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AbstractIn this letter, we propose to introduce the notion of which technology is quite challenging and not yet adopted by
equivalent capacitance and to generalize the so-called equivalent- the industry.
thickness concept to model arbitrary shapes of lightly doped Conversely, multigate MOSFETs such as FinFETs and -
nonplanar multigate MOSFETs, without the need to introduce
any unphysical parameter. These definitions, which merely map FETs [3] have proven their compatibility with standard CMOS
a multigate geometry into the symmetric double-gate (DG) MOS- technology and lithography techniques, leading to basic circuits
FET topology, have been validated by extensive comparison with [4]. Today, FinFETs are foreseen as next-generation devices for
3-D numerical simulations of quadruple-gate, triple-gate (TG), microprocessors [5]. But, modeling multigate architectures is
triangular gate, cylindrical gate-all-around, and DG Fin Field Ef- quite complex, the main reason being that the structure is 2-D,
fect Transistors (FinFETs). Based on this modeling approach, any
multigate architecture inherits of the fundamental relationships
and hence, no simple solution exists for the BoltzmannPoisson
that have been developed for planar DG MOSFETs, including equation. An empirical approach was proposed by Yu et al.
the normalization of all electrical quantities that considerably [6], who introduced some arbitrary smoothing functions and
simplifies its analysis. In addition, considering a constant mobility, fitting parameters in order to fit the charges and the current in
we find that the model can predict electrical characteristics of nonplanar multigate topologies. In their approach, the authors
FinFETs from 275 to 425 K, without the need for any additional
extended their cylindrical surrounding-gate (SG) MOSFETs
parameters. Finally, we were able to predict electrical measure-
ments of a TG MOSFET, making of this generic model an interest- model to quadruple-gate (QG) MOSFETs. They noted that,
ing candidate for a design-oriented compact model for arbitrary when volume inversion occurs, the subthreshold current is
multigate MOSFETs geometries. proportional to the area of the cross section of the silicon
Index TermsMOS devices, semiconductor device modeling, body. On the other hand, well above threshold, the current
semiconductor devices. becomes proportional to the perimeter of the cross section of
the silicon body. In their approach, the QG was modeled as
I. I NTRODUCTION an SG, but the transition between subthreshold and above-
threshold regimes requires an empirical function depending
A S FAR as compact modeling is concerned, the simplest
multigate MOSFET device to model is undoubtedly the
fully depleted symmetric double-gate (DG) MOSFET. Dif-
on the gate voltage. Hence, the authors proposed a model for
partially surrounding rectangular multiple-gate MOSFETs as
ferent approaches have been proposed. Yu et al. [1] initially a linear combination of a DG and a QG model. For instance,
developed an exact solution that is still difficult to use in the the triple-gate (TG) MOSFET was considered as an average of
context of compact modeling, where more simple relationships a DG and a QG having the same cross section and the same
are preferred. Next, a more compact formulation was proposed gate oxide thickness as for the TG. To model -FET or Pi-FET,
by Sallese et al. [2], where an approximate solution was sought other empirical functions are required, together with empirical
and led to a more compact but still accurate formulation. parameters extracted from Technology Computer Aided Design
However, these models concern the symmetric DG MOSFET, (TCAD) simulations that could not be predicted from simple
analysis.
Next, an interesting and complete analytical modeling of
Manuscript received July 28, 2011; revised September 9, 2011; accepted multiple-gate MOSFETs in subthreshold was proposed by
October 3, 2011. Date of publication October 27, 2011; date of current version
December 23, 2011. This work was supported by the European Compact Ritzenthaler et al. [7]. The potential in the volume of the
Modelling Network (COMON), Industry Academia Partnerships and Pathways channel was obtained by solving the 3-D Laplaces equation,
research project under Grant FP7-IAPP-218255. The review of this letter was where the electrostatic potential along the most leaky path
arranged by Editor S. Deleonibus.
