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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN5400, SN54LS00, SN54S00
SN7400, SN74LS00, SN74S00
SDLS025C DECEMBER 1983 REVISED NOVEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ......................................... 8
2 Applications ........................................................... 1 8.3 Feature Description................................................... 8
3 Description ............................................................. 1 8.4 Device Functional Modes......................................... 8
4 Revision History..................................................... 2 9 Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
5 Pin Configuration and Functions ......................... 3
9.2 Typical Application .................................................... 9
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4 10 Power Supply Recommendations ..................... 10
6.2 ESD Ratings: SN74LS00 .......................................... 4 11 Layout................................................................... 11
6.3 Recommended Operating Conditions....................... 4 11.1 Layout Guidelines ................................................. 11
6.4 Thermal Information .................................................. 5 11.2 Layout Example .................................................... 11
6.5 Electrical Characteristics: SNx400 ............................ 5 12 Device and Documentation Support ................. 12
6.6 Electrical Characteristics: SNx4LS00 ....................... 5 12.1 Documentation Support ........................................ 12
6.7 Electrical Characteristics: SNx4S00 ......................... 5 12.2 Related Links ........................................................ 12
6.8 Switching Characteristics: SNx400 ........................... 6 12.3 Receiving Notification of Documentation Updates 12
6.9 Switching Characteristics: SNx4LS00....................... 6 12.4 Community Resources.......................................... 12
6.10 Switching Characteristics: SNx4S00....................... 6 12.5 Trademarks ........................................................... 12
6.11 Typical Characteristics ............................................ 6 12.6 Electrostatic Discharge Caution ............................ 12
7 Parameter Measurement Information .................. 7 12.7 Glossary ................................................................ 12
8 Detailed Description .............................................. 8 13 Mechanical, Packaging, and Orderable
8.1 Overview ................................................................... 8
Information ........................................................... 13
4 Revision History
Changes from Revision B (October 2003) to Revision C Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Changed Ordering Information table to Device Comparison Table; see Package Option Addendum at the end of the
data sheet ............................................................................................................................................................................... 1
Changed Package thermal impedance, RJA, values in Thermal Information table From: 86C/W To: 90.9C/W (D),
From: 96C/W To: 102.8C/W (DB), From: 80C/W To: 54.8C/W (N), and From: 76C/W To: 89.7C/W (NS)................... 5
1A 1 8 VCC
1A 1 14 VCC
1B 2 7 2B
1B 2 13 4A
1Y 3 6 2A
1Y 3 12 4B
GND 4 5 2Y
2A 4 11 4Y
2B 5 10 3A Not to scale
2Y 6 9 3B
SN54xx00 FK Package
GND 7 8 3Y 20-Pin LCCC
Top View
VCC
NC
Not to scale
1B
1A
4B
SN5400 W Package
20
19
14-Pin CFP
Top View
1Y 4 18 4A
NC 5 17 NC
1A 1 14 4Y
2A 6 16 4Y
1B 2 13 4B
NC 7 15 NC
1Y 3 12 4A
2B 8 14 3B
VCC 4 11 GND
10
12
13
11
2Y 5 10 3B
9
2A 6 9 3A
Not to scale
2Y
GND
NC
3Y
3A
2B 7 8 3Y
Not to scale
Pin Functions
PIN
CDIP, CFP, SOIC, SO CFP I/O DESCRIPTION
NAME LCCC
PDIP, SO, SSOP (SN74xx00) (SN5400)
1A 1 1 1 2 I Gate 1 input
1B 2 2 2 3 I Gate 1 input
1Y 3 3 3 4 O Gate 1 output
2A 4 6 6 6 I Gate 2 input
2B 5 7 7 8 I Gate 2 input
2Y 6 5 5 9 O Gate 2 output
3A 10 9 13 I Gate 3 input
3B 9 10 14 I Gate 3 input
3Y 8 8 12 O Gate 3 output
4A 13 12 18 I Gate 4 input
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VCC (2) 7 V
SNx400 and SNxS400 5.5
Input voltage V
SNx4LS00 7
Junction temperature, TJ 150 C
Storage temperature, Tstg 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltage values are with respect to network ground terminal.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as 2000 V may actually have higher performance. Tested
on SN74LS00N package.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
14
12
TPHL (ns)
10
3V
High-Level Timing
Pulse 1.5 V 1.5 V Input 1.5 V
0V
tw th
tsu
3V
Low-Level 1.5 V 1.5 V Data
1.5 V 1.5 V
Pulse Input
0V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE DURATIONS SETUP AND HOLD TIMES
Output 3V
Control
(low-level 1.5 V 1.5 V
3V
Input 1.5 V 1.5 V enabling) 0V
0V tPZL tPLZ
tPLH tPHL
Waveform 1 1.5 V
In-Phase VOH (see Notes C 1.5 V
Output 1.5 V 1.5 V and D) VOL + 0.5 V
(see Note D) VOL
VOL
tPZH tPHZ
tPHL tPLH
VOH
Out-of-Phase VOH Waveform 2 VOH 0.5 V
Output (see Notes C 1.5 V
1.5 V 1.5 V 1.5 V
(see Note D) and D)
VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
8 Detailed Description
8.1 Overview
The SNx4xx00 devices are quadruple, 2-input NAND gates which perform the Boolean function Y = A B or Y =
A + B in positive logic.
A
Y
B
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
A2
B2
Y2
C2
Figure 3. Typical Application Diagram
15
TPLH(ns)
10
0
1 2 3
Device D001
Figure 4. TPLH (Across Devices)
11 Layout
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 17-Mar-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
JM38510/00104BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
00104BCA
JM38510/00104BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
00104BDA
JM38510/07001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07001BCA
JM38510/07001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07001BDA
JM38510/30001B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30001B2A
JM38510/30001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30001BCA
JM38510/30001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30001BDA
JM38510/30001SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30001S
CA
JM38510/30001SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30001S
DA
M38510/00104BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
00104BCA
M38510/00104BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
00104BDA
M38510/07001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07001BCA
M38510/07001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07001BDA
M38510/30001B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30001B2A
M38510/30001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30001BCA
M38510/30001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30001BDA
M38510/30001SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30001S
CA
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
M38510/30001SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30001S
DA
SN5400J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN5400J
SN54LS00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS00J
SN54S00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S00J
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
SNJ5400W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ5400W
SNJ54LS00FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS00FK
SNJ54LS00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS00J
SNJ54LS00W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS00W
SNJ54S00FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S
00FK
SNJ54S00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S00J
SNJ54S00W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S00W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN5400, SN54LS00, SN54LS00-SP, SN54S00, SN7400, SN74LS00, SN74S00 :
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Mar-2016
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Mar-2016
Pack Materials-Page 2
MECHANICAL DATA
0,38
0,65 0,15 M
0,22
28 15
0,25
0,09
5,60 8,20
5,00 7,40
Gage Plane
1 14 0,25
A 08 0,95
0,55
Seating Plane
PINS **
14 16 20 24 28 30 38
DIM
4040065 /E 12/01
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