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AIAG PUBLICATIONS
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MAINTENANCE PROCEDURE
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APPROVAL STATUS
The AIAG Board of Directors approved this document for publication on February 25, 2003.
Published by:
Automotive Industry Action Group
26200 Lahser Road, Suite 200
Southfield, Michigan 48034
Phone: (248) 358-3570 Fax: (248) 358-3253
The contents of all published materials are copyrighted by the Automotive Industry Action Group unless otherwise indicated. Copyright is not
claimed as to any part of an original work prepared by a U.S. or state government officer or employee as part of the persons official duties. All
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subject to criminal and civil penalties. AIAG and the Automotive Industry Action Group are registered service marks of the Automotive Industry
Action Group.
FOREWORD
This guideline was prepared by the 2D Direct Parts Marking (DPM) Work Group of the Automatic
Identification Data Collection Work Group. AIAG believes that the use of this guideline will help
maximize the benefits of auto ID as an industry-wide productivity tool. Without guidelines, industry use
of auto ID technology would be encumbered by many different protocols and methodologies.
The mission of the 2D DPM Work Group is to provide information on direct parts marking of Data
Matrix and/or QR Codes using laser, dot-peen, and inkjet marking technologies.
This guideline was developed to help educate end users on the most common marking methods used
throughout the automotive supply chain. The team obtained input from automotive industry standards and
companies, non-automotive industry standards and companies, parts-marking technology providers, code-
reading technology providers, label companies, and various industry experts. In developing this guideline,
the project team considered current 2D symbology parts identification methods, the common needs of
manufacturing and assembly locations, and the performance capabilities of various marking and scanning
technologies. After much research and many deliberations, a consensus was developed.
ACKNOWLEDGEMENTS
The following individuals and companies were instrumental in the development of this guideline:
*Chair
** Co-Chair
*** Secretary
**** Document Coordinator
TABLE OF CONTENTS
AIAG PUBLICATIONS........................................................................................................................... 1
FOREWORD............................................................................................................................................. 2
ACKNOWLEDGEMENTS...................................................................................................................... 3
TABLE OF CONTENTS.......................................................................................................................... 4
1.0 INTRODUCTION........................................................................................................................... 6
1.1 Scope6
2.0 DEFINITIONS ................................................................................................................................ 7
3.0 GENERAL: 2D DIRECT PARTS MARKING (DPM) ............................................................... 8
3.1 Project Considerations............................................................................................................. 9
3.2 Mark Durability..................................................................................................................... 10
3.3 Part Characteristics................................................................................................................ 11
4.0 INKJET MARKING..................................................................................................................... 14
4.1 Overview ............................................................................................................................... 14
4.2 Mark Geometry ..................................................................................................................... 16
4.3 Mark Quality ......................................................................................................................... 16
4.4 Reading Considerations......................................................................................................... 16
5.0 DOT-PEEN MARKING............................................................................................................... 19
5.1 Overview ............................................................................................................................... 19
5.2 Mark Geometry ..................................................................................................................... 19
5.3 Mark Quality ......................................................................................................................... 20
5.4 Reading Considerations......................................................................................................... 24
6.0 LASER MARKING ...................................................................................................................... 26
6.1 Overview ............................................................................................................................... 26
6.2 Mark Geometry ..................................................................................................................... 30
6.3 Mark Quality ......................................................................................................................... 32
6.4 Reading Considerations......................................................................................................... 34
7.0 READING AND VERIFICATION ............................................................................................. 35
7.1 Fundamentals of Reading ...................................................................................................... 35
7.2 Symbol Quality Grading ....................................................................................................... 36
7.3 Quality Parameters and Grading for 2D Symbols ................................................................. 38
7.4 Scan Grading ......................................................................................................................... 39
7.5 Physical Issues....................................................................................................................... 40
8.0 REFERENCES.............................................................................................................................. 43
ABOUT AIAG ......................................................................................................................................... 44
MAINTENANCE REQUEST ................................................................................................................ 45
FIGURES
Figure 1. Comparator Showing Cast Surface Roughness ......................................................................... 12
