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MC14541B

Programmable Timer
The MC14541B programmable timer consists of a 16stage binary
counter, an integrated oscillator for use with an external capacitor and
two resistors, an automatic poweron reset circuit, and output control
logic.
Timing is initialized by turning on power, whereupon the poweron http://onsemi.com
reset is enabled and initializes the counter, within the specified VDD
range. With the power already on, an external reset pulse can be MARKING
applied. Upon release of the initial reset command, the oscillator will DIAGRAMS
oscillate with a frequency determined by the external RC network. The
16stage counter divides the oscillator frequency (fosc) with the nth 14
stage frequency being fosc/2n. PDIP14
P SUFFIX MC14541BCP
CASE 646 AWLYYWWG
Features
1
Available Outputs 28, 210, 213 or 216
Increments on Positive Edge Clock Transitions 14
Builtin Low Power RC Oscillator ( 2% accuracy over temperature SOIC14
14541BG
range and 20% supply and 3% over processing at < 10 kHz) D SUFFIX
AWLYWW
CASE 751A
Oscillator May Be Bypassed if External Clock Is Available
1
(Apply external clock to Pin 3)
External Master Reset Totally Independent of Automatic Reset
14
Operation
14
Operates as 2n Frequency Divider or Single Transition Timer TSSOP14
541B
DT SUFFIX ALYWG
Q/Q Select Provides Output Logic Level Flexibility CASE 948G G
Reset (auto or master) Disables Oscillator During Resetting to
1
Provide No Active Power Dissipation
Clock Conditioning Circuit Permits Operation with Very Slow Clock 14
Rise and Fall Times
SOEIAJ14
Automatic Reset Initializes All Counters On Power Up F SUFFIX MC14541B
ALYWG
Supply Voltage Range = 3.0 Vdc to 18 Vdc with Auto Reset CASE 965
Supply Voltage Range = Disabled (Pin 5 = VDD) 1
Supply Voltage Range = 8.5 Vdc to 18 Vdc with Auto Reset
Supply Voltage Range = Enabled (Pin 5 = VSS) A = Assembly Location
WL, L = Wafer Lot
PbFree Packages are Available YY, Y = Year
WW, W = Work Week
PIN ASSIGNMENT G or G = PbFree Package
(Note: Microdot may be in either location)
Rtc 1 14 VDD
Ctc 2 13 B
RS 3 12 A ORDERING INFORMATION
See detailed ordering and shipping information in the package
NC 4 11 NC dimensions section on page 2 of this data sheet.

AR 5 10 MODE
MR 6 9 Q/Q SEL
VSS 7 8 Q

NC = NO CONNECTION

Semiconductor Components Industries, LLC, 2006 1 Publication Order Number:


October, 2006 Rev. 10 MC14541B/D
MC14541B

MAXIMUM RATINGS (Voltages Referenced to VSS)


Symbol Parameter Value Unit
VDD DC Supply Voltage Range 0.5 to +18.0 V
Vin, Vout Input or Output Voltage Range, (DC or Transient) 0.5 to VDD + 0.5 V
Iin Input Current (DC or Transient) 10 (per Pin) mA
Iout Output Current (DC or Transient) 45 (per Pin) mA
PD Power Dissipation, per Package (Note 1) 500 mW
TA Ambient Temperature Range 55 to +125 C
Tstg Storage Temperature Range 65 to +150 C
TL Lead Temperature, (8Second Soldering) 260 C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Temperature Derating:
Plastic P and D/DW Packages: 7.0 mW/_C From 65_C To 125_C

ORDERING INFORMATION
Device Package Shipping
MC14541BCP PDIP14
MC14541BCPG PDIP14 25 Units / Rail
(PbFree)

MC14541BD SOIC14
MC14541BDG SOIC14 55 Units / Rail
(PbFree)

MC14541BDR2 SOIC14
MC14541BDR2G SOIC14
(PbFree)
2500 / Tape & Reel
MC14541BDTR2 TSSOP14*
MC14541BDTR2G TSSOP14*
MC14541BF SOEIAJ14
MC14541BFG SOEIAJ14 50 Units / Rail
(PbFree)

MC14541BFEL SOEIAJ14
MC14541BFELG SOEIAJ14 2000 / Tape & Reel
(PbFree)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently PbFree.