N. Chevillon, C. Lallement, F. Prgaldiny, and M. Madec are with the Institut from source to drain was used to get an analytical subthreshold
dlectronique du Solide et des Systmes, Centre National de la Recherche current expression. As for [6], the draincurrent characteristics
Scientifique, Universit de Strasbourg, 67412 Illkirch, France. from weak to strong inversion were obtained by means of
J.-M. Sallese is with cole Polytechnique Fdrale de Lausanne, 1015
Lausanne, Switzerland (e-mail: jean-michel.sallese@epfl.ch). smoothing functions.
J. Sedlmeir and J. Aghassi are with Intel Mobile Communications GmbH, In addition to these approaches is the solution proposed
85579 Neubiberg, Germany. in [2] that consists in calculating the potential of the silicon
Color versions of one or more of the figures in this letter are available online
at http://ieeexplore.ieee.org. layer in weak inversion, without the need for any empiri-
Digital Object Identifier 10.1109/TED.2011.2171347 cal parameter. Recently, this approach has been extended to
Fig. 7. Equivalent oxide capacitance network of the DG FinFET. Since the specific current for a given interface is ISP = 4
Coxinterface UT 2 (Winterface /L), from relation (21a), we
care must be taken since the gate capacitance is no longer obtain
constant. In the weak inversion regime, if we assume that
4 UT 2 HSi
flatband happens in the whole volume of the silicon (we will ID SI = iSI 2 Cox + Cox_top_eq
see to what extent this is justified), this topology is expected to L 2
give the same current as for the QG since it only depends upon WSi WSi
the cross-section area of the silicon channel. + Cox_bottom . (21b)
2 2
However, in strong inversion, the smaller gate perimeter
around the channel implies that the ON-state current will be Or equivalently
decreased in regard to the QG. If we assume that the nongated
Weq
Si/SiO2 interfaces will not experience inversion, the equivalent ID SI = iSI 4 Cox_eq UT 2 (22)
L
thickness and the equivalent width can be defined by taking the
silicon perimeter covered by the thin gate oxide layer instead of where Weq = HSi + WSi , and Cox_eq is an equivalent gate
using the entire perimeter in (3). oxide capacitance given by
TG MOSFET: Therefore, a TG model can be derived from
the generic SG model introduced in Section III, by considering Cox HSi +Cox_top_eq WSi /2+Cox_bottom WSi /2
Cox_eq = .
that geometrical parameter P is the perimeter of the silicon HSi + WSi
(23)
covered by the thin gate. From their definitions, the equiv-
alent width and equivalent thickness are Weq = HSi + WSi /2 Now, let us define Cox_bottom and Cox_top_eq as the equivalent
and Teq = (2 HSi WSi )/(2 HSi + WSi ), respectively. oxide capacitance values per unit surface for the bottom and
DG FinFET: Contrary to the TG MOSFET, the DG FinFET top interfaces and Cox (= ox /Tox ) as the oxide capacitance for
has a thicker top oxide thickness called Tox_top . When this the lateral interfaces.
thickness is large enough, we can consider this device as a Therefore, adopting these new definitions, we can consider
planar DG MOSFET and model it as such. the DG FinFET as a QG with a specific current given by ISP =
However, even for an oxide layer thicker than its nominal 4 Cox_eq UT 2 ((HSi + WSi )/L).
value, the related interface could still be a conducting channel The equivalent gate oxide capacitance has been derived
when the gate bias exceeds some threshold voltage. This is under the strong inversion condition, but since the subthreshold
indeed supported by 3-D simulations. Therefore, additional charge density is almost independent of the capacitance, we can
currents located at thick oxide interfaces should also be taken still adopt the equivalent capacitance regardless of the mode of
into account when accurate modeling of non-SG architectures operation.
is carried out. The normalized current is still given by
CSi_eq Cox_eq
i = qm 2 + 2 qm + 2 ln 1 qm
B. Definition of the Equivalent Oxide Capacitance Cox_eq 2 CSi_eq
(24)
Case of the DG FinFET: Basically, if we consider that, in
strong inversion, each channel is independent, meaning that with equivalent thickness Teq = (HSi WSi )/(HSi + WSi ) and
the normal electric field at the Si/SiO2 interfaces dominates, the equivalent silicon capacitance CSi_eq = Si /Teq .
total current of the DG FinFET (see Fig. 7) can be considered Finally, the problem reverts to finding an analytical expres-
as the sum of all Si/SiO2 channel currents. sion for the individual capacitance values that come into play.