Figure 2. Texture to Improve Readability................................................................................................. 12
Figure 3. Marking Curved Surfaces.......................................................................................................... 13
Figure 4. Sample Inkjet Marks.................................................................................................................. 14
Figure 5. Continuous Inkjet System.......................................................................................................... 15
Figure 6. White Inkjet Ink on Green PCB When Imaged with Red Light................................................ 18
Figure 7. Ultraviolet Inkjet Mark.............................................................................................................. 18
Figure 8. Inkjet with White Background Added....................................................................................... 18
Figure 9. Single Dot Mark Geometry ....................................................................................................... 20
Figure 10. Multiple Dot Mark Geometry.................................................................................................. 20
Figure 11. Cross Sections of Material Marked with Various Stylus Cone Angles................................... 21
Figure 12. Preferred Stylus-to-Target Configuration................................................................................ 22
Figure 13. Mark Diameter Range Using 30 Stylus ................................................................................. 22
Figure 14. Data Matrix Dot-Peen Marking with and without Proper Illumination................................... 25
Figure 15. QR Code Dot-Peen Marking with and without Proper Illumination ....................................... 25
Figure 16. Photonic Spectrum and Laser Wavelengths ............................................................................ 27
Figure 17. Laser Etching/Engraving ......................................................................................................... 30
Figure 18. Laser Annealing....................................................................................................................... 30
Figure 19. Laser Discoloration ................................................................................................................. 31
Figure 20. Laser Marking Enhancers........................................................................................................ 31
Figure 21. Galvonometer Beam Steering.................................................................................................. 33
Figure 22. Flying Optic Beam Steering .................................................................................................... 33
Figure 23. Mapping of Alphabetic and Numeric Overall Symbol Grades................................................ 37
Figure 24. Results of Using Option A ...................................................................................................... 40
Figure 25. Results of Using Option B....................................................................................................... 41
Figure 26. Angle Distortion ...................................................................................................................... 42
Figure 27. Variation from Nominal Fill.................................................................................................... 42
TABLES
Table 1. Terms and Definitions................................................................................................................... 7
Table 2. Marking Method Selection ......................................................................................................... 10
Table 3. Marking Method Test Specifications.......................................................................................... 10
Table 4. Photonic Spectrum and Laser Wavelengths................................................................................ 27
Table 5. Equivalence of Numeric and Alphabetic Quality Grades ........................................................... 37
Table 6. Test Parameters and Values ........................................................................................................ 38
1.0 INTRODUCTION
This two-dimensional (2D) Direct Parts Marking (DPM) Guideline provides information for the marking
and reading of Data Matrix and/or QR Code symbols marked directly on parts using laser, dot-peen, and
inkjet technologies. The three technologies noted in this document are currently the most common
methods for marking variable data 2D codes directly on parts in the automotive industry. This 2D DPM
guideline is intended as a supplement to the AIAG B-4 Parts Identification and Tracking Application
Standard. As a guideline, this document is intended to provide general information in order to help users
of DPM technology.
This guideline was developed in part based on a review of many related standards, which are listed in
Section 8.0 References.
1.1 Scope
To make this guideline as comprehensive as possible, the document begins with the terms most
commonly used in the auto ID industry and continues through the specialized characteristics of each
technology.
Items to consider when evaluating marking projects
Features and benefits of laser, inkjet, and dot-peen
Qualities of each symbology
Decoding techniques
All exhibits are for illustrative purposes only and may not be to scale or code print quality guidelines.
2.0 DEFINITIONS
There are several terms and definitions associated with the subject of this guideline that have special
meaning to the automotive industry.
TERM DEFINITION
Direct Part Marking The use of technology such as laser, dot-peen, and inkjet to create an
image on an item.
Global Threshold The reflectance value (usually the average of the maximum and
minimum reflectance values in an image) that determines the
boundary level above which pixels are considered white and below
which they are considered black.
Life of a Part Anticipated life cycle, as defined by the manufacturer.
Mark The result of lasering, dot-peening, or inkjetting.
Permanent Mark A mark on an item that can survive its intended environment and
remain readable for the anticipated life cycle of the item.
Code Verification Confirmation that a symbol is printed correctly and conforms to a
specific standard.
Code Validation Confirmation that data in a symbol is encoded using the correct
semantics and syntax and the data is appropriate for the intended
application.
Intrusive Marking Markings that alter the part surface and are considered controlled
defects.
Module A single cell in a matrix symbology used to encode one bit of data.
Non-intrusive Marking Markings that are produced without damaging the part.
Unused Error Correction The amount of remaining error-correction available in a symbol after
existing damage/errors have been compensated for in the default
decode algorithm.
Symbol A Data Matrix or QR Code.
Substrate Material upon which a mark is placed.
Collimated Light Columns of illumination in parallel.
