DHANALAKSHMI SRINIVASAN ENGINEERING COLLEGE, PERAMBALUR

DEPARTMENT OF ECE
EC6011 ELECTROMAGNETIC INTERFERENCE AND COMPATIBILITY
QUESTION BANK
UNIT I BASIC THEORY:
PART A:
1. Analyze the need for electromagnetic compatibility.
2. Write some of the testing strategies in EMC.
3. Identify the three criteria to be satisfied by any system to become electromagnetically
compatible.
4. Discuss the steps to prevent emission that causes the EMI in a system.
5. Why is EMI a vital problem?
6. We feel electric shock at times, when we touch TV and Computer monitors. Give the reason.
7. List the sources of EMI
8. Give the explanation about the conducted coupling of EMI.
9. Explain why a bike started or a mixie under running condition disturbs a TV
10. Where is a decoupling capacitor used? Why?
11. Illustrate various types of radiation coupling in EMI.
12. Choose which coupling happens directly between the emitter and receptor.
13. What is the possibility to develop circuit models of EMI with correct reason.
14. Criticize on the two factors that tend to affect the amount of interference that would
otherwise be transmitted along a conducted path.
15. Define EMI and EMC.
16. List some of the EMC applications.
17. Classify EMI/EMC.
18. Summarize the effect of EMI on secured communications.
19. What would happen if the coupling path is not properly shielded? Justify
20. How can the hazards due to radiation be reduced or prevented?

PART B:
1. Write short notes on EMI Testing categories. (10)
2. What are the various parameters of measurement? Give their relevant units. (6)
3. List out all the sources and victims of EMI? (6)
4. Write notes on each sources and victims with examples. (10)
5. What is an intersystem EMI? How does it affect equipment in an EM environment? (8)
6. Select and write about the case histories related to intersystem EMI. (8)
7. What is an intrasystem EMI? How does it affect equipment in an EM environment? (8)
8. Write about the case histories related to intersystem EMI. (8)
9. Distinguish between the features of conducted EMI and radiated EMI.(8)
10. Explain the interference elements present in an EMI system. (8)
11. Give an account on radiation hazards. (8)
12. Explain in detail the conducted EMI and radiated EMI with examples. (8)
13. Identify how a conducted emission occurs in an EM environment. (8)
14. Explain the tests performed for the conducted susceptibility. (8)
15. Illustrate proper industrial citations to explain the significance of EMI in a system design.
(8)
16. Show how celestial bodies act as a source of EMI. (8)
17. Select a proper testing methodology for Radiation emissions and susceptibility. Explain.
(8)
18. Interpret the lightning discharge as a source of EMI. (8)
19. Analyze how an electrostatic discharge occurs. (8)
20. Investigate on details of how an EMI is caused by radiation Hazards.(8)
21. Explain the measurement performed for the conducted emission? (8)
22. Examine the role of Decoupling capacitors in digital ICs. (8)
23. Analyze the various issues of EMC in brief. (6)
24. How does the conduction emission occur in Switched mode power supply? Discuss about
the common mode noise in SMPS. (10)
25. Consider the past historical facts. Criticize on the impact of radio communication. Also
discuss the role of electromagnetic susceptibility and compatibility in it. (16)
26. Generate suitable examples to explain the intentional and unintentional electromagnetic
emissions during operation of various equipments. How to control them? (16)
UNIT II COUPLING MECHANISMS:
PART A:
1.
2.
3.
4.
5.
6.
7.
8.

List out the types of coupling between cables.

Define Ground coupled Interference.
Draw the elements of interference in a basic system with source and receptor.
What is transient coupling?
Draw common mode and differential mode coupling in circuits.
Describe the effect of cross talk with reference to EMI/EMC design issues.
Give suitable explanation for Ground with respect to working on electrical gadgets.
Express the impacts of electromagnetic emission.

