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DerrickDean
UniversityofAlabamaatBirmingham
Agenda
Briefoverviewofpolymers
DSCBasics
Applications
Meltingtransitions,Tm
Theglasstransition,Tg
ThermalStability
ModulatedDSC,MDSC
VariationsinDSC
2
ThermalAnalysisUsefulFor
QualityControl
Characterization
Processing
EndUseApplication
MostCommonlyUsed
ThermalAnalysisTechniques
Technique ParameterMeasured
DifferentialScanning dH/dT
Calorimetry(DSC)
Thermogravimetry (TGA) Mass
Derivative Thermogravimetry dM/dT
(DTGA)
Thermomechanical Analysis Deformation,Volumeor Length
(TMA)
(Dilatometry;Penetration)
DynamicMechanical Modulus/Damping
Analysis(DMA)
DielectricAnalysis (DEA) Permitivity/LossFactor
Major Polymer Transitions
TwoMainTransitionsin
ThermoplasticPolymers
GlassTransition,Tg
Indicatesminimum/maximumservice
temperature
Veryimportantinamorphouspolymers
Meltingtemperature,Tm
Definesminimumprocessingandmaximum
servicetemperature
TransitionsandRelaxations
WhyImportant?
Rangeatwhichpropertieschange
Modulus
Brittleness
Impactstrength
Wear
Permeability
Thermalconductivity
Strength
Dielectricconstant
Stressstrainproperties
Electricalconductivity
TransitionsandRelaxations
Ifweexaminepolymerpropertieswithrespect
totemperatureand/orfrequency
wefindthatthereisarangeoverwhichthe
LogE
propertieschange(eg.,SillyPutty)
Log
LogE
Athighfrequenciesnomotion>unrelaxed
Atlowfrequenciesitflows>relaxed
IfTischangedinsteadof,
T
samefeaturesresult.
Relaxation significantsharporsteepchangeinpropertiesinarelatively
narrowtemperatureorfrequencyrange.
TransitionsandRelaxations
Relaxation significantsharporsteepchangeinpropertiesinarelatively
narrowtemperatureorfrequencyrange.
Canberelatedtovarioustypesofpolymer
motion: - CH2 - CH -
CH3
-
1. Sidechainrotation(PP,PMMAorPS) CH3
- CH2 - CH -
- CH2 - C -
2. SmallsegmentsasinPE: C=O
CH3
3. Longersegments(2030carbonatoms,asat
Tg)
TransitionsandRelaxations
Transition adiscontinuouschangeinthermodynamicproperties
ofamaterial.
Includeschangesofstate:
Crystallinetoamorphous Tm
Crystalline1tocrystalline2 polymorphism
Amorphoustoglass Tg
Atatransitiontherewillbeadiscontinuouschangeinthermodynamic
properties,whichcanbeobservedtodefinethetransitiontemperature.
Specificvolume
Heatcapacity
Specificheat(Enthalpy)
TransitionsandRelaxations
1st OrderTransition Transitionforwhich 2nd OrderTransition Transitionforwhichthe
thefirstorderderivativeoffreeenergyisa secondorderderivativeoffreeenergyisa
thermodynamicfunctionthatis thermodynamicfunctionthatisdiscontinuous
discontinuouswhenplottedvs. whenplottedvs.temperature.
temperature.
Cp
Tm isafirstorder
v transition
T
Tg isasecondorder
transition
T
Tg isasecondorder
V transition
T
T
TransitionsandRelaxations
ChangeisgreatestatTm andTg,andlesssoat
lowertemperaturerelaxations.
ManypolymersbecomebrittlebelowTg nomeansto
absorbenergyofimpact(PS,PMMA)
Someremainductile(PC,PET),becauseofalarge
secondaryrelaxationatT<Tgwhichcanabsorbenergy
andbecomebrittleatmuchlowerT,belowthe
secondaryrelaxation.
