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and Integration
Amit Lal, Program Manager
MTO/DARPA
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16. SECURITY CLASSIFICATION OF: 17. LIMITATION OF 18. NUMBER 19a. NAME OF
ABSTRACT OF PAGES RESPONSIBLE PERSON
a. REPORT b. ABSTRACT c. THIS PAGE
UU 21
unclassified unclassified unclassified
NEMS-CMOS: Meshing
of transistors and relays
2 Amit Lal, DARPA-MTO
Two views of MEMS
MEMS for
everyone/everything?
MEMS is like
Spanish moss on
the IC industry
tree
http://www.mems-exchange.org
3 Amit Lal, DARPA-MTO
MEMS for Microsystems
Insect MEMS
CSAC
Temex RMO
Vol: 230 cm3 Symmetricom CSAC Integration of
Power: 10 W Vol: 7.8 cm3 Alkali-metal
Acc: 11011 Power: 95 mW
vapor on chip for
Stab: 51011/100s atomic sensors
Contact Detail
Miniaturization/Integration SWAP
Scaling for higher performance
Multiphysics
Gate
Biological interfaces
100 m
Gateways to nanoscale effects Universal MEMS
RF-MEMS Environmental control over sensors and package-HERMIT
switch actuators
Navigation grade
Gyroscope
0.8 cm
Embedded MEMS
- HERMIT
4 NEMS - switch
Amit Lal, DARPA-MTO
Radant Demonstrates
>900 Billion Switch Cycles
PM: Amit Lal, HERMIT
MEMS: Wins Frost & Sullivan Excellence in
Undeniable Reliability Technology Award
New /
Composite Frame
Modified
(Graphite / Epoxy)
HW/SW
2
0.4 m Azimuth Scanning
MEMS RadantTM Lens
MEMS TM
MEMSInsertion
Insertioninto
intothe
theRadant
RadantTM
Lens
LensArchitecture
ArchitecturehashasBeen
Been
Demonstrated
Demonstrated
This
This Antennaisisthe
Antenna theFirst
FirstLarge
LargeScale
Scale
Use of MEMS Switches in the World
Use of MEMS Switches in the World
5 Amit Lal, DARPA-MTO 30 degree scan 0.4m2 ESA
Hybrid-Insect MEMS
VISION
Create technology to reliably
integrate microsystems payloads
on insects to enable insect
cyborgs
OBJECTIVES
Develop technology to enable highly coupled electro
mechanical interfaces to insect anatomy
Demonstrate MEMS platforms for electronic locomotion
control, power harvesting from insect, and eliminate
extraneous biological functions
6 Amit Lal, DARPA-MTO
Background: Insect
Metamorphosis
Storage of energy over weeks to use later for flight
1st instar 2nd instar 3rd instar 4th instar 5th instar
DARPA Program :
Use object
insertion ability into
pupas to reliably
insert
microsystems
(instead of glass
tube) for insect
control
Normal Pupa halved and Sectioned Pupa with pipe inserted for hormone
growth front develops into transport grows into moth shown above. Insertion of
moth chemical blocking ball bearing results in no growth
8 Amit Lal, DARPA-MTO
MEMS Platform
Ultrasonic CSAC
Platform for sensors,
transducers NGIMG
actuators, and comm
Piezoelectric flaps
for power Pheromone
ejectors
Thermoelectric
Light sources power, flexible
platform
Microfluidic
port
Neural/
Muscle
probes
Moth body weight
Tissue- ~1-5 grams
anchors
Cross and across Payload ~ 0.5-5
9inserts in pupae Amit Lal, DARPA-MTO grams
HI-MEMS
Hybrid Insect MEMS
PM: Amit Lal
Boyce Thompson Institute:
Insect Sentinals
X-ray images of probes in
muscles show good tissue
growth around inserted
probes
+
NEMS/CMOS
Pentium (2006)
8086 (1978)
4004
(1971)
11 Amit Lal, DARPA-MTO
Hybrid NEMtronics
Objectives
Ioff
Eliminate leakage power in 1
P-Substrate N-Well
NEMS can work at high
temperature, enabling high Hybrid NEMS/CMOS Device
efficiency power scavenging. integration
12 Amit Lal, DARPA-MTO
Nano Switches
1 m in
0.35m,
100nm in 90
nm CMOS
Nanoscale e-
CMOS Integrated NEMS shuttle
40 nm beam
50 nm
tines
Nano-machined Nanotube/Fiber
Released FinFET NEMS
switches switches
13 switch Amit Lal, DARPA-MTO
The Problems: Max Heat Removal
Rate and Leakage Power
1E+03
Active Power Density
1E+02
gh
le i
Power (W/cm2)
i d t h
1E+01
a te ro- a ot NEMS
1E+00 in Ze k
r arn
o
1E-01
e lim t n w : C ng
1E-02 a n ren ca ures puti
1E-03 S
c Power
Passive
c ur Density M S at
r com
E M ge N E e
p nt
N ka
1E-04
m
a er
le0.01 te icie
eff
1E-05
o w 0.1 1
p Gate Length (m)
Pext + Pin TH Si
Premove
TC
Pconv
TH TC TH TC
Pext = Pin G Pin = Pin (1 G )
TH TH
TH should be maximized for high Carnot efficiency
700C => 973-300/973 = 0.70
If 50% of Carnot => 35% power can be reclaimed
Cooling could be eliminated Past Example
acoustic
receiver sig process sensor
batteries
Distributed actuators to
pump air + solar cells +
Benefits of mostly-silicon MAV
Collision
avoidance
Weight (a.u.)
Low-power
Power (a.u.)
IR CMOS,
imaging MEMS
components
RADAR to reduce
Inertial power for RF
sense No-wiring, limited
guidance packaging
Microfluidics Cryo-electronics
MEMS
Radioactivity Quantum
Gas/vacuum computation
devices
19 Amit Lal, DARPA-MTO
Summary
MEMS offers pathways to miniaturized
and chip-scale sensor and actuator
systems for reduced SWAP and
increased functionality
Upcoming MEMS will result in
cost/performance benefits by
integrating functionality
The future for MEMS-IC symbiosis is
bright
20 Amit Lal, DARPA-MTO
QUESTIONS?