In addition, if the oxide thickness is different at each inter- Generalization: The aforementioned result can be general-
face, it will affect both the related threshold voltage and the ized to any type of FET device having a common gate with n
normalized current [see (12)]. body/oxide interfaces of length Li and capacitance Ci .
At this point, it is interesting to introduce a basic assumption In that case, if we assume that the device can be planarized so
that consists in considering that the threshold voltages for thin as to revert to a DG MOSFET, each side length will represent
and thick gate oxide interfaces will be almost the same. The half of its counterpart in DG topology (since the width of a
validity of this approximation will be discussed later. This DG is expected to be twice its geometrical size), and if we still
66 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 59, NO. 1, JANUARY 2012
Fig. 8. Drain current of a DG FinFET as a function of gate voltage in Fig. 10. Drain current of a TG MOSFET as a function of gate voltage in linear
linear and saturation regimes with a 50-nm top oxide thickness. (Symbols) and saturation regimes. (Symbols) 3-D simulations. (Dashed lines) TG model.
3-D simulations. (Dashed lines) DG model. (Solid lines) QG model with the (Solid lines) QG model with the equivalent oxide capacitance.
equivalent oxide capacitance.
TABLE II
D ESCRIPTION OF THE M ODEL PARAMETERS
Fig. 13. Drain current of a GAA MOSFET as a function of drain voltage in Fig. 14. Drain current of a TG MOSFET as a function of gate voltage in linear
linear and saturation regimes. (Circles) 3-D simulations. (Lines) Model. and saturation regimes. (Crosses) Measurements. (Lines) Model.
TABLE III
M EAN VALUE FOR THE R ELATIVE E RROR IN P ERCENT B ETWEEN 3-D
TCAD S IMULATIONS AND THE M ODEL OF Ion AND Io C URRENTS ON A
275- TO -425-K T EMPERATURE R ANGE . T HESE R ESULTS A RE G IVEN FOR
D IFFERENT G EOMETRY OF DG F IN FET, TG, AND GAA MOSFET S
we have extracted effective channel length Le = 0.9 m Fig. 15. Drain current of a TG MOSFET as a function of drain voltage in lin-
and series resistance RSD298.15 K = 1300 at room temper- ear and saturation regimes for different temperatures. (Circles) Measurements.
ature. By extracting the series resistance for different tem- (Lines) Model.
peratures, we obtained a linear variation given by RSD (T ) =
RSD298.15 K [1 + aT (T 298.15)] with aT = 0.0108. age mechanisms exist such as the gate induced drain leakage
Comparisons Between Model and Measurements: Since the (GIDL) [20], the gate leakage, and the trap-assisted tunneling
model presented so far focuses on the intrinsic device prop- process [21]. In strong inversion, the good predictions of the
erties, additional extrinsic parameters related to the mobility model for low and high drain voltages justify the temperature-
dependence and access resistances should be taken into account dependent mobility relationship adopted here.
to simulate a real device. Without entering into the details, Fig. 15 shows the drain current versus the drain voltage
we give hereafter the main values that were obtained. For for Vg = 1 V at different temperatures. The saturation regime
the mobility coefficients and low-field mobility 0 at room is well modeled, as is the current in the linear region, also
temperature, we found n = 1.3, = 2, and 1350 cm2 /V s. meaning that the series resistance variation with temperature
Fig. 14 compares the measurements and the multigate model seems reasonable.
for the drain current versus the gate voltage at VD = 0.05 So far, the core model was mainly validated for long-channel
and 1 V and for temperatures between 273.15 and 373.15 K. multigates. Concerning short-channel devices, we expect that,
The subthreshold slope and the threshold voltage predicted by to some extent, the present model can inherit from some
the model are in good agreement with the measurements in the developments done for DG FinFETs [17], i.e., by using the
whole temperature range. For gate voltages close to 0 V, we potential minimum approach. However, for certain geometries
observe some mismatch between the model and the measure- such as TG and QG FETs, a more physical approach might be
ments, which is attributed to current leakage mechanisms that needed by considering corner effects and real 3-D topologies,
are not included in the model. as recently addressed in [22]. It is very likely that merging the
Most likely, at high temperature, the Io current is dominated work done in [22] with our core model will allow including
by channel leakage (in this case, the leakage current at the drain short channel effects while keeping a physically based model
is the same than the one at the source). However, several leak- with a minimum number of parameters.
