetitive overload conditions it will have
to face. It is rated at 12 ARMS and comes in
the SOT428 (DPAK) package.
Using Eq. 3, ITRIACAVG= IPK / = 5 / =
1.59 A.
Using Eq. 5, ITRIACRMS= IPK/2 = 5/2 = 2.5 A.
From the datasheet, VO = 1.06 V and
RS = 0.0304 .
Using Eq. 1, P = VO ITRIACAVG + RS
ITRIACRMS2 = 1.06 V 1.59 A + 0.0304
(2.5 A)2 = 1.88 W.
Using Eq. 6, TJ = TA + P RTHJ-A.
We already know that TA = 50C and
P = 1.88 W and, in this case, TJ = TJMAX =
125C.
Rearranging the equation gives:
RTHJ-A= (TJ TA) / P = (125C 50C) /
1.88 W = 39.9C/W.
Using Eq. 7, RTHJ-A = RTHJ-MB + RTHMB-HS
+ RTHHS-A.
From the datasheet, RTHJ-MB = 1.8C/W.
We need to nd RTHMB-A.
Rearranging the equation gives:
RTHMB-A = RTHJ-A RTHJ-MB = 39.9C/W
1.8C/W = 38.1C/W.
A maximum heatsink thermal resistance
of 38C/W will keep TJ at or below 125C.
This heatsink thermal resistance covers the
steady-state condition and is easily achievVisit www.bussco.com/busbar
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