TOP244Y Power Integrations

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TOP242-250
TOPSwitch -GX Family
Extended Power, Design Flexible,

EcoSmart, Integrated Off-line Switcher
Product Highlights +
AC DC
Lower System Cost, High Design Flexibility IN OUT
-
Extended power range for higher power applications
No heatsink required up to 30 W using P package
Features eliminate or reduce cost of external components
D L
Fully integrated soft-start for minimum stress/overshoot
CONTROL
Externally programmable accurate current limit TOPSwitch-GX C
Wider duty cycle for more power, smaller input capacitor
Separate line sense and current limit pins on Y/R/F packages S X F
Line under-voltage (UV) detection: no turn off glitches
Line overvoltage (OV) shutdown extends line surge limit PI-2632-060200
Line feed forward with maximum duty cycle (DCMAX)
reduction rejects line ripple and limits DCMAX at high line Figure 1. Typical Flyback Application.
Frequency jittering reduces EMI and EMI filtering costs
Regulates to zero load without dummy loading OUTPUT POWER TABLE
132 kHz frequency reduces transformer/power supply size
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230 VAC 15%4 85-265 VAC
Half frequency option in Y/R/F packages for video applications
PRODUCT3 Open Open
Hysteretic thermal shutdown for automatic fault recovery Adapter1 Adapter1
Frame2 Frame2
Large thermal hysteresis prevents PC board overheating
TOP242 P or G 9 W 15 W 6.5 W 10 W
EcoSmart - Energy Efficient TOP242 R 21 W 22 W 11 W 14 W
Extremely low consumption in remote off mode TOP242 Y or F 10 W 22 W 7W 14 W
(80 mW @ 110 VAC, 160 mW @ 230 VAC) TOP243 P or G 13 W 25 W 9W 15 W
Frequency lowered with load for high standby efficiency TOP243 R 29 W 45 W 17 W 23 W
Allows shutdown/wake-up via LAN/input port TOP243 Y or F 20 W 45 W 15 W 30 W
TOP244 P or G 16 W 28 W 11 W 20 W
Description TOP244 R 34 W 50 W 20 W 28 W
TOPSwitch-GX uses the same proven topology as TOPSwitch, cost TOP244 Y or F 30 W 65 W 20 W 45 W
effectively integrating the high voltage power MOSFET, PWM TOP245 P 19 W 30 W 13 W 22 W
control, fault protection and other control circuitry onto a single TOP245 R 37 W 57 W 23 W 33 W
CMOS chip. Many new functions are integrated to TOP245 Y or F 40 W 85 W 26 W 60 W
reduce system cost and improve design flexibility, performance
TOP246 R 40 W 64 W 26 W 38 W
and energy efficiency.
TOP246 Y or F 60 W 125 W 40 W 90 W
Depending on package type, either 1 or 3 additional pins over the TOP247 R 42 W 70 W 28 W 43 W
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TOPSwitch standard DRAIN, SOURCE and CONTROL terminals TOP247 Y or F 85 W 165 W 55 W 125 W
allow the following functions: line sensing (OV/UV, line feed- TOP248 R 43 W 75 W 30 W 48 W
forward/DCMAX reduction), accurate externally set current limit, TOP248 Y or F 105 W 205 W 70 W 155 W
remote ON/OFF, synchronization to an external lower frequency, TOP249 R 44 W 79 W 31 W 53 W
and frequency selection (132 kHz/66 kHz). TOP249 Y or F 120 W 250 W 80 W 180 W
All package types provide the following transparent features: Soft- TOP250 R 45 W 82 W 32 W 55 W
start, 132 kHz switching frequency (automatically reduced at light TOP250 Y or F 135 W 290 W 90 W 210 W
load), frequency jittering for lower EMI, wider DCMAX, hysteretic Table 1. Notes: 1. Typical continuous power in a non-ventilated
thermal shutdown and larger creepage packages. In addition, all enclosed adapter measured at 50 C ambient. 2. Maximum practical
critical parameters (i.e. current limit, frequency, PWM gain) have continuous power in an open frame design at 50 C ambient. See
tighter temperature and absolute tolerance, to simplify design and Key Applications for detailed conditions. 3. See Part Ordering
optimize system cost. Information. 4. 230 VAC or 100/115 VAC with doubler.
September 2003
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TOP242-250
Section List
Functional Block Diagram ......................................................................................................................................... 3
Pin Functional Description ........................................................................................................................................ 4
TOPSwitch-GX Family Functional Description ........................................................................................................ 5
CONTROL (C) Pin Operation ................................................................................................................................. 6
Oscillator and Switching Frequency ....................................................................................................................... 6
Pulse Width Modulator and Maximum Duty Cycle ................................................................................................. 7
Light Load Frequency Reduction ............................................................................................................................ 7
Error Amplifier ......................................................................................................................................................... 7
On-chip Current Limit with External Programmability ............................................................................................. 7
Line Under-Voltage Detection (UV) ........................................................................................................................ 8
Line Overvoltage Shutdown (OV) ........................................................................................................................... 8
Line Feed Forward with DCMAX Reduction .............................................................................................................. 8
General Information & Table of Contents
Remote ON/OFF and Synchronization ................................................................................................................... 9
Soft-Start ................................................................................................................................................................ 9
Shutdown/Auto-Restart .......................................................................................................................................... 9
Product Selector Guide
Hysteretic Over-Temperature Protection ................................................................................................................ 9
Bandgap Reference .............................................................................................................................................. 10
1
High-Voltage Bias Current Source ........................................................................................................................ 10
Data Sheets
Using Feature Pins .................................................................................................................................................... 10 2
FREQUENCY (F) Pin Operation ........................................................................................................................... 10
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LINE-SENSE (L) Pin Operation ............................................................................................................................ 10
Application Notes
EXTERNAL CURRENT LIMIT (X) Pin Operation ................................................................................................. 11 3
MULTI-FUNCTION (M) Pin Operation .................................................................................................................. 11
Typical Uses of FREQUENCY (F) Pin ...................................................................................................................... 14
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins ....................................................... 15
Design Ideas 4
Typical Uses of MULTI-FUNCTION (M) Pin ............................................................................................................. 17
Design Tools
Application Examples ............................................................................................................................................... 20 5
A High Efficiency, 30 W, Universal Input Power Supply ........................................................................................ 20
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply .............................................................................. 21
Quality and Reliability
A High Efficiency, 250 W, 250-380 VDC Input Power Supply ............................................................................... 22 6
Multiple Output, 60 W, 185-265 VAC Input Power Supply .................................................................................... 23
Processor Controlled Supply Turn On/Off ............................................................................................................ 24
Package Information
Key Application Considerations .............................................................................................................................. 26
7
TOPSwitch-II vs. TOPSwitch-GX .......................................................................................................................... 26
DPA-Switch DC-DC Seminar
TOPSwitch-FX vs. TOPSwitch-GX ....................................................................................................................... 27
TOPSwitch-GX Design Considerations ................................................................................................................ 28
8
TOPSwitch-GX Layout Considerations ................................................................................................................. 30
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LinkSwitch & TinySwitch-II AC-DC Seminar

Quick Design Checklist ......................................................................................................................................... 30
Design Tools ......................................................................................................................................................... 32
9
Product Specifications and Test Conditions .......................................................................................................... 33
TOPSwitch-GX AC-DC Seminar 10
Typical Performance Characteristics ...................................................................................................................... 40
Part Ordering Information ........................................................................................................................................ 45
Sales Representatives and Distributors 11
Package Outlines ...................................................................................................................................................... 45
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TOP242-250
VC
0
CONTROL (C) DRAIN (D)
ZC INTERNAL
1 SUPPLY
SHUNT REGULATOR/
ERROR AMPLIFIER +
SOFT START
- 5.8 V
4.8 V -
+ 5.8 V
INTERNAL UV
IFB COMPARATOR
VI (LIMIT)
CURRENT
LIMIT SOFT
ADJUST START -
ON/OFF 8
+
VBG + VT SHUTDOWN/
AUTO-RESTART CURRENT LIMIT
COMPARATOR
EXTERNAL
CURRENT LIMIT (X) HYSTERETIC
STOP LOGIC THERMAL
SHUTDOWN
LINE-SENSE (L) 1V
CONTROLLED
VBG TURN-ON
STOP SOFT- GATE DRIVER
OV/UV START
LINE DMAX
SENSE DCMAX DCMAX
CLOCK
S Q
HALF SAW - LEADING
FREQ. EDGE
R
FREQUENCY (F) + BLANKING
OSCILLATOR WITH JITTER
PWM
COMPARATOR
LIGHT LOAD
FREQUENCY
RE
REDUCTION
SOURCE (S)
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PI-2639-060600
Figure 2a. Functional Block Diagram (Y, R or F Package).
VC
0
CONTROL (C) DRAIN (D)
ZC INTERNAL
1 SUPPLY
SHUNT REGULATOR/
ERROR AMPLIFIER +
SOFT START
- 5.8 V
4.8 V -
+ 5.8 V
INTERNAL UV
IFB COMPARATOR
VI (LIMIT)
CURRENT
LIMIT SOFT
START -
ADJUST
ON/OFF 8
+
SHUTDOWN/
AUTO-RESTART CURRENT LIMIT
VBG + VT COMPARATOR
STOP LOGIC HYSTERETIC

MULTI-
FUNCTION (M) THERMAL
SHUTDOWN
VBG CONTROLLED
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TURN-ON
STOP SOFT- GATE DRIVER
OV/UV START
LINE DMAX
SENSE DCMAX DCMAX
CLOCK
S Q
SAW - LEADING
R EDGE
+ BLANKING
OSCILLATOR WITH JITTER
PWM
COMPARATOR
LIGHT LOAD
FREQUENCY
RE
REDUCTION
SOURCE (S)
PI-2641-061200
Figure 2b. Functional Block Diagram (P or G Package).
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TOP242-250
Pin Functional Description FREQUENCY (F) Pin: (Y, R or F package only)

Input pin for selecting switching frequency: 132 kHz if
connected to SOURCE pin and 66 kHz if connected to
DRAIN (D) Pin:
CONTROL pin. The switching frequency is internally set for
High voltage power MOSFET drain output. The internal
fixed 132 kHz operation in P and G packages.
start-up bias current is drawn from this pin through a switched
high-voltage current source. Internal current limit sense point
SOURCE (S) Pin:
for drain current.
Output MOSFET source connection for high voltage power
return. Primary side control circuit common and reference point.
CONTROL (C) Pin:
PI-2629-092203
Error amplifier and feedback current input pin for duty cycle
VUV = IUV x RLS
control. Internal shunt regulator connection to provide internal +
VOV = IOV x RLS
bias current during normal operation. It is also used as the
For RLS = 2 M
connection point for the supply bypass and auto-restart/ RLS 2 M
VUV = 100 VDC
compensation capacitor. VOV = 450 VDC
DC DCMAX@100 VDC = 78%
D L
LINE-SENSE (L) Pin: (Y, R or F package only) Input
Input pin for OV, UV, line feed forward with DCMAX reduction, Voltage CONTROL
C
DCMAX@375 VDC = 38%
remote ON/OFF and synchronization. A connection to For RIL = 12 k

SOURCE pin disables all functions on this pin. ILIMIT = 69%
Product Selector
S
Guide
X
See Figure 54b for
RIL
1
other resistor values
EXTERNAL CURRENT LIMIT (X) Pin: (Y, R or F - 12 k
(RIL) to select different
package only)
Input pin for external current limit adjustment, remote Data Sheets
ILIMIT values
2
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ON/OFF, and synchronization. A connection to SOURCE pin Figure 4. Y/R/F Pkg Line Sense and Externally Set Current Limit.
disables all functions on this pin.
+
Application Notes 3
MULTI-FUNCTION (M) Pin: (P or G package only) VUV = IUV x RLS
This pin combines the functions of the LINE-SENSE (L) and VOV = IOV x RLS
EXTERNAL CURRENT LIMIT (X) pins of the Y package Design Ideas
For R = 2 M
4
RLS 2 M LS
into one pin. Input pin for OV, UV, line feed forward with VUV = 100 VDC
DCMAX reduction, external current limit adjustment, remote DC VOV = 450 VDC
ON/OFF and synchronization. A connection to SOURCE pin Input
Voltage
Design Tools 5
DCMAX@100 VDC = 78%
disables all functions on this pin and makes TOPSwitch-GX D M DCMAX@375 VDC = 38%
operate in simple three terminal mode (like TOPSwitch-II).
CONTROL
C 6
Y Package (TO-220-7C) - S
Tab Internally 7D Package Information PI-2509-040501 7

Connected to 5F
SOURCE Pin 4S Figure 5. P/G Package Line Sense.
3X
2L
1C
DPA-Switch DC-DC Seminar 8
+
R Package (TO-263-7C) For RIL = 12 k
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F Package (TO-262-7C) ILIMIT = 69%
9
P Package (DIP-8B) For RIL = 25 k
G Package (SMD-8B) ILIMIT = 43%
M 1 8 S
TOPSwitch-GX
DC
Input
AC-DCSeeSeminar
Figures 54b and 10
55b for other resistor
Voltage values (RIL) to select
S 2 7 S D M
different ILIMIT values
S 3
Sales Representatives
R
and Distributors 11 IL
CONTROL
C
C 4 5 D
123 4 5 7 - S
CL X S F D PI-2724-010802
PI-2517-092203
Figure 3. Pin Configuration (top view).
Figure 6. P/G Package Externally Set Current Limit.
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TOP242-250
TOPSwitch-GX Family Functional Description

Like TOPSwitch, TOPSwitch-GX is an integrated switched Auto-restart
mode power supply chip that converts a current at the control ICD1 IB
input to a duty cycle at the open drain output of a high voltage
IL = 125 A
power MOSFET. During normal operation the duty cycle of
132
the power MOSFET decreases linearly with increasing
Frequency (kHz)
CONTROL pin current as shown in Figure 7. IL < IL(DC)
IL = 190 A
In addition to the three terminal TOPSwitch features, such as

the high voltage start-up, the cycle-by-cycle current limiting,
loop compensation circuitry, auto-restart, thermal shutdown, 30
the TOPSwitch-GX incorporates many additional functions that
reduce system cost, increase power supply performance and
design flexibility. A patented high voltage CMOS technology IC (mA)
allows both the high voltage power MOSFET and all the low
voltage control circuitry to be cost effectively integrated onto
a single monolithic chip. Auto-restart
ICD1 IB
Three terminals, FREQUENCY, LINE-SENSE, and
EXTERNAL CURRENT LIMIT (available in Y, R or F 78
Slope = PWM Gain
package) or one terminal MULTI-FUNCTION (available in P
Duty Cycle (%)
or G package) have been added to implement some of the new
functions. These terminals can be connected to the SOURCE
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IL = 125 A
pin to operate the TOPSwitch-GX in a TOPSwitch-like three 38
terminal mode. However, even in this three terminal mode, the IL < IL(DC)
TOPSwitch-GX offers many new transparent features that do I = 190 A

L
not require any external components: 10
TOP242-5 1.6 2.0 5.2 6.0

1. A fully integrated 10 ms soft-start limits peak currents and TOP246-9 2.2 2.6 5.8 6.6
voltages during start-up and dramatically reduces or TOP250 2.4 2.7 IC (mA) 6.5 7.3
eliminates output overshoot in most applications. Note: For P and G packages IL is replaced with IM.
2. DCMAX of 78% allows smaller input storage capacitor, lower PI-2633-011502
input voltage requirement and/or higher power capability.
3. Frequency reduction at light loads lowers the switching Figure 7. Relationship of Duty Cycle and Frequency to CONTROL
Pin Current.
losses and maintains good cross regulation in multiple
output supplies. The pin can also be used as a remote ON/OFF and a
4. Higher switching frequency of 132 kHz reduces the synchronization input.
transformer size with no noticeable impact on EMI.
5. Frequency jittering reduces EMI. The EXTERNAL CURRENT LIMIT (X) pin is usually used to
6. Hysteretic over-temperature shutdown ensures automatic reduce the current limit externally to a value close to the operating
recovery from thermal fault. Large hysteresis prevents circuit peak current, by connecting the pin to SOURCE through a resistor.
board overheating. This pin can also be used as a remote ON/OFF and a
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7. Packages with omitted pins and lead forming provide large synchronization input in both modes. See Table 2 and Figure 11.
drain creepage distance.
8. Tighter absolute tolerances and smaller temperature vari- For the P or G packages the LINE-SENSE and EXTERNAL
ations on switching frequency, current limit and PWM gain. CURRENT LIMIT pin functions are combined on one MULTI-
FUNCTION (M) pin. However, some of the functions become
The LINE-SENSE (L) pin is usually used for line sensing by mutually exclusive as shown in Table 3.
connecting a resistor from this pin to the rectified DC high
voltage bus to implement line overvoltage (OV), under-voltage The FREQUENCY (F) pin in the Y, R or F package sets the
(UV) and line feed-forward with DCMAX reduction. In this switching frequency to the default value of 132 kHz when
mode, the value of the resistor determines the OV/UV thresholds connected to SOURCE pin. A half frequency option of 66 kHz
and the DCMAX is reduced linearly starting from a line voltage can be chosen by connecting this pin to CONTROL pin
above the under-voltage threshold. See Table 2 and Figure 11. instead. Leaving this pin open is not recommended.