The use of DPM may also be beneficial in the following manufacturing related processes:
Production Automation
Inventory Management
Traceability/Part Path History
Lot Control
Select Fit
Error Proofing
Serialization
Product Identification
Quality Control/Defect Containment
Material To Be
Marked
Metallics Non-Metallics
Marking
Process
A F M T C G F P R
L E A I E L I L U
U R G T R A B A B
M R N A A S E S B
I O E N M S R T E
N U S I I G I R
U S I U C L C
M U M S A S
M S
S
Dot-peen
Laser
Inkjet
= Acceptable marking process for noted material
Specification
Test Specification Title
Number
Abrasion Standard Test Method for Abrasion Resistance of Organic
ASTM D-4060-95
Resistance Coatings by the Taber Abraser
Standard Test Methods for Measuring Adhesion by Tape
Adhesion ASTM D3359-95
Test
Atmospheric ASTM D1308 (with
Standard Test Method for Effect of Household Chemicals
Acid Pollution addition of sulfuric acid
on Clear and Pigmented Organic Finishes
Resistance testing)
Standard Practice for Testing Water Resistance of Coatings
Boiling Water ASTM D870-92
Using Water Immersion
Specification
Test Specification Title
Number
Corrosion
ASTM B117-97 Standard Practice for Operating Salt Spray (Fog) Apparatus
Resistance
Mar Resistance ASTM D673-93 Standard Test Method for Mar Resistance of Plastics
Standard Test Methods for Evaluating Coatings for High
Thermal ASTM D2485-91
Temperature Service
Standard Practice for Operating Light- and Water-Exposure
Ultraviolet
ASTM G53-96 Apparatus (Fluorescent UV-Condensation Type) for
Exposure
Exposure of Nonmetallic Materials
Standard Practice for Testing Water Resistance of Coatings
Water Resistance ASTM D870-92
Using Water Immersion
Standard Practice for Testing Water Resistance of Coatings
Water Resistance ASTM 2247-94
in 100% Relative Humidity
Standard Practice for Operating Light-Exposure Apparatus
Weathering ASTM G26-95 (Xenon-Arc Type) With and Without Water for Exposure
of Nonmetallic Materials
Note: ASTM Specifications can be acquired from the American Society for Testing and Materials.
The surface of an item to be marked should not be rougher than the minimum module size in the symbol.
Symbol marking should be limited to a module size ratio of at least 5:1 of the surface roughness,
regardless of the marking method selected. For example, cast surfaces present a unique symbol decoding
challenge because the surface irregularities (pits) create shadows that can be misinterpreted by the
decoding software as dark data modules. Consequently, individual data modules in the symbol must be
larger than the surface irregularities so that the decoding software can differentiate between the two
features.
Figure 1 is for illustrative purposes only and shows the effect of a surface on the readability of a symbol.
Painted and coated surfaces present special concerns when a mark is intended to be permanent. If the item
is marked prior to coating, the coating may obscure the mark. If the item is marked after coating, the
marking method may damage the coatings integrity. If a mark is placed on a coating, then the mark
durability is equally dependent on the coating and marking method.
Surface enhancement such as machining, texturing, or cleaning may be required to improve marking and
reading quality. In most cases, a smooth matte, or dull finish is preferred over a shiny surface. The area of
the finished surface should be greater than the mark itself. See Figure 2.
Textured
Area
Thickness
Part or surface thickness must be taken into account when applying intrusive markings to prevent
deformation or excessive weakening of the part. The degree of thickness required for intrusive marking is
directly related to the heat, depth, or force applied. In most applications, the marking depth should not
exceed 1/10 the thickness of the part.
4.1 Overview
Inkjet technology sprays precisely controlled drops of ink through the air in a pattern capable of creating
a symbol. These drops are made of pigment suspended in fluid that evaporates, leaving the colored dye on
the surface of the item. Figure 4 shows an example of an inkjet mark.
There are two primary methods for generating these drops: the Drop-on-Demand and Continuous. The
Drop-on-Demand method uses valves or Piezo-electric technology to force ink through an orifice. This
method has significant printing resolution advantages over the Continuous method. The distance the ink
can be shot is usually limited to no more than 1/8th of an inch. This limits the use of Drop-on-Demand
in industrial DPM applications.
The Continuous method is preferred over Drop-on-Demand for industrial DPM applications. In this
method, a continuous single jet of ink is made to pass between two variable voltage plates whose voltage
can be adjusted. The voltage changes adjust the vertical location at which the drops will land; the
horizontal position is varied by movement of the target (or part) in reference to the print head. Figure 5
displays a typical system. When no marks are being formed, the drops circulate from the nozzle to the ink
reservoir.
An advantage of the Continuous Inkjet method for DPM is that the distance from the nozzle to the target
item is significantly larger. It is more robust when dealing with non-porous surfaces and dirty
environments. For the remainder of this document (unless specifically stated), inkjet will refer to
Continuous Inkjet marking technology.
