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2017, IRJET | Impact Factor value: 5.181 | ISO 9001:2008 Certified Journal | Page 343
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 04 Issue: 06 | June -2017 www.irjet.net p-ISSN: 2395-0072
2017, IRJET | Impact Factor value: 5.181 | ISO 9001:2008 Certified Journal | Page 344
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 04 Issue: 06 | June -2017 www.irjet.net p-ISSN: 2395-0072
3. High definition and reproduction of silicon device amount of material is removed from silicon wafer to form
shapes using photolithography are perfect for high membranes, cantilever beams, different types of trenches,
levels of MEMS precision holes and other types of structures. Now lets see how to
4. Silicon has desirable electrical & mechanical build cantilever beam on a silicon wafer by using Bulk
properties required for micromachining. Micromachining
MEMS devices have been fabricated using the well-known i) Grow thick layer of silicon dioxide on silicon wafer.
micromachining techniques used in the integrated circuit ii) ii) Apply a layer of photoresist on silicon dioxide
domain, such as: photolithography, thin film deposition by surface.
chemical vapor deposition (CVD) or physical vapor iii) Next is the photolithography process to define
deposition (PVD), thin film growth by oxidation and epitaxy, cantilever geometry.
doping by ion implantation or diffusion, wet etching, dry iv) Etch out oxide in unwanted area to form cantilever
etching, etc. as shown in fig.3. MEMS devices have the beam and expose silicon surface.
potential of providing significant cost advantages when v) Do anisotropic etching to form cavity in silicon
batch fabricated. The micromachining process can use the wafer.
material to form microstructures by etching directly into the
material or use structural layer. Most widely used micro 3.2 Surface Micromachining: In contrast to Bulk
fabrication processes are bulk micromachining and surface Micromachining, Surface Micromachining build
micromachining. microstructures by adding material layer on the top of the
substrate. Basic steps involved in Surface Micromachining
are:
Silicon wafer preparation i) Deposition & patterning of sacrificial layer mostly
(substrate) silicon dioxide
ii) Deposition & patterning of structural (polysilicon)
layer.
Thin film deposition by using PVD iii) Removal of sacrificial layer.
or CVD
Wafer preparation &
Apply layer of photo resist on it cleaning
4. MICROSYSTEM PACKAGING
Comparison between Bulk & Surface Micromachining [3]
The purpose of microelectronics packaging is to provide
Bulk Micromachining Surface Micromachining mechanical support, electrical connections, and protection
of the delicate integrated circuits from all possible attacks
Established 1960 1980 by mechanical and environmental sources. It also removed
Process Maturity Well established Fairly well established
heat generated by the integrated circuits. The three levels of
microsystem packaging are: Die level, Device level & System
Ruggedness Structure can withstand Less rugged
vibration & shock level packaging
Electroplating of metal on
patterns Fig.6.Three levels of microsystem packaging[1]
2017, IRJET | Impact Factor value: 5.181 | ISO 9001:2008 Certified Journal | Page 346
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 04 Issue: 06 | June -2017 www.irjet.net p-ISSN: 2395-0072
i) Intrauterine pressure sensors have been used to Currently, MEMS market demands are strongly
monitor pressure during child delivery. Also becoming high .This technology adapted new advanced
Angioplasty pressure sensors are used to monitor micromachining process for fabrication of products that
the pressure inside the balloon once it is inside the meet customer requirement as well as performance. In this
blood vessel. paper we discuss the need of miniaturization, different
ii) Optical sensors have been used in Micro sensors and actuators used in MEMS technology. Also this
iii) spectrometers for patient self-testing and paper focuses on microfabrication process need to design
monitoring MEMS structure. The various application of microsystem
iv) Microfluidic devices have been used for discussed in this paper clearly specify how MEMS
insulin pump & micro needles. technology becomes an integral part of each & every field.
C] In Telecommunication field
REFERENCES
i) RF MEMS have been used in tunable
Capacitors and resonators for mobile phones, [1] MEMS & MICROSYSTEMS Design and Manufacture by
Switches in base stations. Tai-Ran Hsu Mc Graw Hill Education
ii) Optical sensors are used in Variable optical [2] MEMS by Nitaigour Premchand Mahalik Mc Graw Hill
Attenuators, optical switching, tunable filters Education
D] In consumer Product [3] MICRO AND SMART SYSTEMS by
i) IR sensors are used in Cabin temperature G.K.Ananthasuresh,K.J.Vinoy,S.Gopalakrishnan,K.N.Bhat,
Control, crash prevention, anti-fog systems, seat V.K.Atre Wiley India Pvt..Ltd..
Occupancy, tire and break monitoring system [4] Nidhi Maheshwari, Gaurav Chatterjee,V. Ramgopal Rao
ii) Microfluidic devices are used in inkjet heads A Technology Overview and Applications of Bio-MEMS J.
iii) Microphones have been used in Mobile phones, ISSS Vol. 3 No. 2, pp. 39-59, Sept. 2014.
Note books, camcorder.
iv) Inertial sensors are used in Pedometer, game [5] Srinivasa Rao Karumuri.K.Girija Sravani, S. Durga
Control, image stabilization in video cameras, Sailaja, J.Vijay Sekhar,Y.Srinivas, Ramendu Bhattacharje,
Hard disk protection Micro-Electro-Mechanical-Systems (MEMS) Technology
Scholars Research Library Archives of Applied Science
E] In Aerospace & Defense Research, 2012, 4 (1):307- 314
i) RF MEMS have been used in Switches and [6]N.Maluf,AnIntroduction to Microelectromechanical
Tunable capacitors for radar and communications. Systems Engineering Artech House, Norwood, MA, 2000
ii) Inertial sensors are used in Missile guidance,
Navigation, laser range finder application
iii) Pressure sensors are used in Flight control
Systems, cabin pressure monitoring, hydraulic .
Systems
iv) IR sensors are used for security monitoring
2017, IRJET | Impact Factor value: 5.181 | ISO 9001:2008 Certified Journal | Page 347