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Features Description
4A Source/Sink Drive Current The IXDD604/IXDF604/IXDI604/IXDN604 dual
Wide Operating Voltage Range: 4.5V to 35V high-speed gate drivers are especially well suited for
-40C to +125C Extended Operating Temperature driving the latest IXYS MOSFETs and IGBTs. Each of
Range the two outputs can source and sink 4A of current
Logic Input Withstands Negative Swing of up to 5V while producing voltage rise and fall times of less than
Outputs May be Connected in Parallel for Higher 10ns. The input of each driver is virtually immune to
Drive Current latch up, and proprietary circuitry eliminates cross
Matched Rise and Fall Times conduction and current shoot-through. Low
Low Propagation Delay Time propagation delay and fast, matched rise and fall times
Low, 10A Supply Current make the IXD_604 family ideal for high-frequency and
Low Output Impedance high-power applications.
Applications The IXDD604 is a dual non-inverting driver with an
Efficient Power MOSFET and IGBT Switching enable. The IXDN604 is a dual non-inverting driver,
Switch Mode Power Supplies the IXDI604 is a dual inverting driver, and the IXDF604
Motor Controls has one inverting driver and one non-inverting driver.
DC to DC Converters
Class-D Switching Amplifiers The IXD_604 family is available in a standard 8-pin
Pulse Transformer Driver DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an
exposed metal back (SI), and an 8-pin DFN (D2)
package.
Ordering Information
Logic Packing
Part Number Package Type Quantity
Configuration Method
IXDD604D2TR 8-Pin DFN Tape & Reel 2000
IXDD604PI ENA
8-Pin DIP Tube 50
IXDD604SI INA A OUTA
8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDD604SITR ENB
8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
B
IXDD604SIA INB OUTB
8-Pin SOIC Tube 100
IXDD604SIATR 8-Pin SOIC Tape & Reel 2000
IXDF604PI 8-Pin DIP Tube 50
IXDF604SI INA A OUTA 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDF604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDF604SIA INB B OUTB 8-Pin SOIC Tube 100
IXDF604SIATR 8-Pin SOIC Tape & Reel 2000
IXDI604PI 8-Pin DIP Tube 50
IXDI604SI INA A OUTA 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDI604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDI604SIA INB B OUTB 8-Pin SOIC Tube 100
IXDI604SIATR 8-Pin SOIC Tape & Reel 2000
IXDN604PI 8-Pin DIP Tube 50
IXDN604SI INA A OUTA 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDN604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDN604SIA INB B OUTB 8-Pin SOIC Tube 100
IXDN604SIATR 8-Pin SOIC Tape & Reel 2000
DS-IXD_604-R08 www.ixysic.com 1
INTEGRATED CIRCUITS DIVISION IXD_604
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: -40C < TA < +125C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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INTEGRATED CIRCUITS DIVISION IXD_604
1 Specifications
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
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INTEGRATED CIRCUITS DIVISION IXD_604
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INTEGRATED CIRCUITS DIVISION IXD_604
2 IXD_604 Performance
VIH VIH
INx INx
VIL VIL
toffdly tondly
tondly toffdly
90%
90%
OUTx OUTx
10%
10%
tf tr tr tf
+
VCC
INA OUTA
VCC
0.1F 10F -
INB Tektronix
OUTB
Current Probe
VCC CLOAD
6302
VIN
ENA
ENB Tektronix
GND CLOAD Current Probe
6302
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INTEGRATED CIRCUITS DIVISION IXD_604
VCC
ENA
INA
GND
OUTA
VCC
VCC
200k
VCC INB OUTB
ENB
INB
OUTB
GND
INA OUTA
0 1
1 0
INX ENX OUTX
INB OUTB
0 1 or open 0
0 0
1 1 or open 1
1 1
0 0 Z
1 0 Z
GND GND
VCC VCC
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INTEGRATED CIRCUITS DIVISION IXD_604
A&B Rise Times vs. Supply Voltage A&B Fall Times vs. Supply Voltage A&B Rise and Fall Times
(Input=0-5V, f=10kHz, TA=25C) (Input=0-5V, f=10kHz, TA=25C) vs. Temperature
120 120 (Input=0-5V, VCC=18V, CL=1nF)
10
100 100
9
tr
A&B Rise Time vs. Load Capacitance A&B Fall Time vs. Load Capacitance
at Various VCC Levels at Various VCC Levels
120 120
VCC=4.5V VCC=4.5V
100 100 VCC=8V
VCC=8V
VCC=12V VCC=12V
Rise Time (ns)
80 80 VCC=18V
VCC=18V
VCC=24V VCC=24V
60 60 VCC=35V
