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TLP185
Office Machine
Programmable Controllers Unit: mm
AC Adapter
I/O Interface Board
The TOSHIBA mini flat coupler TLP185 is a small outline coupler, suitable for
surface mount assembly.
TLP185 consists of a photo transistor optically coupled to a gallium arsenide
infrared emitting diode. Since TLP185 is smaller than DIP package, its
suitable for high-density surface mounting applications such as
programmable controllers.
2000m
Classification
Type IF = 5 mA, VCE = 5 V, Ta = 25C Marking Of Classification
(Note1)
Min Max
Note: Application, type name for certification test, please use standard product type name, i, e.
TLP185(GB,E: TLP185
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TLP185
Absolute Maximum Ratings (Ta = 25C)
Forward current IF 50 mA
Forward current derating (Ta 90C) IF/C -1.5 mA/C
Pulse forward current (Note 1) IFP 1 A
LED
Reverse voltage VR 5 V
Diode power dissipation PD 100 mW
Collector current IC 50 mA
Collector power dissipation PC 150 mW
Collector power dissipation derating (Ta 25C) PC/C -1.5 mW/C
Junction temperature Tj 125 C
Operating temperature range Topr -55 to 110 C
Storage temperature range Tstg -55 to 125 C
Lead soldering temperature (10 s) Tsol 260 C
Total package power dissipation PT 200 mW
Total package power dissipation derating (Ta 25C) PT/C -2.0 mW/C
Isolation voltage (AC, 60 s, R.H. 60%) (Note 2) BVS 3750 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 2: Device considered a two terminal device: Pins 1 and 3 shorted together and 4 and 6 shorted together.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
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TLP185
Electrical Characteristics (Ta = 25C)
Reverse current IR VR = 5 V 5 A
Capacitance CT V = 0 V, f = 1 MHz 30 pF
Collector-emitter breakdown voltage V(BR)CEO IC = 0.5 mA 80 V
Emitter-collector breakdown voltage V(BR)ECO IE = 0.1 mA 7 V
Detector
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TLP185
Switching Characteristics (Ta = 25C)
Rise time tr 5
Fall time tf VCC = 10 V, IC = 2 mA 9
s
Turn-on time ton RL = 100 9
Turn-off time toff 9
Turn-on time ton 2
RL = 1.9 k (Fig.1)
Storage time ts 30 s
VCC = 5 V, IF = 16 mA
Turn-off time toff 70
IF
IF VCC tS
VCC
RL
VCE 4.5V
VCE 0.5V
tton
ON ttOFF
off
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TLP185
I F - Ta P C - Ta
100 160
120
60 100
Forward current
80
40
60
20 40
This curve shows the maximum This curve shows the
limit to the forward current. maximum limit to the
20
0 collector power dissipation.
-20 0 20 40 60 80 100 120 0
-20 0 20 40 60 80 100 120
IFP-DR IF-VF
3000 100
Pulse width100s
(mA)
Ta=25C
IF (mA)
1000
IFP
500 10
Pulse forward current
300 110C
Forward current
85C
50C
25C
100 0C
1 -25C
-55C
50
30
This curve shows the maximum
limit to the pulse forward current. 0.1
10
10-3
10-2
10 -1
100 0.6 0.8 1 1.2 1.4 1.6 1.8 2
V F / Ta - I F IFP VFP
-3.2 1000
-2.8
Forward voltage temperature coefficient
IFP (mA)
-2.4
100
VF /Ta (mV/C)
-2
Pulse forward current
-1.6
-1.2 10
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TLP185
IC-VCE IC-VCE
50 30
Ta=25C Ta=25C
PC (max)
Collector current IC (mA)
0 0
0 2 4 6 8 10 0 0.2 0.4 0.6 0.8 1
IC-IF I C E O - Ta
10
100
Ta=25C
Collector dark current ID (ICEO) (A)
1
(mA)
10
Collector current IC
0.1 VCE=48V
24V
0.01 10V
5V
1
0.001
VCE=10V
VCE=5V
VCE=0.4V 0.0001
0.1
0 20 40 60 80 100 120
0.1 1 10 100
IC/IF -IF
1000
VCE=10V
VCE=5V
VCE=0.4V
(%)
IC / IF
Current transfer ratio
100
10
0.1 1 10 100
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TLP185
V C E ( s a t ) - Ta I C - Ta
0.28 100
25
0.24
10
(mA)
Collector-Emitter saturation
Voltage VCE(sat) (V)
0.20
10 5
IC
0.16
Collector current
0.12 1
1
0.08
IF=0.5mA
0.04 IF=8mA, IC=2.4mA
S wi t c h i n g t i m e - R L S wi t c h i n g t i m e - Ta
10000 1000
Ta=25C
IF=16mA
VCC=5V
toff
ts
100 10
toff
10 1
IF=16mA
ton VCC=5V
RL=1.9k
1 0.1
1 10 100 -60 -40 -20 0 20 40 60 80 100 120
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TLP185
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
240
This profile is based on the devices
maximum heat resistance guaranteed
Package surface temperature
210
value.
Set the preheat temperature/heating
temperature to the optimum
160
temperature corresponding to the
140
solder paste type used by the
customer within the described profile.
Time (s)
230 value.
Set the preheat temperature/heating
temperature to the optimum
190
temperature corresponding to the
180 solder paste type used by the
customer within the described profile.
60 to 120s 30 to 50s
Time (s)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2
weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
Please preheat it at 150C between 60 and 120 seconds.
Complete soldering within 10 seconds below 260C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260C, or within 3 seconds at 350C. Each pin
may be heated at most once.
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TLP185
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5C to 35C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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