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PCM2900B
PCM2902B
Burr-Brown Audio
www.ti.com ........................................................................................................................................................................................... SLES229 DECEMBER 2008
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 SpAct is a trademark of Texas Instruments.
3 System Two, Audio Precision are trademarks of Audio Precision, Inc.
4 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
PCM2900B Not Recommended For New Designs
PCM2902B
SLES229 DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) TEST0 and TEST1 apply to the PCM2900B; DIN and DOUT apply to the PCM2902B.
ELECTRICAL CHARACTERISTICS
All specifications at TA = +25C, VBUS = 5 V, fS = 44.1 kHz, fIN = 1 kHz, and 16-bit data, unless otherwise noted.
PCM2900B, PCM2902B
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DIGITAL INPUT/OUTPUT
Host interface Apply USB Revision 2.0, full speed
Audio data format USB isochronous data format
INPUT LOGIC
D+, D 2 3.3
XTI, HID0, HID1,
High-level input 2.52 3.3
VIH and HID2 VDC
voltage
SEL0, SEL1 2 5.25
DIN (PCM2902B) 2.52 5.25
D+, D 0.8
XTI, HID0, HID1,
Low-level input 0.9
VIL and HID2 VDC
voltage
SEL0, SEL1 0.8
DIN (PCM2902B) 0.9
D+, D, XTI, SEL0,
10
SEL1
High-level input
IIH HID0, HID1, and VIN = 3.3 V A
voltage 50 80
HID2
DIN (PCM2902B) 65 100
D+, D, XTI, SEL0,
10
SEL1
Low-level input
IIL HID0, HID1, and VIN = 0 V A
voltage 10
HID2
DIN (PCM2902B) 10
OUTPUT LOGIC
D+, D 2.8
High-level DOUT
VOH IOH = 4 mA 2.8 VDC
output voltage (PCM2902B)
SSPND IOH = 2 mA 2.8
D+, D 0.3
Low-level output DOUT
VOL IOL = 4 mA 0.5 VDC
voltage (PCM2902B)
SSPND IOL = 2 mA 0.5
CLOCK FREQUENCY
Input clock frequency, XTI 11.994 12 12.008 MHz
(1) fIN = 1 kHz, using a System Two audio measurement system by Audio Precision in the RMS mode with 20-kHz LPF, 400-Hz HPF in
calculation.
(2) Using external voltage regulator for VCCCI (as shown in Figure 36 and Figure 37, using with REG103xA-A).
(3) Using internal voltage regulator for VCCCI (as shown in Figure 38 and Figure 39).
(4) fOUT = 1 kHz, using a System Two audio measurement system by Audio Precision in the RMS mode with 20-kHz LPF, 400-Hz HPF.
(5) Under USB suspend state.
D+ 1 28 SSPND
D 2 27 VDDI
VBUS 3 26 DGND
DGNDU 4 25 TEST1
HID0 5 24 TEST0
HID1 6 23 VCCXI
HID2 7 22 AGNDX
PCM2900B
SEL0 8 21 XTI
SEL1 9 20 XTO
VCCCI 10 19 VCCP2I
AGNDC 11 18 AGNDP
VINL 12 17 VCCP1I
VINR 13 16 VOUTL
VCOM 14 15 VOUTR
D+ 1 28 SSPND
D 2 27 VDDI
VBUS 3 26 DGND
DGNDU 4 25 DOUT
HID0 5 24 DIN
HID1 6 23 VCCXI
HID2 7 22 AGNDX
PCM2902B
SEL0 8 21 XTI
SEL1 9 20 XTO
VCCCI 10 19 VCCP2I
AGNDC 11 18 AGNDP
VINL 12 17 VCCP1I
VINR 13 16 VOUTL
VCOM 14 15 VOUTR
TEST0 Power
Manager SSPND
TEST1
VBUS
VINL
ISO-In
ADC FIFO
End-Point
VINR
USB SIE
D+
XCVR
Analog D
PLL
VCOM Selector Control
End-Point
Analog
PLL
SEL0
SEL1
VOUTL
ISO-Out
DAC FIFO
End-Point
VOUTR
HID0
HID
HID1
End-Point
HID2
USB
Protocol
Controller
96 MHz Tracker
PLL (8)
(SpAct)
XTI 12 MHz
XTO
B0238-01
Lock
Power
Manager SSPND
VINL
ISO-In
ADC FIFO
End-Point
VINR
USB SIE
D+
XCVR
Analog D
PLL
VCOM Selector Control
End-Point
Analog
PLL
SEL0
SEL1
VOUTL
ISO-Out
DAC FIFO
End-Point
VOUTR
HID0
HID
HID1
DOUT S/PDIF Encoder End-Point
HID2
USB
Protocol
Controller
96 MHz Tracker
PLL (8)
(SpAct)
XTI 12 MHz
XTO
B0239-01
4.7 mF 30 kW
VINR
+
13
(+)
+
+
()
VCOM Delta-Sigma
Modulator
14
+ (VCCCI/2)
10 mF
Reference
S0011-06
0.009
Dynamic Range
0.007
85
0.006
0.005
80
0.004
0.003 75
50 25 0 25 50 75 100 50 25 0 25 50 75 100
TA Free-Air Temperature C TA Free-Air Temperature C
G001 G002
Figure 1. Figure 2.
