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I. INTRODUCTION
1.0, (1)
We review an example described by Steinberg [1]. Figure 1 Figure 1: Dimensions (in inches) of the PCB and its
shows geometry of a polyimide glass PCB with a through- through-hole-mounted hybrid component
hole-mounted hybrid component designed and used for
monitoring performance of a delivery truck combustion The electronics will be expected to go through and
engine located inside the engine compartment. withstand random vibrations from an environmental stress
screening (ESS), city, and highway driving. Power spectral
density values and their durations are shown in Figure
2(a).
Figure 3: Solder shear tear out due to mismatch of
coefficients of thermal expansion for a through-hole
component and the PCB [1].
IV. RESULTS
III. ASSUMPTIONS
We can see that only blue and purple regions can satisfy
the inequality condition specified in Equation (1).
Furthermore, in the context of Stress Margin Analysis [2]
only the blue region will satisfy six sigma design
robustness requirement.
9.8
543.6
= = 135.3 "/$%/$&' ()'*
4
V. CONCLUSIONS
REFERENCES