In DPM applications (unlike in paper, where the ink fluid is absorbed by the paper), the ink is required to
have an evaporation fluid. This fluid is normally referred to as the make-up fluid. The solvent-based fluid
is used to keep the viscosity of the ink stream correct. This must be a fast evaporation fluid to prevent the
mark smearing by either motion or handling. The evaporation of this fluid allows for the deposition of the
ink dye on the surface. It is this ink dye that generates the contrast of the mark to the target surface. The
fast evaporation of the fluid can also cause problems with the ink drying and clogging the marking head if
proper maintenance is not performed.
There are many solvent-based fluids available. They can be selected for very fast drying, pigmented,
colored, UV curable, low odor, low solvent, alcohol based, water based, non-flammable, high gloss,
thermochromic, boil resistant, and many other applications. Particular attention must be placed if a
Methyl Ethyl Ketone (MEK) solvent-based fluid is selected. Consult your plant Safety Officer about
related OSHA, environmental, and/or company mandates about the use of MEK.
The issues involved in marking and reading inkjet symbols placed directly on parts are somewhat
different from those of symbols printed on paper. Particular attention must be paid to the condition of the
substrate on which the ink is to be deposited. Cleaning the part surfaces prior to marking with an abrasive
pad to remove coatings, rust, and discoloration, or using an air knife to blow away excess machining
fluids, debris, or oil can improve mark and adhesion reliability.
Limitations
Inkjet marking may not be considered a permanent marking method in some cases and is generally
limited to parts that will not be exposed subsequently to harsh manufacturing, operational, and/or
remanufacturing conditions. In particular, it should not be used on EDM, grit-blasted, machined, and
shot-peened surfaces. Many of these conditions change surface properties and/or color and may make it
necessary to reapply the mark. In addition, care must be exercised to ensure that the part will not go
through any paint-dissolving fluid, as this may also wash out the mark. Another limitation to inkjet
marking is that normally a part must be moving at a consistent speed in one direction past the marking
head during the marking process. Some inkjet system suppliers can provide a modification where the
marking head moves and the part being marked remains still.
Figure 7 shows ultraviolet ink illumination. Mutual agreement between supplier and customer is
necessary to ensure that compatible reading technologies are available when using special applications of
IR or UV fluorescing inks. In some cases, symbol reading can be improved by applying a colored
medium as a backdrop to the area where the code will be applied, as illustrated in Figure 8.
Note: To ensure reading efficiency, a minimum contrast ratio of 20 percent is required between the
reflectance value of the module and the surrounding substrate. Various densitometers can provide such
measurements nondestructively.
Figure 6. White Inkjet Ink on Green PCB When Imaged with Red Light
5.1 Overview
Dot-peen marking technology typically produces round indentations on a parts surface with a
pneumatically or electromechanically driven stylus, otherwise known as a pin. Critical to the readability
of dot-peen marked symbols are the indented dots shape, size, and spacing. The dot size and appearance
are determined mostly by the stylus cone angle, marking force, and material hardness. The indented dot
created should be suitable to trap or reflect light and large enough to be distinguishable from the parts
surface roughness. It should also have spacing wide enough to accommodate varying module sizes,
placement, and illumination.
The issues involved in marking and reading dot-peen-marked symbols on metals are different than
symbols printed on paper. The first fundamental difference is that the contrast between dark and light
fields is created by artificial illumination of the symbol. Therefore, the modules shape, size, spacing, and
part surface finish can all affect symbol readability.
The key to a successful dot-peen marking and reading project is to tightly control the variables affecting
the consistency of the process. Symbol reading verification systems can provide feedback of the process
parameters to some extent. Marking system operating and maintenance procedures must be established to
help ensure consistent symbol quality. Regular maintenance schedules should be established to check for
issues such as stylus wear.
Additional processes, like machining dedicated surfaces, may be necessary to improve the symbol
readability. Cleaning the part surfaces prior to marking with an abrasive pad to remove coatings, rust, and
discoloration, or using an air knife to blow away excess machining fluids, debris, or oil can also increase
the symbol quality.
2x2 3X3
The greatest advantage to single-dot module marking is faster mark cycle time. Single-dot module
marking may reduce marking time by more than 75 percent in some cases.
Another mark geometry factor that can affect code readability is off-center marks resulting from
fluctuations in throw force, stylus play, stylus deflections, or similar conditions such as drag. To some
extent, these can be compensated for by decoding software.