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TOP242-250
CONTROL (C) Pin Operation voltage of 5.8 V, current in excess of the consumption of the
The CONTROL pin is a low impedance node that is capable of chip is shunted to SOURCE through resistor RE as shown in
receiving a combined supply and feedback current. During Figure 2. This current flowing through RE controls the duty
normal operation, a shunt regulator is used to separate the cycle of the power MOSFET to provide closed loop regulation.
feedback signal from the supply current. CONTROL pin The shunt regulator has a finite low output impedance ZC that
voltage VC is the supply voltage for the control circuitry sets the gain of the error amplifier when used in a primary
including the MOSFET gate driver. An external bypass feedback configuration. The dynamic impedance ZC of the
capacitor closely connected between the CONTROL and CONTROL pin together with the external CONTROL pin
SOURCE pins is required to supply the instantaneous gate drive capacitance sets the dominant pole for the control loop.
current. The total amount of capacitance connected to this pin
also sets the auto-restart timing as well as control loop When a fault condition such as an open loop or shorted output
compensation. prevents the flow of an external current into the CONTROL
pin, the capacitor on the CONTROL pin discharges towards
When rectified DC high voltage is applied to the DRAIN pin 4.8 V. At 4.8 V, auto-restart is activated which turns the output
during start-up, the MOSFET is initially off, and the MOSFET off and puts the control circuitry in a low current
CONTROL pin capacitor is charged through a switched high standby mode. The high-voltage current source turns on and
voltage current source connected internally between the DRAIN charges the external capacitance again. A hysteretic internal
and CONTROL pins. When the CONTROL pin voltage VC supply under-voltage comparator keeps VC within a window
reaches approximately 5.8 V, the control circuitry is activated of typically 4.8 V to 5.8 V by turning the high-voltage current
and the soft-start begins. The soft-start circuit gradually Product Selector Guide
source on and off as shown in Figure 8. The auto-restart 1
increases the duty cycle of the MOSFET from zero to the circuit has a divide-by-eight counter which prevents the output
maximum value over approximately 10 ms. If no external MOSFET from turning on again until eight discharge/charge
feedback/supply current is fed into the CONTROL pin by the Data Sheets
cycles have elapsed. This is accomplished by enabling the 2
end of the soft-start, the high voltage current source is turned output MOSFET only when the divide-by-eight counter reaches
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off and the CONTROL pin will start discharging in response full count (S7). The counter effectively limits TOPSwitch-GX
to the supply current drawn by the control circuitry. If the Application Notes
power dissipation by reducing the auto-restart duty cycle to 3
power supply is designed properly, and no fault condition such typically 4%. Auto-restart mode continues until output
as open loop or shorted output exists, the feedback loop will voltage regulation is again achieved through closure of the
close, providing external CONTROL pin current, before the feedback loop. Design Ideas 4
CONTROL pin voltage has had a chance to discharge to the
lower threshold voltage of approximately 4.8 V (internal supply Oscillator and Switching Frequency
under-voltage lockout threshold). When the externally fed Design Tools
The internal oscillator linearly charges and discharges an 5
current charges the CONTROL pin to the shunt regulator internal capacitance between two voltage levels to create a
Quality and Reliability 6

~
~
~
~
VUV
Package Information 7
~
~
~
~
~
~
VLINE
0V
S7 S0 S1 S2 S6 S7 S0 S1 S2 DPA-Switch DC-DC Seminar

S6 S7 S0 S1 S2 S6 S7 S7 5.8 V 8
~
~
~
~
~
~
VC 4.8 V
0V
~
~
~
~
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VDRAIN
LinkSwitch & TinySwitch-II AC-DC Seminar 9
~
~
0V
VOUT
~
~
~
~
~
~
0V
1 2 3 2 4
Note: S0 through S7 are the output states of the auto-restart counter PI-2545-082299
Figure 8. Typical Waveforms for (1) Power Up (2) Normal Operation (3) Auto-restart (4) Power Down.
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TOP242-250
sawtooth waveform for the pulse width modulator. This
PI-2550-092499
oscillator sets the pulse width modulator/current limit latch at 136 kHz
the beginning of each cycle. Switching
Frequency
128 kHz
The nominal switching frequency of 132 kHz was chosen to
minimize transformer size while keeping the fundamental EMI
4 ms
frequency below 150 kHz. The FREQUENCY pin (available
only in Y, R or F package), when shorted to the CONTROL
pin, lowers the switching frequency to 66 kHz (half frequency) VDRAIN
which may be preferable in some cases such as noise sensitive
video applications or a high efficiency standby mode. Time
Otherwise, the FREQUENCY pin should be connected to the
SOURCE pin for the default 132 kHz. Figure 9. Switching Frequency Jitter (Idealized VDRAIN Waveform).
To further reduce the EMI level, the switching frequency is jittered minimum frequency is typically 30 kHz and 15 kHz for
(frequency modulated) by approximately 4 kHz at 132 kHz and 66 kHz operation, respectively.
250 Hz (typical) rate as shown in Figure 9. Figure 46 shows the
typical improvement of EMI measurements with frequency jitter. This feature allows a power supply to operate at lower
frequency at light loads thus lowering the switching losses while
Pulse Width Modulator and Maximum Duty Cycle maintaining good cross regulation performance and low
The pulse width modulator implements voltage mode control output ripple.
by driving the output MOSFET with a duty cycle inversely
proportional to the current into the CONTROL pin that is in Error Amplifier
excess of the internal supply current of the chip (see Figure 7). The shunt regulator can also perform the function of an error
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The excess current is the feedback error signal that appears amplifier in primary side feedback applications. The shunt
across RE (see Figure 2). This signal is filtered by an RC regulator voltage is accurately derived from a temperature-
network with a typical corner frequency of 7 kHz to reduce the compensated bandgap reference. The gain of the error amplifier
effect of switching noise in the chip supply current generated is set by the CONTROL pin dynamic impedance. The
by the MOSFET gate driver. The filtered error signal is CONTROL pin clamps external circuit signals to the VC
compared with the internal oscillator sawtooth waveform to voltage level. The CONTROL pin current in excess of the
generate the duty cycle waveform. As the control current supply current is separated by the shunt regulator and flows
increases, the duty cycle decreases. A clock signal from the through RE as a voltage error signal.
oscillator sets a latch which turns on the output MOSFET. The
pulse width modulator resets the latch, turning off the output On-chip Current Limit with External Programmability
MOSFET. Note that a minimum current must be driven into The cycle-by-cycle peak drain current limit circuit uses the output
the CONTROL pin before the duty cycle begins to change. MOSFET ON-resistance as a sense resistor. A current limit
comparator compares the output MOSFET on-state drain to
The maximum duty cycle, DCMAX, is set at a default maximum source voltage, VDS(ON) with a threshold voltage. High drain
value of 78% (typical). However, by connecting the LINE- current causes VDS(ON) to exceed the threshold voltage and turns
SENSE or MULTI-FUNCTION pin (depending on the the output MOSFET off until the start of the next clock cycle.
package) to the rectified DC high voltage bus through a The current limit comparator threshold voltage is temperature
resistor with appropriate value, the maximum duty cycle can compensated to minimize the variation of the current limit due to
be made to decrease from 78% to 38% (typical) as shown in temperature related changes in RDS(ON) of the output MOSFET.
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Figure 11 when input line voltage increases (see line feed The default current limit of TOPSwitch-GX is preset internally.
forward with DCMAX reduction). However, with a resistor connected between EXTERNAL
CURRENT LIMIT (X) pin (Y, R or F package) or MULTI-
Light Load Frequency Reduction FUNCTION (M) pin (P or G package) and SOURCE pin,
The pulse width modulator duty cycle reduces as the load at current limit can be programmed externally to a lower level
the power supply output decreases. This reduction in duty cycle between 30% and 100% of the default current limit. Please refer
is proportional to the current flowing into the CONTROL pin. to the graphs in the typical performance characteristics section
As the CONTROL pin current increases, the duty cycle for the selection of the resistor value. By setting current limit
decreases linearly towards a duty cycle of 10%. Below 10% low, a larger TOPSwitch-GX than necessary for the power
duty cycle, to maintain high efficiency at light loads, the required can be used to take advantage of the lower RDS(ON) for
frequency is also reduced linearly until a minimum frequency higher efficiency/smaller heat sinking requirements. With a
is reached at a duty cycle of 0% (refer to Figure 7). The second resistor connected between the EXTERNAL

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TOP242-250
CURRENT LIMIT (X) pin (Y, R or F package) or MULTI- input voltage operating range (UV low threshold). If the UV
FUNCTION (M) pin (P or G package) and the rectified DC low threshold is reached during operation without the power
high voltage bus, the current limit is reduced with increasing supply losing regulation the device will turn off and stay off
line voltage, allowing a true power limiting operation against until UV (high threshold) has been reached again. If the power
line variation to be implemented. When using an RCD clamp, supply loses regulation before reaching the UV low threshold,
this power limiting technique reduces maximum clamp the device will enter auto-restart. At the end of each auto-
voltage at high line. This allows for higher reflected voltage restart cycle (S7), the UV comparator is enabled. If the UV high
designs as well as reducing clamp dissipation. threshold is not exceeded the MOSFET will be disabled during
the next cycle (see Figure 8). The UV feature can be disabled
The leading edge blanking circuit inhibits the current limit independent of OV feature as shown in Figures 19 and 23.
comparator for a short time after the output MOSFET is turned
on. The leading edge blanking time has been set so that, if a Line Overvoltage Shutdown (OV)
power supply is designed properly, current spikes caused by The same resistor used for UV also sets an overvoltage threshold
primary-side capacitances and secondary-side rectifier reverse which, once exceeded, will force TOPSwitch-GX output into
recovery time should not cause premature termination of the off-state. The ratio of OV and UV thresholds is preset at 4.5 as
switching pulse. can be seen in Figure 11. When the MOSFET is off, the rectified
The current limit is lower for a short period after the leading
DC high voltage surge capability is increased to the voltage
rating of the MOSFET (700 V), due to the absence of the
edge blanking time as shown in Figure 52. This is due to reflected voltage and leakage spikes on the drain. A small
dynamic characteristics of the MOSFET. To avoid triggering
the current limit in normal operation, the drain current
amount of hysteresis is provided on the OV threshold to
prevent noise triggering. The OV feature can be disabled
1
waveform should stay within the envelope shown. independent of the UV feature as shown in Figures 18 and 32.
Line Under-Voltage Detection (UV)

Data Sheets
Line Feed Forward with DCMAX Reduction
2
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At power up, UV keeps TOPSwitch-GX off until the input line The same resistor used for UV and OV also implements line
voltage reaches the under voltage threshold. At power down,
UV prevents auto-restart attempts after the output goes out of
Application Notes
voltage feed forward which minimizes output line ripple and
reduces power supply output sensitivity to line transients. This
3
regulation. This eliminates power down glitches caused by feed forward operation is illustrated in Figure 7 by the
the slow discharge of large input storage capacitor present in
applications such as standby supplies. A single resistor
Design Ideas
different values of IL (Y, R or F package) or IM (P or G Package).
Note that for the same CONTROL pin current, higher line
4
connected from the LINE-SENSE pin (Y, R or F package) or voltage results in smaller operating duty cycle. As an added
MULTI-FUNCTION pin (P or G package) to the rectified DC
high voltage bus sets UV threshold during power up. Once the
Design Tools
feature, the maximum duty cycle DCMAX is also reduced from
78% (typical) at a voltage slightly higher than the UV threshold
5
power supply is successfully turned on, the UV threshold is to 30% (typical) at the OV threshold (see Figure 11).
lowered to 40% of the initial UV threshold to allow extended Quality and Reliability
Limiting DC MAX at higher line voltages helps prevent 6
Oscillator DPA-Switch DC-DC Seminar 8

(SAW)
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DMAX

Enable from
X, L or M Pin (STOP)
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Time 11
PI-2637-060600
Figure 10. Synchronization Timing Diagram.
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TOP242-250
transformer saturation due to large load transients in forward but with very low power consumption (160 mW typical at
converter applications. DCMAX of 38% at the OV threshold was 230 VAC with M or X pins open). When the TOPSwitch-GX is
chosen to ensure that the power capability of the remotely turned on after entering this mode, it will initiate a
TOPSwitch-GX is not restricted by this feature under normal normal start-up sequence with soft-start the next time the
operation. CONTROL pin reaches 5.8 V. In the worst case, the delay from
remote on to start-up can be equal to the full discharge/charge
Remote ON/OFF and Synchronization cycle time of the CONTROL pin, which is approximately
TOPSwitch-GX can be turned on or off by controlling the current 125 ms for a 47 F CONTROL pin capacitor. This
into the LINE-SENSE pin or out from the EXTERNAL reduced consumption remote off mode can eliminate
CURRENT LIMIT pin (Y, R or F package) and into or out from expensive and unreliable in-line mechanical switches. It also
the MULTI-FUNCTION pin (P or G package) (see Figure 11). allows for microprocessor controlled turn-on and turn-off
In addition, the LINE-SENSE pin has a 1 V threshold comparator sequences that may be required in certain applications such as
connected at its input. This voltage threshold can also be used to inkjet and laser printers.
perform remote ON/OFF control. This allows easy
implementation of remote ON/OFF control of TOPSwitch-GX in Soft-Start
several different ways. A transistor or an optocoupler output Two on-chip soft-start functions are activated at start-up with
connected between the EXTERNAL CURRENT LIMIT or LINE- a duration of 10 ms (typical). Maximum duty cycle starts from
SENSE pins (Y, R or F package) or the MULTI-FUNCTION pin 0% and linearly increases to the default maximum of 78% at
(P or G package) and the SOURCE pin implements this function the end of the 10 ms duration and the current limit starts from
with active-on (Figures 22, 29 and 36) while a transistor or an about 85% and linearly increases to 100% at the end of the
optocoupler output connected between the LINE-SENSE pin 10ms duration. In addition to start-up, soft-start is also
(Y, R or F package) or the MULTI-FUNCTION (P or G package) activated at each restart attempt during auto-restart and when
pin and the CONTROL pin implements the function with restarting after being in hysteretic regulation of CONTROL
active-off (Figures 23 and 37). pin voltage (VC), due to remote off or thermal shutdown
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conditions. This effectively minimizes current and voltage
When a signal is received at the LINE-SENSE pin or the stresses on the output MOSFET, the clamp circuit and the
EXTERNAL CURRENT LIMIT pin (Y, R or F package) or output rectifier during start-up. This feature also helps
the MULTI-FUNCTION pin (P or G package) to disable the minimize output overshoot and prevents saturation of the
output through any of the pin functions such as OV, UV and transformer during start-up.
remote ON/OFF, TOPSwitch-GX always completes its current
switching cycle, as illustrated in Figure 10, before the output is Shutdown/Auto-Restart
forced off. The internal oscillator is stopped slightly before the To minimize TOPSwitch-GX power dissipation under fault
end of the current cycle and stays there as long as the disable conditions, the shutdown/auto-restart circuit turns the power
signal exists. When the signal at the above pins changes state supply on and off at an auto-restart duty cycle of typically 4%
from disable to enable, the internal oscillator starts the next if an out of regulation condition persists. Loss of regulation
switching cycle. This approach allows the use of these pins to interrupts the external current into the CONTROL pin. VC
synchronize TOPSwitch-GX to any external signal with a regulation changes from shunt mode to the hysteretic auto-
frequency between its internal switching frequency and 20 kHz. restart mode as described in CONTROL pin operation section.
When the fault condition is removed, the power supply output
As seen above, the remote ON/OFF feature allows the becomes regulated, VC regulation returns to shunt mode, and
TOPSwitch-GX to be turned on and off instantly, on a cycle- normal operation of the power supply resumes.
by-cycle basis, with very little delay. However, remote
ON/OFF can also be used as a standby or power switch to turn Hysteretic Over-Temperature Protection
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off the TOPSwitch-GX and keep it in a very low power Temperature protection is provided by a precision analog
consumption state for indefinitely long periods. If the circuit that turns the output MOSFET off when the junction
TOPSwitch-GX is held in remote off state for long enough time temperature exceeds the thermal shutdown temperature
to allow the CONTROL pin to discharge to the internal (140 C typical). When the junction temperature cools to
supply under-voltage threshold of 4.8 V (approximately 32 ms below the hysteretic temperature, normal operation resumes
for a 47 F CONTROL pin capacitance), the CONTROL pin providing automatic recovery. A large hysteresis of 70 C
goes into the hysteretic mode of regulation. In this mode, the (typical) is provided to prevent overheating of the PC board
CONTROL pin goes through alternate charge and discharge due to a continuous fault condition. VC is regulated in hysteretic
cycles between 4.8 V and 5.8 V (see CONTROL pin operation mode and a 4.8 V to 5.8 V (typical) sawtooth waveform is
section above) and runs entirely off the high voltage DC input, present on the CONTROL pin while in thermal shutdown.

