Due on 22.4.

2016 (before lecture hour)

SPRING 2016

METU NCC
MECHANICAL ENGINEERING PROGRAM
MECH 311 HEAT TRANSFER
HOMEWORK 4

Q1. Forced air at T = 25C and V = 10 m/s is used to cool electronic elements on a circuit
board. One such element is a chip, 4 mm by 4 mm, located 120 mm from the leading edge of
the board. Experiments have revealed that flow over the board is disturbed by the elements
and that convection heat transfer is correlated by an expression of the form

Estimate the surface temperature of the chip if it is dissipating 30 mW.

Q2. Consider the problem of steady, incompressible laminar flow between two stationary, infinite
parallel plates maintained at different temperatures.

Referred to as Poiseuille flow with heat transfer, this special case of parallel flow is one for which the
x velocity component is finite, but the y and z components (v and w) are zero.

(a) What is the form of the continuity equation for this case? In what way is the flow fully developed?

(b) What forms do the x- and y-momentum equations take? What is the form of the velocity profile?
Note that, unlike Couette flow, fluid motion between the plates is now sustained by a finite pressure
gradient. How is this pressure gradient related to the maximum fluid velocity?
Q3. Experimental results for heat transfer over a flat plate with an extremely rough surface were
found to be correlated by an expression of the form

For airflow at 50 m/s, what is the surface shear stress at x = 1 m from the leading edge of the plate?
Assume the air to be at a temperature of 300 K.