0.009
Dynamic Range
Dynamic Range and SNR dB
90
0.008
SNR
0.007
85
0.006
0.005
80
0.004
0.003 75
4.0 4.5 5.0 5.5 4.0 4.5 5.0 5.5
VBUS Supply Voltage V VBUS Supply Voltage V
G003 G004
Figure 3. Figure 4.
0.09
0.009
Dynamic Range
0.07
0.007
85
0.06
0.006
0.05
0.005
80
0.04
0.004
0.03
0.003 75
30 35 40 45 50 30 35 40 45 50
fS Sampling Frequency kHz fS Sampling Frequency kHz
G005 G006
Figure 5. Figure 6.
97
0.007 SNR
Dynamic Range and SNR dB
96
95
0.006
Dynamic Range
94
0.005
93
92
0.004
91
0.003 90
50 25 0 25 50 75 100 50 25 0 25 50 75 100
TA Free-Air Temperature C TA Free-Air Temperature C
G007 G008
Figure 7. Figure 8.
97
0.007 SNR
95
0.006
Dynamic Range
94
0.005
93
92
0.004
91
0.003 90
4.0 4.5 5.0 5.5 4.0 4.5 5.0 5.5
VBUS Supply Voltage V VBUS Supply Voltage V
G009 G010
97
SNR
0.007
Dynamic Range and SNR - dB
96
95
0.006
94
0.005
93
Dynamic Range
92
0.004
91
0.003 90
30 35 40 45 50 30 35 40 45 50
fS Sampling Frequency kHz fS - Sampling Frequency - kHz
G011 G012
Figure 11. Figure 12.
50 0.26
40 Suspend 0.24
30 0.22
20 0.20
4.00 4.25 4.50 4.75 5.00 5.25 5.50
VBUS Supply Voltage V
G013
Figure 13.
0.35
60
0.25
40
0.20
30
0.15
20 0.10
30 35 40 45 50 -40 -20 0 20 40 60 80 100
fS Sampling Frequency kHz TA - Free-Air Temperature - C
G014 G015
10
20
20
40
30
Amplitude dB
Amplitude dB
60
40
80 50
60
100
70
120
80
140
90
160 100
0 8 16 24 32 0.0 0.2 0.4 0.6 0.8 1.0
Frequency [y fS] Frequency [y fS]
G016 G017
0.0 4
Amplitude dB
Amplitude dB
0.2 8
0.4 12
0.6 16
0.8 20
0.0 0.1 0.2 0.3 0.4 0.5 0.46 0.48 0.50 0.52 0.54
Frequency [y fS] Frequency [y fS]
G018 G019
10
20 0.2
30
Amplitude dB
Amplitude dB
40 0.4
50
60 0.6
70
80 0.8
90
100 1.0
0.0 0.1 0.2 0.3 0.4 0 1 2 3 4
Frequency [y fS/1000] Frequency [y fS/1000]
G020 G021
Figure 20. Figure 21.
10 0.2
Amplitude dB
Amplitude dB
20 0.4
30 0.6
40 0.8
50 1.0
1 10 100 1k 10k 0.01 0.1 1 10 100
f Frequency kHz f Frequency kHz
G022 G023
10
20 0.0
30
Amplitude dB
Amplitude dB
40 0.2
50
60 0.4
70
80 0.6
90
100 0.8
0 1 2 3 4 0.0 0.1 0.2 0.3 0.4 0.5
Frequency [y fS] Frequency [y fS]
G024 G025
TRANSITION-BAND RESPONSE
0
6
Amplitude dB
10
12
14
16
18
20
0.46 0.47 0.48 0.49 0.50 0.51 0.52 0.53 0.54
Frequency [y fS]
G026
Figure 26.
10 0.0
Amplitude dB
Amplitude dB
20 0.2
30 0.4
40 0.6
50 0.8
0 8 16 24 32 0.0 0.1 0.2 0.3 0.4 0.5
Frequency [y fS] Frequency [y fS]
G027 G028
10 0.2
Amplitude dB
Amplitude dB
20 0.4
30 0.6
40 0.8
50 1.0
1 10 100 1k 10k 0.01 0.1 1 10 100
f Frequency kHz f Frequency kHz
G029 G030
DETAILED DESCRIPTION
USB INTERFACE
Control data and audio data are transferred to the PCM2900B/2902B via D+ (pin 1) and D (pin 2). All data
to/from the PCM2900B/2902B are transferred at full speed. The device descriptor contains the information
described in Table 3. The device descriptor can be modified on request; contact a Texas Instruments
representative for details.
