Академический Документы
Профессиональный Документы
Культура Документы
SN65HVS885
SLAS638A JANUARY 2009 REVISED OCTOBER 2015
8
GND
internal debounce filters. VCC
LED Outputs 8
With the addition of few external components, the RE 0:7
input switching characteristic can be configured in IREF Adjust:
accordance with IEC61131-2 for Type 1, 2 and 3 RLIM Serial Output
sensor switches.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN65HVS885
SLAS638A JANUARY 2009 REVISED OCTOBER 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.1 Overview ................................................................... 9
2 Applications ........................................................... 1 8.2 Functional Block Diagram ......................................... 9
3 Description ............................................................. 1 8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 12
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3 9 Application and Implementation ........................ 13
9.1 Application Information............................................ 13
6 Specifications......................................................... 4
9.2 Typical Application ................................................. 16
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4 10 Power Supply Recommendations ..................... 19
6.3 Recommended Operating Conditions....................... 4 11 Layout................................................................... 19
6.4 Thermal Information .................................................. 4 11.1 Layout Guidelines ................................................. 19
6.5 Electrical Characteristics........................................... 5 11.2 Layout Example .................................................... 19
6.6 Timing Requirements ................................................ 5 12 Device and Documentation Support ................. 20
6.7 Switching Characteristics .......................................... 6 12.1 Community Resources.......................................... 20
6.8 Typical Characteristics .............................................. 7 12.2 Trademarks ........................................................... 20
7 Parameter Measurement Information .................. 8 12.3 Electrostatic Discharge Caution ............................ 20
7.1 Waveforms ................................................................ 8 12.4 Glossary ................................................................ 20
7.2 Signal Conventions ................................................... 8 13 Mechanical, Packaging, and Orderable
8 Detailed Description .............................................. 9 Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
PWP Package
28-Pin HTSSOP With Exposed Thermal Pad
Top View
DB0 1 28 GND
DB1 2 27 SIP
IP0 3 26 LD
RE0 4 25 CLK
IP1 5 24 CE
RE1 6 23 SOP
IP2 7 22 IP7
RE2 8 21 RE7
IP3 9 20 IP6
RE3 10 19 RE6
IP4 11 18 IP5
RE4 12 17 RE5
RLIM 13 16 HOT
NC 14 15 VCC
Pin Functions
PIN
DESCRIPTION
NAME NO.
CE 24 Clock Enable Input
CLK 25 Serial Clock Input
DB0 1
Debounce select inputs
DB1 2
GND 28 Device Ground
HOT 16 Over-Temperature Flag
3, 5, 7, 9,
IPx Input Channel x
11, 18, 20, 22
LD 26 Load Pulse Input
NC 14 Not Connected
4, 6, 8, 10,
REx Return Path x (LED drive)
12, 17, 19, 21
RLIM 13 Current Limiting Resistor
SIP 27 Serial Data Input
SOP 23 Serial Data Output
VCC 15 5 V Device Supply
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Device power input VCC 0.5 6 V
VIPx Field digital inputs IPx 0.3 36 V
VID Voltage at any logic input DB0, DB1, CLK, SIP, CE, LD 0.5 6 V
IO Output current HOT, SOP 8 8 mA
PTOT Continuous total power dissipation See Thermal Information
TJ Junction temperature 170 C
Tstg Storage temperature 150 C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) JEDEC Standard 22, Method A115-A
(1) Maximum data rate corresponds to 0 ms debounce time, (DB0 = open, DB1 = GND), and RIN = 0
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4 Submit Documentation Feedback Copyright 20092015, Texas Instruments Incorporated
30
RIN = 1.2 kW
25
a) IIP-LIM = 2.5mA (RLIM = 36.1 kW) a) b) c)
b) IIP-LIM = 3.0mA (RLIM = 30.1 kW)
20
c) IIP-LIM = 3.6mA (RLIM = 24.9 kW)
VIN / V
15
10
Off
On
5
Field Input Thresholds
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
I IN / mA
Figure 1. Typical Input Characteristics
102.0 9.6
VCC = 5 V,
101.5 VIN = 24 V, 9.4
VTH+(IN)
RIN = 1.2 kW, 9.2
101.0
IIPLIM/IIPLIM 25C - %
RLIM = 24.9 kW
9.0 VCC = 5 V,
100.5
VIN V
99.5 8.6
99.0 8.4
VTH(IN)
98.5 8.2
98.0 8.0
-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85 95 -45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85 95
TA - Ambient Temperature - C TA - Ambient Temperature - C
Figure 2. Typical Current Limiter Variation vs Ambient Figure 3. Typical Limiter Threshold Voltage Variation vs
Temperature Ambient Temperature
tW2
LD
LD tREC
tLPH2 tPLH2
CLK
SOP
1/fCLK
valid
tW1
SIP
CLK
tSU1 tH1
tPLH1 tPHL1
SOP CLK
tr tf
CLK
tSU2
CE CLK
inhibited
Figure 8. Serial Shift Mode
IIN
GND
8 Detailed Description
8.1 Overview
The SN65HVS885 is an 8 channel, digital input serializer which operates from a 5 V supply and accepts digital
inputs of up to 34 V on the 8 channels (IP0-IP7). The device provides a serially shifted digital output with reduced
voltage ranges of 0-5 V for applications in industrial and building automation systems. The SN65HVS885 meets
JEDEC standards for ESD protection (refer to ESD Ratings), and is SPI compatible for interfacing with standard
microcontrollers. The serializer operates in 2 fundamental modes: Load Mode and Shift mode. In Load mode,
information from the field inputs is allowed to latch into the shift register. In Shift mode, the information stored in
the parallel shift register can be serially shifted to the serial output (SOP). A detailed description of the functional
modes is available in the Device Functional Modes section.
