MCQ

Q: In the following problems, indicate your answer by giving the letter of the statement you
consider correct.

1- An integrated electronic circuit is

(a) A complicated circuit.
(b) An integrated device.
(c) Fabricated only on a tiny silicon chip.
(d) Much costlier than a single transistor
2- The silicon wafer thickness varies from
(a) 0.4 to 1.0 mm.
(b) 0.6 to 0.8 mm.
(c) 0.6 to 0.8 cm.
(d) 1.2 to 2 mm.
3- In the thin film circuits.
(a) Active components are diffused into the substrate.
(b) Components are formed by silk-screen circuits.
(c) Active components are not used.
(d) Passive components are formed on the surface of the substrate by evaporation.
4- In the context of IC fabrication, metallization means.
(a) Connecting metallic wires.
(b) Covering with a metallic cap.
(c) forming interconnecting conduction pattern and bonding pads.
(d) Depositing SiO2 layer.
5- The foundation on which an IC is built is called an
(a) Insulator (b) Base (c) Plate (d) Wafer
6- As compared to monolithic ICS, film ICS have the advantage of
(a) Better high frequency response.
(b) Much reduced cost.
(c) Smaller size.
(d) Less flexibility in circuit design
7- Epitaxial growth is used in ICS
(a) To grow selectively single-crystal p-doped silicon of one resistively on p-type
substrate of a different resistivity.
(b) To grow single-crystal n-doped silicon on a single-crystal p-doped on p-type
substrate.
(c) Because it yields back-to-back isolating p-n junctions.
(d) Because it produces low parasitic capacitance.
8- A multichip circuit.
(a) Consists of several interconnecting thin film circuits.
(b) Is a monolithic silicon wafer with thick film techniques
 (c) Is normally made with thick film techniques
(d) Is formed either by inter-connecting a number of individual chips or by a
combination of film and monolithic IC techniques.
9- The photo masking.
(a) Provides control of the regions of the silicon oxide to be etched
(b) Control the depth of diffusion
(c) Reduces component size
(d) Prevents ambient light from shining on the silicon wafer during processing
10- The sheet resistance of a semiconductor is
(a) An undesirable parasitic element
(b) An important characteristic of a diffused region, especially when used to form
diffused resistors.
(c) A characteristic whose value determines the required area for a given value of
integrate capacitance.
(d) A parameter whose value is important in a thin film resistance.
11- Increasing the yield of an integrated circuit
(a) Reduces individual circuit cost
(b) Increases the cost of each good circuit.
(c) Results in a lower number of good chips per wafer.
(d) Means that more transistors can be fabricated on the same size wafer.
12- Monolithic integrated circuit systems offer greater reliability than discrete component
system because
(a) There are fewer interconnections.
(b) High-temperature metalizing is used.
(c) Electric voltages are low.
(d) Electric elements are closely matched.
13- Almost all resistors are made in a monolithic IC
(a) During the emitter diffusion.
(b) While growing the epitaxial layer.
(c) During the base diffusion.
(d) During the collector diffusion.
14- In a monolithic-type IC
(a) All isolation problems are eliminated.
(b) Resistors and capacitors of any value may be made.
(c) All components are eliminated.
(d) Each transistor is diffused into a separate isolation region.
15- The main purpose of the metallization process is
(a) To interconnect the various circuit elements.
(b) To protect the chip from oxidation.
(c) To act as a heat sink.
(d) To supply a bonding surface for mounting the chip.