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TOP242-250
Bandgap Reference shorting the FREQUENCY pin to the CONTROL pin

All critical TOPSwitch-GX internal voltages are derived from (Figure 14). In addition, an example circuit shown in Figure 15
a temperature-compensated bandgap reference. This reference may be used to lower the switching frequency from 132 kHz in
is also used to generate a temperature-compensated current normal operation to 66 kHz in standby mode for very low standby
reference which is trimmed to accurately set the switching power consumption.
frequency, MOSFET gate drive current, current limit, and the
line OV/UV thresholds. TOPSwitch-GX has improved circuitry LINE-SENSE (L) Pin Operation (Y, R and F Packages)
to maintain all of the above critical parameters within very tight When current is fed into the LINE-SENSE pin, it works as a
absolute and temperature tolerances. voltage source of approximately 2.6 V up to a maximum
current of +400 A (typical). At +400 A, this pin turns into a
High-Voltage Bias Current Source constant current sink. Refer to Figure 12a. In addition, a
This current source biases TOPSwitch-GX from the DRAIN comparator with a threshold of 1 V is connected at the pin and is
pin and charges the CONTROL pin external capacitance used to detect when the pin is shorted to the SOURCE pin.
during start-up or hysteretic operation. Hysteretic operation
occurs during auto-restart, remote off and over-temperature There are a total of four functions available through the use of the
shutdown. In this mode of operation, the current source is LINE-SENSE pin: OV, UV, line feed-forward with DCMAX
switched on and off with an effective duty cycle of General Information & Table of Contents
approximately 35%. This duty cycle is determined by the ratio
reduction, and remote ON/OFF. Connecting the LINE-SENSE
pin to the SOURCE pin disables all four functions. The LINE-
of CONTROL pin charge (IC) and discharge currents (ICD1 and SENSE pin is typically used for line sensing by connecting a
I CD2). This current source is turned off during normal
operation when the output MOSFET is switching. The effect
resistor from this pin to the rectified DC high voltage bus to
implement OV, UV and DCMAX reduction with line voltage. In
1
of the current source switching will be seen on the DRAIN this mode, the value of the resistor determines the line OV/UV
voltage waveform as small disturbances and is normal. Data Sheets
thresholds, and the DCMAX is reduced linearly with rectified DC
high voltage starting from just above the UV threshold. The pin
2
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Using Feature Pins can also be used as a remote ON/OFF and a synchronization input.
Application Notes
Refer to Table 2 for possible combinations of the functions with
example circuits shown in Figure 16 through Figure 40. A
3
FREQUENCY (F) Pin Operation
description of specific functions in terms of the LINE-SENSE
The FREQUENCY pin is a digital input pin available in the
Y, R or F package only. Shorting the FREQUENCY pin to Design Ideas
pin I/V characteristic is shown in Figure 11 (right hand side).
The horizontal axis represents LINE-SENSE pin current with
4
SOURCE pin selects the nominal switching frequency of
positive polarity indicating currents flowing into the pin. The
132 kHz (Figure 13) which is suited for most applications. For
other cases that may benefit from lower switching Design Tools
meaning of the vertical axes varies with functions. For those
that control the on/off states of the output such as UV, OV and
5
frequency such as noise sensitive video applications, a 66 kHz
remote ON/OFF, the vertical axis represents the enable/
switching frequency (half frequency) can be selected by
disable states of the output. UV triggers at IUV (+50 A typical 6
Package
LINE-SENSE AND EXTERNAL CURRENT LIMIT Information
PIN TABLE* 7

Figure Number 16 17 18 19 20 21 22 23 24 25 26 27 28 29
Three Terminal Operation
Under-Voltage
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Overvoltage
LinkSwitch

& TinySwitch-II AC-DC

Seminar

9
Line Feed-Forward (DCMAX)
Overload Power Limiting
TOPSwitch-GX

AC-DC Seminar 10
External Current Limit
Remote ON/OFF
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and

Distributors

11
*This table is only a partial list of many LINE-SENSE and EXTERNAL CURRENT LIMIT pin configurations that are possible.
Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations.
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10 9/03
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TOP242-250
with 30 A hysteresis) and OV triggers at IOV (+225 A MULTI-FUNCTION (M) Pin Operation (P and G Packages)
typical with 8 A hysteresis). Between the UV and OV The LINE-SENSE and EXTERNAL CURRENT LIMIT pin
thresholds, the output is enabled. For line feed-forward with functions are combined to a single MULTI-FUNCTION pin
DCMAX reduction, the vertical axis represents the magnitude of for P and G packages. The comparator with a 1 V threshold at
the DCMAX. Line feed-forward with DCMAX reduction lowers the LINE-SENSE pin is removed in this case as shown in Figure
maximum duty cycle from 78% at IL(DC) (+60 A typical) to 2b. All of the other functions are kept intact. However, since
38% at IOV (+225 A). some of the functions require opposite polarity of input current
(MULTI-FUNCTION pin), they are mutually exclusive. For
EXTERNAL CURRENT LIMIT (X) Pin Operation example, line sensing features cannot be used simultaneously
(Y, R and F Packages) with external current limit setting. When current is fed into
When current is drawn out of the EXTERNAL CURRENT the MULTI-FUNCTION pin, it works as a voltage source of
LIMIT pin, it works as a voltage source of approximately approximately 2.6 V up to a maximum current of +400 A
1.3 V up to a maximum current of -240 A (typical). At (typical). At +400 A, this pin turns into a constant current
-240 A, it turns into a constant current source (refer to sink. When current is drawn out of the MULTI-FUNCTION
Figure 12a). pin, it works as a voltage source of approximately 1.3 V up to
a maximum current of -240 A (typical). At -240 A, it turns
There are two functions available through the use of the into a constant current source. Refer to Figure 12b.
EXTERNAL CURRENT LIMIT pin: external current limit
and remote ON/OFF. Connecting the EXTERNAL CURRENT There are a total of five functions available through the use of
LIMIT pin and SOURCE pin disables the two functions. In the MULTI-FUNCTION pin: OV, UV, line feed-forward with
high efficiency applications this pin can be used to reduce the DCMAX reduction, external current limit and remote ON/OFF.
current limit externally to a value close to the operating peak A short circuit between the MULTI-FUNCTION pin and
current, by connecting the pin to the SOURCE pin through a SOURCE pin disables all five functions and forces
resistor. The pin can also be used for remote ON/OFF. Table 2 TOPSwitch-GX to operate in a simple three terminal mode like
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shows several possible combinations using this pin. See TOPSwitch-II. The MULTI-FUNCTION pin is typically used
Figure 11 for a description of the functions where the horizontal for line sensing by connecting a resistor from this pin to the
axis (left hand side) represents the EXTERNAL CURRENT rectified DC high voltage bus to implement OV, UV and DCMAX
LIMIT pin current. The meaning of the vertical axes varies reduction with line voltage. In this mode, the value of the
with function. For those that control the ON/OFF states of the resistor determines the line OV/UV thresholds, and the DCMAX
output such as remote ON/OFF, the vertical axis represents the is reduced linearly with increasing rectified DC high voltage
enable/disable states of the output. For external current limit, starting from just above the UV threshold. External current
the vertical axis represents the magnitude of the ILIMIT. Please limit programming is implemented by connecting the MULTI-
see graphs in the Typical Performance Characteristics section FUNCTION pin to the SOURCE pin through a resistor.
for the current limit programming range and the selection of However, this function is not necessary in most applications
appropriate resistor value. since the internal current limit of the P and G package devices
has been reduced, compared to the Y, R and F package devices,
to match the thermal dissipation capability of the P and G
MULTI-FUNCTION PIN TABLE*

Figure Number 30 31 32 33 34 35 36 37 38 39 40
Three Terminal Operation
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Under-Voltage
Overvoltage
Line Feed-Forward (DCMAX)
Overload Power Limiting
External Current Limit
Remote ON/OFF
*This table is only a partial list of many MULTI-FUNCTION pin configurations that are possible.
Table 3. Typical MULTI-FUNCTION Pin Configurations.

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TOP242-250
M Pin
X Pin L Pin
IREM(N) IUV IOV

(Enabled)
Output
MOSFET
Switching
(Disabled)
Disabled when supply I

output goes out of
regulation
ILIMIT (Default)
Current
Limit
I
DCMAX (78.5%)
Product Selector Guide 1
Maximum
Duty Cycle
Data Sheets 2
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-22 A
Application Notes
I
3
-27 A
VBG + VTP
Design Ideas 4
VBG
Pin Voltage
Design Tools 5
I
-250 -200 -150 -100 -50 0 50 100 150 200 250 300 350 400

X and L Pins (Y, R or F Package) and M Pin (P or G Package) Current (A)
Package Information
Note: This figure provides idealized functional characteristics with typical performance values. Please refer to the parametric
table and typical performance characteristics sections of the data sheet for measured data.
7
PI-2636-010802

Figure 11. MULTI-FUNCTION (P or G package), LINE-SENSE, and EXTERNAL CURRENT LIMIT (Y, R or F package) Pin Characteristics. 8
packages. It is therefore recommended that the MULTI- the enable/disable states of the output. UV triggers at IUV
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LinkSwitch & TinySwitch-II

FUNCTION pin is used for line sensing as described above AC-DC
(+50 A typical) and OV triggers Seminar
at I (+225 A typical with OV 9
and not for external current limit reduction. The same pin can 30 A hysteresis). Between the UV and OV thresholds, the
also be used as a remote ON/OFF and a synchronization input output is enabled. For external current limit and line feed-
in both modes. Please refer to Table 3 for possible combinations TOPSwitch-GX AC-DC Seminar 10
forward with DCMAX reduction, the vertical axis represents the
of the functions with example circuits shown in Figure 30 magnitude of the ILIMIT and DCMAX. Line feed-forward with
through Figure 40. A description of specific functions in terms DCMAX reduction lowers maximum duty cycle from 78% at
of the MULTI-FUNCTION pin I/V characteristic is shown inSales Representatives and Distributors 11
IM(DC) (+60 A typical) to 38% at IOV (+225 A). External
Figure 11. The horizontal axis represents MULTI-FUNCTION current limit is available only with negative MULTI-
pin current with positive polarity indicating currents flowing FUNCTION pin current. Please see graphs in the Typical
into the pin. The meaning of the vertical axes varies with Performance Characteristics section for the current limit
functions. For those that control the ON/OFF states of the output programming range and the selection of appropriate resistor
such as UV, OV and remote ON/OFF, the vertical axis represents value.
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TOP242-250
Y, R and F Package
CONTROL Pin
TOPSwitch-GX
240 A
(Negative Current Sense - ON/OFF,

Current Limit Adjustment)
EXTERNAL CURRENT LIMIT (X) VBG + VT
(Voltage Sense)
LINE-SENSE (L) 1V
VBG
(Positive Current Sense - Under-Voltage,
Overvoltage, ON/OFF Maximum Duty
Cycle Reduction)
400 A
PI-2634-010802
Figure 12a. LINE-SENSE (L), and EXTERNAL CURRENT LIMIT (X) Pin Input Simplified Schematic.
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P and G Package
CONTROL Pin
TOPSwitch-GX
240 A
(Negative Current Sense - ON/OFF,

Current Limit Adjustment)
VBG + VT
MULTI-FUNCTION (M)
VBG
(Positive Current Sense - Under-Voltage,
Overvoltage, Maximum Duty
Cycle Reduction)
400 A
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PI-2548-092399
Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic.

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TOP242-250
Typical Uses of FREQUENCY (F) Pin
+ +
DC DC
D D
Input Input
Voltage CONTROL Voltage CONTROL
C C
S F S F
- -
PI-2654-071700 PI-2655-071700
Figure 13. Full Frequency Operation (132 kHz).

General Figure
Information & Table of Contents
14. Half Frequency Operation (66 kHz).
+ Data Sheets 2
QS can be an optocoupler output.
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Application Notes 3
DC
D
Input
CONTROL
Voltage C Design Ideas 4
STANDBY
S F 47 k
QS
RHF
20 k 1 nF Design Tools 5
-
PI-2656-040501
Figure 15. Half Frequency Standby Mode (For High Standby
6
Efficiency).
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TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins
+ + VUV = IUV x RLS

VOV = IOV x RLS
For RLS = 2 M
CLXS F D RLS 2 M VUV = 100 VDC
VOV = 450 VDC
DC DC
Input Input DCMAX@100 VDC = 78%
Voltage Voltage DCMAX@375 VDC = 38%
D L D L
CONTROL C S D CONTROL
C C
S X F S
- -
PI-2617-050100 PI-2618-081403
Figure 16. Three Terminal Operation (LINE-SENSE and Figure 17. Line-Sensing for Under-Voltage, Overvoltage and
EXTERNAL CURRENT LIMIT Features Disabled. Line Feed-Forward.
FREQUENCY Pin Tied to SOURCE or CONTROL Pin).
+ +
VUV = RLS x IUV VOV = IOV x RLS
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2 M 2 M
For Value Shown For Values Shown

RLS VUV = 100 VDC RLS VOV = 450 VDC
DC DC
Input 22 k Input 30 k
Voltage Voltage 1N4148
D M D L
CONTROL CONTROL
C C
6.2 V
S
- S -
PI-2510-040501 PI-2620-040501
Figure 18. Line-Sensing for Under-Voltage Only (Overvoltage Figure 19. Line-Sensing for Overvoltage Only (Under-Voltage
Disabled). Disabled). Maximum Duty Cycle Reduced at Low Line
and Further Reduction with Increasing Line Voltage.
+ For RIL = 12 k + ILIMIT = 100% @ 100 VDC

ILIMIT = 69% ILIMIT = 63% @ 300 VDC
RLS 2.5 M
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For RIL = 25 k
ILIMIT = 43%
DC See Figure 54b for DC

D other resistor values D
Input Input
Voltage CONTROL (RIL) Voltage CONTROL
C C
S X S X
RIL RIL
6 k
- -
PI-2623-092303 PI-2624-040501
Figure 20. Externally Set Current Limit. Figure 21. Current Limit Reduction with Line Voltage.

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TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
+ + QR can be an
QR can be an optocoupler optocoupler output or
output or can be replaced by can be replaced
a manual switch. QR
by a manual switch.
ON/OFF
47 k RMC
DC DC
D Input
Input 45 k
Voltage CONTROL Voltage
C D L
CONTROL
S X C
QR ON/OFF
47 k S
- -
PI-2625-040501 PI-2621-040501
Figure 22. Active-on (Fail Safe) Remote ON/OFF.

General Figure
23. Active-off Remote ON/OFF. Maximum Duty Cycle
Reduced.

