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Operational Amplifiers
Applications
Audio Application
Consumer Equipment
Active Filter
Simplified Schematic
VCC
-IN
OUT
+IN
VEE
Product structureSilicon monolithic integrated circuit This product has no designed protection against radioactive rays.
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TSZ2211114001
BA15218F Datasheet
Pin Configuration
BA15218F : SOP8
Package
SOP8
BA15218F
Ordering Information
B A 1 5 2 1 8 F - E2
Line-Up
Operating Supply
Slew Rate Orderable
Topr Supply Voltage Current Package
(Typ) Part Number
(split supply) (Typ)
-40C to +85C 2.0V to 16.0V 5mA 3V/s SOP8 Reel of 2500 BA15218F-E2
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TSZ2211115001
BA15218F Datasheet
Electrical Characteristics
BA15218F (Unless otherwise specified VCC=+15V, VEE=-15V, TA=25C)
Limit
Parameter Symbol Unit Conditions
Min Typ Max
12 14 - V RL10k
Maximum Output Voltage VOM
10 13 - V RL2k
RS=1k
- 1.0 - Vrms
f=20Hz to 30kHz, RIAA
Input Referred Noise Voltage VN
- 9.5 - nV/ Hz RS=100, +IN=0V, f=1kHz
AV=20dB
Total Harmonic Distortion + Noise THD+N - 0.0015 - %
RL=2k, 80kHz-LPF
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TSZ2211115001
BA15218F Datasheet
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BA15218F Datasheet
1.0 10
0.8 8
Power Dissipation [W]
0.4 4
0.2 2
85C
0.0 0
0 25 50 75 100 125 0 2 4 6 8 10 12 14 16 18
Ambient Temperature [C] . Supply Voltage [V]
Figure 2. Figure 3.
Power Dissipation vs Ambient Temperature Supply Current vs Supply Voltage
(Derating Curve)
10 30
Maximum Output Voltage Swing [VP-P]
25
8
Supply Current [mA]
20
6
15V
15
7.5 V
4
10
2
5
2 V
0 0
-50 -25 0 25 50 75 100 0.1 1 10
Ambient Temperature [C] Load Resistance [k]
Figure 4. Figure 5.
Supply Current vs Ambient Temperature Maximum Output Voltage Swing vs Load Resistance
(VCC/VEE=+15V/-15V, TA=25C)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ2211115001
BA15218F Datasheet
20 20
15 15
Maximum Output Voltage [V]
VOH
5 5
0 0
-5 -5
VOL
-10 -10
VOL
-15 -15
-20 -20
0.1 1 10 0 2 4 6 8 10 12 14 16 18
Load Resistance [k] Supply Voltage [V]
Figure 6. Figure 7.
Maximum Output Voltage vs Load Resistance Maximum Output Voltage vs Supply Voltage
(VCC/VEE=+15V/-15V, TA=25C) (RL=2k, TA=25C)
20 20
15 15
Maximum Output Voltage [V]
10 10
VOH VOH
5 5
0 0
-5 -5
VOL VOL
-10 -10
-15 -15
-20 -20
-50 -25 0 25 50 75 100 0 5 10 15 20 25
Ambient Temperature [C] Output Current [mA]
Figure 8. Figure 9.
Maximum Output Voltage vs Ambient Temperature Maximum Output Voltage vs Output Current
(VCC/VEE=+15V/-15V, RL=2k) (VCC/VEE=+15V/-15V, TA=25C)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ2211115001
BA15218F Datasheet
6 6
4 4
Input Offset Voltage [mV]
0 0
25C 15V
85C
-2 -2
-4 -4
-6 -6
0 2 4 6 8 10 12 14 16 18 -50 -25 0 25 50 75 100
Supply Voltage [V] Ambient Temperature [C]
60 60
50 50
Input Bias Current [nA]
40 40
-40C
25C 15V
7.5V
30 30
20 20
85C 2V
10 10
0 0
0 2 4 6 8 10 12 14 16 -50 -25 0 25 50 75 100
Supply Voltage [V] Ambient Temperature [C]
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ2211115001
BA15218F Datasheet
30 30
20 20
Input Offset Current [nA]
0 0
15V
85C
-10 -10
-20 -20
-30 -30
0 2 4 6 8 10 12 14 16 -50 -25 0 25 50 75 100
Supply Voltage [V] Ambient Temperature [C]
5 150
85C
4
Common Mode Rejection Ratio [dB]
25C 125
3
-40C
Input Offset Voltage [mV]
2
100
1
0 75
-1
50
-2
-3
25
-4
-5 0
0 2 4 6 8 -50 -25 0 25 50 75 100
Common Mode Input Voltage [V] Ambient Temperature [C]
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ2211115001
BA15218F Datasheet
150 4
Power Supply Rejection Ratio [dB]
125
3
75 2
50
1
25
0 0
-50 -25 0 25 50 75 100 0 2 4 6 8 10 12 14 16
Ambient Temperature [C] Supply Voltage [V]
80 1
Input Reffered Noise Voltage [nV/Hz]
60 0.1
20kHz
40 0.01
1kHz
20 0.001
20Hz
0 0.0001
1 10 1002 10003 4
10000
1 10 10 10 10 0.1 1 10
Frequency
Frequency[Hz]
[Hz] Output Voltage [Vrms]
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ2211115001
BA15218F Datasheet
30 100 200
PHASE
90 180
Maximum Output Voltage Swing [VP-P]
25
80 160
70 140
20
Phase [deg]
60 120
15 50 100
GAIN
40 80
10
30 60
20 40
5
10 20
0 0 0
1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
1 10 100 1000 1 10 10 2
10 3
10 4
10 5
10 6
10 7
Frequency [Hz] Frequency [kHz]
Frequency [Hz]
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ2211115001
BA15218F Datasheet
Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM Unit: V