RelativeSensitivityofThermal
AnalysisInstruments
14
PopularityofDSC
Technique
Speedofoperation
Easeofoperation
Smallsamplesize
InformationObtainedfrom
DSC
GlassTransitiontemperatures
Meltingpointsandboilingpoints
Crystallizationtimeandtemperature
Percentcrystallinity
Heatsoffusionandreaction
Specificheat
Oxidativestability
Rateofcure
Degreeofcure
Reactionkinetics
Purity
Thermalstability
TypesofDSC
HeatFlux PowerCompensation
Sameheatflowsintobothsamples;T=0. WhenaTisdetected,anadditionalcircuit
Whenachangeoccurs(endoorexo)aT willincreaseordecreaseheatingpowerOf
signalisgeneratedwhichisproportionalto samplefurnace.Thiscompensatingheating
theheatflowdifference. power,P,isproportionaltoheatabsorbed
orreleased.
DSCHeatFlow
dH dT
Cp f (T, t)
dt dt
f (T, t) Heat flow that is function of time
dT
Heating Rate at an absolute temperature (kinetic)
dt
18
TypicalDSCOutput:
TransitionsofInterestinaDSC
Oxidation
or
HeatFlow>exothermic
Decomposition
Melting
Glass
Transition CrossLinking
Crystallization (Cure)
Temperature
DSCSignals
DSCmeasuresthedifferenceinheatflowrate
(mW =mJ/sec)betweenasampleandinert
referenceasafunctionoftimeandtemperature
HeatFlow
Endothermic:heatflowsinto thesampleasaresult
ofeitherheatcapacity(heating)orsome
endothermicprocess(Tg,melting,evaporation,etc.)
Exothermic:heatflowsoutof thesampleasaresult
ofeitherheatcapacity(cooling)orsomeexothermic
process(crystallization,cure,oxidation,etc.)
DSC: Terminology
Amorphous Phase - The portion of material whose molecules are randomly oriented in space.
Liquids and glassy or rubbery solids. Thermosets and some thermoplastics.
Crystalline Phase - The portion of material whose molecules are regularly arranged into well
defined structures consisting of repeat units. Very few polymers are 100% crystalline.
Semi-crystalline Polymers - Polymers whose solid phases are partially amorphous and partially
Melting - The endothermic transition upon heating from a crystalline solid to the liquid state. This
process is also called fusion. The melt is another term for the polymer liquid phase.
Crystallization - The exothermic transition upon cooling from liquid to crystalline solid.
to the crystalline state. This only occurs in semi-crystalline polymers that have been quenched
(very rapidly cooled from the melt) into a highly amorphous state.
Enthalpy of Melting/Crystallization - The heat energy required for melting or released upon
crystallization. This is calculated by integrating the area of the DSC peak on a time basis.
21
PhysicalOriginsofPeaksinDSC
Endothermic Exothermic
CrystallineTransition X X
Fusion X
Crystallization X
Vaporization X
Sublimation X
Adsorption X
Desorption X
GlassTransition BaselineChange, Nopeaks
LiquidCrystaltransition X
Physical Aging X
ChemicalOriginofPeaksinDSC
Endothermic Exothermic
Chemisorption X
Dehydration X
Decomposition X X
Oxidative X
Degradation
Oxidation in X
Gaseous
Atmosphere
Adsorption X
SolidStatereaction X X
Combustion X
Polymerization X
Curing X
SampleSize
5to15mgforthermoplasticsorelastomers
MightnobeabletodetermineTGofhighly
crosslinkedsample
Melting/Crystallizing
Lessthan10mg
Heatofreaction
Assmallascanbeaccuratelymeasured
Composites:Dependsonfillerloading
GeneralExperimental
Setup
Calbration:ASTME967,E968,D3417,D3418
Sameheatingrateasexperiment
Sameatmosphereandpurgeflowrates(50cc/min)
Sametemperaturerangeasexperiment
Pan:
Flatbottom
Goodsampletopancontact
Inerttoreactivesamples
Reference:
Samepanassample,butitshouldbeempty
PanCellContact:
Symmetricplacementofreferenceandsample
ReportingDSCData
ASTME472,D3418
Identificationofallsubstancesandtheirsources
Detailsofmaterialhistories,pretreatments,purities,
etc.
Calibrationprocedures,temperatures,cellconstants
used.