+ QR can be an optocoupler
output or can be replaced
+ QR Dataoptocoupler
Sheets
Q can be an R
output
2
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ON/OFF or can be replaced
by a manual switch. 47 k RMC by a manual switch.
For RIL = 12 k
ILIMIT = 69%
Application Notes 45 k 3
DC DC
D For RIL = 25 k Input D L
Input
Voltage CONTROL
C
ILIMIT = 43% Voltage CONTROL
Design Ideas
C 4
S X S X
RIL
QR ON/OFF
RIL Design Tools 5
- 47 k -
PI-2627-040501
PI-2626-040501
Figure 24. Active-on Remote ON/OFF with Externally Set Current Figure 25. Active-off Remote ON/OFF with Externally Set Current
Limit. Limit.
+
RLS 2 M
QR can be an optocoupler
DPA-Switch
+ DC-DCVVSeminar
=I xR
=I xR
UV
OV
UV
OV
LS
LS
8
by a manual switch.
DCMAX@100 VDC = 78%
RLS 2 M
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ON/OFF
QR
LinkSwitch
For R = 2 M & TinySwitch-II AC-DC Seminar
LS
Q can be an optocoupler
DCMAX@375 VDC = 38%
9
R
47 k VUV = 100 VDC DC output or can be replaced
D L
VOV = 450 VDC Input by a manual switch.
DC
D L
TOPSwitch-GX AC-DC Seminar
Voltage
For R = 12 k
10
CONTROL
C
IL
Input
Voltage CONTROL ILIMIT = 69%
C S X
Sales Representatives and Distributors 11 RIL
QR
ON/OFF
S -
- 47 k
PI-2622-040501 PI-2628-040501
Figure 26. Active-off Remote ON/OFF with LINE-SENSE. Figure 27. Active-on Remote ON/OFF with LINE-SENSE and
EXTERNAL CURRENT LIMIT.
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TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
PI-2629-092203
VUV = IUV x RLS +
VOV = IOV x RLS
output or can be replaced by
For RLS = 2 M a manual switch.
RLS 2 M
VUV = 100 VDC
VOV = 450 VDC
DC DC 300 k
D L DCMAX@100 VDC = 78% D L
Input Input
DCMAX@375 VDC = 38% CONTROL
Voltage CONTROL Voltage
C C
For RIL = 12 k
S
ILIMIT = 69% S
X
See Figure 54b for QR ON/OFF
RIL
other resistor values 47 k
- 12 k
(RIL) to select different -
ILIMIT values PI-2640-040501
Figure 28. Line-Sensing and Externally Set Current Limit. Figure 29. Active-on Remote ON/OFF.
Typical Uses of MULTI-FUNCTION (M) Pin
+ +
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VUV = IUV x RLS
C S S
VOV = IOV x RLS
M
RLS 2 M For RLS = 2 M
D S S VUV = 100 VDC
DC DC VOV = 450 VDC
Input Input
Voltage Voltage DCMAX@100 VDC = 78%
D M D M DCMAX@375 VDC = 38%
C D S
CONTROL CONTROL
C C
S S
- -
PI-2508-081199 PI-2509-040501
Figure 30. Three Terminal Operation (MULTI-FUNCTION Figure 31. Line Sensing for Undervoltage, Over-Voltage and
Features Disabled). Line Feed-Forward.
+ +
2 M VUV = RLS x IUV VOV = IOV x RLS
2 M
For Value Shown For Values Shown

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RLS RLS
VUV = 100 VDC VOV = 450 VDC
DC DC
Input 22 k Input 30 k
1N4148
Voltage Voltage
D M D M
CONTROL CONTROL
C C
6.2 V
S S
- -
PI-2510-040501 PI-2516-040501
Figure 32. Line Sensing for Under-Voltage Only (Overvoltage Figure 33. Line Sensing for Overvoltage Only (Under-Voltage
Disabled). Disabled). Maximum Duty Cycle Reduced at Low Line
and Further Reduction with Increasing Line Voltage.

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TOP242-250
Typical Uses of MULTI-FUNCTION (M) Pin (cont.)
+ +
For RIL = 12 k
ILIMIT = 69% ILIMIT = 100% @ 100 VDC
RLS 2.5 M ILIMIT = 63% @ 300 VDC
For RIL = 25 k
ILIMIT = 43%
DC DC
See Figures 54b and
Input Input
55b for other resistor
Voltage values (RIL) to select
Voltage
D M D M
different ILIMIT values
CONTROL RIL 6 k CONTROL
RIL C C
S S
- -
PI-2517-092203 PI-2518-040501
General Figure
Figure 34. Externally Set Current Limit (Not Normally Required-
35. Current Limit Reduction with Line Voltage (Not Normally
See M Pin Operation Description). Required-See M Pin Operation Description).

+
+ Data
Q can beSheets
R an optocoupler
2
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output or can be replaced by a manual switch.
by a manual switch.
Application Notes
QR
3
DC DC ON/OFF
Input Input 47 k RMC
Voltage
D M
Voltage
D M
Design Ideas
45 k 4
CONTROL CONTROL
QR C C
ON/OFF
47 k
Design Tools 5
S S
- -
PI-2519-040501 PI-2522-040501
Figure 36. Active-on (Fail Safe) Remote ON/OFF.

Figure 37. Active-off Remote ON/OFF. Maximum Duty Cycle
6
Reduced.
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TOP242-250
Typical Uses of MULTI-FUNCTION (M) Pin (cont.)
+ + QR can be an optocoupler
by a manual switch.
by a manual switch.
For RIL = 12 k QR
ILIMIT = 69% ON/OFF
DC DC 47 k
Input For RIL = 25 k Input
Voltage Voltage RMC 24 k RMC = 2RIL
RIL D M ILIMIT = 43%
D M
CONTROL CONTROL
QR C RIL 12 k C
ON/OFF
47 k S
- S
-
PI-2520-040501 PI-2521-040501
Figure 38. Active-on Remote ON/OFF with Externally Set Figure 39. Active-off Remote ON/OFF with Externally Set
Current Limit (See M Pin Operation Description). Current Limit (See M Pin Operation Description).
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by a manual switch.
RLS 2 M
QR
DC ON/OFF
Input 47 k
Voltage For RLS = 2 M
D M
CONTROL
VUV = 100 VDC
C VOV = 450 VDC
S
-
PI-2523-040501
Figure 40. Active-off Remote ON/OFF with LINE-SENSE.

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TOP242-250
Application Examples provides line sensing, setting UV at 100 VDC and OV at

450 VDC. The extended maximum duty cycle feature of
A High Efficiency, 30 W, Universal Input Power Supply TOPSwitch-GX (guaranteed minimum value of 75% vs. 64%
The circuit shown in Figure 41 takes advantage of several of for TOPSwitch-II) allows the use of a smaller input capacitor
the TOPSwitch-GX features to reduce system cost and power (C1). The extended maximum duty cycle and the higher
supply size and to improve efficiency. This design delivers reflected voltage possible with the RCD clamp also permit the
30 W at 12 V, from an 85 to 265 VAC input, at an ambient of use of a higher primary to secondary turns ratio for T1 which
50 C, in an open frame configuration. A nominal efficiency reduces the peak reverse voltage experienced by the secondary
of 80% at full load is achieved using TOP244Y. rectifier D8. As a result a 60 V Schottky rectifier can be used
for up to 15 V outputs, which greatly improves power supply
The current limit is externally set by resistors R1 and R2 to a efficiency. The frequency reduction feature of the
value just above the low line operating peak DRAIN current TOPSwitch-GX eliminates the need for any dummy loading
of approximately 70% of the default current limit. This allows for regulation at no load and reduces the no load/standby
use of a smaller transformer core size and/or higher transformer consumption of the power supply. Frequency jitter provides
primary inductance for a given output power, reducing improved margin for conducted EMI meeting the CISPR 22
TOPSwitch-GX power dissipation, while at the same time (FCC B) specification.
General Output
avoiding transformer core saturation during startup and output
transient conditions. The resistors R1 & R2 provide a signal
regulation is achieved by using a simple Zener sense
that reduces the current limit with increasing line voltage, which circuit for low cost. The output voltage is determined by the
in turn limits the maximum overload power at high input line
voltage. This function in combination with the built-in soft-
Zener diode (VR2) voltage and the voltage drops across the
optocoupler (U2) LED and resistor R6. Resistor R8 provides
1
start feature of TOPSwitch-GX, allows the use of a low cost bias current to Zener VR2 for typical regulation of 5% at the
RCD clamp (R3, C3 and D1) with a higher reflected voltage,
by safely limiting the TOPSwitch-GX drain voltage, with
Data Sheets
12 V output level, over line and load and component
variations.
2
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adequate margin under worst case conditions. Resistor R4
Application Notes 3
PERFORMANCE SUMMARY
Output Power:
Regulation:
30 W
4%
CY1
2.2 nF
Design Ideas 4
Efficiency: 79% C14 R15
Ripple: 50 mV pk-pk 1 nF 150
Design
L3
3.3 H
Tools
12 V 5
@ 2.5 A
C3 R3
4.7 nF 68 k
1 kV 2W D8
MBR1060 Quality
C10
560 F 560and
C11
F Reliability
C12
220 F
35 V
6
35 V 35 V
BR1
600 V D1 RTN
UF4005
2A
R4 D2
L1 2 M 1N4148 R6
1/2 W 150
20 mH
R1 T1
DPA-Switch
C6
DC-DC150R8
Seminar

8
4.7 M 0.1 F
C1 1/2 W U2
CX1 68 F LTV817A
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100 nF 400 V LinkSwitch

U1
& TinySwitch-II AC-DC Seminar
D L TOPSwitch-GX 9
250 VAC CONTROL
TOP244Y C
F1 S X F TOPSwitch-GX
R5
6.8 AC-DC
VR2
Seminar 10
J1 3.15 A 1N5240C
85-265 VAC
10 V, 2%
L R2
9.09 k Sales Representatives
C5
47 F
10 V
and Distributors 11
N
PI-2657-040501
Figure 41. 30 W Power Supply using External Current Limit Programming and Line Sensing for UV and OV.
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20 9/03
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TOP242-250
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply damage. Capacitor C11 has been added in parallel with VR1 to
The circuit shown in figure 42 takes advantage of several of the reduce Zener clamp dissipation. With a switching frequency of
TOPSwitch-GX features to reduce cost, power supply size and 132 kHz a PQ26/20 core can be used to provide 70 W. To
increase efficiency. This design delivers 70 W at 19 V, from an maximize efficiency, by reducing winding losses, two output
85 to 265 VAC input, at an ambient of 40 C, in a small sealed windings are used each with their own dual 100 V Schottky
adapter case (4 x 2.15 x 1). Full load efficiency is 85% at rectifier (D2 and D3). The frequency reduction feature of the
85 VAC rising to 90% at 230 VAC input. TOPSwitch-GX eliminates any dummy loading to maintain
regulation at no-load and reduces the no-load consumption of the
Due to the thermal environment of a sealed adapter a TOP249Y power supply to only 520 mW at 230 VAC input. Frequency
is used to minimize device dissipation. Resistors R9 and R10 jittering provides conducted EMI meeting the CISPR 22
externally program the current limit level to just above the (FCC B) / EN55022B specification, using simple filter
operating peak DRAIN current at full load and low line. This components (C7, L2, L3 and C6) even with the output earth
allows the use of a smaller transformer core size without grounded.
saturation during startup or output load transients. Resistors R9
and R10 also reduce the current limit with increasing line To regulate the output an optocoupler (U2) is used with a
voltage, limiting the maximum overload power at high input secondary reference sensing the output voltage via a resistor
line voltage, removing the need for any protection circuitry on divider (U3, R4, R5, R6). Diode D4 and C15 filter and smooth
the secondary. Resistor R11 implements an under voltage and the output of the bias winding. Capacitor C15 (1F) prevents the
over voltage sense as well as providing line feed forward for bias voltage from falling during zero to full load transients.
reduced output line frequency ripple. With resistor R11 set at Resistor R8 provides filtering of leakage inductance spikes
2 M the power supply does not start operating until the DC rail keeping the bias voltage constant even at high output loads.
voltage reaches 100 VDC. On removal of the AC input the UV Resistor R7, C9 and C10 together with C5 and R3 provide loop
sense prevents the output glitching as C1 discharges, compensation.
turning off the TOPSwitch-GX when the output regulation is lost
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or when the input voltage falls to below 40 V, whichever Due to the large primary currents, all the small signal control
occurs first. This same value of R11 sets the OV threshold to components are connected to a separate source node that is Kelvin
450 V. If exceeded, for example during a line surge, connected to the source pin of the TOPSwitch-GX. For improved
TOPSwitch-GX stops switching for the duration of the surge common mode surge immunity the bias winding common returns
extending the high voltage withstand to 700 V without device directly to the DC bulk capacitor (C1).
C7 2.2 nF PERFORMANCE SUMMARY

C13 C12 C11 D2
MBR20100 Output Power: 70 W
0.33 F 0.022 F 0.01 F
400 V 400 V 400 V Y1 Safety Regulation: 4%
Efficiency: 84%
Ripple: 120 mV pk-pk
No Load Consumption: < 0.52 W @ 230 VAC
VR1 D3
P6KE- MBR20100
C3 C14
200 820 F L1 0.1 F 19 V
BR1 25 V 200 H 50 V @ 3.6 A
RS805 D1
8A 600 V UF4006
C2 C4 RTN
D4 820 F R1 820 F
1N4148 25 V 270 25 V
L2 R11
820 H 2 M R4
U2 31.6 k
2A 1/2 W R8
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PC817A 1%
C1 4.7
T1 R2
150 F C15 R5
400 V 1 k
C6 TOPSwitch-GX 1 F 562
0.1 F D L 50 V C9 1%
X2 L3 TOP249Y 4.7 nF 50 V
CONTROL
RT1 75 H R9 C U1
10 t 2A 13 M C10
1.7 A R3 0.1 F
S X F R7
F1 6.8 56 k 50 V
J1 3.15 A R10 C8 U3
85-265 VAC
0.1 F TL431 R6
20.5 k 4.75 k
L 50 V C5
47 F 1%
16 V
N All resistors 1/8 W 5% unless otherwise stated.
PI-2691-042203
Figure 42. 70 W Power Supply using Current Limit Reduction with Line and Line Sensing for UV and OV.
K

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TOP242-250
A High Efficiency, 250 W, 250-380 VDC Input Power Supply However, VR1 is essential to limit the peak drain voltage
The circuit shown in figure 43 delivers 250 W (48 V @ 5.2 A) during start-up and/or overload conditions to below the 700 V
at 84% efficiency using a TOP249 from a 250 to 380 VDC rating of the TOPSwitch-GX MOSFET.
input. DC input is shown, as typically at this power level a
p.f.c. boost stage would preceed this supply, providing the DC The secondary is rectifed and smoothed by D2 and C9, C10
input (C1 is included to provide local decoupling). Flyback and C11. Three capacitors are used to meet the secondary ripple
topology is still useable at this power level due to the high current requirement. Inductor L2 and C12 provide switching
output voltage, keeping the secondary peak currents low enough noise filtering.
so that the output diode and capacitors are reasonably sized.
A simple Zener sensing chain regulates the output voltage. The
In this example the TOP249 is at the upper limit of its power sum of the voltage drop of VR2, VR3 and VR4 plus the LED
capability and the current limit is set to the internal maximum drop of U2 gives the desired output voltage. Resistor R6
by connecting the X pin to SOURCE. However, line sensing limits LED current and sets overall control loop DC gain.
is implemented by connecting a 2 M resistor from the L pin Diode D4 and C14 provide secondary soft-finish, feeding
to the DC rail. If the DC input rail rises above 450 VDC, then current into the CONTROL pin prior to output regulation and
TOPSwitch-GX will stop switching until the voltage returns to thus ensuring that the output voltage reaches regulation at start-
normal, preventing device damage. General Information & Table of Contents
up under low line, full load conditions. Resistor R9 provides a
discharge path for C14. Capacitor C13 and R8 provide control
Due to the high primary current, a low leakage inductance loop compensation and are required due to the gain associated
transformer is essential. Therefore, a sandwich winding with
a copper foil secondary was used. Even with this technique
with such a high output voltage. 1
the leakage inductance energy is beyond the power capability Sufficient heat sinking is required to keep the TOPSwitch-GX
of a simple Zener clamp. Therefore, R2, R3 and C6 are added
in parallel to VR1. These have been sized such that during
Data Sheets
device below 110 C when operating under full load, low line
and maximum ambient temperature. Airflow may also be
2
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normal operation very little power is dissipated by VR1, the required if a large heat sink area is not acceptable.
leakage energy instead being dissipated by R2 and R3. Application Notes 3
C7
R2 R3 C6
2.2 nF Y1 D2
MUR1640CT
C10 C11
Design Ideas 4
L2
VR1 68 k 68 k 4.7 nF 560 F 560 F 3 H 8A
+250 - 380 VDC P6KE200 2W 2W 1 kV 63 V 63 V 48 V @ 5.2 A
Design Tools 5
C9 C12
560 F 68 F
63 V 63 V
D1
BYV26C D2 RTN
1N4148 U2
R1 Package Information
LTV817A 7
2 M
1/2 W T1 R9
C4 10 k
C1
22 F
1 F
50 V
8
R6
400 V 100
TOPSwitch-GX
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PERFORMANCE SUMMARY LinkSwitch &TOP249Y