The configuration descriptor contains the information described in Table 4. The configuration descriptor can be
modified on request; contact a Texas Instruments representative for details.
The string descriptor contains the information described in Table 5. The string descriptor can be modified on
request; contact a Texas Instruments representative for details.
DEVICE CONFIGURATION
Figure 31 illustrates the USB audio function topology. The PCM2900B/2902B has four interfaces. Each interface
consists of alternative settings.
End-Point #0
Default End-Point
FU
End-Point #2 Analog Out
(IF #1) IT OT
TID1 TID2
Audio Streaming Interface
UID3
End-Point #4 Analog In
(IF #2) OT IT
TID5 TID4
Audio Streaming Interface
End-Point #5
(IF #3)
HID Interface
PCM2900B/2902B
M0024-03
Interface #0
Interface #0 is defined as the control interface. Alternative setting #0 is the only possible setting for interface #0.
Alternative setting #0 describes the standard audio control interface. The audio control interface consists of a
single terminal. The PCM2900B/2902B has the following five terminals:
Input terminal (IT #1) for isochronous-out stream
Output terminal (OT #2) for audio analog output
Feature unit (FU #3) for DAC digital attenuator
Input terminal (IT #4) for audio analog input
Output terminal (OT #5) for isochronous-in stream
Input terminal #1 is defined as a USB stream (terminal type 0x0101). Input terminal #1 can accept two-channel
audio streams consisting of left and right channels. Output terminal #2 is defined as a speaker (terminal type
0x0301). Input terminal #4 is defined as a microphone (terminal type 0x0201). Output terminal #5 is defined as a
USB stream (terminal type 0x0101). Output terminal #5 can generate two-channel audio streams composed of
left and right channel data. Feature unit #3 supports the following sound control features:
Volume control
Mute control
The built-in digital volume controller can be manipulated by an audio class specific request from 0 dB to 64 dB
in 1-dB steps. Changes are made by incrementing or decrementing by one step (1 dB) for every 1/fS time interval
until the volume level has reached the requested value. Each channel can be set for different values. The master
volume control is not supported. A request to the master volume is stalled and ignored. The built-in digital mute
controller can be manipulated by an audio class specific request. A master mute control request is acceptable. A
request to an individual channel is stalled and ignored.
Interface #1
Interface #1 is the audio streaming data-out interface. Interface #1 has five alternative settings listed in Table 6.
Alternative setting #0 is the zero bandwidth setting. All other alternative settings are operational settings.
Interface #2
Interface #2 is the audio streaming data-in interface. Interface #2 has the 19 alternative settings listed in Table 7.
Alternative setting #0 is the zero bandwidth setting. All other alternative settings are operational settings.
Interface #3
Interface #3 is the interrupt data-in interface. Alternative setting #0 is the only possible setting for interface #3.
Interface #3 consists of the HID consumer control device and reports the status of these three key parameters:
Mute (0xE209)
Volume up (0xE909)
Volume down (0xEA09)
End-Points
The PCM2900B/2902B has the following four end-points:
Control end-point (EP #0)
Isochronous-out audio data stream end-point (EP #2)
Isochronous-in audio data stream end-point (EP #4)
HID end-point (EP #5)
The control end-point is a default end-point. The control end-point is used to control all functions of the
PCM2900B/2902B by a standard USB request and an USB audio class specific request from the host. The
isochronous-out audio data stream end-point is an audio sink end-point, which receives the PCM audio data. The
isochronous-out audio data stream end-point accepts the adaptive transfer mode. The isochronous-in audio data
stream end-point is an audio source end-point, which transmits the PCM audio data. The isochronous-in audio
data stream end-point uses asynchronous transfer mode. The HID end-point is an interrupt-in end-point. HID
end-point reports HID0, HID1, and HID2 pin status every 32 ms.
The human interface device (HID) pins are defined as consumer control devices. The HID function is designed
as an independent end-point from both isochronous-in and -out end-points. Therefore, the result obtained from
the HID operation depends on the host software. Typically, the HID function is used as the primary audio-out
device.
INTERFACE SEQUENCE
0V
st nd
Bus Reset Set Configuration 1 Audio Data 2 Audio Data
Bus Idle
D+/D
SOF SOF SOF
SSPND
VOUTL BPZ
VOUTR
VBUS (Pin 3)
D+/D
SOF SOF SOF SOF SOF
VOUTL
VOUTR
1 ms Detach
T0056-02
Record Sequence
The PCM2900B/2902B starts the audio capture into the internal memory after receiving the SET_INTERFACE
command, as shown in Figure 34.