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MC14541B

ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)


55_C 25_C 125_C
VDD
Characteristic Symbol Min Max Min Typ Max Min Max Unit
Vdc
(Note 2)
Output Voltage 0 Level VOL 5.0 0.05 0 0.05 0.05 Vdc
Vin = VDD or 0 10 0.05 0 0.05 0.05
15 0.05 0 0.05 0.05
1 Level VOH 5.0 4.95 4.95 5.0 4.95 Vdc
Vin = 0 or VDD 10 9.95 9.95 10 9.95
15 14.95 14.95 15 14.95
Input Voltage 0 Level VIL Vdc
(VO = 4.5 or 0.5 Vdc) 5.0 1.5 2.25 1.5 1.5
(VO = 9.0 or 1.0 Vdc) 10 3.0 4.50 3.0 3.0
(VO = 13.5 or 1.5 Vdc) 15 4.0 6.75 4.0 4.0
1 Level VIH Vdc
(VO = 0.5 or 4.5 Vdc) 5.0 3.5 3.5 2.75 3.5
(VO = 1.0 or 9.0 Vdc) 10 7.0 7.0 5.50 7.0
(VO = 1.5 or 13.5 Vdc) 15 11 11 8.25 11
Output Drive Current IOH mAdc
(VOH = 2.5 Vdc) Source 5.0 7.96 6.42 12.83 4.49
(VOH = 9.5 Vdc) 10 4.19 3.38 6.75 2.37
(VOH = 13.5 Vdc) 15 16.3 13.2 26.33 9.24
(VOL = 0.4 Vdc) Sink IOL 5.0 1.93 1.56 3.12 1.09 mAdc
(VOL = 0.5 Vdc) 10 4.96 4.0 8.0 2.8
(VOL = 1.5 Vdc) 15 19.3 15.6 31.2 10.9
Input Current Iin 15 0.1 0.00001 0.1 1.0 mAdc
Input Capacitance Cin 5.0 7.5 pF
(Vin = 0)
Quiescent Current IDD 5.0 5.0 0.005 5.0 150 mAdc
(Pin 5 is High) 10 10 0.010 10 300
Auto Reset Disabled 15 20 0.015 20 600
Auto Reset Quiescent Current IDDR 10 250 30 250 1500 mAdc
(Pin 5 is low) 15 500 82 500 2000
Supply Current (Notes 3 & 4) ID 5.0 ID = (0.4 mA/kHz) f + IDD mAdc
(Dynamic plus Quiescent) 10 ID = (0.8 mA/kHz) f + IDD
15 ID = (1.2 mA/kHz) f + IDD
2. Data labelled Typ is not to be used for design purposes but is intended as an indication of the ICs potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. When using the on chip oscillator the total supply current (in mAdc) becomes: IT = ID + 2 Ctc VDD f x 103 where ID is in mA, Ctc is in pF,
VDD in Volts DC, and f in kHz. (see Fig. 3) Dissipation during poweron with automatic reset enabled is typically 50 mA @ VDD = 10 Vdc.

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MC14541B

SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)


Characteristic Symbol VDD Min Typ Max Unit
(Note 6)
Output Rise and Fall Time tTLH, ns
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTHL 5.0 100 200
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns 10 50 100
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns 15 40 80
Propagation Delay, Clock to Q (28 Output) tPLH ms
tPLH, tPHL = (1.7 ns/pF) CL + 3415 ns tPHL 5.0 3.5 10.5
tPLH, tPHL = (0.66 ns/pF) CL + 1217 ns 10 1.25 3.8
tPLH, tPHL = (0.5 ns/pF) CL + 875 ns 15 0.9 2.9
Propagation Delay, Clock to Q (216 Output) tPHL ms
tPHL, tPLH = (1.7 ns/pF) CL + 5915 ns tPLH 5.0 6.0 18
tPHL, tPLH = (0.66 ns/pF) CL + 3467 ns 10 3.5 10
tPHL, tPLH = (0.5 ns/pF) CL + 2475 ns 15 2.5 7.5
Clock Pulse Width tWH(cl) 5.0 900 300 ns
10 300 100
15 225 85
Clock Pulse Frequency (50% Duty Cycle) fcl 5.0 1.5 0.75 MHz
10 4.0 2.0
15 6.0 3.0
MR Pulse Width tWH(R) 5.0 900 300 ns
10 300 100
15 225 85
Master Reset Removal Time trem 5.0 420 210 ns
10 200 100
15 200 100
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled Typ is not to be used for design purposes but is intended as an indication of the ICs potential performance.