DTinySwitch-II AC-DC Seminar
U1
L D4
1N4148
C13
150 nF 9
CONTROL 63 V
Output Power: 250 W C
VR2 22 V
Line Regulation: 1% BZX79B22
Load Regulation:
Efficiency:
5%
85%
S X F TOPSwitch-GX
R4
6.8
AC-DC Seminar
VR3 12 V
C14 10
C3 R8 22 F
Ripple: < 100 mV pk-pk BZX79B12 63 V
0.1 F C3 56
No Load Consumption: 1.4 W (300 VDC) 47 F
50 V
VR4 12 V
BZX79B12 10 V
0V
All resistor 1/8 W 5% unless
otherwise stated. PI-2692-042203
Figure 43. 250 W, 48 V Power Supply using TOP249.
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22 9/03
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TOP242-250
Multiple Output, 60 W, 185-265 VAC Input Power Supply to the relatively large size of C2). An optional MOV (RV1)
Figure 44 shows a multiple output supply typical for high end extends the differential surge protection to 6 kV from 4 kV.
set-top boxes or cable decoders containing high capacity hard
disks for recording. The supply delivers an output power of Leakage inductance clamping is provided by VR1, R5 and C5,
45 W cont./60 W peak (thermally limited) from an input keeping the DRAIN voltage below 700 V under all conditions.
voltage of 185 to 265 VAC. Efficiency at 45 W, 185 VAC is Resistor R5 and capacitor C5 are selected such that VR1
75%. dissipates very little power except during overload conditions.
The frequency jittering feature of TOPSwitch-GX allows the
The 3.3 V and 5 V outputs are regulated to 5% without the circuit shown to meet CISPR22B with simple EMI filtering
need for secondary linear regulators. DC stacking (the (C1, L1 and C6) and the output grounded.
secondary winding reference for the other output voltages is
connected to the cathode of D10 rather than the anode) is used The secondaries are rectified and smoothed by D7 to D11, C7,
to minimize the voltage error for the higher voltage outputs. C9, C11, C13, C14, C16 and C17. Diode D11 for the 3.3 V
output is a Schottky diode to maximize efficiency. Diode D10
Due to the high ambient operating temperature requirement for the 5 V output is a PN type to center the 5 V output at 5 V.
typical of a set-top box (60 C) the TOP246Y is used to The 3.3 V and 5 V output require two capacitors in parallel to
reduce conduction losses and minimize heat sink size. Resistor meet the ripple current requirement. Switching noise filtering
R2 sets the device current limit to 80% of typical to limit is provided by L2 to L5 and C8, C10, C12, C15 and C18.
overload power. The line sense resistor (R1) protects the Resistor R6 prevents peak charging of the lightly loaded 30 V
TOPSwitch-GX from line surges and transients by sensing when output. The outputs are regulated using a secondary reference
the DC rail voltage rises to above 450 V. In this condition the (U3). Both the 3.3 V and 5 V outputs are sensed via R11 and
TOPSwitch-GX stops switching, extending the input voltage R10. Resistor R8 provides bias for U3 and R7 sets the overall
withstand to 496 VAC which is ideal for countries with poor DC gain. Resistor R9, C19, R3 and C5 provide loop
power quality. A thermistor (RT1) is used to prevent compensation. A soft-finish capacitor (C20) eliminates output
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premature failure of the fuse by limiting the inrush current (due overshoot.
PERFORMANCE SUMMARY
Output Power: 45 W Cont./60 W Peak
Regulation:
R6 D7
3.3 V: 5% 10 UF4003 30 V @
5 V: 5% 0.03 A
C7 L2 C8
12 V: 7% D8 47 F 3.3 H 10 F
18 V: 7% UF5402 50 V 3A 50 V 18 V @
0.5 A
30 V: 8% C9 L3 C10
Efficiency: 75% D9 330 F 3.3 H 100 F
No Load Consumption: 0.6 W UF5402 25 V 3A 25 V 12 V @
0.6 A
C11 C13 C16 C12
C6 L4
390 F 1000 F 1000 F 100 F
2.2 nF 35 V 25 V 25 V 3.3 H
Y1 25 V
VR1 5A 5V@
R5 3.2 A
P6KE170 68 k
2W C14 L5 C15
D10 1000 F 3.3 H 220 F
BYV32-200 25 V 5A 165 V 3.3 V @
C5 3A
1 nF C18
400 V D11 C17
MBR1045 220 F
1000 F 16 V
D1-D4 25 V
1N4007 V D6 RTN
1N4937
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C2
L1 68 F
20 mH 400 V D6 C3 R10
R7 15.0
0.8A R1 1N4148 1 F 150
50 V k
C1 2 M T1 U2
1/2 W LTV817 R8
0.1 F 1 k R11
X1 9.53
k
RV1 D L TOPSwitch-GX
275 V CONTROL R9 C19
14 mm C
3.3 k 0.1 F
F1 TOP246Y C3
0.1 F R3
J1
3.15 A U1 S X F 6.8
RT1 50 V
185-265 VAC
10 R2 C5 C20 U3
L TL431 R12
1.7 A 9.08 k 47 F 22 F
10 V 10 V 10 k
N
PI-2693-042203
Figure 44. 60 W Multiple Output Power Supply using TOP246.

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TOP242-250
Processor Controlled Supply Turn On/Off parking the print heads in the storage position. In the case of
A low cost momentary contact switch can be used to turn the products with a disk drive, the shutdown procedure may include
TOPSwitch-GX power on and off under microprocessor saving data or settings to the disk. After the shutdown procedure
control that may be required in some applications such as is complete, when it is safe to turn off the power supply, the
printers. The low power remote off feature allows an elegant microprocessor releases the M pin by turning the optocoupler
implementation of this function with very few external U4 off. If the manual switch and the optocouplers U3 and U4
components as shown in Figure 45. Whenever the push button are not located close to the M pin, a capacitor CM may be needed
momentary contact switch P1 is closed by the user, the to prevent noise coupling to the pin when it is open.
optocoupler U3 is activated to inform the microprocessor of
this action. Initially, when the power supply is off (M pin is The power supply could also be turned on remotely through a
floating), closing of P1 turns the power supply on by shorting local area network or a parallel or serial port by driving the
the M pin of the TOPSwitch-GX to SOURCE through a diode optocoupler U4 input LED with a logic signal. Sometimes it is
(remote on). When the secondary output voltage VCC is easier to send a train of logic pulses through a cable (due to AC
established, the microprocessor comes alive and recognizes that coupling of cable, for example) instead of a DC logic level as
the switch P1 is closed through the switch status input that is a wake up signal. In this case, a simple RC filter can be used to
driven by the optocoupler U3 output. The microprocessor then generate a DC level to drive U4 (not shown in Figure 45). This
sends a power supply control signal to hold the power supply
in the on-state through the optocoupler U4. If the user presses
remote on feature can be used to wake up peripherals such as
printers, scanners, external modems, disk drives, etc., as needed
the switch P1 again to command a turn off, the microprocessor from a computer. Peripherals are usually designed to turn off
detects this through the optocoupler U3 and initiates a shutdown
procedure that is product specific. For example, in the case of
automatically if they are not being used for a period of time, to
save power.
1
the inkjet printer, the shutdown procedure may include safely
Data Sheets 2
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Application Notes VCC
(+5 V) 3
+
Design Ideas 4
External
Wake-up
High Voltage
DC Input Design Tools Signal
5
MICRO Power
PROCESSOR/ Supply
100 k CONTROLLER ON/OFF
27 k U2 Quality and Reliability Control
6
LOGIC LOGIC 1N4148
1N4148
INPUT OUTPUT 6.8 k
U4
D M
CONTROL
TOPSwitch-GX
U3 C
6.8 k
P1
CM
1 nF
S F U1 47 F DPA-Switch DC-DC Seminar
U3
LTV817A
P1 Switch 8
Status U4
- LTV817A
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LinkSwitch & TinySwitch-II AC-DC Seminar RETURN 9

PI-2561-042303
Figure 45. Remote ON/OFF using Microcontroller. TOPSwitch-GX AC-DC Seminar 10

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TOP242-250
In addition to using a minimum number of components, sequence when it detects the first closure of the switch, and
TOPSwitch-GX provides many technical advantages in this type subsequent bouncing of the switch has no effect. If necessary,
of application: the microprocessor could implement the switch debouncing
in software during turn-off, or a filter capacitor can be used
1. Extremely low power consumption in the off mode: 80 mW at the switch status input.
typical at 110 VAC and 160 mW typical at 230 VAC. This
is because in the remote/off mode the TOPSwitch-GX 4. No external current limiting circuitry is needed for the
consumes very little power, and the external circuitry does operation of the U4 optocoupler output due to internal
not consume any current (either M, L or X pin is open) from limiting of M pin current.
the high voltage DC input.
5. No high voltage resistors to the input DC voltage rail are
2. A very low cost, low voltage/current, momentary contact required to power the external circuitry in the primary. Even
switch can be used. the LED current for U3 can be derived from the CONTROL
pin. This not only saves components and simplifies layout,
3. No debouncing circuitry for the momentary switch is required. but also eliminates the power loss associated with the high
During turn-on, the start-up time of the power supply voltage resistors in both on and off states.
(typically 10 to 20 ms) plus the microprocessor initiation
time act as a debouncing filter, allowing a turn-on only if the 6. Robust design: There is no on/off latch that can be accidentally
switch is depressed firmly for at least the above delay time. triggered by transients. Instead, the power supply is held in
During turn-off, the microprocessor initiates the shutdown the on-state through the secondary side microprocessor.
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TOP242-250
Key Application Considerations

TOPSwitch-II vs. TOPSwitch-GX
Table 4 compares the features and performance differences Other features increase the robustness of design allowing cost
between TOPSwitch-GX and TOPSwitch-II. Many of the new savings in the transformer and other power components.
features eliminate the need for additional discrete components.
Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages
Soft-Start N/A* 10 ms Limits peak current and voltage

component stresses during start-up
Eliminates external components
used for soft-start in most
applications
Reduces or eliminates output
overshoot
External Current Limit N/A*
General
Programmable
Information
11,20,21,
& Table of Contents
Smaller transformer
100% to 30% of 24,25,27, Higher efficiency
default current 28,34,35, Allows power limiting (constant over-
limit 38,39 Product Selector Guide
load power independent of line 1
voltage
Allows use of larger device for lower
Data Sheets
losses, higher efficiency and smaller 2
heatsink
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DCMAX 67% 78% 7 Smaller input cap (wider dynamic
Application Notes
range) 3
Higher power capability (when used
with RCD clamp for large VOR)
Design Ideas
Allows use of Schottky secondary 4
rectifier diode for up to 15 V output
for high efficiency
Line Feed Forward with N/A* 78% to 38% 7,11,17, Design Tools
Rejects line ripple 5
DCMAX Reduction 26,27,28,
31,40
Line OV Shutdown N/A* Single resistor 11,17,19,Quality
Increasesand
voltageReliability
withstand cap- 6
programmable 26,27,28, ability against line surge
31,33,40
Line UV Detection N/A* Single resistor 11,17,18, Package Information
Prevents auto-restart glitches 7
programmable 26,27,28, during power down
31,32,40
Switching Frequency 100 kHz 10% 132 kHz 6% DPA-Switch
13,15 DC-DC
Smaller transformer Seminar 8
Below start of conducted EMI limits
Switching Frequency N/A* 66 kHz 7% 14,15 Lower losses when using RC and
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Option (Y, R and F LinkSwitch & TinySwitch-II AC-DC Seminar RCD snubber for noise reduction in 9
Packages) video applications
Allows for higher efficiency in
standby mode
Lower EMI (second harmonic below
150 kHz)
Frequency Jitter N/A* Sales Representatives
4 kHz@132 kHz 9,46 and Distributors 11
Reduces conducted EMI
2 kHz@66 kHz
Frequency Reduction N/A* At a Duty Cycle 7 Zero load regulation without dummy
below 10% load
Low power consumption at no load
Table 4. Comparison Between TOPSwitch-II and TOPSwitch-GX. (continued on next page) *Not available
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26 9/03
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TOP242-250
Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages
Remote ON/OFF N/A* Single transistor 11, 22, Fast on/off (cycle by cycle)
or optocoupler 23, 24, Active-on or active-off control
interface or manual 25, 26, Low consumption in remote off state
switch 27, 29, Active-on control for fail-safe
36, 37, Eliminates expensive in-line on/off
38, 39, switch
40 Allows processor controlled turn
on/off
Permits shutdown/wake-up of
peripherals via LAN or parallel port
Synchronization N/A* Single transistor Synchronization to external lower
or optocoupler frequency signal
interface Starts new switching cycle on
demand
Thermal Shutdown 125 C min. Hysteretic 130 C Automatic recovery from thermal
Latched min. Shutdown (with fault
75 C hysteresis) Large hysteresis prevents circuit
board overheating
Current Limit Tolerance 10% (@25 C) 7% (@25 C) 10% higher power capability due to
-8% (0 C to100 C) -4% Typical tighter tolerance
(0 C to 100 C)**
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DRAIN DIP 0.037" / 0.94 mm 0.137" / 3.48 mm Greater immunity to arcing as a
Creepage SMD 0.037" / 0.94 mm 0.137" / 3.48 mm result of build-up of dust, debris and
at Package TO-220 0.046" / 1.17 mm 0.068" / 1.73 mm other contaminants
DRAIN Creepage at 0.045" / 1.14 mm 0.113" / 2.87 mm Preformed leads accommodate
PCB for Y, R and F (R and F (preformed leads) large creepage for PCB layout
Packages Package N/A*) Easier to meet Safety (UL/VDE)
Table 4 (cont). Comparison Between TOPSwitch-II and TOPSwitch-GX. *Not available **Current limit set to internal maximum
TOPSwitch-FX vs. TOPSwitch-GX
Table 5 compares the features and performance differences Other features increase the robustness of design allowing cost
between TOPSwitch-GX and TOPSwitch-FX. Many of the new savings in the transformer and other power components.
features eliminate the need for additional discrete components.
Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages
Light Load Operation Cycle skipping Frequency and Duty Cycle Improves light load efficiency
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reduction Reduces no-load consumption

Line Sensing/Externally Line sensing and Line sensing and externally Additional design flexibility allows all
Set Current Limit externally set set current limit possible features to be used simultaneously
(Y, R and F Packages) current limit simultaneously
mutually (functions split onto
exclusive (M pin) L and X pins)
Current Limit 100-40% 100-30% Minimizes transformer core size
Programming in highly continuous designs
Range
Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. (continued on next page)

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TOP242-250
Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages
P/G Package Current Identical to Y TOP243-245 P and G Matches device current limit to
Limits packages packages internal current package dissipation capability
limits reduced Allows more continuous design to
lower device dissipation (lower RMS
currents)
Y/R/F Package Current 100% (R and F 90% (for equivalent RDS (ON)) Minimizes transformer core size
Limits package N/A*) Optimizes efficiency for most
applications
Thermal Shutdown 125 C min. 130 C min. 75 C Allows higher output powers in
70 C hysteresis hysteresis high ambient temperature
applications
Maximum Duty Cycle 90 A 60 A Reduces output line frequency
Reduction Threshold ripple at low line
DMAX reduction optimized for
forward design
Line Under-Voltage N/A* 40% of positive (turn-on) Provides a well defined turn-off
Negative (turn-off) threshold Product Selector Guide
threshold as the line voltage falls 1
Threshold
Soft-Start 10 ms (duty cycle) 10 ms (duty cycle + current
limit)
Data Sheets
Gradually increasing current limit
in addition to duty cycle during soft-
2
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start further reduces peak current
Application Notes
and voltage
Further reduces component
3
stresses during start up
Table 5 (cont). Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available Design Ideas 4
TOPSwitch-GX Design Considerations Input Capacitor Design Tools 5
The input capacitor must be chosen to provide the minimum DC
Power Table voltage required for the TOPSwitch-GX converter to maintain
Data sheet power table (Table 1) represents the maximum practical Quality and Reliability
regulation at the lowest specified input voltage and maximum 6
continuous output power based on the following conditions: output power. Since TOPSwitch-GX has a higher DCMAX than
TOP242 to TOP246: 12 V output, Schottky output diode, 150 V TOPSwitch-II, it is possible to use a smaller input capacitor.
reflected voltage (VOR) and efficiency estimates from curves Package Information
For TOPSwitch-GX, a capacitance of 2 F per watt is possible 7
contained in application note AN-29. TOP247 to TOP250: Higher for universal input with an appropriately designed transformer.
output voltages, with a maximum output current of 6 A.
Primary Clamp and Output Reflected Voltage VOR 8
For all devices, a 100 VDC minimum for 85-265 VAC and A primary clamp is necessary to limit the peak TOPSwitch-GX
250 VDC minimum for 230 VAC are assumed and sufficient heat drain to source voltage. A Zener clamp requires few parts and
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sinking to keep device temperature 100 C. Power takes up little board space. For good efficiency, the clamp 9
levels shown in the power table for the R package device Zener should be selected to be at least 1.5 times the output
assume 6.45 cm2 of 610 g/m2 copper heat sink area in an reflected voltage VOR as this keeps the leakage spike conduction
enclosed adapter, or 19.4 cm2 in an open frame. TOPSwitch-GX AC-DC Seminar 10
time short. When using a Zener clamp in a universal input
application, a VOR of less than 135 V is recommended to allow
TOPSwitch-GX Selection for the absolute tolerances and temperature variations of the
Selecting the optimum TOPSwitch-GX depends upon required Zener. This will ensure efficient operation of the clamp circuit
maximum output power, efficiency, heat sinking constraints and will also keep the maximum drain voltage below the rated
and cost goals. With the option to externally reduce current breakdown voltage of the TOPSwitch-GX MOSFET.
limit, a larger TOPSwitch-GX may be used for lower power
applications where higher efficiency is needed or minimal heat
sinking is available.
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28 9/03
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TOP242-250
A high VOR is required to take full advantage of the wider DCMAX below 150 kHz, above which the conducted EMI specifications
of TOPSwitch-GX. An RCD clamp provides tighter clamp get much tighter.
voltage tolerance than a Zener clamp and allows a VOR as high as
150 V. RCD clamp dissipation can be minimized by reducing For 10 W or below, it is possible to use a simple inductor in
the external current limit as a function of input line voltage (see place of a more costly AC input common mode choke to meet
Figure 21 and 35). The RCD clamp is more cost effective than worldwide conducted EMI limits.
the Zener clamp but requires more careful design (see quick
design checklist). Transformer Design
It is recommended that the transformer be designed for
Output Diode maximum operating flux density of 3000 Gauss and a peak flux
The output diode is selected for peak inverse voltage, output density of 4200 Gauss at maximum current limit. The turns ratio
current, and thermal conditions in the application (including should be chosen for a reflected voltage (VOR) no greater than
heatsinking, air circulation, etc.). The higher DC MAX of 135 V when using a Zener clamp, or 150 V (max) when using
TOPSwitch-GX along with an appropriate transformer turns ratio RCD clamp with current limit reduction with line voltage
can allow the use of a 60 V Schoktty diode for higher efficiency (overload protection).
on output voltages as high as 15 V (see Figure 41. A 12 V, 30 W
design using a 60 V Schottky for the output diode). 80
PI-2576-010600
70 TOPSwitch-II (no jitter)
Bias Winding Capacitor
Due to the low frequency operation at no-load a 1 F bias 60
Amplitude (dBV)
winding capacitor is recommended. 50
40
Soft-Start
30
Generally a power supply experiences maximum stress at
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start-up before the feedback loop achieves regulation. For a 20
period of 10 ms the on-chip soft-start linearly increases the duty -10
cycle from zero to the default DCMAX at turn on. In addition, the
0
primary current limit increases from 85% to 100% over the same EN55022B (QP)
period. This causes the output voltage to rise in an orderly -10 EN55022B (AV)
manner allowing time for the feedback loop to take control of the -20
duty cycle. This reduces the stress on the TOPSwitch-GX 0.15 1 10 30
MOSFET, clamp circuit and output diode(s), and helps prevent Frequency (MHz)
transformer saturation during start-up. Also soft-start limits the Figure 46a. TOPSwitch-II Full Range EMI Scan
amount of output voltage overshoot, and in many applications (100 kHz, No Jitter).
eliminates the need for a soft-finish capacitor.
80
PI-2577-010600
EMI
The frequency jitter feature modulates the switching frequency 70 TOPSwitch-GX (with jitter)
over a narrow band as a means to reduce conducted EMI peaks 60
Amplitude (dBV)
associated with the harmonics of the fundamental switching 50