Detailsofanypreconditioning
Temperatureprogram
MethodfordetrminingTg,Tm
Instrumentused
Tm and Crystallinity Measurement by
Differential Scanning Calorimetry, DSC
% Xtallinity =Hexp/Ho
Where Hexp is Heat of fusion for the polymer
0.0
-0.2
236.86C
Heat Flow (W/g)
48.50J/g
-0.4
-0.6
-0.8
250.61C
-1.0
160 180 200 220 240 260 280 300
Exo Up Temperature (C) Universal V3.8B TA Instruments
MeltingandCrystallization
Meltingistheendothermictransitionfroma
crystallinesolidtoaliquidamorphousstate
Crystallizationistheexothermictransition
fromamorphoustocrystalline(normallyfrom
liquidtosolidduringcooling)
ColdCrystallizationistheexothermic
transitionduringheatingfromasolid
amorphousstatetoasolidcrystallinestate.
TypicalDSCOutput:
TransitionsofInterestinaDSC
Oxidation
or
HeatFlow>exothermic
Decomposition
Melting
Glass
Transition CrossLinking
Crystallization (Cure)
Temperature
MeasurementofMelting
0.0
ExtrapolatedOnset
-0.2
&IntegratedArea
242.65C
-77.27J/g
-0.4
221.83C
271.52C
End
Heat Flow (W/g)
-0.6
Start
-0.8
12.28C
Width@
Halfheight
-1.0
-1.2 Peak&
256.26C
Height
-0.8930W/g
-1.4
160 180 200 220 240 260 280 300 320 340
Exo Up Temperature (C)
MeasurementofMelting
0.0
-0.2
242.65C
-77.27J/g
-0.4
Heat Flow (W/g)
-0.6
-0.8
-1.0
-1.2
256.26C
-1.4
160 180 200 220 240 260 280 300 320 340
Exo Up Temperature (C)
DSCMelting
Polymers
Thepeaktemperatureisthemeltpoint
Betweentheextrapolatedonsetandthepeak,crystalperfection
maybeoccurring
Betweenthepeakandtheendthesampleisfinishedmelting
andreturningtotheDSCtemperature
Pure,lowmolecularweightmaterials
(mw<500g/mol)(smallmolecules)
Theextrapolatedonsetisthemeltingtemperature
Allofthecrystalsaremeltedatthepeak
Betweenthepeakandtheendthesampleisfinishedmelting
andreturningtotheDSCtemperature
Tm isaffectedby:
Mwt
ChemicalStructure
Additives
Candisruptpackingofserveasnucleating
sites
Effectofheating/coolingrate
Crystallizationkinetics
Effectsofpolymerstructure/composition
Effectsofthermal/mechanicalprocessing
Effect of Aromaticity on Melting
34
Effect of Branching on Melting
Polyolefin Branching Tm
PP regular ~ 150C
fixed lengths
35
Effect of Polymer Type on Melting
36
Effect of Molecular Weight on Melting
37
EffectofHydrogen
BondingonMelting
Polyamide Tm H Bonding
Nylon 12,2 236 Least
Nylon 10,2 242
Nylon 8,2 279
Nylon 6,2 326 Most
38
EffectofProcessingon
Crystallinity
Firstheatvs.secondheat
forPP
0.5
PP Pellet
PP Cup
PP Quenched from Melt
PP Slow Cooled
0.0 152.08C
77.88J/g
153.18C
95.98J/g
Heat Flow (W/g)
-0.5
167.94C
152.84C
91.62J/g
-1.0 150.18C
88.10J/g
166.25C
-1.5
168.21C
167.52C
-2.0
60 80 100 120 140 160 180 200
Exo Up Temperature (C) Universal V4.4A TA Instruments
ObservationofCrystallization
Crystallizationisatwostepprocess:
Nucleation
Growth
Theextrapolatedonsetisthenucleationtemperature
Thepeakmaximumisthecrystallizationtemperature
ObservationofCrystallization
1.0
Peak
0.9
160.65C
0.8
Heat Flow (W/g)
0.7
183.75C
14.68J/g
0.6
ExtrapolatedOnset
&IntegratedArea
0.5
0.4
0 50 100 150 200 250
Exo Up Temperature (C)
EffectofNucleatingAgents
2.0
0.0
1.0
-0.5
Heat Flow (W/g)
-1.0
melting
0.5
-1.5
60 80 100 120 140 160 180 200
Exo Up
Temperature (C)
0.0
40 50 60 70 80 90 100 110 120 130 140 150 160
Exo Up
Temperature (C)
DSC:Applications
Effectofheating/coolingrate
Crystallizationkinetics
Effectsofpolymerstructure/composition
Effectsofthermal/mechanicalprocessing
43
DSC: Effect of Heating Rate on
Nylon 66 Melting Behavior
0.2 mW
0.5C/min Increased heating rate causes:
1 mW Can change appearance of
HEAT FLOW
2C/min curve
5 mW Can cause Tm increase and be
5 mW 10C/min less accurate
20C/min If heating rate is low, sample
10 mW
may anneal as it is tested.
