BLOCK 3

UNIT 1d
SOLID STATE DEVICES
Integrated Circuits (IC)
NOTE: This lesson contains information which may not be disclosed to international
students without proper authorization. Refer to the foreign disclosure memorandum
in the Security Annex of the Course Training Plan for further information.
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 OBJECTIVE

1d. Without reference, identify basic facts about

integrated circuits with at least 70% accuracy.
(7 out of 10)

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 OVERVIEW

1d. Identify basic facts about solid state devices

Integrated Circuits (ICs)

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Developed in 1958
Texas Instruments first
used integrated circuits
in Air Force computers
and the Minuteman
Missiles in 1962 First Integrated Circuit
Integrated circuit design
has reduced the size
and weight of all major
systems on the aircraft

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)
Construction
ICs are made from a silicon wafer using a complex
process in which layers and layers of doping are
added until the circuit is formed
ICs can contain millions of transistors, resistors,
diodes, and capacitors

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

The ant holds in its mouth an IC chip that could

contain all the circuitry in the circuit card to the left
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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Classification of IC
Analog - RF, video, servo, sensors, operational
amplifiers, & voltage regulators
Digital - microprocessors, switching gates, flip-
flops, counters, comparators, adders, & types of
memory
Mixed signal - both analog & digital circuits
combined on a single semiconductor; analog to
digital (A/D) converters and digital to analog
(D/A) converters

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Advantages
Small size
Low cost
High reliability
Easier to Troubleshoot

Disadvantages
Some power, voltage and component limitations

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Types of Packaging

Transistor
Outline
TO-5

Surface Dual-In-Line
Mounted Device Package (DIP)
(SMD) 9
 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Transistor-Outline (TO) Packaging

'metal can' package for
semiconductor devices
Hermetically sealed to protect
the device from environmental
factors such as contaminants
and moisture
Leads normally number between
2 and 12

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Dual-In-Line Package (DIP)

Holes are drilled through the circuit card to
mount the IC chips. Increases production
time and cost

Pins extend
through the
circuit board

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Surface Mounted Device (SMD)

Components are mounted directly onto the
surface of printed circuit boards. IC Pins do not
penetrate through the circuit board
Fewer holes need to be drilled into the circuit
boards

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Pin Numbering
Uses several different markings: such as an
indentation, a notch, a dot, a ridge

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Pin Numbering
Start at manufacturers symbol or
identification marking and count counter
clockwise

Pin #1
location
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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Pin Numbering
Surface Mounted
Device (SMD)

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Pin Numbering
TO-5 Can - Top View TAB

Start at the tab &

count counter
clockwise (CCW)

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 Basic Facts About Solid State Devices
Integrated Circuits (IC)

Pin Numbering
TO-5 Can - Bottom TAB
View
Start at the tab &
count clockwise

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 SUMMARY

1d. Identify basic facts about solid state devices

Integrated Circuits (ICs)

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 OBJECTIVE

1d. Without reference, identify basic facts about

integrated circuits with at least 70% accuracy.
(7 out of 10)

Questions? Homework Progress Check

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