VDD VDD

PULSE PULSE
RS RS
GENERATOR GENERATOR
AR AR
Q/Q SELECT Q/Q SELECT
MODE Q MODE Q
A CL A CL
B B
MR MR

VSS VSS

(Rtc AND Ctc OUTPUTS ARE LEFT OPEN) 20 ns 20 ns

90% 50%
50%
20 ns 20 ns RS 10%
tPLH tPHL
90% 50%
10% 50% 90%
50%
50% Q 10%
DUTY CYCLE tTLH tTHL

Figure 1. Power Dissipation Test Circuit Figure 2. Switching Time Test Circuit
and Waveform and Waveforms

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MC14541B

EXPANDED BLOCK DIAGRAM

A12
B13

1 OF 4
MUX
8Q
Rtc1 210 213 216
8STAGE 8
Ctc2 OSC C 2 C 8STAGE
COUNTER
RS3 RESET COUNTER
RESET RESET

AUTO RESET POWERON


5
RESET

6 10 9
MASTER RESET MODE Q/Q
SELECT
VDD = PIN 14
VSS = PIN 7

FREQUENCY SELECTION TABLE TRUTH TABLE


Number of State
Counter Stages Count
Pin 0 1
A B n 2n
Auto Reset, 5 Auto Reset Auto Reset Disabled
0 0 13 8192
Operating
0 1 10 1024
Master Reset, 6 Timer Operational Master Reset On
1 0 8 256
Q / Q, 9 Output Initially Low Output Initially High
1 1 16 65536 After Reset After Reset
Mode, 10 Single Cycle Mode Recycle Mode

3
TO CLOCK
CIRCUIT

INTERNAL
RESET
2 1
Ctc

RS RTC

Figure 3. Oscillator Circuit Using RC Configuration

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MC14541B

TYPICAL RC OSCILLATOR CHARACTERISTICS

8.0 100
VDD = 10 V
VDD = 15 V 50
4.0
f AS A FUNCTION

f, OSCILLATOR FREQUENCY (kHz)


20
FREQUENCY DEVIATION (%)

OF RTC
0 10 (C = 1000 pF)
(RS 2RTC)
10 V 5.0
4.0 f AS A FUNCTION
2.0 OF C
8.0 1.0 (RTC = 56 kW)
5.0 V (RS = 120 kW)
0.5
12
RTC = 56 kW, RS = 0, f = 10.15 kHz @ VDD = 10 V, TA = 25C 0.2
C = 1000 pF RS = 120 kW, f = 7.8 kHz @ VDD = 10 V, TA = 25C
16 0.1
55 25 0 25 50 75 100 125 1.0 k 10 k 100 k 1.0 m
TA, AMBIENT TEMPERATURE (C) RTC, RESISTANCE (OHMS)
0.0001 0.001 0.01 0.1
Figure 4. RC Oscillator Stability C, CAPACITANCE (mF)

Figure 5. RC Oscillator Frequency as a


Function of Rtc and Ctc

OPERATING CHARACTERISTICS

With Auto Reset pin set to a 0 the counter circuit is when B is 0, normal counting is interrupted and the 9th
initialized by turning on power. Or with power already on, counter stage receives its clock directly from the oscillator
the counter circuit is reset when the Master Reset pin is set (i.e., effectively outputting 28).
to a 1. Both types of reset will result in synchronously The Q/Q select output control pin provides for a choice of
resetting all counter stages independent of counter state. output level. When the counter is in a reset condition and
Auto Reset pin when set to a 1 provides a low power Q/Q select pin is set to a 0 the Q output is a 0,
operation. correspondingly when Q/Q select pin is set to a 1 the Q
The RC oscillator as shown in Figure 3 will oscillate with output is a 1.
a frequency determined by the external RC network i.e., When the mode control pin is set to a 1, the selected
1 count is continually transmitted to the output. But, with
f= if (1 kHz v f v 100 kHz)
2.3 RtcCtc mode pin 0 and after a reset condition the RS flipflop (see
Expanded Block Diagram) resets, counting commences,
and RS 2 Rtc where RS 10 kW
and after 2n1 counts the RS flipflop sets which causes the
The time select inputs (A and B) provide a twobit address output to change state. Hence, after another 2n1 counts the
to output any one of four counter stages (28, 210, 213 and output will not change. Thus, a Master Reset pulse must be
216). The 2n counts as shown in the Frequency Selection applied or a change in the mode pin level is required to reset
Table represents the Q output of the Nth stage of the counter. the single cycle operation.
When A is 1, 216 is selected for both states of B. However,