70 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 59, NO. 1, JANUARY 2012
VII. C ONCLUSION [16] D. S. Jeon and D. E. Burk, MOSFET electron inversion layer
mobilitiesA physically based semi-empirical model for a wide tempera-
In this letter, we demonstrated how a multigate FET topology ture range, IEEE Trans. Electron Devices, vol. 36, no. 8, pp. 14561463,
having a common gate electrode could be merely considered as Aug. 1989.
[17] A. Yesayan, F. Prgaldiny, N. Chevillon, C. Lallement, and J.-M. Sallese,
a symmetric DG MOSFET through the definition of an equiv- Physics-based compact model for ultra-scaled FinFETs, Solid State
alent silicon thickness, an equivalent gate oxide capacitance, Electron., vol. 62, no. 1, pp. 165173, Aug. 2011.
and an equivalent channel width. All these transformations are [18] R. Quay, C. Moglestu, V. Palankovski, and S. Selberherr, A temperature
dependent model for the saturation velocity in semiconductor materials,
explicit and only rely on physical and technological parameters, Mater. Sci. Semicond. Process., vol. 3, no. 1/2, pp. 149155, Mar. 2000.
with no empirical relationships. The ability of the model to [19] G. Niu, J. D. Cressler, S. J. Mathew, and S. Subbanna, A channel resis-
predict charge densities and current up to 425 K confirms tance derivative method for effective channel length extraction in LDD
MOSFETs, IEEE Trans. Electron Devices, vol. 47, no. 3, pp. 648650,
the quite strong physical roots of this approach. In addition, Mar. 2000.
provided a temperature-dependent mobility was introduced, [20] J.-H. Chen, S.-C. Wong, and Y.-H. Wang, An analytic three-terminal
which is anyway required for real devices, the model was also band-to-band tunneling model on GIDL in MOSFET, IEEE Trans. Elec-
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able to simulate measurements of a TG MOSFET at various [21] T.-E. Chang, C. Huang, and T. Wang, Mechanisms of interface trap-
temperatures. Based on these equivalence between planar DG induced drain leakage current in off-state n-MOSFETs, IEEE Trans.
and multigate FETs, any geometry can now be modeled with Electron Devices, vol. 42, no. 4, pp. 738743, Apr. 1995.
[22] R. Ritzenthaler, F. Lime, B. Iiguez, O. Faynot, and S. Cristoloveanu, 3-
a common formalism. Additional work is needed to take into D analytical modelling of subthreshold characteristics in Pi-gate FinFET
account short-channel effects and quantum corrections. transistors, in Proc. Solid-State Device Res. Conf., 2010, pp. 448451.
R EFERENCES
Nicolas Chevillon was born in Dijon, France, in
[1] B. Yu, H. Lu, M. Liu, and Y. Taur, Explicit continuous models for double- 1982. He received the M.S. degree in micro- and
gate and surrounding-gate MOSFETs, IEEE Trans. Electron Devices, nanoelectronics from the University of Strasbourg,
vol. 54, no. 10, pp. 27152722, Oct. 2007. Strasbourg, France, in 2008. He is currently working
[2] J.-M. Sallese, F. Krummenacher, F. Prgaldiny, C. Lallement, A. Roy, and toward the Ph.D. degree at the Institut dlectronique
C. Enz, A design oriented charge-based current model for symmetric du Solide et des Systmes, Centre National de la
DG MOSFET and its correlation with the EKV formalism, Solid State Recherche Scientifique, University of Strasbourg.
