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THAPAR UNIVERSITY, PATIALA

CENTRE FOR INDUSTRIAL LIAISON AND PLACEMENT

Dated: 05.10.2016
CAMPUS INTERVIEWS

1.

Name of the Organization:

NXP SEMICONDUCTORS INDIA


(www.nxp.com)

Branches of Engineering:

BE - CS/EC/EIC

Profile : BE CS - Software - only Internship


BE- EC/EIC Design Hardware Internship & Job
Eligibility Criteria

10th, 10+2/Dip
Graduation
Present CGPA8.00

Process of Interviews:

Written test
Technical & Aptitude test
Interviews

60%
60%

2.

P.P.T. & entire process will be in Auditorium on 10.10.2016 at 9.00 AM.

3.

Submit the following details to placement coordinators of the branch by 06.10.2016


by 5.00 PM.
Sr. No.

Name to the student

Roll No.

%age of marks
10th

4.

CTC

Present
CGPA

10+2/Dip.

Rs. 20,000/- PM Stipend during internship


Rs 11.19 Lacs p.a.
Organization under dream status

5.

Students should bring Hard Board along with few A-4 size blank papers and Institute
Identity Card at the time of written test.

( H.S. Bawa )
Industrial Coordinator
CC:

HCSED/HECED/HE&IED - for kind information and request to nominate faculty


placement council member for slots for project semester.
THAPAR UNIVERSITY, PATIALA
CENTRE FOR INDUSTRIAL LIAISON AND PLACEMENT

Dated: 05.10.2016

1.

Name of the Organization:

SAP LABS INDIA


(www.sap.com)

Branches of Engineering:

B.E. CS
M.E. CS/SOFT/IS/CSA
MCA

Eligibility Criteria

Present CGPA7.00

Process of Interviews:

Online Test
Four rounds of Interviews

2.

Online Test on 10.10.2016 at 2.00 P.M.


P.P.T. & entire process will be in TU / PEC on 21.10.2016 at 9.00 A.M.

3.

Placement Coordinators of the branch should submit the following details by


06.10.2016 by 5.00 P.M.

Sr.
No.

Name to the
student

Roll No.

%age of marks
10th

4.

CTC

10+2/Dip

Rs. 25,000/- PM during internship


Rs. 10.00 lacs p.a.

Graduation
for MCA/ME

Present
CGPA

Organization under dream status

5.

Students should bring Hard Board, Two photographs along with few A-4 size blank
papers and Institute Identity Card at the time of written test.

( H.S. Bawa )
Industrial Coordinator
CC:

HCSED/HE&IED/HEC&ED for kind information and request to nominate faculty


placement council member for slots for project semester.
THAPARUNIVERSITY, PATIALA
CENTRE FOR INDUSTRIAL LIAISON AND PLACEMENT

Dated: 05.10.2016
CAMPUS INTERVIEWS
1.

Name of the Organization:

NEWGEN SOFTWARE TECHNOLOGIES


(www.newgensoft.com)
Profile Enclosed.

Branches of Engineering:

B.E. - CS

Eligibility Criteria:

10th, 10+2 CBSE Board


10th, 10+2 other Board
Present CGPA

85%
75%
6.50

Formal Schooling (Should not be pass out of NIOS or any open schooling)

Process of Interviews:

Online test
Aptitude Test
English language
Technology Test
Psychometric Test
Techno Puzzle round
Interviews

2.

P.P.T. & entire process will be in C-Hall on _______at 9.00AM.

3.

Submit the details in following format to placement coordinators of the branch by


08.10.2016 by 5.00 PM.
Sr.
No
.

Name of the student

Roll No.

%age of marks

10th

Board

Present
CGPA

10+2/Dip

4.

CTC

Rs. 15,000/- PM stipend during internship


Rs. 6.25 lacs P.A.

5.

Students should bring Hard Board along with few A-4 size blank papers and Institute
I.Card at the time of written test.

( H.S. Bawa )
Industrial Coordinator
CC:

HCSED for kind information and request to nominate placement council member
for slots for project semester

THAPAR UNIVERSITY, PATIALA


CENTRE FOR INDUSTRIAL LIAISON AND PLACEMENT

Dated: 05.10.2016
CAMPUS INTERVIEWS

1.

Name of the Organization:

CDK GLOBAL (INDIA) PVT. LTD.


(www.cdkglobal.com)

Branches of Engineering:

B.E. - CS/EC/EIC
M.E. - CS/SW/CSA/EC

Eligibility Criteria

Present CGPA7.00

Process of Interviews:

Online test
Aptitude test
Technical test
Three rounds of Interviews

2.