50C/min
endo
1 2
240 260 280 3
300 4
Temperature (C)
44
EffectofSampleMass
DSC: Crystallization Kinetics
Twostepprocess
Nucleation
Crystalgrowth
Nucleationmaybe
Natural
Induced(usingnucleationagents)
Thermallyinfluencedprocess
Naturalnucleation
Crystalgrowth
ModeledbyIsothermalKineticsusingthe
AutocatalyticModel
46
DSC:
Isothermal Crystallization Procedure
Hold isothermally
47
DSC: Isothermal Crystallization of
Polyethylene Terephthalate
T1 T1<T2<T3<T4
T
T2
T3
T4
Blank run
0 1 2 3 4 5 6
Time (min)
48
Effect of Annealing
Poly(ethyletherketone) (PEEK) on Melting
0.0
PEEK
HeatFlow(W/g)
0.1
303.61C
PEEK annealed
0.2 @ 300C
0.3
260 280 300 320 340 360 380
49 Temperature(C)
EffectofDrawRatioonCrystallinityfor
HDPEFibers
6
HDPE 115%.001 HDPE 115%
HDPE 240.001 HDPE 240%
HDPE 700 HDPE 700%
104 J/g
4
Heat Flow (W/g)
120 J/g
160 J/g
-2
80 100 120 140 160
Exo Up Temperature (C) Universal V4.4A TA Instruments
50
Melting and Crystallization -
Summary
51
TheGlassTransition
Temperature,Tg
Observedinamorphousthermoplasticsbut
notallsemicrystallinethermoplastics
Observedinthermosets
Exceptions:
Extremelyhighcrosslinkdensities
Veryrigidbackbones
TheGlassTransition
TheGlassTransitionis1.)thereversiblechange
oftheamorphousregionofapolymerfrom,or
to,aviscousorrubberyconditionto,orfrom,a
hardandrelativelybrittleone.2.)onsetoflarge
scale,cooperativemotionofthepolymerchains.
TheGlassTransitionTemperatureisa
temperaturetakentorepresentthetemperature
range overwhichtheglasstransitiontakesplace
DetectedbyDSCasanincreaseinCp
Tg MeasurementbyDSC
Tg ofPMMA
Sample: PMMA sample File: J:...\MSE 430-Fall 2010\Team 2\PMMA.001
Size: 10.6500 mg DSC Operator: AH
Method: Ramp Run Date: 01-Oct-2010 12:51
Instrument: DSC Q100 V9.8 Build 296
-0.15
-0.20
Heat Flow (W/g)
-0.25
103.43C
-0.30
109.58C(H)
-0.35 115.78C
-0.40
40 60 80 100 120 140 160
Exo Up Temperature (C) Universal V4.4A TA Instruments
-0.15
MeasurementofTg
Extrapolated
Start
Onset
-0.20 53.49C
Midpoint&
88.27C Change
Heat Flow (W/g)
-0.25 93.01C(H)
0.04705W/g
98.33C
-0.30
125.49C
Extrapolated End
End
-0.35
20 40 60 80 100 120 140 160
Exo Up Temperature (C)
MeasurementofTg
-0.15
-0.20
Heat Flow (W/g)
-0.25
93.01C(H)
-0.30
-0.35
20 40 60 80 100 120 140 160
Exo Up Temperature (C)
SomePropertiesAffectedatTg
Anythingthateffectsthemobilityofthe
molecules,affectstheHeatCapacity,whichin
turnaffectstheTg
DSC:HeatingRate
59
EffectofHeating
RateontheTg
OptimizingMeasurementofTg
If Tg is hard to see:
Use larger sample weight
Use higher heating rate
Use MDSC
Factors that Affect the Tg
Molecular Weight
RedrawnfromthedataofT.G.FoxandP.J.Flory,