VCC=35V
40 40
20 20
0 0
0 2000 4000 6000 8000 10000 0 2000 4000 6000 8000 10000
Load Capacitance (pF) Load Capacitance (pF)
Propagation Delay vs. Supply Voltage Propagation Delay vs. Input Voltage
(VIN=0-5V, CL=1nF, f=1kHz) (VCC=15V, CL=1nF) Propagation Delay vs. Temperature
160 70 50
140
Propagation Delay (ns)
60 45
toffdly
120
40
100 50
35
80
toffdly 40
toffdly 30 tondly
60
30 25
40 tondly
tondly
20 20 20
0 5 10 15 20 25 30 35 2 4 6 8 10 12 -40 -20 0 20 40 60 80 100 120 140
Supply Voltage (V) Input Voltage (V) Temperature (C)
3.0 20
2.7 VENH
Enable Threshold (V)
18
Input Threshold (V)
2.8 VENL
16
2.5 2.6
Min VIH 14
2.4 12
2.3
2.2 10
VIH 8
2.1 2.0
Max VIL 6
1.8
1.9 VIL 4
1.6 2
1.7 1.4 0
-40 -20 0 20 40 60 80 100 120 140 0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35
Temperature (C) Supply Voltage (V) Supply Voltage (V)
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INTEGRATED CIRCUITS DIVISION IXD_604
Supply Current vs. Load Capacitance Supply Current vs. Load Capacitance Supply Current vs. Load Capacitance
Both Outputs Active Both Outputs Active Both Outputs Active
(VCC=35V) (VCC=18V) (VCC=12V)
1000 400 400
f=2MHz 350 f=1MHz 350
f=1MHz
f=500kHz f=2MHz
f=500kHz 300 f=100kHz 300
f=1MHz
100 f=100kHz f=50kHz f=500kHz
250 250
f=50kHz f=100kHz
f=10kHz 200 f=2MHz 200
f=50kHz
150 150
10
100 100
50 50
1 0 0
100 1000 10000 100 1000 10000 100 1000 10000
Load Capacitance (pF) Load Capacitance (pF) Load Capacitance (pF)
Supply Current vs. Load Capacitance Supply Current vs. Frequency Supply Current vs. Frequency
Both Outputs Active Both Outputs Active Both Outputs Active
(VCC=8V) (VCC=35V) (VCC=18V)
350 1000 1000
CL=10nF
300 CL=1nF
Supply Current (mA)
Supply Current (mA)
0 1 0.1
100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000
Load Capacitance (pF) Frequency (kHz) Frequency (kHz)
Supply Current vs. Frequency Supply Current vs. Frequency Quiescent Supply Current
Both Outputs Active Both Outputs Active vs. Temperature
(VCC=12V) (VCC=8V) (VCC=18V)
1000 1000 3.0
CL=10nF CL=10nF VIN=3.5V
CL=1nF CL=1nF 2.5 VIN=5V
Supply Current (mA)
Supply Current (mA)
100 100
Supply Current (mA)
1.2
8
Supply Current (mA)
-8
1.0
-6 6
0.8
0.6 -4 4
0.4
-2 2
0.2
0.0 0 0
-40 -20 0 20 40 60 80 100 120 140 0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35
Temperature (C) Supply Voltage (V) Supply Voltage (V)
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INTEGRATED CIRCUITS DIVISION IXD_604
4 4.0
3 3.0
2 2.0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (C) Temperature (C)
2.5 2.5
2.0 2.0
1.5 1.5
1.0 1.0
0.5 0.5
0.0 0.0
0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35
Supply Voltage (V) Supply Voltage (V)
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INTEGRATED CIRCUITS DIVISION IXD_604
5 Manufacturing Information
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
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INTEGRATED CIRCUITS DIVISION IXD_604
0.65
0.40 min
6.00 0.20 3.90 0.10 1.27 max
1.75
Pin 1 5.60
0.42 0.09
1.25 min
4.90 0.10
1.27
NOTES:
1.75 max
1. Complies with JEDEC Standard MS-012.
0.175 0.075 2. All dimensions are in millimeters.
3. Dimensions do not include mold flash or burrs
Pin 1
1.27 0.60
0.406 0.076 1.270 REF
(0.050) (0.024)
(0.016 0.003) (0.050)
1.346 0.076 Recommended PCB Land Pattern
4.928 0.254
(0.053 0.003)
(0.194 0.010)
2.540 0.254
(0.100 0.010)
Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for
carrying current.
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INTEGRATED CIRCUITS DIVISION IXD_604
330.2 DIA.
(13.00 DIA.)
Dimensions
User Direction of Feed mm
Embossed Carrier
(inches)
Embossment NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
0.813 0.102 mm
(0.032 0.004) (inches)
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INTEGRATED CIRCUITS DIVISION IXD_604
4.00 BSC
(0.157 BSC) 3.10
0.45
(0.018) (0.122)
0.10
(0.004) 2.60
0.74 / 0.83 1.20
(0.102)
(0.029 / 0.033) (0.047)
Top Cover
Tape Thickness
0.102 MAX. 5 MAX (0.05)
(0.004 MAX.)
5.50 0.05
(0.05)
B0=5.40 0.10
12.00 0.30
Specification: DS-IXD_604-R08
Copyright 2016, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
8/18/2016
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