frequency. This is particularly beneficial for average detection
40
mode. As can be seen in Figure 46, the benefits of jitter increase
with the order of the switching harmonic due to an increase in 30
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frequency deviation. 20
-10
The FREQUENCY pin of TOPSwitch-GX offers a switching
0
frequency option of 132 kHz or 66 kHz. In applications that EN55022B (QP)
require heavy snubbers on the drain node for reducing high -10 EN55022B (AV)
frequency radiated noise (for example, video noise sensitive -20
applications such as VCR, DVD, monitor, TV, etc.), operating at 0.15 1 10 30
66 kHz will reduce snubber loss resulting in better efficiency. Frequency (MHz)
Also, in applications where transformer size is not a concern, use
Figure 46b. TOPSwitch-GX Full Range EMI Scan (132 kHz,
of the 66 kHz option will provide lower EMI and higher with Jitter) with Identical Circuitry and
efficiency. Note that the second harmonic of 66 kHz is still Conditions.

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TOP242-250
For designs where operating current is significantly lower than In addition to the 47 F CONTROL pin capacitor, a high
the default current limit, it is recommended to use an externally frequency bypass capacitor in parallel may be used for better
set current limit close to the operating peak current to reduce noise immunity. The feedback optocoupler output should also
peak flux density and peak power (see Figures 20 and 34). In be located close to the CONTROL and SOURCE pins of
most applications, the tighter current limit tolerance, higher TOPSwitch-GX.
switching frequency and soft-start features of TOPSwitch-GX
contribute to a smaller transformer when compared to Y-Capacitor
TOPSwitch-II. The Y-capacitor should be connected close to the secondary
output return pin(s) and the positive primary DC input pin of
Standby Consumption the transformer.
Frequency reduction can significantly reduce power loss at light
or no load, especially when a Zener clamp is used. For very Heat Sinking
low secondary power consumption use a TL431 regulator for The tab of the Y package (TO-220) or F package (TO-262) is
feedback control. Alternately, switching losses can be internally electrically tied to the SOURCE pin. To avoid
significantly reduced by changing from 132 kHz in normal circulating currents, a heat sink attached to the tab should not
operation to 66 kHz under light load conditions. be electrically tied to any primary ground/source nodes on the
TOPSwitch-GX Layout Considerations

PC board.
When using a P (DIP-8), G (SMD-8) or R (TO-263) package,

As TOPSwitch-GX has additional pins and operates at much
higher power levels compared to previous TOPSwitch
a copper area underneath the package connected to the
SOURCE pins will act as an effective heat sink. On double
1
families, the following guidelines should be carefully sided boards (Figure 49), top side and bottom side areas
followed. Data Sheets
connected with vias can be used to increase the effective heat
sinking area.
2
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Primary Side Connections
Use a single point (Kelvin) connection at the negative terminal
of the input filter capacitor for TOPSwitch-GX source pin and
Application Notes
In addition, sufficient copper area should be provided at the
anode and cathode leads of the output diode(s) for heat
3
bias winding return. This improves surge capabilities by sinking.
returning surge currents from the bias winding directly to the
input filter capacitor.
Design Ideas
In Figures 47, 48 and 49 a narrow trace is shown between the
4
output rectifier and output filter capacitor. This trace acts as a
The CONTROL pin bypass capacitor should be located as
close as possible to the SOURCE and CONTROL pins and its
Design Tools
thermal relief between the rectifier and filter capacitor to
prevent excessive heating of the capacitor.
5
SOURCE connection trace should not be shared by the main
MOSFET switching currents. All SOURCE pin referenced
components connected to the MULTI-FUNCTION, LINE-
Quick Design Checklist 6
SENSE or EXTERNAL CURRENT LIMIT pins should also As with any power supply design, all TOPSwitch-GX designs
be located closely between their respective pin and SOURCE.
Once again the SOURCE connection trace of these
Package Information
should be verified on the bench to make sure that components
specifications are not exceeded under worst case conditions.
7
components should not be shared by the main MOSFET The following minimum set of tests is strongly recommended:
switching currents. It is very critical that SOURCE pin
switching currents are returned to the input capacitor negative
1. Maximum drain voltage Verify that peak VDS does not
8
terminal through a seperate trace that is not shared by the exceed 675 V at highest input voltage and maximum
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components connected to CONTROL, MULTI-FUNCTION,
LINE-SENSE or EXTERNAL CURRENT LIMIT pins. This
overload output power. Maximum overload output power
occurs when the output is overloaded to a level just before
9
is because the SOURCE pin is also the controller ground the power supply goes into auto-restart (loss of regulation).
reference pin. TOPSwitch-GX AC-DC Seminar 10
2. Maximum drain current At maximum ambient
Any traces to the M, L or X pins should be kept as short as temperature, maximum input voltage and maximum output
possible and away from the DRAIN trace to prevent noise
coupling. LINE-SENSE resistor (R1 in figures 47-49) should
load, verify drain current waveforms at start-up for any signs
of transformer saturation and excessive leading edge current
be located close to the M or L pin to minimize the trace length spikes. TOPSwitch-GX has a leading edge blanking time
on the M or L pin side. of 220 ns to prevent premature termination of the on-cycle.
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30 9/03
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TOP242-250
Safety Spacing Maximize hatched copper

areas ( ) for optimum
Y1- heat sinking
Capacitor
+ Output Rectifier
HV Output Filter Capacitor
Input Filter Capacitor
- PRI T
r
BIAS a SEC
n
s
PRI f
S S D o
r
m
TOPSwitch-GX
e
BIAS r
TOP VIEW
M S S C
Opto-
R1 coupler
- DC +
R2 Out
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PI-2670-042301
Figure 47. Layout Considerations for TOPSwitch-GX using P or G Packages.
Safety Spacing
Y1- Maximize hatched copper

+ Capacitor
areas ( ) for optimum
heat sinking
HV Input Filter Capacitor
Output Rectifier
Output Filter Capacitor
-
T
r SEC
a
TOPSwitch-GX
n
D s
f
o
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X r
L m
C e
TOP VIEW r
Opto-
R1 Heat Sink coupler
- DC +
Out
PI-2669-042301
Figure 48. Layout Considerations for TOPSwitch-GX using Y or F Package.

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TOP242-250
Solder Side Output Filter Capacitors

Safety Spacing
Component Side
Y1-
+ Capacitor
TOP VIEW
HV
T
PRI r
Input Filter
a
n
Capacitor PRI s
- SEC
f
R1a - 1c o
r
m
BIAS e
r
D
S
X
L
- DC +
1
C Out
Opto- Maximize hatched copper
coupler
areas( Data Sheets
) for optimum 2
heat sinking
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TOPSwitch-GX
PI-2734-043001
Figure 49. Layout Considerations for TOPSwitch-GX using R Package. Application Notes 3
Verify that the leading edge current spike is below the Design Tools Design Ideas 4
allowed current limit envelope (see Figure 52) for the drain
For a discussion on utilizing TOPSwitch-GX in a forward
current waveform at the end of the 220 ns blanking period.
Design Tools
converter configuration, please refer to the TOPSwitch-GX 5
Forward Design Methodology Application Note.
3.Thermal check At maximum output power, minimum
input voltage and maximum ambient temperature, verify
that temperature specifications are not exceeded for Quality and Reliability
Up-to-date information on design tools can be found at the 6
Power Integrations Web site: www.powerint.com
TOPSwitch-GX, transformer, output diodes and output
capacitors. Enough thermal margin should be allowed for
the part-to-part variation of the RDS(ON) of TOPSwitch-GX Package Information 7
as specified in the data sheet. The margin required can
either be calculated from the tolerances or it can be
accounted for by connecting an external resistance in DPA-Switch DC-DC Seminar 8
series with the DRAIN pin and attached to the same
heatsink, having a resistance value that is equal to the
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difference between the measured RDS(ON) of the device
9
under test and the worst case maximum specification.
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TOP242-250
ABSOLUTE MAXIMUM RATINGS(1)

DRAIN Voltage ............................................ -0.3 to 700 V CONTROL Current ............................................... 100 mA
DRAIN Peak Current: TOP242 ............................... 0.72 A LINE SENSE Pin Voltage ................................ -0.3 to 9 V
TOP243 ............................... 1.44 A CURRENT LIMIT Pin Voltage ..................... -0.3 to 4.5 V
TOP244 ............................... 2.16 A MULTI-FUNCTION Pin Voltage .................... -0.3 to 9 V
TOP245 ............................... 2.88 A FREQUENCY Pin Voltage ............................... -0.3 to 9 V
TOP246 ............................... 4.32 A Storage Temperature ..................................... -65 to 150 C
Operating Junction Temperature(2) ................ -40 to 150 C
TOP247 ............................... 5.76 A
Lead Temperature(3) ................................................ 260 C
TOP248 ............................... 7.20 A
Notes:
TOP249 ............................... 8.64 A 1. All voltages referenced to SOURCE, TA = 25 C.
TOP250 ............................. 10.08 A 2. Normally limited by internal circuitry.
CONTROL Voltage .......................................... -0.3 to 9 V 3. 1/16" from case for 5 seconds.
THERMAL IMPEDANCE
Thermal Impedance: Y or F Package: Notes:
(JA) (1) ....................................... 80 C/W 1. Free standing with no heatsink.
(JC) (2) ......................................... 2 C/W 2. Measured at the back surface of tab.
P or G Package: 3. Soldered to 0.36 sq. inch (232 mm2), 2 oz. (610 g/m2) copper clad.
(3)
(JA) ...................... 70 C/W ; 60 C/W (4) 4. Soldered to 1 sq. inch (645 mm2), 2 oz. (610 g/m2) copper clad.
(JC) ....................................... 11 C/W 5. Measured on the SOURCE pin close to plastic interface.
(5)
6. Soldered to 3 sq. inch (1935 mm2), 2 oz. (610 g/m2) copper clad.
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R Package:
(7)
(JA) ... 80 C/W ; 40 C/W ; 30 C/W (4) (6) 7. Soldered to foot print area, 2 oz. (610 g/m2) copper clad.
(5)
(JC) ......................................... 2 C/W
Conditions
(Unless Otherwise Specified)
Parameter Symbol Min Typ Max Units
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 C
CONTROL FUNCTIONS
FREQUENCY Pin
Switching IC = 3 mA; Connected to SOURCE
124 132 140
Frequency fOSC
TJ = 25 C kHz
(average) FREQUENCY Pin 61.5 66 70.5
Connected to CONTROL
Duty Cycle at
ONSET of Fre- DC(ONSET) 10 %
quency Reduction
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Switching 132 kHz Operation 30

Frequency near fOSC(DMIN) kHz
0% Duty Cycle 66 kHz Operation 15
Frequency Jitter 132 kHz Operation 4

f kHz
Deviation 66 kHz Operation 2
Frequency Jitter fM
Modulation Rate 250 Hz

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TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 C
CONTROL FUNCTIONS (cont.)

IL IL (DC) or IM IM(DC) 75 78 83
IL or IM = 190 A
28 38 50
TOP242-245
Maximum Duty IL or IM = 100 A
DCMAX 66.5
Cycle IC = ICD1 TOP242-245 %
IL or IM = 190 A
33
General Information &41.3 49.5
Table
TOP246-250 of Contents
IL or IM = 100 A
60 66.8 73.5
TOP246-250 Product Selector Guide 1
Soft Start Time tSOFT TJ = 25 C; DCMIN to DCMAX 10 15 ms
Data Sheets 2
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PWM Gain DCreg IC = 4 mA; TJ = 25 C -28 -23 -18 %/mA
Application Notes 3
PWM Gain See Note A -0.01 %/mA/C
Temperature Drift
TOP242-245 1.2 2.0Design
3.0 Ideas 4
External Bias lB See Figure 7 TOP246-249 1.6 2.6 4.0
Current mA
TOP250 1.7 2.7Design
4.2 Tools 5
CONTROL TOP242-245 6.0 7.0
Current at 0% lC(OFF) TJ = 25 C TOP246-249 Quality 6.6
and Reliability
8.0 mA 6
Duty Cycle TOP250 7.3 8.5
Dynamic ZC IC = 4 mA; TJ = 25 C Package
10 15
Information
22 7
Impedance See Figure 51
Dynamic
Impedance
DPA-Switch DC-DC
0.18
Seminar
%/C
8
Temperature Drift
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CONTROL Pin LinkSwitch & TinySwitch-II AC-DC

7
Seminar
kHz
9
Internal Filter Pole
SHUTDOWN/AUTO-RESTART TOPSwitch-GX AC-DC Seminar 10
CONTROL Pin VC = 0 V -5.0 -3.5 -2.0
lC (CH) TJ = 25 C mA
Charging Current Sales Representatives
V =5V -3.0 and
-1.8 Distributors
C -0.6 11
Charging Current
See Note A 0.5 %/C
Temperature Drift
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34 9/03
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TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 C
SHUTDOWN/AUTO-RESTART (cont.)
Auto-restart Upper VC(AR)U V
5.8
Threshold Voltage
Auto-restart Lower VC(AR)L 4.5 4.8 5.1 V
Threshold Voltage
Auto-restart VC(AR)hyst 0.8 1.0 V
Hysteresis Voltage
Auto-restart Duty 4 8 %
DC(AR)
Cycle
Auto-restart
f(AR) 1.0 Hz
Frequency
MULTI-FUNCTION (M), LINE-SENSE (L) AND EXTERNAL CURRENT LIMIT (X) INPUTS
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Line Under-Voltage Threshold 44 50 54 A
Threshold Current
lUV TJ = 25 C
and Hysteresis
Hysteresis 30 A
(M or L Pin)
Line Overvoltage
Threshold 210 225 240 A
or Remote ON/
OFF Threshold IOV TJ = 25 C
Current and Hys- Hysteresis 8 A
teresis (M or L Pin)
L Pin Voltage VL(TH) 0.5 1.0 1.6 V
Threshold
Remote ON/OFF Threshold -35 -27 -20 A
Negative Threshold IREM (N) TJ = 25 C
Current and Hyster-
Hysteresis 5 A
esis (M or X Pin)
IL(SC) or
L or M Pin Short
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IM(SC) VL, VM = VC 300 400 520 A

Circuit Current
IX(SC) or Normal Mode -300 -240 -180
X or M Pin Short VX, VM = 0 V A
Circuit Current IM(SC) Auto-restart Mode -110 -90 -70
lL or lM = 50 A 1.90 2.50 3.00
L or M Pin Voltage VL, VM V
(Positive Current) lL or lM = 225 A 2.30 2.90 3.30
X Pin Voltage lX = -50 A 1.26 1.33 1.40
VX V
(Negative Current) lX = -150 A 1.18 1.24 1.30
M Pin Voltage lM = -50 A 1.24 1.31 1.39
VM V
(Negative Current) lM = -150 A 1.13 1.19 1.25
K

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TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 C
MULTI-FUNCTION, LINE-SENSE AND EXTERNAL CURRENT LIMIT INPUTS (cont.)