Vcc HOT
SIP
RE0 Current
IP0 Sense
Debounce
&
Filter LD
Voltage
Sense CE
SERIALIZER
Channel 0 CLK
GND
RE7
Channel 7
IP7
SOP
1.25 VREF
5V
ILIM Mirror
n = 72
IIN
IPx ILIM IREF
Limiter
RLIM
IINmax = ILIM
Each digital input operates as a controlled current sink limiting the input current to a maximum value of ILIM. The
current limit is derived from the reference current via ILIM = n IREF, and IREF is determined by IREF = VREF/RLIM.
Thus, changing the current limit requires the change of RLIM to a different value via: RLIM = n VREF/ILIM.
Inserting the actual values for n and VREF gives: RLIM = 90 V / ILIM.
While the device is specified for a current limit of 3.6 mA, (via RLIM = 25 k), it is easy to lower the current limit
to further reduce the power consumption. For example, for a current limit of 2.5 mA simply calculate:
90 V 90 V
RLIM = = = 36 k
ILIM 2.5 mA (1)
5V
IPx
REF
REx
RLIM
GND
SIP
D Q D Q D Q D Q D Q D Q D Q D Q SOP
CLK
Logic CP CP CP CP CP CP CP CP
CE
R S R S R S R S R S R S R S R S
LD
(1) Shift = content of each internal register shifts towards serial outputs.
Data at SIP is shifted into first register.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
R IN
INx IP0 IP7 V CC 5V
RIN 1.2 kW, 1/4 W MELF Resistor
C IN 1mF
CIN 220 nF, 60 V Ceramic Capacitor
SN65HVS885
CS 4.7 nF, 2 kV Ceramic Capacitor
0V GND
CS
FE
Figure 13. Typical EMC Protection Circuitry for Supply and Signal Inputs
30 30 30
25 25 25
ON
20 20 ON 20 ON
VIN (V)
VIN (V)
VIN (V)
15 15 15
10 10 10
5 5 5
0 OFF 0 OFF 0 OFF
3- 3 3
0 5 10 15 0 5 10 15 20 25 30 0 5 10 15
IIN (mA) IIN (mA) IIN (mA)
Figure 14. Switching Characteristics for IEC61131-2 Type 1, 2, and 3 Proximity Switches
For a Type 2 switch application, two inputs are connected in parallel. The current limiters then add to a total
maximum current of 7.2 mA. While the return-path (RE-pin), of one input might be used to drive an indicator
LED, the RE-pin of the other input channel should be connected to ground (GND).
RIN RIN
IN0 IP0 IN0 IP0
CIN CIN
RE0 RE0
RIN RIN
IN1 IP1 IP1
CIN CIN
RE1 RE1
Figure 15. Paralleling Two Type 1 or Type 3 Inputs Into One Type 2 Input
CE OUTB INB
STE
Upon a low-level at the load input, LD, the information of the field inputs, IP0 to IP7 is latched into the shift
register. Taking /LD high again blocks the parallel inputs of the shift register from the field inputs. A low-level at
the clock-enable input, CE, enables the clock signal, CLK, to serially shift the data to the serial output, SOP. Data
is clocked at the rising edge of CLK. Thus after eight consecutive clock cycles all field input data have been
clocked out of the shift register and the information of the serial input, SIP, appears at the serial output, SOP.
CLK
CE
SIP high
LD
PIP0PIP6
PIP7
Figure 17. Interface Timing for Parallel-Load and Serial-Shift Operation of the Shift Register
OUTB INB
STE
OUTC INC
SCLK
IND OUTD
SOMI
SIP
LD
CE
CLK
SOP
SIP
LD
CE
CLK
SOP
SIP
LD
CE
CLK
SOP
SIP
LD
CE
CLK
SOP
IP7
IP0
IP7
IP0
IP7
IP0
IP7
1.2k NC VCC
ISO7242
MELF HOST
IP0 HOT VCC2 VCC1 CONTROLLER
S0 22nF
RE0 SIP EN2 EN1 VCC
S7 22nF
RE7 SOP IND OUTD SOMI
30
25
20
VIN (V)
15
10
ON = 8. 2 V
OFF = 7.3V
5
0
0 0.5 1 1.5 2 2.5 3
I IN (mA)
11 Layout
1 2
R C
R C
High R C
Voltage R C Isolator MCU
Parallel
R C
Inputs
R R SN65HVD885
C
R C C
3
R C
Isolated
Via to ground
Via to VCC 5V DC-DC
12.2 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 25-Mar-2015
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
SN65HVS885PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HVS885
& no Sb/Br)
SN65HVS885PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HVS885
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 25-Mar-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Mar-2015
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Mar-2015
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2016, Texas Instruments Incorporated