DIGITAL TIMER APPLICATION

Rtc When Master Reset (MR) receives a positive pulse, the


1 14 VDD internal counters and latch are reset. The Q output goes high
Ctc
2 13 B and remains high until the selected (via A and B) number of
3 12 A clock pulses are counted, the Q output then goes low and
RS
NC 4 11 N.C. remains low until another input pulse is received.
AR
5 10
MODE This one shot is fully retriggerable and as accurate as the
MR
6 9
Q/Q
VDD
input frequency. An external clock can be used (pin 3 is the
INPUT clock input, pins 1 and 2 are outputs) if additional accuracy
7 8
OUTPUT is needed.
tMR Notice that a setup time equal to the desired pulse width
output is required immediately following initial power up,
during which time Q output will be high.
t + tMR

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MC14541B

PACKAGE DIMENSIONS

PDIP14
CASE 64606
ISSUE P

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14 8 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
B FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 7 5. ROUNDED CORNERS OPTIONAL.

INCHES MILLIMETERS
A DIM MIN MAX MIN MAX
A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
F L C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78
N C G 0.100 BSC 2.54 BSC
H 0.052 0.095 1.32 2.41
T J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
SEATING L 0.290 0.310 7.37 7.87
PLANE
K J M 10 _ 10 _
H G D 14 PL N 0.015 0.039 0.38 1.01
M
0.13 (0.005) M

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MC14541B

SOIC14
CASE 751A03
ISSUE H

NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
A 2. CONTROLLING DIMENSION: MILLIMETER.
14 8 3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
B 5. DIMENSION D DOES NOT INCLUDE
P 7 PL DAMBAR PROTRUSION. ALLOWABLE
0.25 (0.010) M B M DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
1 7 CONDITION.

G MILLIMETERS INCHES
R X 45 _ F DIM MIN MAX MIN MAX
C A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
T F 0.40 1.25 0.016 0.049
K M J
SEATING D 14 PL G 1.27 BSC 0.050 BSC
PLANE J 0.19 0.25 0.008 0.009
0.25 (0.010) M T B S A S K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019

SOLDERING FOOTPRINT*
7X
7.04 14X
1.52
1
14X
0.58

1.27
PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our PbFree strategy and soldering


details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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MC14541B

PACKAGE DIMENSIONS

TSSOP14
CASE 948G01
ISSUE B

14X K REF NOTES:


1. DIMENSIONING AND TOLERANCING PER
0.10 (0.004) M T U S V S ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
0.15 (0.006) T U S 3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
N EXCEED 0.15 (0.006) PER SIDE.
0.25 (0.010)
14 8 4. DIMENSION B DOES NOT INCLUDE
2X L/2 INTERLEAD FLASH OR PROTRUSION.
M INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
L B 5. DIMENSION K DOES NOT INCLUDE
U N DAMBAR PROTRUSION. ALLOWABLE
PIN 1 DAMBAR PROTRUSION SHALL BE 0.08
IDENT. F (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
1 7 CONDITION.
DETAIL E 6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE


0.15 (0.006) T U S
A K DETERMINED AT DATUM PLANE W.

V K1



MILLIMETERS INCHES
DIM MIN MAX MIN MAX



J J1 A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C 1.20 0.047
SECTION NN D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
C W J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
0.10 (0.004) K1 0.19 0.25 0.007 0.010
T SEATING D G H DETAIL E L 6.40 BSC 0.252 BSC
PLANE M 0_ 8_ 0_ 8_

SOLDERING FOOTPRINT*

7.06

0.65
PITCH

14X 14X
0.36
1.26
DIMENSIONS: MILLIMETERS

*For additional information on our PbFree strategy and soldering


details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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9
MC14541B

PACKAGE DIMENSIONS

SOEIAJ14
CASE 96501
ISSUE A

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
14 8 LE MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
Q1 (0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
E HE M_ REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
1 7 L TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DETAIL P DAMBAR CANNOT BE LOCATED ON THE LOWER
Z RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
D TO BE 0.46 ( 0.018).

VIEW P MILLIMETERS INCHES


e A DIM MIN MAX MIN MAX
A 2.05 0.081
c A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.10 0.20 0.004 0.008
D 9.90 10.50 0.390 0.413
b A1 E 5.10 5.45 0.201 0.215
e 1.27 BSC 0.050 BSC
0.13 (0.005) M 0.10 (0.004) HE 7.40 8.20 0.291 0.323
0.50 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0_ 10 _ 0_ 10 _
Q1 0.70 0.90 0.028 0.035
Z 1.42 0.056

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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