9. Discuss the way by which one can avoid power mains interference.
10. Illustrate the steps in the procedure to analyze EMP susceptibility.
11. What would happen if conductive transfer occurs?
12. Classify the factors that the noise voltage developed in a closed loop, depend on.
13. Criticize the need of ground loop coupling.
14. Explain automotive transient.
15. Analyze the drawbacks of various coupling mechanisms.
16. Explain power supply and power main coupling.
17. Combine the effect of radiation and conduction coupling and discuss its effect.
18. Define LISN.
19. Point out the important techniques to control EMI at source point.
20. Explain how the field coupling affects the system?
PART B:
1. What is the electromagnetic field sources found in an electromagnetic environment?
Discuss. (8)
2. Define coupling. What are the types of coupling encountered in an EM environment?
Discuss. (8)
3. Define coupling path. What are the electromagnetic interferences that occur in the
coupling path? (8)
4. What is common mode coupling? Show how it affects a system in an electromagnetic
environment? (8)
5. Define radiated differential mode coupling? How In what way this is different from the
radiated common mode coupling? (8)
6. What are transient sources? How does the lightning discharge affect the electronic
equipments? (8)
7. What is ground loop coupling? State the causes of ground loop coupling. (6)
8. Show how it affects the grounding in a system that is a part of the electromagnetic
environment. (10)
9. Illustrate in detail the conducted and radiated coupling. (8)
10. Demonstrate the common impedance ground couplings with examples (8)
11. Illustrate the effect of cross talk in a three conductor transmission line. (8)
12. Discuss in detail about power supply coupling. (8)
13. Describe the cable related emissions and coupling briefly. (8)
14. Summarize on Automotive transients. (8)
15. Describe about the Inductive coupling supporting with neat diagrams and scenarios. (8)
16. Explain how the Electrostatic discharge affects the digital circuits and control panels. (8)
17. Explain the Capacitive coupling that occurs between the two cables running parallel to
each other. (8)
18. Identify how surges occurring on main power supply affect the appliances. Explain. (8)
19. Explain the concept behind Cross talk with help of PCB in detail. (8)

20. Analyze how a coupling takes place in a supply network and how does it affect the
network. (8)
21. Explain how common mains supply acts as a frequent source of conducted interference.
(8)
22. Illustrate the electromagnetic impact of cable coupling in a system design. (8)
23. Analyze the effects of inductance in a two wire cable system. (8)
24. Describe the effects of the capacitance that exists between the cables. (8)
25. Justify the reasons of how the cable coupling, near and far coupling of EM fields
produced can be reduced. Also, suggest the ways to enhance the immunity of
circuits/equipments /systems. (8)
26. Evaluate the effects of radiative coupling in an EM environment. (8)
27. How an electromagnetic field that appears in the atmosphere does gets coupled into the
transmission or power cables? Calculate the induced voltage and current due to this
coupling action. (8)
28. Develop the scenarios which demonstrate the electromagnetic coupling between an
emitter and a receptor. Support it with neat diagrams. (8)
UNIT III EMI MITIGATION TECHNIQUES:
PART A
1. Analyze EMI shielding and its need.
2. What is Murphys Law?
3. List the Choice of Materials for shielding.
4. Define shielding effectiveness.
5. Formulate the shielding effectiveness of E and H fields.
6. Summarize various shielding methods.
7. Interpret the all the tests that can be carried over in a shielding room.
8. Explain the need for EMI Gaskets.
9. Point out the different Gasketting for EMI sealing.
10. List out the coupling situations to be addressed during the physical layout process.
11. Classify the procedures for effective grounding in PCB design
12. Discuss about the advantages of multipoint grounding.
13. Chemical Salting has to be repeated for every 2 or 3 years for better grounding effect
Justify.
14. Illustrate the terms grounding and bonding.
15. Classify EMI filters.
16. What is meant by bulging capacitor?
17. Estimate the insertion loss of the filter.
18. Estimate the functionality of transient suppressors.
19. Draw the diagram of gas tube surge suppressor and arrestors.
20. Show all the procedures that have to be considered for cable routing.
PART B:

1. Discuss the shielding mechanism and derive the expression for the attenuation due to
2.
3.
4.
5.
6.
7.

single shield and multimedia laminated shield with neat diagrams and equations. (16)
Show that the electromagnetic leakage occurs through shielding joints. (6)
Suggest the methods to reduce this electromagnetic leakage. (10)
How can a gasket be used to suppress the EM leakage at joints? (8)
Write notes on sealing for EMI leakage. (8)
Explain in detail about the different types of system grounding for EMI/EMC. (16)
Describe a filter help in suppressing undesired conducted electromagnetic interference?