J.Appl.Phys.,1950,21,581
Effect of Molecular Weight
on the Tg (for Styrene Oligomers/Polymers)
Molecular Weight Tg
104 -138C
524 - 40C
2,210 40C
3,100 62C
15,100 86C
36,000 94C
170,000 100C
Turi, pg 249 Kumler, 1977
63
Bulky Substituents
- CH2 - CH2 -
Tg ~ 800C
Polyethylene
- CH2 - CH -
-
CH3 Tg ~ 100C
AtacticPolypropylene
- CH2 - CH -
Tg ~1000C
AtacticPolystyrene
Poly(methyl methacrylate)
CH3
- CH2 - C -
C=O
Flexible Substituents
O T ~1050C
g
CH3
Poly(ethyl methacrylate)
CH3
- CH2 - C -
C=O
O T ~650C
g
CH2 - CH3
Poly(butyl methacrylate) Poly(dodecyl methacrylate)
Poly(propyl methacrylate) Poly(octyl methacrylate)
CH3 CH3 CH3 CH3
- CH2 - C - - CH2 - C - - CH2 - C - - CH2 - C -
C=O C=O C=O C=O
O Tg ~350C O Tg ~200C O Tg ~200C O Tg ~650C
(CH2)2 - CH3 (CH2)3 - CH3 (CH2)7 - CH3 (CH2)11 - CH3
The Effect of Intermolecular
Interactions
- CH2 - CH -
Tg ~ 100C
-
CH3
AtacticPolypropylene
- CH2 - CH - Tg ~870C
-
Cl
PVC
EffectofHydrogenBonding
ontheTg
67
The Effect of Cross - Linking
The Effect of Crystallization
The Effect of Plasticizer on
Tg
0.4
Pure Polystyrene
10%
20%
30%
64.39C
0.2 67.19C(H)
Polymer + Solvent 70.04C
or Plasticizer 48.80C
Heat Flow (W/g)
52.85C(H) 56.83C
0.0 38.89C
45.26C(H)
51.72C
-0.2
103.45C
109.86C(H)
116.47C
-0.4
0 20 40 60 80 100 120 140 160
Exo Up Temperature (C) Universal V4.4A TA Instruments
The Effect of Plasticizer on
Tg
0.005
0.0 0.000
0.1
0.0 -0.005
-0.1
-0.015
-0.3 -0.006
0 20 40 60 80 100 120
0 20 40 60 80 100 120
Exo Up Temperature (C) Universal V4.4A TA Instruments
Exo Up Temperature (C) Universal V4.4A TA Instruments
Effect of Plasticizer on the Tg
forPolyamides
WaterContent(%) Tg(C)
0.35 94
0.70 84
1.17 71
1.99 56
2.70 45
4.48 40
6.61 23
10.33 6
72
Physical Aging--Relaxation and
Recovery
Thermallyreversible
SpecificVolume
InvolveschangesbelowTg
Melt
Associatedwithnonequilibrium
frommeltstate
Affectstheamorphousphaseonly
A Volumeandenthalpychangewith
time
Thechangeinenthalpywithtimeis
Glass
B Temperature calledrelaxationorphysicalaging
Tg
EffectofAgingontheGlass
Transition[M.Todoki,PolymerDataHandbook]
Cold Crystallization
Glass Transition
As-Spun
2 days
28 days
196 days
3 years and
2 months
4 years and
11 months
0 50 100 150
74 Temperature (C)
DSC:EffectofAgingTimeat95C
onShapeofPolystyreneTg
0. 00
Anneal Times = 0, 10, 100 & 1000 minutes
- 0. 05
Heat Fl ow ( W/ g)
- 0. 10
- 0. 15
- 0. 20
- 0. 25
80 90 100 110 120 130
75 Temper at ur e ( C)
PhysicalAging
Heating the material above the Tg then cooling it through the Tg at a rate
equal to or greater than the final heating rate reduces the relaxation effect.