VF3 OFF ON
Input Bias Current OFF 15 -15 0 0 3
VF4 ON OFF
VF9 2 -2 0 0
Power Supply Rejection Ratio ON ON OFF 6
VF10 15 -15 0 0
- Calculation - |VF1|
1. Input Offset Voltage (VIO) VIO = 1 + R /R [V]
F S
|VF2 - VF1|
IIO = RI x (1 + RF/RS) [A]
2. Input Offset Current (IIO)
|VF4 - VF3|
IB = 2 x RI x (1 + RF/RS) [A]
3. Input Bias Current (IB)
EK (1+RF/RS)
Av = 20Log |VF6 - VF5| [dB]
4. Large Signal Voltage Gain (AV)
VICM (1+RF/RS)
CMRR = 20Log |VF8 - VF7| [dB]
5. Common-mode Rejection Ration (CMRR)
0.1F
RF=50k
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TSZ2211115001
BA15218F Datasheet
SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF
Maximum Output Voltage OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON
Slew Rate OFF OFF OFF ON OFF OFF OFF ON ON ON OFF OFF
Input Referred Noise Voltage ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF
Input Voltage
SW4
VH
SW5 R2
VCC
VL
Input Wave
t
Output Voltage
SW1 SW2 SW3
V
RL CL
-IN +IN
10%
VL
Output Wave t
Figure 25. Test Circuit 2 (each channel) Figure 26. Slew Rate Input Waveform
R2=100k R2=100k
OUT1 OUT2
VIN R1//R2 =0.5Vrms R1//R2
VEE VEE
100 OUT1
CS = 20Log
OUT2
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TSZ2211115001
BA15218F Datasheet
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol JAC/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 28(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (JA), given the ambient temperature (TA), junction temperature (TJmax), and power dissipation (PD).
JA = (TJmaxTA) / PD C/W
The derating curve in Figure 28(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (JA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 28(c) shows an example of the derating curve for BA15218F.
JA=(TJmax-TA)/ PD C/W
P2
Ambient temperature TA [ C ] JA2 < JA1
Power Dissipation of IC
P1 JA2
TJmax
Chip surface temperature TJ [ C ] JA1
1.0
0.8
Power Dissipation [W]
0.6
BA15218F
0.4
0.2
0.0
0 25 50 75 100 125
Ambient Temperature [C]
(c)BA15218F
5.5 mW/C
When using the unit above TA=25C, subtract the value above per Celsius degree. Permissible dissipation is the value
when FR4 glass epoxy board 70mm 70mm 1.6mm (copper foil area less than 3%) is mounted.
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TSZ2211115001
BA15218F Datasheet
Examples of Circuit
Voltage Follower
OUT=IN
VEE
Inverting Amplifier
R2
Non-inverting Amplifier
R1 R2
For non-inverting amplifier, input voltage (IN) is amplified
by a voltage gain, which depends on the ratio of R1 and
VCC R2. The output voltage (OUT) is in-phase with the input
voltage (IN) and is shown in the next expression.
OUT=(1 + R2/R1)IN
OUT
IN Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
VEE
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TSZ2211115001
BA15218F Datasheet
Operational Notes
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
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TSZ2211115001
BA15218F Datasheet
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
VCC
protection
resistor
VEE
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TSZ2211115001
BA15218F Datasheet
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
Direction of feed
1pin
Reel Order quantity needs to be multiple of the minimum quantity.
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TSZ2211115001
BA15218F Datasheet
Marking Diagrams
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SOP8
MIE
e
b2
Revision History
Date Revision Changes
10.SEP.2013 001 New Release
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TSZ2211115001
Datasheet
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASSb
CLASS CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHMs Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
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[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
Notice - GE Rev.002
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Datasheet
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
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3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
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Datasheet
General Precaution
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ROHMs Products against warning, caution or note contained in this document.
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Notice WE Rev.001
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