Maave Electronics Pvt Limited

WORK INSTRUCTIONS No.: WI / PROD / 1/08

Prepared By:
PRODUCTION Rev. No.: 1 Page
ASSEMBLY OF PCB's, CABLES, Approved By:
& SYSTEMS
Date: 18/06/2008 1 of 6

1.0 PURPOSE:

To follow the systematic procedure in assembly section for handling of assembling activities at

Various stages.

2.0 ACTIVITIES TO BE PERFORMED:

a. Collection of material from assembly supervisor.

b. Assembling of PCB's, Systems.

c. Wiring of Systems.

d. Making of cable assemblies.

e. Cleaning of Assembled PCB's.

f. Inspection.

3.0 INPUTS:

a. Workmanship standards.

b. Assembly procedures, assembly drawings, cable assembly drawings, wiring drawings.

c. Material like components, connectors, bare PCB's.

d. Tested PCB's, Systems.

e. Process Cards.

f. Tools.

4.0 OUTPUTS:

a. Assembled PCB's.

b. Wired Systems.

c. Cable Assemblies.

MEF 057 /1/ 08

 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.: WI / PROD / 1/ 08

PRODUCTION Prepared By: Rev. No.: 1 Page

ASSEMBLY OF PCB's, CABLES, Approved By: Date: 18/06/2008 2 of 6
& SYSTEMS
5.0 INSTRUCTIONS:

5.1 PCB's ASSEMBLY:-

a. Collect all items and documents (like part list, assembly drawings and assembly procedures) from

assembly supervisor.

b. Verify all received components item wise as per the parts list, If any shortages are noticed bring it to

the knowledge of assembly supervisor.

c. Refer the list of ESD sensitive components and separate them. Solder these items on ESD work

station only.

d. Don’t mix all varieties of components and keep them item wise separately with labels.

e. Keep all the required tools and respective documents, ready to start assembly activity and ensure the

soldering iron TIP is in proper condition.

g. Use tinning bath for tinning, and clean the leads with cotton waste after tinning.

h. Do the bending for necessary leaded components either by nose pliers or bend - cut machine (if

available) as per the pitch provided on PCB's.

i. Verify the received PCB's for serial numbers before start soldering. If the serial numbers are not

available bring it to the knowledge of your supervisor.

j. Read the assembly procedure, take the component one by one as per parts list and start mounting
j
them on PCB as per assembly drawing.

k. Mount the components on PCB in a sequence as specified in assembly procedure and solder the

components.

l. On completion of assembly, take all ESD sensitive devices and semi-assembled PCB's to ESD

workstation.

MEF 057 /1/ 08

 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.:WI / PROD / 1/ 08

PRODUCTION Prepared By: Rev. No.: 1 Page

ASSEMBLY OF PCB's, CABLES, Approved By: Date: 18/06/2008 3 of 6
& SYSTEMS

m. Now put on the ESD wrist strap, mount the components as per parts list / assembly drawing/assembly
procedure and solder all the points.
n. Remove / cut the excess length of component leads.
o. Always keep all the assembled and semi-assembled cards in separate card trays.
p. Verify and ensure whether any of the components are missed on completion of assembly.
q. Always use the card trays when carrying the PCB's for cleaning.
r. On completion of assembly, clean the PCB's with ISOPROPYL ALCOHOL (IPA) as per cleaning
Procedure at the site located out side the shop floor.

s. Inspect the solder points of all assembled PCB's after completion of cleaning. Touch-up the points

and remove the excess lead/ clear the blow holes where ever necessary. Take the cotton waste,

dip into isopropyl alcohol(IPA) and clean the reworked area.

t. If any hardware items (like clamps, ejectors, heat sinks or wound coils) are to be fixed, send them to

mechanical assembly and collect the same on completion.

u. Collect the process cards ("ASSEMBLED PCB" process cards) from assembly supervisor and fill all
the respective columns.
v. Write down the circuit reference and quantity of the shortage items if any on process card at remarks
column. Whenever the shortage items were assembled, sign on process card and write down as
"Shortages assembled".
w. Sign with date on process card and tie it to the respective PCB assembly. Hand over all assemblies
to assembly supervisor for sending them to the QAD for inspection.

x. Collect the inspection completed cards from assembly supervisor and see the QC remarks (Non -
Conformances) on process cards.
y. Attend all QAD remarks one by one, clean the reworked area and hand over to the assembly

supervisor to re-offer to QAD for inspection.

MEF 057 /1/ 08

 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.:WI / PROD / 1/ 08

PRODUCTION Prepared By: Rev. No.: 1 Page

ASSEMBLY OF PCB's, CABLES, Approved By:
& SYSTEMS
Date: 18/06/2008 4 of 6

z. If any non-conformances like components with erased markings, damages, missing of legend, leads

solderability, inserting, mounting problems e.t.c. are noticed during assembly bring it to the

knowledge of assembly supervisor.

