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THREE THINGS TO CONSIDER WHEN

DESIGNING ELECTRONIC PRODUCTS


WITH HIGH-SPEED CONSTRAINTS

BY: PATRICK CARRIER, MENTOR GRAPHICS CORP.

W H I T E P A P E R

P A D S

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Three Things to Consider when Designing Electronic Products with High-Speed Constraints

INTRODUCTION
Designing high-speed electronic products brings many challenges. High-speed busses such as PCI-Express, DDRx,
and Serial ATA run at frequencies from several hundred megahertz to more than a gigahertz, making for tight
timing margins. Fine-geometry silicon generates fast edge rates. And growing pressure for smaller and cheaper
products leads to very dense PCB layouts. To implement a successful high-speed PCB design, all these factors must
be taken into consideration.

There are three main areas of concern when creating electronic products with high-speed design constraints:
signal quality, timing, and crosstalk.

Signal quality includes items like overshoot, ringback, and non-monotonicities that can damage a receiver or
introduce data errors.
Timing, including effects of terminations, receiver loading, and trace impedances and lengths, must be
rigorously analyzed at the PCB level to ensure compliance at the system level.
Crosstalk, which is unwanted noise induced by one trace onto another, can affect both signal quality and
timing.

By analyzing these areas you can improve product reliability and quality by testing what-if scenarios, generating
routing constraints, and validating them in layout to ensure your electrical requirements are met. Through analysis,
you can also drive sensible decisions about trace lengths, topology, spacing, and part placement, and constrain
items such as board stackup, trace widths, and copper weights.

SIGNAL QUALITY
Digital logic reduces data to a series of 1s and 0s, which are represented in a real system by high and low voltages.
In order for a receiver to determine whether or not a voltage represents a 1 or a 0 that voltage must be above or
below the logic thresholds of the receiver. Also, that voltage must not exceed the limits of the receiver or it might
be damaged. These two requirements generate two fundamental constraints in signal quality analysis: ringback
and overshoot.

If a designer or engineer were to just connect a transmitter to a receiver, the result would be something like the
waveform shown in Figure 1 on the left side. Here, we can see there are both ringback and overshoot violations.
The waveform shows negative overshoot in excess of 1V. It also rings back to 0.8V, which is the lower logic
threshold. If a PCB were built with this topology as is, errors in the data stream would occur and the receivers could
be damaged.

If the length of the topology is reduced significantly, to well below the length of our signal edges, the receiver
waveform is cleaned up dramatically. This can be seen in Figure 1 on the right side. Unfortunately, however, such
lengths are typically on the order of an inch or so, which is not always feasible in a design.

Another method of cleaning up the signal at the receiver is to use termination to match the impedance of the
drivers and receivers to the board traces. This lets you control the reflections that create overshoot and ringback
violations. Termination also allows for greater flexibility in topology length as trace lengths arent restricted to an
unrealistic maximum and cleaner signals can be obtained.

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Three Things to Consider when Designing Electronic Products with High-Speed Constraints

Figure 1: A topology with signal quality problems (left) and a reduced-length topology with clean signals (right).

Termination values may be taken from bus design guidelines or, in the absence of such guidelines, determined
from analysis. Powerful HyperLynx technology, integrated within the PADS flow, takes this a step further with the
Termination Wizard, which can determine ideal termination values automatically by looking at the topology. The
location of the terminator within the trace topology can also be determined by varying those lengths and
analyzing the results. Maximum length rules for determining where the terminators should be placed are created
from this analysis, as are length constraints for the other traces in the topology. An example of this is shown in
Figure 2. All these lengths may be explored in order to create the widest solution space that still meets the signal
quality requirements.

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Three Things to Consider when Designing Electronic Products with High-Speed Constraints

Figure 2: A terminated topology with clean signals.

TIMING
Most length constraints in a design are driven from a timing need. Timing needs come from the fact that data is
clocked in to a receiver at certain intervals. If the data are not there when the system needs them to be, the
system doesnt work.

There are two main types of bus timing architectures: common clock and source synchronous. These lead to two
types of layout constraints: min/max and matched lengths. Minimum and maximum delay constraints are created
from common clock bus architectures.