PhysicalAging
EffectonMechanical
Properties
Generallossofductility
Modulusincreases
Yieldstrengthincreases
Impactstrength,elongation,
fractureenergydecrease
Effect of Miscible and Immiscible
Blends on Tg
Tg2
Tg1
Endotherm
Tgmixture
TwoPhase
SinglePhase
Temperature
CuringofThermosets
Crosslinking
ThermosettingPolymers
Curingreactioncanbefollowedby
monitoringawidevarietyofphysical
propertiesincluding:
Heatofreaction
Heatcapacity
Viscosity
Modulus
Others
DSCThermosetCure:FirstandSecondHeat
-0.04
Tg
-0.12 Residual Cure
102.64C
-0.16 Second Tg 20.38J/g
-0.20
-0.24
0 50 100 150 200 250 300
Temperature (C)
IsothermalCureofEpoxy
Resin
2.5 100
2.0
80
1.5
Temperature (C)
Heat Flow (W/g)
1.0 60
0.5
40
0.0
-0.5 20
0 5 10 15 20 25
Exo Up Time (min) Universal V4.4A TA Instruments
OxidativeInductionTime
Heat
flow Oxidative Induction Time
Time
MDSC Theory
Heat Flow Equation
dH dT
Cp f (T , t )
dt dt
86
Kinetic Heat Flow
Isothermal Temperature
constant temperature.
0 87 t1 t2
time
Standard DSC Measures the Sum of Heat Flow
88 Temperature
Heat Flow Can Be Separated
f(T,t)
Heat Flow
Temperature
89
General Theory of MDSC
90
Distribution of Transitions in
MDSC Experiments
92
Raw Signals in MDSC
Time
Modulated Temperature (Stimulus)
Modulated Heat Flow (Response)
93
MDSC Raw Signal
0.2
COLD CRYSTALLIZATION
8 MODULATED HEAT FLOW
(Response) CRYSTALLIZATION DURING MELTING
Deriv. Modulated Temp (C/min)
2
-0.4
230 230
CALCULATED AVERAGE
TEMPERATURE
210 210
200 200
38 39 40 41 42 43 44 45
Exo Up Time (min) Universal V2.5D TA Instruments
95
MDSC Signals: Total Heat Flow
The average value of the modulated heat flow signal. This signal
is qualitatively and quantitatively equivalent to the heat flow
signal from conventional DSC at the same average heating rate.
96
Total Heat Flow: Average of Modulated Heat
Flow Signal
0.2 0.2
0.1
Modulated Heat Flow (W/g)
-0.1
-0.2 -0.2
-0.3
-0.4 -0.4
50 100 150 200 250 300
Temperature (C)
97
MDSC Signals: Heat Capacity
AMHF
Cp xK
AMHR
Where:
AMHF = Amplitude of Modulated Heat Flow
AMHR = Amplitude of Modulated Heating Rate
K = Heat Capacity Calibration Factor
HFS HFMT
Cp K x 0
HFMT
Heat Rate x wt
HF
Where:
K = Calibration constant
endo HFS
HFS = Differential heat flow
with sample
Temp.
HFMT = Differential heat flow
with empty pans
wt = weight of sample
99
Alternative DSC Cp Measurement
HFHR2 HFHR1
Cp K x
(HR2 HR1) wt 0
HFHR1
Where:
HF
K = Calibration constant
HFHR1 = Differential heat flow of HFHR2
sample at HR1 endo
HFHR2 = Differential heat flow of
sample at HR2 Temp.
HR2 = Heating rate 2
HR1 = Heating rate 1
wt = weight
100 of sample
Deriv. Modulated Temp (C/min)
Heat Capacity from MDSC Raw Signals
0.6
Complex Cp (J/g/C)
HEAT CAPACITY
4
10
0.2
2
4
0 MODULATED HEATING RATE
-0.6
50 100 150 200 250 300
Temperature
101 (C)
MDSC Signals - Reversing Heat Flow
(Heat Capacity Component)
ReversingHeatFlowistheheatcapacitycomponentofthetotalheatflow.Itiscalculated
byconvertingthemeasuredheatcapacityintoaheatflowsignalusingtheclassicalheat
flowequationasatheoreticalbasis.