(8)
8. Support your answer with the help of lumped element low pass filter. (8)
9. Summarize on the methods to measure the ground resistance. (8)
10. Brief out the preventions to be followed while earthing. (8)
11. Analyze the factors considered for a telephone line filter design. How does this factor
influence the filter design? Explain with necessary examples. (16)
12. Summarize about various lumped element low pass filter schemes for EMI mitigation.
Also compare their performances. (16)
13. Write notes on (i) Surge protection and suppression (ii) Transient protection and
suppression (ii) Low Frequency (LF) magnetic field shielding (5)+(5)+(6)
14. The insertion loss of a particular filter depends on the source and load impedances, and
therefore cannot be stated independently of the termination impedances. Justify the
above statement and prove it numerically. Also determine the insertion loss at 150 kHz
and 30 MHz for a differential mode and common mode. (16)
15. For a Residential power distribution system, analyze the requirements and the steps to
design a safety grounding system considering the two wires and three wires grounding
scenario. (16)
16. Investigate on how the component selection and mounting controls EMI.(6)
17. Explain about PCB to chassis ground connection and effects of apertures. (10)
18. What are all the procedures used for effective grounding in PCB design? (8)
19. Brief about electromagnetic compatibility that is achieved while PCB is prepared for
industry applications. (8)
20. Illustrate the consequence of different shielding materials over the shielding. Tabulate
some of the shielding materials and their uses.(8)
21. Demonstrate the shielding integrity at discontinuities. (8)
UNIT IV STANDARDS AND REGULATION
PART A:
1.
2.
3.
4.

List out the EMI/EMC civilian standards.

What for MIL STD 461, 462 and 463 are used?
Which are the class A devices with reference to FCC?
Give the reason why CISPR standards evolved.

5. Can High Voltage lines be allowed to cross residential sites? Justify.

6. Quote the CISPR standards for EMIC.
7. Illustrate at least two standards for design guidelines and test & measurement procedures
published by IEEE/ANSI.
8. State the objective of requirements CS 103/104/105.
9. Identify the expansion of the terms CISPR, FCC.
10. Differentiate military and civilian standards.
11. Propose the Standards for generic products to be used in industrial environments?
12. Summarize few parameters of MIL 461E / 462.
13. Define IEC and BSI.
14. Discuss the special requirements of MIL STD 461E for EMC testing?
15. Interpret the need for EMI standards?
16. Construct the main function of ACEC.
17. Analyze the key for Conducted Emission (CE) EMC standards?
18. Prepare the AS/NZS standards?
19. Assess modular approval standards.
20. Point out the two types of EMC Product standard.
PART B:
1. What does the standard MIL 461E emphasize? What are the problems one may face by
violating the regulations in it? If possible, a case study be referred to support your
justification. (16)
2. Express the needs to meet for EMI standards? Explain. (8)
3. Discuss briefly of FCC regulations. (8)
4. Develop the conducted interference controls, radiated interference controls and
susceptibility at intermediate levels of exposure in MIL STD 461/462 standard. (16)
5. Compare Euro norms standards in Japan. (8)
6. Infer details about EMI specifications and its limits with respect to civilian and military
standards. (8)
7. Analyze the purpose of EMI standards and give different types of standards that followed
in different countries? (16)
8. Distinguish between the FCCs EMC requirement and the European Unions EMC
requirements? What additional emission requirements does the European Union have that
the FCC does not? (16)
9. Write about Committee Special des Perturbations Radio electrique (CISPR) and
International Electro technical Commission (IEC) standards. (8+8)
10. Explain in detail the usage of ANSI standards in EMC area & Point out why military
standards are more stringent for RE and RS. (16)
11. List out the IEC specifications adopted by ANSI standard. Briefly explain the MIL
standards are useful in the area of EMI/EMC. (16)