Limitations of Dot-Peen
Conditions that may affect the use of dot-peen marking are the following:
Thin materials whose structural integrity might be compromised by a mark
Parts not held firmly in place during the marking process
Figure 11. Cross Sections of Material Marked with Various Stylus Cone Angles
Incoming Light
Reflected Light
60
60
30 Angle
45
75
Stylus Cartridge
Stylus
Stylus cartridge to
stylus tip distance 0.05-
inch to 0.5-inch in the
retracted state
= .0056Markin
Depth g Surface
Stylus tip to target
distance 0.050-inch to
0.5-inch
0.022 Mark
Dia.
0.0046 Depth
Machine Parameters
It is important to control marking system parameters.
The following situations can lead to reading failure: improper setup, lack of maintenance on stylus
drive air pressure, stylus stroke, and stylus return pressure (or in the case of spring stylus return
systems, spring fatigue).
Along with marking system parameters, the following elements can cause variations in module size,
shape and placement: marking head fixtures, part fixtures, machine settings and operator error.
It is recommended that marking and reading systems be incorporated into automatic stations
whenever possible or that dedicated fixtures be used for aligning the part to the marking head. With
all machine setup parameters, auxiliary equipment can be added to provide greater control of operator
variables on the factory floor.
Fixed-mount single or multiple stylus markers are preferred. Handheld markers are acceptable but
must be clamped to the surface to prevent unwanted movement during the marking operations.
Machine setup operations must be checked to ensure that the stylus is positioned at a 90-degree angle
(perpendicular) to the marking surface. Stylus projection from the stylus nose guide should not
exceed 0.5-inches in the retracted state to prevent deflection upon impact and its resulting
oscillations. See Figure 12.
Because dot-peening produces a low contrast mark, successful reading could be improved by the
application of colored backfill media or by using a lighting solution that produces artificial contrast.
When selecting the location for the symbol, illumination of the mark must be taken into consideration. If
the symbol is recessed or adjacent to a protruding surface, lighting becomes more difficult.
Figures 14 and 15 illustrate a properly applied and illuminated dot-peen mark. The lighting setup used
with the fixed station reader must be forgiving enough to compensate for normal production variation in
surface roughness and stylus wear.
Figure 14. Data Matrix Dot-Peen Marking with and without Proper Illumination
Figure 15. QR Code Dot-Peen Marking with and without Proper Illumination
When considering a laser marking system, the following factors should be taken into consideration:
Different materials absorb or reflect specific laser wavelengths at different rates. The amount of
absorption is directly proportional to the lasers ability to heat the material and cause a change in its
appearance. The type of lasing medium will determine a lasers light wavelength. Laser marking systems
typically derive their name from their lasing medium. For example, CO2 lasers use carbon dioxide gas as
a medium.
Wavelength
Laser Type
(nm)
Nd:Yag (neodymium: yttrium-aluminum
1064
garnet)
CO2 gas (carbon dioxide) 10,600
Nd:YVO4 (neodymium: yttrium-vanadate) 1060
Nd:Yag Green (frequency doubled
532
neodymium: yttrium-aluminum garnet)
Solid-State Lasers
The solid-state laser medium is a crystal or glass which has an impurity (the lasing material) distributed
(doped) throughout its solid matrix There are a variety of beam generation techniques, but all solid-state
lasers require a high intensity light source in a reflective chamber to drive light energy into the crystal to
excite the molecules. The light source can be pulsed or operated in the continuous wave (CW) mode.
Examples of this type of laser would be the Nd:YAG and the Nd:YVO4 lasers.
Semiconductor Lasers
Sometimes called direct diode lasers, these are not to be confused with solid-state lasers. These are
electronic devices and are generally very small and emit very low power. They may be built into larger
arrays; however, as of this writing output power has been limited to fewer than 20 watts.
Gas Lasers
As the name implies, gas lasers rely on a reactant gas contained in some form of enclosure or tube and are
often pumped or induced to laser by passing an electric discharge through the gas medium itself. Excimer
and CO2 lasers are examples of gas lasers.
Excimer lasers are a notable exception to the name-implies-the-lasingmedium nomenclature rule of
gas lasers. The excimer name is derived from combining and shortening the terms excited and
dimmers. Excimer uses reactive gases, such as chlorine and fluorine, mixed with inert gases such as
argon, krypton, or xenon combined in a sealed tube. When electrically stimulated, a pseudo molecule
(dimmer) is produced. The dimmer produces laser light in the ultraviolet range.