Audio Data Audio Data Audio Data
SET_INTERFACE IN Token IN Token IN Token
D+/D
SOF SOF SOF SOF SOF
VINL
VINR
1 ms T0259-01
SSPND
APPLICATION INFORMATION
1.5 kW 3 1.5 kW
PCM2900B
22 W
D+ 1 D+ SSPND 28
22 W C3
D 2 D VDDI 27
2.2 W
VBUS 3 VBUS DGND 26
1 mF
GND 4 DGNDU TEST1 25
5 HID0 TEST0 24
C4
6 HID1 VCCXI 23
7 HID2 AGNDX 22
IC1 1 MW C5
8 SEL0 XTI 21
IN OUT GND ADJ EN
C6
1 2 3 4 5 3.6 V 9 SEL1 XTO 20
3.85 V 12 MHz
10 VCCCI VCCP2I 19 MUTE/
C13 D1 + C7
Power
11 AGNDC AGNDP 18 Down
C9 C1
C8
12 VINL VCCP1I 17
+ 27 kW 13 kW
C10 C11 LPF,
13 VINR VOUTL 16 +
+ Amp
C2 C12
VCOM VOUTR +
14 15
+
LPF,
Amp
S0264-03
1.5 kW 3 1.5 kW
PCM2902B
22 W
D+ 1 D+ SSPND 28
22 W C3
D 2 D VDDI 27
2.2 W
VBUS 3 VBUS DGND 26
1 mF
GND 4 DGNDU DOUT 25
5 HID0 DIN 24
C4
6 HID1 VCCXI 23
7 HID2 AGNDX 22
IC1 1 MW C5
8 SEL0 XTI 21
IN OUT GND ADJ EN
C6
1 2 3 4 5 3.6 V 9 SEL1 XTO 20
3.85 V 12 MHz
10 VCCCI VCCP2I 19 MUTE/
C13 D1 + C7
Power
11 AGNDC AGNDP 18 Down
C9 C1
C8
12 VINL VCCP1I 17
+ 27 kW 13 kW
C10 C11 LPF,
13 VINR VOUTL 16 +
+ Amp
C2 C12
VCOM VOUTR +
14 15
+
LPF,
Amp
S0264-04
1.5 kW 4
PCM2900B
22 W
D+ 1 D+ SSPND 28
22 W C3
D 2 D VDDI 27
2.2 W
VBUS 3 VBUS DGND 26
1 mF
GND 4 DGNDU TEST1 25
5 HID0 TEST0 24
C4
6 HID1 VCCXI 23
7 HID2 AGNDX 22
1 MW C5
8 SEL0 XTI 21
C6
9 SEL1 XTO 20
C1 12 MHz C7
10 VCCCI VCCP2I 19 MUTE/
+
Power
11 AGNDC AGNDP 18 Down
C9 C8
12 VINL VCCP1I 17
+
C10 C11 LPF,
13 VINR VOUTL 16 +
+ Amp
C2 C12
VCOM VOUTR +
14 15
+
LPF,
Amp
S0265-03
1.5 kW 4
PCM2902B
22 W
D+ 1 D+ SSPND 28
22 W C3
D 2 D VDDI 27
2.2 W
VBUS 3 VBUS DGND 26
1 mF
GND 4 DGNDU DOUT 25
5 HID0 DIN 24
C4
6 HID1 VCCXI 23
7 HID2 AGNDX 22
1 MW C5
8 SEL0 XTI 21
C6
9 SEL1 XTO 20
C1 12 MHz C7
10 VCCCI VCCP2I 19 MUTE/
+
Power
11 AGNDC AGNDP 18 Down
C9 C8
12 VINL VCCP1I 17
+
C10 C11 LPF,
13 VINR VOUTL 16 +
+ Amp
C2 C12
VCOM VOUTR +
14 15
+
LPF,
Amp
S0265-04
OPERATING ENVIRONMENT
For current information on the PCM2900B/2902B operating environment, see the Updated Operating
Environments for PCM270X, PCM290X Applications application report, SLAA374.
www.ti.com 11-Apr-2013
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Top-Side Markings Samples
(1) Drawing Qty (2) (3) (4)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
MECHANICAL DATA
0,38
0,65 0,15 M
0,22
28 15
0,25
0,09
5,60 8,20
5,00 7,40
Gage Plane
1 14 0,25
A 08 0,95
0,55
Seating Plane
PINS **
14 16 20 24 28 30 38
DIM
4040065 /E 12/01
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2014, Texas Instruments Incorporated