Reversing Heat Flow = Cp x Avg. Heat Rate
BasisforCalculation
dH dT
Where : Cp f (T, t)
dH dt dt
total heat flow
dt
Cp measured heat capacity
dT
average heating rate
dt
dT
Cp heat capacity component (Reversing )
dt
102
f (T, t) heat flow from kinetic process (Nonrevers ing)
Reversing Heat Flow from MDSC Raw Signals
8 0.15
4 0.05
HEAT CAPACITY
0 -0.05
-4 -0.15
-8 -0.25
50 100 150 200 250 300
103
Temperature (C)
Quench Cooled PET:
Total vs. Reversing Heat Flow
0.1 0.15
TOTAL
-0.1 -0.05
REVERSING
-0.2 -0.15
[
-0.3 -0.25
50 100 150 200 250 300
Temperature (C)
104
MDSC Signals - Nonreversing Heat Flow
(Kinetic Component)
0.25 0.25
NONREVERSING
0.05 0.0 0.05
TOTAL
-0.05 -0.1 -0.05
REVERSING
-0.25 -0.25
50 100 150 200 250 300
Temperature (C)
106
Glass Transition of Polymer Resin
107
MDSC: Glass Transition of Epoxy Coating
108
MDSC: Glass Transition of Epoxy Coating
109
PET/ABS Blend
Conventional DSC
-0.2 120.92C
67.38C first heat on molded part
70.262C (H)
235.36C
-0.3 22.63J/g
-0.4
Heat Flow (W/g)
111.82C
-0.5 9.016J/g
249.75C
-0.6
second heat after 10C/min cooling
(Curve shifted on Y axis to avoid overlap)
-0.7
9.22 mg sample, nitrogen purge
10C/minute heating rate
-0.8
50 100 150 200 250
110 Temperature (C)
PET/ABS - MDSC
67.00C
-0.13 +72.89C (H)
-0.05 -0.07
PET Tg
104.45C
107.25C (H)
-0.14 -0.06 -0.08
8.46mg sample ABS Tg
nitrogen purge
(
2C/minute heating rate, 1C amplitude, 60 second period
(
-0.15 -0.09
20 40 60 80 100 120 140 160 180 200
111 Temperature (C)
DSC of Polymer Blend
112
MDSC of Polymer Blend
113
MDSC: Detection of Two Glass
Transitions in PC/PEE Blend
3 CONSECUTIVE HEATING RUNS AFTER 2deg/min COOLING
+
2
-0.04
1 -0.002
DERIVATIVE
-0.06
-0.10 -0.004
-0.005
40 60 80 100 120 140 160
Temperature (C)
114
FAST MDSC ON THE Q1000
2.0 -0.15
1
2
1 First Heat 1
2
1
2 Second Heat 2
1.8 2
1
2
First Heat Shows Small MDSC Conditions: -0.20
[ ] Rev Cp (J/g/C)
Low Temperature Tg of
First Heat
1.0 -0.35
0 50 100 150 200 250
Exo Up Universal V3.1B TA Instruments
Temperature (C)
115
MDSC: Heat Capacity for PET During
Isothermal Steps
1.6 140
PLOT vs TIME
Heat Capacity
Heat Capacity (J/g/C)
120
Temperature (C)
1.4
100
Temperature
1.2
80
MDSC 0.30C, 40 sec. period
1C isothermal steps
1.0 60
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
116 Time (day)
MDSC: PET Heat Capacity
During GlassTransition &
Cold Crystallization
COLD CRYSTALLIZATION
1.6 (First-Order Transition)
Heat Capacity (J/g/C)
1.5
1.4
GLASS TRANSITION
(Second-Order Transition)
1.3
1.2
MDSC 0.30C, 40 sec. period
1C isothermal steps
1.1
6 14.5
H of Cure
DMA 1Hz 14.0
Nonrev. Heat Flow (mW)
4 13.5
) E' (GPa)
Heat 20
Capacity 13.0
2 10 12.5
(
Isothermal 80C 12.0
helium purge
0
0.5C amplltude
(
60 second period
0 11.5
0 5 10 15 20 25 30 35 40
118 Time (min)
MDSC: Heat Capacity vs. Cure Time
Result at 70C Cure=
TM
Epoxy-Amine System MDSC
) Nonreversing Heat Flow (mW/g)
120 2.5
t 1/2 Cp = 97 mi
1.5
30 Nonreversing Heat Flow
(
0 1.0
(
=
Thermochimica Acta, 268, 121-142 (1995), Dr. B. Van Mele, et al
119
at Vrije Universiteit Brussels (Belgium)
MDSC: Experimental Considerations
Calibration?