5.2 ASSEMBLY OF CABLE ASSEMBLIES:-

a. Collect the necessary cables, connectors and cable assembly drawings from assembly supervisor.

b. Understand the cable assembly drawing / wiring drawings and get clarifications from assembly
supervisor if necessary.

c. Make the cable bundles / sleeves into pieces as per the dimensions given in cable assembly drawings.

d. Remove sleeves at the ends of cables / wires as per the assembly drawing.

e. Do the scraping and twist the conductor leads. Apply the flux and tin the conductor leads.

f. Take the sleeve piece as per the size given in drawing and Insert to the wire, which is going to be

soldered.

g. Take cable/ wire, sleeve pieces, connectors which are made ready and assemble them as per the
cable assembly drawing.

h. Pull the sleeves till it covers the entire solder joint.

i. Bunch the cables / wires as per the cable assembly drawing. Fix the dust covers to the connectors
wherever as shown in drawing.

j. Use appropriate crimping tool for the crimping type connectors. For each crimping type connector

separate crimping tool may be used (Ex. FRC, Telephone, RELIMATE, UNICON etc.. connectors).

k. After completion of assembly, do the markings on connectors if necessary. Test them with multimeter

or using test jigs (if available).

MEF 057 /1/ 08

 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.:WI / PROD / 1/ 08
Prepared By:
PRODUCTION Rev. No.: 1 Page
ASSEMBLY OF PCB's, CABLES, Approved By:
& SYSTEMS
Date: 18/06/2008 5 of 6

l. Sign with date on process card and tie it to the respective cable assembly. Hand over all cable

assemblies to assembly supervisor for sending them to the QAD for inspection.

5.3 WIRING OF SYSTEMS:

a. Collect the tested PCBs from the assembly supervisor and apply the protector /conformal coating

on solder side of the tested PCB's.

b. Collect all the necessary wires / cable assemblies, which are made ready as per the cable assembly

instructions (para: 5.2) and respective wiring drawings from assembly supervisor.

c. Do the wiring of assembled system with cable assemblies as per the respective sub -

assembly wiring drawings. Use the sleeves where ever necessary.

d. After completion of systems wiring, inform to the assembly supervisor for necessary action.

e. Sign with date on process card (SYSTEM) and tie it to the respective assembly and hand

over to the assembly supervisor.

5.4 WIRING OF SYSTEMS:

a. Collect all the necessary wires / cable assemblies, which are made ready as per the cable assembly

instructions (para: 5.2) and respective wiring drawings from assembly supervisor.

b. Do the wiring of assembled systems with cable assemblies as per the respective chassis / internal

wiring drawings and use the sleeves where ever necessary.

c. Verify all the connections once after completion of wiring and inform to the assembly supervisor.

d. Sign with date on process card (SYSTEM) and tie it to the respective assembly and inform

to the assembly supervisor.

MEF 057 /1/ 08

 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.: WI / PROD / 1/ 08
Prepared By:
PRODUCTION Rev. No.: 1 Page
ASSEMBLY OF PCB's, CABLES, Approved By:
& SYSTEMS
Date: 18/06/2008 6 of 6
6.0 PRECAUTIONS:
a. The body of the component should not touch the molten lead while using the tinning bath for tinning.

b. Care must be taken while bending the leads of the leaded components.

c. Don’t pour the components on worktable, keep them always in plastic bags / bins.

d. Don’t take out the ESD sensitive devices from anti static bags / strips with out care.

e. Use always ESD station with wrist strap put on while soldering ESD sensitive devices.

f. Follow the ESD sensitive device handling instructions while assembling and handling the ESD

Sensitive devices.

g. Don’t drop any of the components especially crystals, IC's .

h. Don’t mix or interchange the material with neighbors,which is issued by assembly supervisor. As

there is the possibility of changing the batch numbers and it will not match with the traceability

records.

i. Use rated wattage soldering iron only as mentioned in assembly procedure.

j. Avoid falling of lead, wire, sleeve pieces inside the systems while doing the internal

wiring, take out if any immediately.

k. Don’t keep the soldering irons in side the systems while doing the wiring.
l. Use always stands to keep the soldering irons.
m. Bring all non-conformances to the knowledge of assembly supervisor.
n. Avoid over writings on process cards and counter sign if any.
o. Plug out the soldering irons on completion of work / before leaving.
p. Collect all the cut leads /wire pieces which are lying on table and drop them in dustbins when
leaving.
7.0 RESPONSIBILITIES:
It is the responsibility of the technicians/operators of assembly section (production department) to

follow these work instructions.

MEF 057 /1/ 08