CO2 laser manufacturers can use several different approaches to gas handling and electrical power
input:
Sealed Tube/Waveguide
Slow-axial flow
Diffusion cooled/waveguide
Fast-axial flow (FAF)
Laser marking system manufacturers are required by the CDRH to certify compliance with whichever
class of safety the laser system has been manufactured in compliance with. The two most common types
of laser safety rating used for laser marking devices are Class I and Class IV. Class I laser safety is the
most safe and Class IV is the least safe.
Class I laser systems require laser beam shielding to prevent injury from contact with the laser beam. This
is normally accomplished by conducting the laser marking process in what is sometimes call a light
tight box. Beam shield boxes can be designed for install directly into production lines or can be made for
manual loading and unloading. These boxes will have interlock safety devices to prevent the laser from
Class IV laser marking systems are the least safe and may not block against accidental contact with the
laser beam. The laser light wavelengths used for laser marking systems (except for some green
wavelength lasers) are not visible to the human eye, so you cannot see a laser beam when it is present to
avoid accidental contact. The power level of lasers used for laser marking is strong enough to easily burn
a persons skin. The hazard of most concern is damage that could occur from a laser beam striking a
person in the eye, which could cause permanent blindness.
Companies that produce laser marking systems are required to create safety-reporting documents and
submit them to the CDRH for approval on all new and/or modified laser marking systems. Once approved
for a specific classification of laser safety, the CDRH will assign that particular laser system an Ascension
Number. If a laser is manufactured by one company but integrated by another company, then the
integration company becomes responsible for laser safety and is considered the system manufacturer. The
integration company would be required to file with the CDRH for a new Ascension Number for each
different system configuration they install. Caution should be taken when selecting a laser system
integration company since many standard equipment integrators may not have experience in laser safety
requirements.
This process uses heat created by a laser beam to remove material through vaporization. Marks produced
by this method may have limited contrast from non-marked areas since the mark color and background
color are normally the same and contrast is created by depth shadows or a difference in surface finish.
Higher power laser systems and longer marking cycle times may be required depending on the material of
the items being marked and mark depth requirements, etc. Lasers can also be used to remove coatings
from items to produce a mark. Many times metal items are coated to protect them so using a laser to
remove a coating may cause the item to rust in marked areas. Many paints and other coatings will burn off
where contacted by high-power marking lasers.
Laser Annealing
Heat created by a laser beam can be used to perform very controlled heat-treating. In this case metal parts
containing carbon are affected by the lasers heat, which will produce a mark due to a localized
metallurgical change by carbon migration. Metals containing higher concentrations of carbon can produce
a darker mark easier than metals containing less carbon, which may produce a lighter brown mark. Marks
created with this method will not necessarily be raised or depressed but instead be flush or smooth with
the rest of the items surface. Mark depth will depend upon the materials carbon content and laser
energy/heat applied for a given time period.
Area of Mark
Metal Substrate
Some lasers can be used to discolor or bleach the color out of certain items and coatings. This process can
also be used to mark some plastics. In plastic marking, a laser can cause the plastic to burn/char, foam, or
bubble, causing contrast with the original color of the part.
Marked Surface
Surface Coating
Chemicals can be added in small amounts to some plastics that will react by changing color when
contacted with a laser. Special coatings can also be applied to the surface of an item that will fuse to the
item when heated by a laser. This also allows for the marking of many different kinds of materials while
needing only one type of laser.
Bonded/Fused Material
Substrate
Galvanometer or beam steered laser marking systems are most common for in-production-line use and are
normally driven by computer-controlled mirrors that move the beam by reflecting it to a specific location.
Figure 21depicts the laser beam emanating from the laser medium chamber, which by hitting one mirror
that draws in one direction then hitting another mirror that draws in the other direction, the beam finally
travels through a focusing lens onto the item to produce a mark. Galvanometer steered systems are much
faster than flying optic systems.
Flying optics, as shown below in Figure 22, work much like a plotter. These laser marking systems are
controlled by belt-or gear-driven motors that move fixed mounted mirrors along x and y coordinates.
Sensors
Both of the symbologies recommended here are matrix-type 2D barcodes. Reading them requires the
simultaneous capture of the symbol, usually accomplished via an image capture device such as Charged-
Coupled Device (CCD) or Complementary Metal Oxide Semiconductor (CMOS) sensors.
CCD/CMOS sensors generate an image map of what they see. This is typically referred to as the captured
image. This captured image is then transferred to the processor memory in order for its algorithms to
generate the information.
Optics
Because the sensor will capture an image, an optical system capable of projecting the symbol image into
the sensor is required. Typically this is done by placing optics in the path between symbol and sensor.
The selection of these optics is specific to the application (whether hand-held or fixed).