An example of this is PCI, where data are clocked out of a transmitter and into a receiver using a common clock. In
order to make sure the data are not there too early, or violate the hold-time requirement, a minimum length
constraint must be created. Similarly, to ensure that data do not arrive too late, a maximum length constraint is
created. These constraints are not based merely upon the length of the line. Many other considerations, such as
receiver loading and signal quality issues, determine when the transmitted data may be valid at the receiver, so
proper signal analysis is critical for calculating these lengths appropriately.

Matched delay constraints come about from source-synchronous busses. These busses, such as DDRx, send a
clocking signal or strobe along with the data in order to clock it in at the receiver. This eliminates the complex
timing relationship between driver and receiver, and requires only the matching of the strobe to the data. Typically,
these interfaces have other concerns, such as signal quality, which determine when the data are valid. The main
timing constraint for these busses is the matched delay constraint, which becomes tighter with increases in bus
speed or signal quality problems.

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Three Things to Consider when Designing Electronic Products with High-Speed Constraints

CROSSTALK
Another important constraint for the layout of the design is the spacing between traces. This is determined by the
amount of crosstalk that occurs between the signals. A number of factors influence crosstalk, including: the edge
rate of the driver, the board stackup, the amount of parallelism between traces, and the spacing between traces.

Crosstalk affects both signal quality and timing, and the amount of crosstalk allowed on a given net can be
determined from simulation. An example of a crosstalk simulation is shown in Figure 3.

Figure 3: Crosstalk analysis in PADS Standard Plus and PADS Professional.

Crosstalk analysis typically consists of a victim trace and two aggressor traces. More aggressors can be included
but, in most cases, 95% of the crosstalk comes from the nearest two. With models for the driver, the receiver, and
the board stackup built into the simulation, you can modify the spacing between the traces to determine an
acceptable level of crosstalk. You can also modify the length that the traces run parallel and view the effects. The
main result of such an analysis is a spacing rule between traces. If that spacing rule cannot be met, or if greater
flexibility is to be allowed in the layout, a rule could be created with tighter spacing and a maximum parallelism
constraint. Such a pair of constraints can be created from crosstalk analysis and modified as demands change.

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Three Things to Consider when Designing Electronic Products with High-Speed Constraints

POST-ROUTE VERIFICATION
Once all the necessary routing constraints have been created and youve routed the board using those constraints,
it is good practice to verify that the board meets the original electrical requirements that prompted those
constraints. A good way to close the loop is to do a post-route analysis of all the nets on the board. Figure 4
highlights an example from the Batch Mode wizard in PADS.

In Figure 4, note that PADS uses HyperLynx to run a simulation directly on the layout data and to verify the design
against overshoot, delay, and crosstalk constraints. If nets are found that violate any of these constraints, these nets
can be simulated one at a time to be looked at in more detail.

Post-route analysis is an excellent complement to the rigorous pre-route or what-if analysis that is performed
earlier in the design cycle. It is another step in the series of tasks performed to analyze high-speed busses. Without
these types of analyses, and the constraints created as results, modern digital systems could not be designed to
meet the cost, size, and performance needs of today.

Figure 4: Post-route analysis will ensure the routed board meets your electrical requirements and high-speed constraints.

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Three Things to Consider when Designing Electronic Products with High-Speed Constraints

HOW PADS CAN HELP


The PADS product creation platform gives individual designers and electrical engineers a competitive advantage,
providing the tools you need to resolve electronic product-design challenges. From concept to fabrication, PADS
helps ensure quality and reliability throughout the design cycle.

Choose the perfect configuration for your needs and budget. Scalable, intuitive solutions provide the horsepower
needed to design, validate, and manufacture PCB-centric electronic products in easy-to-use suites that enable even
casual or occasional users to accelerate time to productivity. Solutions are also available for customers working in
global enterprise companies and for those with multi-gigabit, SERDES, electromagnetic, and electrical rule design
challenges. Contact your sales person for more information.

For the latest information, call us or visit: w w w . p a d s . c o m


2016 Mentor Graphics Corporation, all rights reserved. This document contains information that is proprietary to Mentor Graphics Corporation and may
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MF 5/16 MISC 52785-w

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