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Electromagnetic Immunity
Conducted measurements
Ing. Fernando Hernndez
Inductive coils
Widely used in embedded electronics
Very similar to EM wave in Automotive
(DC-150MHz)
Ex.: BCI in CAN Bus
CAN: Control Area
Network
DUT
Microcontroler
Voltage
Voltage&¤ts
IC pins currents
This method has good correlation with direct radiated RF immunity test
results, especially at lower frequencies.
BCI, Hardware Test Set Up
Limit the RF power injected
Fault
Obs.: between 10 to 500 KHz the insertion loss of the probe (eg. 20 db/dec),
should be taken into account.
BCI Test Set up (Ex)
A set of probes capable of operating over the test freq range is required to
couple the test equipment to the DUT measurement probe, or
Set of probes capable of operating over the specified test freq range shall be
terminated with the load impedance having the same value as used during
the calibration
Simplified diagram IC test set up
Power reflected by the DUT should not be reflected to the DUT again by an
impedance discontinuity somewhere else in the power injection set-up.
Test set-up
Test circuit board:
Strongly recommended: Use of a PCB with common RF ground
plane for immunity testing of ICs.
The DUT should be placed on the test board without sockets because most
sockets have significant inductance that will affect the test (for instance
10nH @ 1 GHz=>XL= 63 )
It is the main purpose of this standard to test the immunity of the DUT
only. Therefore, all external protection components of the DUT shall be
removed unless it is absolutely mandatory to have these external
components to achieve proper function on the IC (blocking capacitors,
timer capacitors, etc.).
Such mandatory blocking shall be placed directly at the IC and be
regarded as if it would be part of it. They shall be grounded on the same
ground plane. Return paths from mandatory blocking components to the
DUT or the shield of a transmission line should not have slits.
Example of the routing from the
injection port to a pin of the DUT
For cases where it is not possible to follow these rules the used power
injection set-up shall be characterized and documented in the Test
Report.
Hints for the best installation (I)
Basic approach: is to carry the RF to be injected as close to the DUT as
possible without leaving the 50 transmission line system.
Coax-cable connector placed on the board Using a shield box placing the connector as close as
nearby the DUT possible to the DUT (optional series resistor may be
added)
Hints for the best installation (II)
Basic approach: is to carry the RF to be injected as close to the DUT as possible
without leaving the 50 transmission line system.
Example of a S21
magnitude
measurement result
(1st resonance above 1
GHz)
Decoupling networks
1. To supply the DUT at the pin that is submitted to the RF and to measure
DC performance of the DUT while RF is applied a DC biasing network
shall be used.
2. Other functional or aux signals should be connected via decoupling
networks
Characteristics:
Impedance 400 @ test freq. DC resistance depends on the
requirements of the application (may be a single Resistor)
The DC biasing network may also be connected to the injection path
offside the PCB
To minimize the effect of mismatching: path < /20 fmax (e.g. < 15 mm for
1 GHz)
Layout example:
Example of a decoupling
network for an input with high
impedance
DC biasing and probing networks (IV)
Mechanical
drawing Stain-less steel
1 mm
IEC-61000-4-6