Illumination
Because these sensors are passive (as opposed to laser sensors, which provide their own illumination),
illumination must be provided. In most cases, the marking method and reading condition will dictate the
type of illumination used. The two major types of illumination are termed Bright Field and Dark Field.
While some marking methods self-generate contrast (e.g., laser marking may generate dark modules and
inkjet may have a specific ink color), methods such as dot-peening are not color specific. Instead, the
mark will assume a color based on the illumination.
Bright field illumination is usually located close to the image capture sensor and produces an image in
which the background is bright (or light), with the marked modules taking a dark color. Dark Field is its
opposite. The lighting is generated very close to the surface, at extremely low angles, generating an image
that displays light modules on a dark background.
As with other methods of marking, readers can have difficulty reading symbols that are placed near
obstructions that can block illumination. Additional illumination and filters can be used to increase code
contrast. Consequently, when considering mark locations, an engineering evaluation must be conducted
Intensity of the light source must be high enough to easily create a contrast of the module relative to the
part surface and also to overcome the effects of changing ambient light conditions. The illumination
source must be diffused lighting to avoid hot spots (glare areas) on the part surface. Florescent lights are
an excellent source of diffused light. Light sources such as light-emitting diodes (LEDs) with a diffusing
filter can also be used. Red light sources are often used instead of white to reduce glare on shiny parts. A
red light filter can also be placed on the camera system to allow in only red light.
Processing Unit
Once an image of a marked symbol is acquired, this information is provided to a processor. Herein lies
one of the major differences between reading and verifying. Whereas readers are primarily interested
in extracting the information from the symbol, verifiers are designed to quantify a number of quality
factors related to the symbol. For that reason, readers are free to implement the most advanced decoding
algorithms that a respective manufacturer can devise, whereas verifiers must implement a reference
decode algorithm specified by international agreement. For this reason, ISO 15415 was developed.
Note that beyond these standardized metrics, manufacturers are free to expand their offerings to include
tools further tailored to specific marking methods.
International Standards specify a numeric basis for expressing quality grades on a descending scale from
4 to 0, with 4 representing the highest quality. However, in application standards with an historical link to
ANSI X3.182, individual parameter grades and individual scan grades may also be expressed on an
equivalent alphabetic scale from A to F, with A representing the highest grade.
The overall symbol grade shall be the arithmetic mean of the scan grades for all images. If any two scans
of the same symbol yield different decoded data, then the overall symbol grade, irrespective of individual
scan grades, shall be 0. Overall symbol grades shall be expressed to one decimal place on a numeric scale
ranging in descending order of quality from 4.0 to 0.0.
4 (A) Passes SC 0.70 See ISO 15415 AN < 0,06 GN < 0.38 MOD 0.50 UEC 0.62
3 (B) SC 0.55 specification or AN < 0,08 GN < 0.50 MOD 0.40 UEC 0.50
Annex A for
2 (C) SC 0.40 grade AN < 0,10 GN < 0.63 MOD 0.30 UEC 0.37
1 (D) SC 0.20 thresholds. AN < 0,12 GN < 0.75 MOD 0.20 UEC 0.25
0 (F) Fails SC < 0.20 AN < 0,12 GN > 0.75 MOD < 0.20 UEC < 0.25
A symbol grade is only meaningful if it is reported in conjunction with the illumination and aperture used.
It should be shown in the format grade/aperture/light/angle. For more information, refer to ISO 15415.
Decode
The decode parameter tests, on a pass/fail basis, whether the symbol has all of its features sufficiently
correct to be readable. If the image cannot be decoded using the symbology reference decode algorithm,
then it shall receive the failing grade 0 (F). Otherwise, it shall receive the grade 4 (A).
Symbol Contrast
Symbol Contrast tests that the two reflective states in the symbol, namely light and dark, are sufficiently
distinct within the symbol for the processing algorithm to be effective. Manipulation of the light source
can be considered to create or enhance code contrast. Like all parameters (but decode), it is a graded
parameter, depending on the level of contrast in the symbol. Specific grading levels go from 4 (optimal)
to 0 (insufficient contrast).
Modulation
Modulation is a measure of the uniformity of reflectance of the dark and light modules. Factors such as
print growth (or loss), spatial misplacement of a module relative to the grid intersection, optical
Axial Non-Uniformity
2D symbols include data fields of modules nominally lying in a regular polygonal grid, and the decode
algorithm must adaptively map the center positions of those modules to extract the data. Axial non-
uniformity is the measure of how much the finder pattern spacing differs from one axis to another. It
measures and grades the spacing of the mapping centers in the direction of each of the grids major axes.