Electron., vol. 49, no. 3, pp. 485489, Mar. 2005. His current research interests include FinFET
[3] J.-P. Colinge, Multiple-gate SOI MOSFETs, Solid State Electron., compact modeling, 3-D simulations, and parameter
vol. 48, no. 6, pp. 897905, Jun. 2004. extraction.
[4] K. von Arnim, E. Augendre, A. C. Pacha, T. Schulz, K. T. San, F. Bauer,
A. Nackaerts, R. Rooyackers, T. Vandeweyer, B. Degroote, N. Collaert,
A. Dixit, R. Singanamalla, W. Xiong, A. Marshall, C. R. Cleavelin,
K. Schrufer, and M. Jurczak, Low-power multi-gate FET CMOS technol-
ogy with 13.9 ps inverter delay, large-scaled integrated high performance Jean-Michel Sallese received the M.Sc. degree from
digital circuits and SRAM, in VLSI Symp. Tech. Dig., 2007, pp. 106107. the Institut National des Sciences Appliques, Lyon,
[5] Intel Announcement for Microprocessor Production With 22 nm France, and the Ph.D. degree in physics from the
FinFET Technology. [Online]. Available: http://newsroom.intel.com/ University/CNRS of Nice Sophia Antipolis, Nice,
community/intel_newsroom/blog/2011/05/04/intel-reinvents-transistors- France, where he worked on deep levels character-
using-new-3-d-structure ization in semiconductors.
[6] B. Yu, J. Song, Y. Yuan, W.-Y. Lu, and Y. Taur, A unified analytic In 1991, he joined the Swiss Federal Institute of
drain-current model for multiple-gate MOSFETs, IEEE Trans. Electron Technology (cole Polytechnique Fdrale de Lau-
Devices, vol. 55, no. 8, pp. 21572163, Aug. 2008. sanne), Lausanne, Switzerland, where he was en-
[7] R. Ritzenthaler, F. Lime, B. Iiguez, E. Miranda, F. Martinez, F. Pascal, gaged in semiconductor laser diodes characterization
M. Valenza, O. Faynot, and S. Cristoloveanu, Analytical modeling of and modeling. He is currently giving lectures on
multiple-gate MOSFETs, in Proc. Spanish Conf. Electron Devices, 2011, advanced semiconductor devices as and his research activities focus on compact
pp. 14. modeling of multigate MOSFETs and modeling of microelectromechanical
[8] J.-M. Sallese, N. Chevillon, F. Prgaldiny, C. Lallement, and B. Iiguez, systems.
The equivalent-thickness concept for doped symmetric DG MOSFETs,
IEEE Trans. Electron Devices, vol. 57, no. 11, pp. 29172924, Nov. 2010.
[9] W. Xiong, J. W. Park, and J. P. Colinge, Corner effect in multiple-gate Christophe Lallement (M96) received the M.S.
SOI MOSFETs, in Proc. SOI Conf., 2003, pp. 111113. degree in engineering from Science University of
[10] Atlas/Silvaco Manual. [Online]. Available: www.silvaco.com Nancy I, Nancy, France, and the Ph.D. degree in
[11] K. E. Moselund, D. Bouvet, L. Tschuor, V. Pott, P. Dainesi, and engineering from cole Nationale Suprieure des