Phase Purge
Correction? Gas?
Sample
Preparation?
120
Modulation Amplitude?
ModulatedDSC
Isothermalapproach
Theapproachassumesthatthereactionfollows
autocatalyzed exothermicsystemsandobeysthegeneral
rateequation: d
k (T ) 1
m n
dt
whered/dt =reactionrate(1/sec)
=fractionalconversionk(T)=specificrateconstantat
temperatureT
Thisapproachrequiresthreeormoreisothermal
experimentstogeneratethekineticparameters:
Activationenergy(Ea),PreexponentialfactorZHeat
ofreaction(H),Reactionorder(n,m)Rateconstant
(k)
121
IsothermalDSCThermogramsat120Cfor
NeatresinandNanocomposites
0.08
1% F-MWCNT EPON 828
1% COOH-MWCNT EPON 828
Neat Epoxy
0.06
0.04
Heat Flow (W/g)
0.02
0.00
-0.02
-0.04
0 50 100 150 200 250
Exo Up Time (min) Universal V4.5A TA I
122
ActivationEnergiesandRateConstantfor
theNeatResinandNanocomposites
Rate constant
Average Ea
Sample min-1
(H) J/g kJ/mol
TIso120 C
1.0 % COOH-MWCNT/EPON
239.8 61.7 0.0390
828
123
IsothermalCureBehaviorofNeat
EpoxyResinandNanocompositesat
1.000E7
120C
Ne at Epoxy
1.000E6 1% F-MWCNT EPON828
1% COOH-M WCNT EPON828
1.000E5
10000
G' (Pa)
1000
100.0
10.00
1.000
0.1000
0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0 7000.0 8000.0
time (s)
124
Gelation,Vitrification andDegreeof
ConversionandoftheNeatResinand
Nanocomposites
Gel point
Degree of
time
Sample tvitr(min) Tg (C) Conversion
(min)
(%)
C
1.0 % COOH-
58 185 120 96
MWCNT/EPON 828
1.0 % F-MWCNT/EPON
78.5 160 119 96
828
125
HeatCapacity
185.11min
148.61min
1.8
158.94min
Rev Cp (J/(gC))
Neat Epoxy
1% COOH-MWCNT EPON828
1% F-MWCNT EPON828
1.4
0 50 100 150 200 250
Time (min) Universal V4.5A TA Instruments
CarbonNanotubeReactionSchemes
A)
F + H2N R NH2
HN
O O
R NH2
NH2 + H2C CH R CH CH2
NH
R
H OH O
N
R N CH CH2 R CH CH2
B) O O O
C OH + HC CH R CH CH2
2
O OH O
C O CH2 CH R CH CH2
127
MDSC: Sample Preparation
Thin,LowMassSamples
MinimizeThermalGradients
AllowforFasterPeriods,Larger
ModulationAmplitudes
Thicker,HeavierSamples
MinimizeBaselineCurvature
ImproveSensitivity
128
MDSC:SamplePansStandardCrimped
129
MDSC:SamplePansStandardHermetic
Useforliquid/volatilesamples
HigherMass,LessSensitivity
UseHeatSinkCompound
130
MDSC:PurgeGas
Nitrogen
Economical
Wide Operating Range
Provides Good Sensitivity
Helium
Higher Thermal Conductivity
Facilitates Wider Range of Modulation
Conditions
Reduces Baseline Curvature
131
MDSC: Purge Gas
Flow Rates
132
MDSC:HeatCapacityCalibration
ProvidesforAccurateHeatCapacity
Measurements
UseEitherSapphireDisc(widetemperature
range)orHDPE(polymermelt)
Chooseonepointoraveragevalues
EffectsofExperimentalConditions
133
VariationsinDSC
PressureDSC
PhotoDSC