P.P.T. & entire process will be in Auditorium on ___ at 09.00 A.M.

3.

Submit the following details to placement coordinators of the branch by 08.10.2016


by 5.00 PM.

Sr.
No.

Name to the student

Roll
No.

%age of marks
10th

10+2/Dip

Graduation
ME

Present
CGPA
for

4.

CTC

Rs. 6.00 lacs p.a.

5.

Students should bring Hard Board along with few A-4 size blank papers and Institute
Identity Card at the time of written test.

( H.S. Bawa )
Industrial Coordinator
CC:
HCSED/HE&ECD/HE&IED- for kind information and request to nominate placement
council member for slots for project semester.
THAPAR UNIVERSITY, PATIALA
CENTRE FOR INDUSTRIAL LIAISON AND PLACEMENT

Dated: 05.10.2016

CAMPUS INTERVIEWS

1.

Name of the Organization:

EDIFECS TECHNOLOGIES PVT. LTD


(www.edifecs.com)

Branches of Engineering:

B.E. - CS/EC/EE/EIC
MCA

Eligibility Criteria

Present CGPA6.00

Process of Interviews:

Online Test
Group Discussion
Two rounds of Interviews

2.

P.P.T. & entire process will be in Auditorium on ___ at 09.00 A.M.

3.

Submit the following details to placement coordinators of the branch by 08.10.2016


by 5.00 p.m.

Sr.
No
.

Name
to
students

the

Roll
No.

%age of marks

10th

10+2/Dip.

Graduation for
MCA

Present
CGPA

4.

CTC

Rs. 20,000/- p.m. during internship


Rs. 4.50 lacs p.a

5.

Students should bring Hard Board along with few A-4 size blank papers and Institute
Identity Card at the time of written test.

( H.S. Bawa )
Industrial Coordinator
CC:

HCSED/HE&ECD/HE&IED for kind information and request to nominate faculty


placement council member for slots for project semester.

THAPAR UNIVERSITY, PATIALA


CENTRE FOR INDUSTRIAL LIAISON AND PLACEMENT

Dated: 05.10.2016
CAMPUS INTERVIEWS
1.

Name of the Organization:

SHORE TEL INC


(www.shoretel.com)

Branches of Engineering:

B.E. - CS/EC

Eligibility Criteria

10th, 10+2
Present CGPA7.00

70%

Academic gap (after HSc.) are not allowed


Process of Interviews:

Written test
Aptitude test
Technical test
Three rounds of Interviews

Requirements:
Knowledge of C, C++,Java, C#, Ruby, AJAX, Java script

Good understanding of Computer Sc. Fundamentals, data structures and


algorithms
Good problem solving skills
An interest and aptitude for delivering reliable, high performance in
distributed systems with imperfect networks.

2.

P.P.T. & entire process will be in Auditorium on _________ at 9.00 AM.

3.

Submit the following details to placement coordinators of the branch by 07.10.2016


by 5.00 PM.

Sr. No.

4.

Name to the student

CTC

Roll No.

%age of marks
10th
10+2/Dip.

20,000/- p.m. during internship


Rs. 8.00 lacs p.a.

Organization under dream status

Present CGPA

5.

Students should bring Hard Board along with few A-4 size blank papers and Institute
Identity Card at the time of written test.

( H.S. Bawa )
Industrial Coordinator
CC:

HCSED/HE&CED- for kind information and request to nominate faculty placement


council member for slots for project semester

THAPAR UNIVERSITY, PATIALA


CENTRE FOR INDUSTRIAL LIAISON AND PLACEMENT

Dated: 05.10.2016
CAMPUS INTERVIEWS

1.

Name of the Organization:

TINYMESH REDIOCRAFTS INDIA


(www.tmrcindia.com)

Branches of Engineering:

BE- CS / EE / EC /EIC

Eligibility Criteria

10th, 10+2
No CGPA Criteria

60%

No Backlog courses at present.

Process of Interviews:

Shot listing based upon bio-datas


Written Test
Group Discussions
Three rounds Interviews

2.

P.P.T. & entire process will be in Auditorium on ____ at 9.00 A.M.

3.

Submit the following details & soft copies of bio-datas to placement coordinators of
the branch by 08.10.2016 by 5.00 PM.

Sr. No.

Name to
student

the

Roll No.

%age of marks
10th

Present
CGPA

10+2/Dip.

4.

CTC

Rs. 7.00 lacs p.a.

5.

Students should bring Hard Board along with few A-4 size blank papers and Institute
Identity Card at the time of written test.

( H.S. Bawa )
Industrial Coordinator
CC:

HCSED/HE&IED/HE&CED- for kind information and request to nominate faculty


placement council member for slots for project semester

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