Maximum Duty
Cycle Reduction IL(DC) or
TJ = 25 C 40 60 75 A
Onset Threshold IM(DC)
Current
X, L or M Pin 0.6 1.0
Remote OFF See Figure 70 Floating
ID(RMT) mA
DRAIN Supply VDRAIN = 150 V L or M Pin Shorted
Current 1.0 1.6
to CONTROL
From Remote ON to Drain Turn-On
Remote ON Delay tR(ON) 2.5 s
See Note B
Minimum Time Before Drain Turn-On
Remote OFF tR(OFF) to Disable Cycle 2.5 s
Setup Time
See Note B Data Sheets 2
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FREQUENCY INPUT
FREQUENCY Pin
Application Notes 3
VF See Note B 2.9 V
Threshold Voltage
FREQUENCY Pin IF VF = VC 10 40
Design
100
Ideas
A
4
Input Current
CIRCUIT PROTECTION Design Tools 5
TOP242 P/G Internal
TOP242 Y/R/F
TJ= 25 C di/dt=90 mA/s Quality
0.418 and 0.481
0.45 Reliability 6
TOP243 P/G Internal
0.697 0.75 0.802
TJ= 25 C di/dt=150 mA/s Package Information 7
TOP243 Y/R/F Internal
TJ= 25 C di/dt=180 mA/s 0.837 0.90 0.963
TOP244 P/G DPA-Switch DC-DC Seminar

Internal 8
TJ= 25 C 0.930 1.00 1.070
di/dt=200 mA/s
Self Protection
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Current Limit ILIMIT LinkSwitch

TOP244 Y/R/F & TinySwitch-II
T = 25 C
J
Internal
di/dt=270 mA/s 1.256 AC-DC
1.35 Seminar
1.445 A 9
(See Note C)
TOP245 P Internal
1.02 1.10 1.18
TJ= 25 C TOPSwitch-GX
di/dt=220 mA/s AC-DC Seminar 10
TJ= 25 C di/dt=360 mA/s 1.674 1.80 1.926
TJ= 25 C 2.511 2.70 2.889
di/dt=540 mA/s
TJ= 25 C 3.348 3.60 3.852
di/dt=720 mA/s
4.185 4.50 4.815
TJ= 25 C di/dt=900 mA/s
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TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 C
CIRCUIT PROTECTION (cont.)

Self Protection TJ= 25 C di/dt=1080 mA/s
5.022 5.40 5.778
ILIMIT
Current Limit A
(See Note C) TJ= 25 C 5.859 6.30 6.741
di/dt=1260 mA/s
85 VAC 0.75 x
(Rectified Line Input) ILIMIT(MIN)
Initial Current Limit IINIT See Note B A
265 VAC 0.6 x
(Rectified Line Input) ILIMIT(MIN)
Leading Edge See Figure 52
tLEB 220 ns
Blanking Time TJ = 25 C, IC = 4 mA
Current Limit Delay tIL(D) IC = 4 mA 100 ns
Thermal Shutdown
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130 140 150 C
Temperature
Thermal Shutdown 75 C
Hysteresis
Power-up Reset VC(RESET) Figure 53, S1 Open 1.75 3.0 4.25 V
Threshold Voltage
OUTPUT
TOP242 TJ = 25 C 15.6 18.0
ID = 50 mA TJ = 100 C 25.7 30.0
TOP243 TJ = 25 C 7.80 9.00
ID = 100 mA TJ = 100 C 12.9 15.0
TOP244 TJ = 25 C 5.20 6.00
ID = 150 mA TJ = 100 C 8.60 10.0
TOP245 TJ = 25 C 3.90 4.50
ON-State
RDS(ON) ID = 200 mA TJ = 100 C 6.45 7.50
Resistance
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TOP246 TJ = 25 C 2.60 3.00

ID = 300 mA TJ = 100 C 4.30 5.00
TOP247 TJ = 25 C 1.95 2.25
ID = 400 mA TJ = 100 C 3.22 3.75
TOP248 TJ = 25 C 1.56 1.80
ID = 500 mA TJ = 100 C 2.58 3.00
TOP249 TJ = 25 C 1.30 1.50
ID = 600 mA TJ = 100 C 2.15 2.50

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TOP242-250
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 C
OUTPUT (cont.)
ON-State TOP250 TJ = 25 C 1.10 1.28
RDS(ON)
Resistance ID = 700 mA TJ = 100 C 1.85 2.15
OFF-State Drain VL, VM = Floating; IC = 4 mA
IDSS 470 A
Leakage Current VDS = 560 V; TJ = 125 C
Breakdown VL, VM = Floating; IC = 4mA
BVDSS 700 V
Voltage See Note D, TJ = 25 C
Rise Time tR General Information & 100

Table of Contents
ns
Measured in a Typical
Flyback Converter Application
Fall Time tF Product Selector
50 Guide
ns 1
SUPPLY VOLTAGE CHARACTERISTICS
Data Sheets 2
DRAIN Supply
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See Note E 36 V
Voltage
Shunt Regulator
Application Notes 3
VC(SHUNT) IC = 4 mA 5.60 5.85 6.10 V
Voltage
Shunt Regulator
Design Ideas 4
50 ppm/C
Temperature Drift
Output TOP242-245 1.0 1.6Design
2.5 Tools 5
lCD1 MOSFET Enabled TOP246-249 1.2 2.2 3.2
Control Supply/ VX, VL, VM = 0 V
Discharge Current
TOP250 Quality and Reliability
1.3 2.4 mA3.65 6
Output
lCD2 MOSFET Disabled 0.3 0.6 1.3
VX, VL, VM = 0 V Package Information 7
NOTES:
A. For specifications with negative values, a negative temperature coefficient corresponds to an increase in
8
magnitude with increasing temperature, and a positive temperature coefficient corresponds to a decrease in
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magnitude with increasing temperature. 9
B. Guaranteed by characterization. Not tested in production.

C. For externally adjusted current limit values, please refer to Figure 54b and 55b (Current Limit vs. External Current
Limit Resistance) in the Typical Performance Characteristics section. The tolerance specified is only valid at full
current limit.
D. Breakdown voltage may be checked against minimum BVDSS specification by ramping the DRAIN pin voltage up to
but not exceeding minimum BVDSS.
E. It is possible to start up and operate TOPSwitch-GX at DRAIN voltages well below 36 V. However, the
CONTROL pin charging current is reduced, which affects start-up time, auto-restart frequency, and auto-restart
duty cycle. Refer to Figure 67, the characteristic graph on CONTROL pin charge current (IC) vs. DRAIN voltage
for low voltage operation characteristics.
K
38 9/03
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TOP242-250
t2
t1
HV
90% 90%
DRAIN t
D= 1
VOLTAGE t2
10%
0V
PI-2039-033001
Figure 50. Duty Cycle Measurement.
PI-2022-033001
tLEB (Blanking Time)
120 1.3
PI-1939-091996
1.2
DRAIN Current (normalized)

CONTROL Pin Current (mA)
100 1.1
1.0
80 0.9
0.8
IINIT(MIN) @ 85 VAC
0.7
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60 IINIT(MIN) @ 265 VAC
0.6
0.5
40 0.4 ILIMIT(MAX) @ 25 C
Dynamic 1 ILIMIT(MIN) @ 25 C
= 0.3
Impedance Slope
20 0.2
0.1
0 0
0 2 4 6 8 10 0 1 2 3 4 5 6 7 8
CONTROL Pin Voltage (V) Time (s)
Figure 51. CONTROL Pin I-V Characteristic. Figure 52. Drain Current Operating Envelope.
Y or R Package (X and L Pin) P or G Package (M Pin)
S1 470 0-100 k
5W 0-100 k
S5
5-50 V M
5-50 V
0-60 k
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40 V
L D
470 CONTROL
C C TOPSwitch-GX
S2
S4 F X S
0-15 V
S3
47 F 0.1 F
0-60 k
NOTES: 1. This test circuit is not applicable for current limit or output characteristic measurements.
2. For P and G packages, short all SOURCE pins together. PI-2631-042303
Figure 53. TOPSwitch-GX General Test Circuit.

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TOP242-250
BENCH TEST PRECAUTIONS FOR EVALUATION OF ELECTRICAL CHARACTERISTICS
The following precautions should be followed when testing while in this auto-restart mode, there is only a 12.5% chance
TOPSwitch-GX by itself outside of a power supply. The sche- that the CONTROL pin oscillation will be in the correct state
matic shown in Figure 53 is suggested for laboratory testing of (drain active state) so that the continuous drain voltage wave-
TOPSwitch-GX. form may be observed. It is recommended that the VC power
supply be turned on first and the DRAIN pin power supply
When the DRAIN pin supply is turned on, the part will be in second if continuous drain voltage waveforms are to be
the auto-restart mode. The CONTROL pin voltage will be observed. The 12.5% chance of being in the correct state is
oscillating at a low frequency between 4.8 and 5.8 V and the due to the divide-by-8 counter. Temporarily shorting the
drain is turned on every eighth cycle of the CONTROL pin CONTROL pin to the SOURCE pin will reset TOPSwitch-GX,
oscillation. If the CONTROL pin power supply is turned on which then will come up in the correct state.
Typical Performance Characteristics

PI-2653-042203
1.1
Scaling Factors:
1.0 Product Selector
200 Guide
TOP242 P/G/Y/R/F: .45
TOP243 P/G: .75
1
0.9 TOP243 Y/R/F: .90 180
TOP244 P/G: 1
Current Limit (A)
0.8 TOP244 Y/R/F:

Data
160
1.35
Sheets 2
di/dt (mA/s)
TOP245 Y/R/F: 1.80
0.7 TOP246 Y/R/F: 2.70 140
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TOP247 Y/R/F: 3.60
0.6 TOP248 Y/R/F 4.50 120
0.5
Application
TOP249 Y/R/F:
100
TOP250 Y/R/F:
Notes
5.40
6.32
3
0.4 80
0.3 Design
60 Ideas 4
0.2 40
-250 -200 -150
IM (A)
-100 -50
Design Tools
0
5
Figure 54a. Current Limit vs. MULTI-FUNCTION Pin Current (See Figure 55a for TOP245P).
PI-2652-042303
1.1
1.0 Package Information

Scaling Factors:
200
TOP242 P/G/Y/R/F: .45 7
TOP243 P/G: .75
0.9 TOP243 Y/R/F: .90 180
TOP244 P/G: 1
Current Limit (A)
0.8 160
TOP244 Y/R/F: 1.35 8
di/dt (mA/s)
Maximum
TOP245 Y/R/F: 1.80
0.7 TOP246 Y/R/F: 2.70
140
Minimum
TOP247 Y/R/F: 3.60
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0.6
0.5
LinkSwitch
Typical
& TinySwitch-II AC-DC 120
Seminar TOP248 Y/R/F
TOP249 Y/R/F:
4.50
5.40
9
TOP250 Y/R/F: 6.32
100
0.4 80
0.3
Maximum and minimum levels
are based on characterization.
TOPSwitch-GX AC-DC Seminar
60
10
0.2 40
0 5K 10K
15K 20K 25K 30K
External Current Limit Resistor RIL ()
35K 40K 45K
Figure 54b. Current Limit vs. External Current Limit Resistance (See Figure 55b for TOP245P).
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TOP242-250
PI-3652-081403
1.1
Scaling Factors:
1.0 TOP245P: 1.1 200
0.9 180
Current Limit (A)
0.8 160
di/dt (mA/s)
0.7 140
0.6 120
0.5 100
0.4 80
0.3 60
0.2 40
-250 -200 -150 -100 -50 0
IM (A)
Figure 55a. Current Limit vs. MULTI-FUNCTION Pin Current (TOP245P only).
PI-3651-081403
1.1
Scaling Factors:
1.0 TOP245P: 1.1 200
0.9 180
Current Limit (A)
0.8 160
di/dt (mA/s)
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0.7 140
0.6 120
0.5 Typical 100
0.4 80
Measured at 25 C.
0.3 60
0.2 40
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
Figure 55b. Current Limit vs. External Current Limit Resistance (TOP245P only).
1.25
Current Limit (Normalized to 25 C)
PI-3653-073003
1.20
1.15 0 C
1.10
1.05
1.00
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.95
25 C
.90
.85
.80 100 C
.75
.70
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
Figure 55c. External Current Limit vs. External Current Limit Resistance at 0 C, 25 C and 100 C
Junction Temperature (TOP245P only).

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TOP242-250
Typical Performance Characteristics (cont.)

1.1 1.2
PI-1123A-033001
PI-176B-033001
1.0
(Normalized to 25 C)
Output Frequency
Breakdown Voltage
0.8
1.0 0.6
0.4
0.2
0.9 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (C) General Information & Temperature
Junction Table of (C) Contents
Figure 56. Breakdown Voltage vs. Temperature. Figure 57. Frequency vs. Temperature.
1.2
1.2
PI-2555-033001
PI-2554-080603
1.0 1.0 Data Sheets 2
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Current Limit
Current Limit
0.8 0.8
Application Notes 3
0.6 0.6
Use for TOP242-250 Y/R/F

0.4 0.4 Design Ideas
packages and TOP242-244 P/G 4
packages only. See Figure 55c
0.2 for TOP245P.
0.2
Design Tools 5
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (C) Quality and Reliability

Junction Temperature (C) 6
Figure 58. Internal Current Limit vs. Temperature. Figure 59. External Current Limit vs. Temperature
with RIL =12 k.
1.2 1.2
PI-2553-033001
PI-2552-033001

Under-Voltage Threshold
Overvoltage Threshold
1.0 1.0
0.8 0.8
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0.6 0.6
0.4 TOPSwitch-GX
0.4 AC-DC Seminar 10
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (C) Junction Temperature (C)
Figure 60. Overvoltage Threshold vs. Temperature. Figure 61. Under-Voltage Threshold vs. Temperature.
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TOP242-250

6.0 1.6
PI-2688-102700
PI-2689-102300
VX = 1.33 - IXx 0.66 k
LINE SENSE Pin Voltage (V)
EXTERNAL CURRENT LIMIT

5.5 1.4
-200 A IX -25 A
5.0 1.2
Pin Voltage (V)

4.5 1.0
4.0 0.8
3.5 0.6
3.0 0.4
2.5 0.2
2.0 0
0 100 200 300 400 -240 -180 -120 -60 0
LINE-SENSE Pin Current (A) EXTERNAL CURRENT LIMIT Pin Current (A)
Figure 62a. LINE-SENSE Pin Voltage vs. Current. Figure 62b. EXTERNAL CURRENT LIMIT Pin Voltage
vs. Current.
6 1.6
PI-2541-102700
PI-2542-102700
MULTI-FUNCTION Pin Voltage (V)
MULTI-FUNCTION Pin Voltage (V)

VM = 1.37 - IMx 1 k
1.4
5 -200 A IM -25 A
1.2
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4
1.0
3 0.8
0.6
2
0.4
See
1 Expanded
Version 0.2
0 0
-300 -200 -100 0 100 200 300 400 500 -300 -250 -200 -150 -100 -50 0
MULTI-FUNCTION Pin Current (A) MULTI-FUNCTION Pin Current (A)
Figure 63a. MULTI-FUNCTION Pin Voltage vs. Current. Figure 63b. MULTI-FUNCTION Pin Voltage vs.
Current (Expanded).
1.2 1.2
PI-2562-033001
PI-2563-033001
Onset Threshold Current
1.0 1.0
CONTROL Current
0.8 0.8
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0.6 0.6
0.4 0.4
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (C) Junction Temperature (C)
Figure 64. Control Current Out at 0% Duty Cycle vs. Figure 65. Max. Duty Cycle Reduction Onset Threshold
Temperature. Current vs. Temperature.

