Академический Документы
Профессиональный Документы
Культура Документы
Ca 3005 ards - 2085) g = 0.188 9,65 10% C/o 63.55 gimol 1 mM mol nog = O48 X BSE gg 7 0-00283 mol diol Te = 0.0083 ptt x FE, = 0:00566 0} fal) F u ' -F te ; 0566p 968 104 300< Tre ous Toss atthe anode i he sane val atthe ent, and the balecton rans SY Note Trego the same value for average eueD! Wi ES ao ed if calculated from the anode mass chal: (anode) Coy SS Cay + BE (03.14 — 52.968 = 0.188 spe average coment esi T0 onze O16 g of opper se anode is 1.8.8. the mass value Coy The primary source of experimental eer it A OS the precision of the balance, which Ii The ra gna igs, One could 180 SY a ET ee mass chang i to smal! because doing used oer forte mes as ong woul give ass Nan Sano Mpean gis Ante! They SOUS the expel variation Jn Ue current low ove KE 35 Ce ree rues which Teguires constant A@}esTen sof the current used by the experimenter. copys 2009 akon pectic cute 53 CAAES tal value ~ predicted value (©) Sdilference = x 100% redid valve = J8A= 18541. seg TSA ‘difference = 2% ‘The ammeter accuracy anpears reasonably good, However, this i tenttveconelsion because the precision oF the oxpesient is poor. Making Connections 19. (a) The plastic is made conductive by a chemical dipping of the cleaned/treated plastic to make an adhering layer of copper otk! (b) ‘The surface must be thoroughly cleaned and etched by removing some surface plastic molecules, In one process for ABS plastic, che intial layer is catalytic palladium, which is then covered with a layer of nickel. In other rocesses. copper is deposited first. In all cases, several other layers of metal are then added, usually by electol- ysis, to produce the final plated product. (©) An important limitation isthe ability to create molecular-size pts in the plastic surface to adhere the initial metal layer. Metal plating plastics makes them less flexible and the plating may crack. Av a general rule, ifthe object ‘has to bend, them it should not be plated. Selective plating may be used with some objects. 20, Chromium from electroplating waste solutions can be removed by first reducing the chromium from the +6 oxidation state to the +3 state using a reducing agent such as sodium bisulfite, The chromiunn(Il}) ions are then precipitated as ‘a nontoxic chrominen(IID) hydroxide, SU (Page 762) Purpose ‘The purpose is to create a process for plating copper onto a metal object. Question ‘What design produces a smooth layer of copper metal that adheres to metal object? Prodiction {) According tothe redox concepts in ths unit and some Imernet research, a metal object can be plated atthe cathode of a copper(I) sulfate electrotytic cell. The key independent variable is the electric current. The best plating should occur at relatively low currents because this produces a relatively low rate of plating. The assumption is that the quality ‘of the copper plating will be beter if forms more slowly. Gis, + 2e > th, ia 1 neat Mog thee ‘The amount of copper formed depends directly on the amount of electrons transferred. The amount of electrons per unit of time depends directly on the current. Experimental Design A small metal object is carefully cleaned and plated with copper. The dependent variable isthe quality of the copper pleting as detcrmined by its thickness. appearance, and adherence tothe object. () The following electrolytic cell is constructed. etal object | CUSOsgay: H_S0 gq! iy cathode (—) il anode (+) Based on other copper-plating cells, copper(I) sulfate is acidified with a sulfuric cell, {) The independent variable used isthe electric current. Other potential variables that are held constant ar: surface area Of the meral in the solution; cieaning of the metal surface; distance between the electrodes: charge transfered {q = 19; and the composition, concentration. and temperature ofthe electrolyte, 454 Unies ony © 2003 nenon