A. Ionescu, Local volume inversion and corner effects in triangular gate- Tlcommunications, Paris, France.
all-around MOSFETs, in Proc. Solid-State Device Res. Conf., 2006, From November 1994 to September 1997, he
pp. 359362. was a Postdoctoral Research Scientist with the Lab-
[12] B. Iguez, D. Jimnez, J. Roig, H. A. Hamid, L. F. Marsal, and J. Pallars, oratory of Electronics, Swiss Federal Institute of
Explicit continuous model for long-channel undoped surrounding gate Technology, Lausanne, Switzerland, working on the
MOSFETs, IEEE Trans. Electron Devices, vol. 52, no. 8, pp. 18681873, characterization and modeling of the MOSFET tran-
Aug. 2005. sistor in the development team of the EKV MOST
[13] P. L. Chambr, On the solution of the PoissonBoltzmann equation with model. In September 1997, he was an Associate Professor with the University
application to the theory of thermal explosions, J. Chem. Phys., vol. 20, of Strasbourg, Strasbourg, France, and the CNRS Laboratory for Physics and
no. 11, pp. 17951797, Nov. 1952. Applications of Semiconductors. Since September 2003, he has been a Profes-
[14] A. S. Roy, C. Enz, and J.-M. Sallese, Compact modeling of gate sidewall sor with the cole Nationale Suprieure de Physique de Strasbourg, Illkirch,
capacitance of DG-MOSFET, IEEE Trans. Electron Devices, vol. 53, France. His current research works, currently at the Institut dlectronique du
no. 10, pp. 26552657, Oct. 2006. Solide et des Systmes (InESS), focus on the study and modeling of advanced
[15] T. Ernst, R. Ritzenthaler, O. Faynot, and S. Cristoloveanu, A model of devices, mixed-signal systems with VHDL-AMS, and biosynthetic systems.
fringing fields in short-channel planar and triple-gate SOI MOSFETs, He is responsible for the group Heterogeneous systems and microsystems
IEEE Trans. Electron Devices, vol. 54, no. 6, pp. 13661375, Jun. 2007. at InESS.
CHEVILLON et al.: EQUIVALENT THICKNESS AND CAPACITANCE TO MOSFETs MODELING 71
Fabien Prgaldiny was born in France, in 1977. Josef Sedlmeir studied physics at the Technical Uni-
He received the M.S. and Ph.D. degrees in micro- versity, Munich, Germany, and received the Ph.D.
electronics from the University of Strasbourg (UdS), degree in condensed matter physics with nuclear
Strasbourg, France, in 2001 and 2003, respectively. methods, in 1992.
His doctoral research pertained to the modeling He worked in high energy physics (silicon de-
and simulation of deep-submicrometer MOSFETs. tectors) at Max-Planck-Institute, Munich/CERN, and
Since 2004, he has been an Associate Professor at Brookhaven National Laboratory, Upton, NY. In
with the cole Nationale Suprieure de Physique 1999, he joined Infineon Technologies, Munich, as
de Strasbourg, Illkirch, France, and the UdS, where a Device Characterization Engineer, working on the
he also joined the Institut dlectronique du Solide electrical characterization and compact modeling of
et des Systmes, Strasbourg, in 2005. His research advanced CMOS technologies. In February 2011, he
interests focus on compact modeling and simulation of a double-gate MOSFET, moved to Intel Mobile Communications, Neubiberg, Germany.
FinFET, and CNTFET. He is also interested in the use of the VHDL-AMS
hardware description language in compact modeling.
Morgan Madec was born in 1980. He received the Jasmin Aghassi received the diploma degree in
M.S. and Ph.D. degrees in microelectronics from the physics from Technical University of Aachen,
University Louis Pasteur (ULP), Strasbourg, France, Aachen, Germany, in 2004 and the Ph.D. degree in
in 2003 and 2006, respectively. theoretical condensed matter physics from the Uni-
From 2003 to 2006, he was with the Laboratoire versity of Karlsruhe, Karlsruhe, Germany, in 2007,
de Physique et Application des Semi-Conducteurs, where she worked on electronic transport in semi-
ULP Centre National de la Recherche Scientifique, conductor quantum dots.
Strasbourg, where he prepared a Ph.D. thesis on In November 2007, she joined Infineon Technolo-
the design and characterization of optical processors gies AG as a Research and Development Engineer,
in order to speed up image reconstruction in the working on advanced CMOS technologies. Her main
medical ?eld. He is currently an Associate Profes- fields of interests include compact modeling and
sor with the cole Nationale Suprieure de Physique de Strasbourg, Institut electrical characterization of submicron MOSFETs and quantum effects. Since
dlectronique du Solide et des Systmes, Universit de Strasbourg, Strasbourg, February 2011, she joined Intel Mobile Communications GmbH, Neubiberg,
where he teaches electronics. His research interests include compact modeling Germany, where she is now a Project Manager for CMOS technology platform
of integrated microsensors. development.