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TOP242-250

6 2
PI-2564-101499
PI-2645-010802
VC = 5 V
Charging Current (mA)

1.6
DRAIN Current (A)
CONTROL Pin
4
1.2
Scaling Factors:
3 TOP250 1.17
TOP249 1.00 0.8
TOP248 0.83
2 TOP247 0.67
TOP246 0.50
TOP245 0.33 0.4
1 TOP244 0.25
TCASE = 25 C TOP243 0.17
TCASE = 100 C TOP242 0.08
0 0
0 2 4 6 8 10 12 14 16 18 20 0 20 40 60 80 100
DRAIN Voltage (V) General InformationDRAIN
& Table
Voltage (V) of Contents
Figure 66. Output Characteristics. Figure 67. IC vs. DRAIN Voltage.
10000 600
PI-2646-010802
PI-2650-020802
Scaling Factors:
TOP250 1.17
Data Sheets 2
DRAIN Capacitance (pF)
500
TOP249 1.00
Scaling Factors: TOP248 0.83
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1000 TOP250 1.17 400 TOP247 0.67
Power (mW)
TOP246 0.50
TOP249 1.00
TOP248 0.83
TOP247 0.67
TOP245 0.33
TOP244 0.25
Application Notes 3
300 TOP243 0.17
TOP246 0.50
TOP245 0.33 TOP242 0.08
100 TOP244 0.25
TOP243 0.17
200 Design Ideas 4
TOP242 0.08
100
Design Tools 5
10 0
0 100 200 300 400 500 600
0 100 200 300 400 500 600
Drain Voltage (V) Quality and (V)
DRAIN Voltage Reliability 6
Figure 68. COSS vs. DRAIN Voltage. Figure 69. DRAIN Capacitance Power.
Remote OFF DRAIN Supply Current
1.2
PI-2690-102700
1.0
0.8
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LinkSwitch
0.6
& TinySwitch-II AC-DC Seminar 9
0.4
0.2
Sales
0
Representatives and Distributors 11
-50 0 50 100 150
Junction Temperature (C)
Figure 70. Remote OFF DRAIN Supply Current
vs. Temperature.
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44 9/03
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TOP242-250
PART ORDERING INFORMATION

TOPSwitch Product Family
GX Series Number
Package Identifier
G Plastic Surface Mount DIP (242, 243 & 244 only)
P Plastic DIP (242, 243, 244 & 245 only)
Y Plastic TO-220-7C
R Plastic TO-263-7C (available only with TL option)
F Plastic TO-262
Package/Lead Options
TOP 242 G - TL Blank Standard Configurations

TL Tape & Reel, (G Package: 1000 min., R Package: 750 min.)
TO-220-7C
.165 (4.19)
.185 (4.70)
.390 (9.91) .045 (1.14)
.146 (3.71) .420 (10.67) .055 (1.40)
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.156 (3.96)
.108 (2.74) REF
+ .234 (5.94)
.261 (6.63)
.461 (11.71) .570 (14.48)

.495 (12.57) REF.
7 TYP. .670 (17.02)
.860 (21.84) REF.
.880 (22.35)
.080 (2.03)
.120 (3.05)
PIN 1 & 7 PIN 2 & 4
PIN 1 .024 (.61) .040 (1.02)

.010 (.25) M
.034 (.86) .060 (1.52)
.050 (1.27) BSC .012 (.30) .040 (1.02)
.024 (.61) .060 (1.52)
.150 (3.81) BSC
.190 (4.83)
.210 (5.33)
.050 (1.27)
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.050 (1.27) Notes:

1. Controlling dimensions are inches. Millimeter
dimensions are shown in parentheses.
.050 (1.27) 2. Pin numbers start with Pin 1, and continue
.050 (1.27) from left to right when viewed from the front.
3. Dimensions do not include mold flash or
other protrusions. Mold flash or protrusions
.200 (5.08) .180 (4.58)
shall not exceed .006 (.15mm) on any side.
.100 (2.54) 4. Minimum metal to metal spacing at the pack-
PIN 1 PIN 7 age body for omitted pin locations is .068
inch (1.73 mm).
.150 (3.81) .150 (3.81) 5. Position of terminals to be measured at a
location .25 (6.35) below the package body.
MOUNTING HOLE PATTERN
6. All terminals are solder plated.
Y07C
PI-2644-112202

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TOP242-250
DIP-8B
D S .004 (.10) Notes:
-E- 1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
.240 (6.10)
protrusions. Mold flash or protrusions shall not exceed
.260 (6.60)
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
Pin 1 5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
.367 (9.32) 6. Lead width measured at package body.
-D- 7. Lead spacing measured with the leads constrained to be
.387 (9.83)
.057 (1.45) perpendicular to plane T.
.068 (1.73)
(NOTE 6)
.125 (3.18) .015 (.38)
.145 (3.68) MINIMUM
-T-
SEATING .008 (.20)
PLANE .120 (3.05) .015 (.38)
.140 (3.56) Data Sheets 2
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.300 (7.62) BSC
.100 (2.54) BSC .048 (1.22) (NOTE 7)
.014 (.36)
.053 (1.35) .300 (7.62) Application Notes
P08B 3
.022 (.56) T E D S .010 (.25) M .390 (9.91) PI-2551-041003
SMD-8B
Design Ideas 4
D S .004 (.10) Design Tools

Notes:
1. Controlling dimensions are
5
inches. Millimeter sizes are
-E- shown in parentheses.
2. Dimensions shown do not
include mold flash or other
6
protrusions. Mold flash or
protrusions shall not exceed
.240 (6.10)
.260 (6.60)
.372 (9.45)
.388 (9.86) Package Information
.420
.006 (.15) on any side.
3. Pin locations start with Pin 1,
7
E S .010 (.25) and continue counter-clock
.046 .060 .060 .046 Pin 8 when viewed from the
DPA-Switch DC-DC Seminar top. Pin 6 is omitted.
4. Minimum metal to metal
8
.080 spacing at the package body
Pin 1 Pin 1
for the omitted lead location
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.100 (2.54) (BSC) .086
.186
is .137 inch (3.48 mm).
5. Lead width measured at
9
package body.
.286
.367 (9.32) 6. D and E are referenced
-D-
.387 (9.83) TOPSwitch-GX AC-DC Seminar 10
Solder Pad Dimensions datums on the package
body.
.057 (1.45)
.125 (3.18) .068 (1.73)
.145 (3.68)
(NOTE 5)
.004 (.10)
.032 (.81) .048 (1.22)
.053 (1.35)
.009 (.23) .004 (.10) .036 (0.91) 0- 8
.037 (.94)
.012 (.30) .044 (1.12) G08B
PI-2546-080703
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46 9/03
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TOP242-250
TO-263-7C
.390 (9.91) .245 (6.22)
.420 (10.67) min. .045 (1.14)
.055 (1.40) .055 (1.40)
.066 (1.68)
.225 (5.72)
.326 (8.28) min.
.336 (8.53) .580 (14.73)
.620 (15.75)
.000 (0.00)
.208 (5.28) .010 (0.25)
Ref. .090 (2.29)
-A- .110 (2.79)
.010 (0.25)
LD #1
.012 (0.30)
.024 (0.61) .100 (2.54) .050 (1.27) .024 (0.61)
.034 (0.86) Ref. 0- 8
.315 (8.00)
Solder Pad
Dimensions .165 (4.19)
.380 (9.65) .185 (4.70)
.004 (0.10)
.638 (16.21) Notes:

1. Package Outline Exclusive of Mold Flash & Metal Burr.
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2. Package Outline Inclusive of Plating Thickness.
.128 (3.25) 3. Foot Length Measured at Intercept Point Between
Datum A Lead Surface.
.050 (1.27) 4. Controlling Dimensions are in Inches. Millimeter
R07C
.038 (0.97) Dimensions are shown in Parentheses. PI-2664-112702
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TOP242-250
TO-262-7C
.045 (1.14)
.390 (9.91) .055 (1.40)
.420 (10.67) .165 (4.17)
.055 (1.40) .185 (4.70)
.066 (1.68)
.326 (8.28) .495 (12.56)

.336 (8.53) 7 TYP. REF.
.795 (20.18) .595 (15.10)
REF. REF.
.080 (2.03)
.120 (3.05)
PIN 1 & 7 PIN 2 & 4
PIN 1 .024 (.61)

.034 (.86)
General Information & .040
.010 (.25) M Table
(1.02)
.060 (1.52)
of Contents
.050 (1.27) BSC .012 (.30) .040 (1.06)
.024 (.61) .060 (1.52)
.150 (3.81) BSC
Product
.190 (4.83) Selector Guide 1
.210 (5.33)
.050 (1.27)
.050 (1.27) Notes: Data Sheets 2
1. Controlling dimensions are inches. Millimeter
www.DataSHeet4U.com
dimensions are shown in parentheses.
.050 (1.27) 2. Pin numbers start with Pin 1, and continue
.050 (1.27)
Application Notes
from left to right when viewed from the front. 3
3. Dimensions do not include mold flash or
other protrusions. Mold flash or protrusions
.200 (5.08) .180 (4.58)
.100 (2.54) Design Ideas
shall not exceed .006 (.15mm) on any side.
4. Minimum metal to metal spacing at the pack- 4
PIN 1 PIN 7 age body for omitted pin locations is .068
inch (1.73 mm).
.150 (3.81) .150 (3.81) Design Tools
5. Position of terminals to be measured at a
location .25 (6.35) below the package body.
5
MOUNTING HOLE PATTERN
6. All terminals are solder plated.
F07C
Quality and Reliability PI-2757-112202 6
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TOP242-250
Notes
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TOP242-250
Notes
Data Sheets 2
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Application Notes 3
Design Ideas 4
Design Tools 5
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TOP242-250
Revision Notes Date

D - 11/00
E 1) Added R package (D2PAK). 7/01
2) Corrected abbreviations (s = seconds).
3) Corrected x-axis units in Figure 11 (A).
4) Added missing external current limit resistor in Figure 25 (RIL).
5) Corrected spelling.
6) Added caption for Table 4.
7) Corrected Breakdown Voltage parameter condition (TJ = 25 C).
8) Corrected font sizes in figures.
9) Figure 40 replaced.
10) Corrected schematic component values in Figure 44.
F 1) Corrected Power Table value. 9/01
G 1) Added TOP250 device and F package (TO-262). 1/02
2) Added R package Thermal Impedance parameters and adjusted Output Power values in Table 1.
3) Adjusted Off-State Current value.
H 1) Added note to parameter table for Breakdown Voltage measurement. 9/02
2) Miscellaneous text corrections.
I 1) Updated P, Y, R and F package information. 4/03
www.DataSHeet4U.com
2) Revised thermal impedances (JA) for all package types.
3) Expanded Maximum Duty Cycle and deleted Maximum Duty Cycle Reduction Slope parameters.
4) Corrected DIP-8B and SMD-8B Package Drawings.
J 1) Added TOP245P. 8/03
2) Miscellaneous text corrections.
K 1) Corrected typographic errors in Figures 4, 6, 20, 28, and 34; and in MULTI-FUNCTION (M) Pin 9/03
Operation section.
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TOP242-250
For the latest updates, visit our Web site: www.powerint.com
PATENT INFORMATION
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not
assume any liability arising from the use of any device or circuit described herein, nor does it convey any license under its patent rights or the rights of others.
The products and applications illustrated herein (including circuits external to the products and transformer construction) may be covered by one or more U.S.
and foreign patents or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents
may be found at www.powerint.com.
LIFE SUPPORT POLICY General Information & Table of Contents

POWER INTEGRATIONS' PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS, INC. As used herein:
1. Life support devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when
1
properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
Data Sheets
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
2
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The PI logo, TOPSwitch, TinySwitch, LinkSwitch and EcoSmart are registered trademarks of Power Integrations.
PI Expert and DPA-Switch are trademarks of Power Integrations. Copyright 2003, Power Integrations. Application Notes 3
WORLD HEADQUARTERS
Power Integrations
CHINA (SHENZHEN)
Power Integrations
ITALY
Power Integrations S.r.l.
Design Ideas
SINGAPORE (ASIA PACIFIC
HEADQUARTERS)
4
5245 Hellyer Avenue International Holdings, Inc. Via Vittorio Veneto 12, Power Integrations, Singapore
San Jose, CA 95138, USA. Rm# 1705, Bao Hua Bldg. Bresso 51 Newton Road
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Customer Service:
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Design Tools
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Phone: +1-408-414-9665 518031, China Fax: +39-028-928-6009 Phone: +65-6358-2160
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e-mail: singaporesales@powerint.com 6
e-mail: chinasales@powerint.com
AMERICAS GERMANY JAPAN TAIWAN
Power Integrations, Inc. Power Integrations GmbH Power Integrations, K.K. Package Information
Power Integrations 7
4335 South Lee Street, Rueckerstrasse 3 Keihin-Tatemono 1st Bldg. International Holdings, Inc.
Suite G D-80336, Muenchen, Germany 12-20 Shin-Yokohama 17F-3, No. 510
Buford, GA 30518, USA
Phone: +1-678-714-6033
Phone: +49-895-527-3910
Fax: +49-895-527-3920 DPA-Switch DC-DC Seminar
2-Chome,
Kohoku-ku, Yokohama-shi,
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Taipei, Taiwan 110, R.O.C. 8
Fax: +1-678-714-6012 e-mail: eurosales@powerint.com Kanagawa 222-0033, Japan Phone: +886-2-2727-1221
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Fax: +81-45-471-3717
e-mail: japansales@powerint.com
e-mail: taiwansales@powerint.com
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CHINA (SHANGHAI) INDIA (TECHNICAL SUPPORT) KOREA UK (EUROPE & AFRICA
Power Integrations
International Holdings, Inc.
Innovatech
#1, 8th Main Road TOPSwitch-GX AC-DC Seminar 10
Power Integrations
International Holdings, Inc.
HEADQUARTERS)
Power Integrations (Europe) Ltd.
Rm 807, Pacheer Vasanthnagar 8th Floor, DongSung Bldg. Centennial Court
Commercial Centre Bangalore, India 560052 17-8 Yoido-dong, Easthampstead Road
555 Nanjing West Road
Shanghai, 200041, China
Phone:
Fax:
+91-80-226-6023
+91-80-228-9727
Youngdeungpo-gu,
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Bracknell, Berkshire RG12 1YQ,
United Kingdom
Phone: +86-21-6215-5548 e-mail: indiasales@powerint.com Phone: +82-2-782-2840 Phone: +44-1344-462-300
Fax: +86-21-6215-2468 Fax: +82-2-782-4427 Fax: +44-1344-311-732
e-mail: chinasales@powerint.com e-mail: koreasales@powerint.com e-mail: eurosales@powerint.com
APPLICATIONS HOTLINE APPLICATIONS FAX
World Wide +1-408-414-9660 World Wide +1-408-414-9760
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LinkSwitch & TinySwitch-II AC-DC Seminar

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Figure 2a. Functional Block Diagram (Y, R or F Package).

STOP LOGIC HYSTERETIC

Figure 2b. Functional Block Diagram (P or G Package).

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Pin Functional Description FREQUENCY (F) Pin: (Y, R or F package only)

remote ON/OFF and synchronization. A connection to For RIL = 12 k

Tab Internally 7D Package Information PI-2509-040501 7

LinkSwitch & TinySwitch-II AC-DC Seminar

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TOPSwitch-GX Family Functional Description

In addition to the three terminal TOPSwitch features, such as

TOPSwitch-GX offers many new transparent features that do I = 190 A

TOP242-5 1.6 2.0 5.2 6.0

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Quality and Reliability 6

S7 S0 S1 S2 S6 S7 S0 S1 S2 DPA-Switch DC-DC Seminar

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sawtooth waveform for the pulse width modulator. This

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Line Under-Voltage Detection (UV)

Oscillator DPA-Switch DC-DC Seminar 8

LinkSwitch & TinySwitch-II AC-DC Seminar 9

TOPSwitch-GX AC-DC Seminar 10

Figure 10. Synchronization Timing Diagram.

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Bandgap Reference shorting the FREQUENCY pin to the CONTROL pin

Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations.

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MULTI-FUNCTION PIN TABLE*

Table 3. Typical MULTI-FUNCTION Pin Configurations.

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IREM(N) IUV IOV

Disabled when supply I

Quality and Reliability 6

DPA-Switch DC-DC Seminar

LinkSwitch & TinySwitch-II

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(Negative Current Sense - ON/OFF,

(Negative Current Sense - ON/OFF,

Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic.

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Typical Uses of FREQUENCY (F) Pin

Figure 13. Full Frequency Operation (132 kHz).

Product Selector Guide 1

LinkSwitch & TinySwitch-II AC-DC Seminar 9

TOPSwitch-GX AC-DC Seminar 10

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+ + VUV = IUV x RLS

For Value Shown For Values Shown

+ For RIL = 12 k + ILIMIT = 100% @ 100 VDC

DC See Figure 54b for DC

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Figure 22. Active-on (Fail Safe) Remote ON/OFF.

Product Selector Guide 1

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Typical Uses of MULTI-FUNCTION (M) Pin

For Value Shown For Values Shown

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Typical Uses of MULTI-FUNCTION (M) Pin (cont.)