If too much deviation from the normal is encountered, uneven scaling of the symbol could hinder
readability at some non-normal viewing angles.
Grid Non-Uniformity
Grid Non-uniformity measures and grades the largest vector deviation of the grid intersections. Where
Axial Non-uniformity dealt with the parallelograms axis, Grid Non-uniformity measures the degree of
deviation of the individual modules from a theoretical grid. A symbol where the modules are correctly
spaced along the spatial rows and columns will have a higher probability of correctly identifying its
respective module value (and thus will receive a higher grade). A symbol where the modules have
bunched, or whose modules are off the nominal, will receive a lower score.
Code Geometry
In DPM, Data Matrix and QR Codes can consist of either square or round modules. Square modules are
easy to understand. When marking square modules, the application closely resembles traditional label
applications. Marking guidelines (as noted in Section 7.2) should adhere to ISO 15415 Symbol Quality
metrics.
Round modules require a better understanding of the geometry of the mark. Round modules integral to
DPM, because they simplify the marking process by marking 2D symbols with individual modules
generated by a single pulse, strike, or drop from the marking device. (There are no square waves in
nature.) As shown in Figure 24, we are trying to fill a square with a circle.
A B
Option A appears at first to be a better solution since it makes sure we mark the intended module.
However, we must keep in mind that the modules not marked (i.e., the spaces) contain just as much
information as those marked (exactly one bit). Figure 25 shows us what happens when all the modules
around a space are thus over-marked. If the eight neighboring marks are over-marked by 10 percent, the
area of the space (X vs. Y) they surround is now reduced to 64 percent of its original intended size. If
they over-marked by 20 percent, the area of the space is reduced to 36 percent of its intended size. Either
may result in the decoder misinterpreting the intended space as a mark.
X Y
Option B in Figure 24 has its own costs. A circle inside a square (where length l is equal to diameter
d) represents 80 percent of the area of the original. Because the adjacent modules are now generated
from touching circumferences, the solid borders on the Data Matrix symbol (as well as the finder
pattern boxes in QR) may not be apparent to some decoders more used to reading labels. In fact, gaps
may be misconstrued to be finder pattern damage errors. ISO 15415 allows for the effect of these gaps
to be minimized by using the 0.8X electronic filter option when calculating the level of border damage.
Round module diameter shall be equal to the intended square dimension, with an allowance for module
size tolerance of 10 percent. Note that for all codes with individual module size smaller than 0.010"
modules, the module placement accuracy and module size become much more critical. Precise module
alignment along the horizontal and vertical alignment bars is preferred. In addition, various factors,
including jerky motion on the part as it is marked, can result in a symbol being skewed or stretched in a
non-linear fashion.
As stated above, it is ideal for modules to be touching but not significantly overlapping or under-lapping.
For this reason, in most DPM applications a small, unmarked space (or gap) between cells is preferred to
significant overlapping.
Precise module alignment along the horizontal and vertical alignment bars is preferred. Under-printing the
module size is not desired either. In addition, various factors, including jerky motion on the part as it is
marked, can result in a symbol being skewed or stretched in a non-linear fashion as shown in Figure 26.
Data Matrix and QR codes should be perpendicular within seven degrees but this is not currently a
gradable measurement. Figure 27 illustrates modules exceeding size and/or placement tolerances, which
forces a reading devices decoding software to seek out and use redundant data (error correction)
embedded in other portions of the symbol. Since the position of the off center modules in relation to the
redundant data cannot be predetermined, limits on the maximum number of off-center modules cannot be
defined. Information related to off center and over/under-printed modules and used overhead can be
obtained by symbol verification software.
F
B
C
8.0 REFERENCES
AIAG B-4 Parts Identification and Tracking Application Standard
AIAG B-8 Quality Assurance for Shipping Labels and Other Bar Code Applications
AIAG B-14 Guideline for Use of Two-Dimensional Symbols with AIAG Trading Partner Labels
ISO/IEC CD 15415 Information technology Automated Identification and Data Capture Techniques- Bar
Code Symbol Print Quality Test Specification - Two-Dimensional Symbols Dated 2002-08-21.
NASA-STD-6002 July 2, 2001 Applying Data Matrix Identification Symbols on Aerospace Parts
NASA-HDBK-6003 July 2, 2001 Application of Data Matrix Identification Symbols to Aerospace Parts Using
Direct Part Marking Methods/Techniques
Air Transport Association SPEC 2000 Integrated Data Processing Materials Management Revision 2000.1
(8th Revision) Chapter 9-6
SAE AS9132 Data Matrix (2D) Coding Quality Requirements for Parts Marking
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