12. Summarize FCC and CISPR Conducted Emission (CE) and Radiated Emission (RE)
standards. (16)
13. Write short notes on (i) British Standard Institution (BSI) & Committee European de
Normalization Electro techniques (CENELEC).(8+8)
14. Determine the generic standards for residential and industrial environments & validate
the VDE standards and pulsed interference immunity. (16)
15. Demonstrate the regulatory model for radiated emissions from electrical equipment. (8)
16. Show that how US organizations involved with EMC for commercial standards. (8)
17. Illustrate on how the spectrum conservation can be achieved through proper frequency
assignment. (16)
UNIT V EMI TEST METHODS AND INSTRUMENTATION
PART A:
1.
2.
3.
4.
5.
6.
7.

Draw two arrangements of OATS.

What are the advantages of OATS?
List the features of current probe and power probe.
Illustrate the significance of narrow band testing.
Assess the Near Field sources in Shielding effectiveness.
List the various measurement precautions in OATS.
Illustrate at least two standards for design guidelines and test & measurement procedures

published by IEEE/ANSI.
8. What is a TEM Cell?
9. Identify atleast two standards for test &measurement procedures published by
IEEE/ANSI.
10. Compare radiated measurements for class A devices and others.
11. Formulate the spectrum bandwidth that will be occupied by a radio station
12. Give the list of antenna used for microwave frequencies.
13. State the recommended ambient conditions for air discharge mode testing.
14. Generalize the requirements of Military STD for EMC testing?
15. Discuss on how test bed is selected for ESD testing.
16. With LISN illustrate the basic circuit used for RI measurements.
17. Point out two very important needs for TEM cell.
18. Develop an equation for spectral efficiency that depends on the useful information from
the radio equipment.
19. Summarize the commonly used test antennas with frequency.
20. Differentiate Military standard and Civilian standards in measurements.
PART B:
1.
2.
3.
4.

Write short notes on sensors/Injectors. (8)

Write short notes on couplers. (8)
Express the needs to meet for EMI standards for testing methods. (8)
Discuss briefly about ESD test bed. (8)

5.
6.
7.
8.

Formulate the various EMI Test instruments. (8)

Develop a test bed for EFT. (8)
Compare Euro Norms standards in Japan.(8)
Infer details about EMI specifications and its limits with respect to civilian and military

standards for measurements. (8)

9. Analyze the schematic that enables the measurements using Anechoic chamber. (8)
10. Explain how testing is performed in an open environment. (8)
11. Describe about the open area test site measurements. What are its limitations?(8)
12. Outline the characteristics of open area test site. (8)
13. Write short notes on Broadband measurement antennas
a) The Biconical Antenna (8)
b) Log-Periodic Antenna (8)
14. Explain briefly about the measurements using an anechoic chamber. (8)
15. Explain about Line Impedance Stabilization Networks. (8)
16. List out the various equipment used for Conducted EMI (6)
17. Explain briefly the MIL-STD test methods useful in the area of EMI/EMC. (10)
18. What do you mean by shielding? Explain the Near Field sources in Shielding
Effectiveness. (10)
19. Write a note on Shielded anechoic chamber. (6)
20. Write short notes on (i) Measurement of CM and DM Interferences (ii) Conducted EMI
in ships and Aircraft. (16)
21. Determine various testing antenna and their frequencies as specified in CISPR standard.
(8)
22. Enumerate the measurements using EMI Rx and spectrum analyzer. (8)
23. Demonstrate the regulatory model for radiated emissions from electrical equipment. (8)
24. How do you perform testing using Giga Hertz TEM Cell? (8)
25. Illustrate on how the spectrum conservation can be achieved through proper frequency
assignment. (10)
26. Build EMI coupling network. (6)