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DATA SHEET
BFR93A
NPN 6 GHz wideband transistor
Product specification 1997 Oct 29
Supersedes data of September 1995
NXP Semiconductors Product specification
FEATURES DESCRIPTION
High power gain NPN wideband transistor in a plastic lfpage 3
PINNING 1 2
APPLICATIONS
Top view MSB003
RF wideband amplifiers and PIN DESCRIPTION
oscillators. 1 base Marking code: R2p.
2 emitter
Fig.1 SOT23.
3 collector
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter 15 V
VCEO collector-emitter voltage open base 12 V
VEBO emitter-base voltage open collector 2 V
IC collector current (DC) 35 mA
Ptot total power dissipation Ts 95 C; note 1 300 mW
Tstg storage temperature 65 +150 C
Tj junction temperature +175 C
Note
1. Ts is the temperature at the soldering point of the collector pin.
1997 Oct 29 2
NXP Semiconductors Product specification
THERMAL CHARACTERISTICS
Note
1. Ts is the temperature at the soldering point of the collector pin.
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
Notes 2
S 21
1. GUM is the maximum unilateral power gain, assuming S12 is zero and G UM = 10 log ----------------------------------------------------------dB .
2 2
1 S 11 1 S 22
2. Measured on the same die in a SOT37 package (BFR91A).
3. dim = 60 dB (DIN 45004B); IC = 30 mA; VCE = 8 V; RL = 75 ; Tamb = 25 C;
Vp = VO at dim = 60 dB; fp = 795.25 MHz;
Vq = VO 6 dB at fq = 803.25 MHz;
Vr = VO 6 dB at fr = 805.25 MHz;
measured at fp + fq fr = 793.25 MHz.
4. IC = 30 mA; VCE = 8 V; RL = 75 ; Tamb = 25 C;
Vp = 200 mV at fp = 250 MHz;
Vq = 200 mV at fq = 560 MHz;
measured at fp + fq = 810 MHz.
1997 Oct 29 3
NXP Semiconductors Product specification
3.3 pF 18 0.68 pF
MBB251
L1 = L3 = 5 H choke.
L2 = 3 turns 0.4 mm copper wire; winding pitch 1 mm; internal diameter 3 mm.
Fig.2 Intermodulation distortion and second harmonic distortion MATV test circuit.
MBG246 MCD087
400 120
handbook, halfpage handbook, halfpage
Ptot
(mW) h FE
300
80
200
40
100
0 0
0 50 100 150 200 0 10 20 30
IC (mA)
Ts ( o C)
VCE = 5 V; Tj = 25 C.
1997 Oct 29 4
NXP Semiconductors Product specification
MBB252 MCD089
1 8
handbook, halfpage handbook, halfpage
Cc
fT
(pF)
(GHz)
0.8
6
0.6
0.4
2
0.2
0 0
0 4 8 12 16 0 10 20 30 40
V CB (V) I C (mA)
MBB255 MBB256
30 30
handbook, halfpage handbook, halfpage
gain gain
(dB)
(dB)
MSG
20 20
MSG
GUM
G UM
10 10
0 0
0 10 20 30 40 0 10 20 30 40
IC (mA) I C (mA)
Fig.7 Gain as a function of collector current; Fig.8 Gain as a function of collector current;
typical values. typical values.
1997 Oct 29 5
NXP Semiconductors Product specification
MBB257 MBB258
50
handbook, halfpage
50
handbook, halfpage
gain gain
(dB) (dB)
40 40
G UM
G UM
30 30 MSG
MSG
20 20
G max
10 10
G max
0 0
2 3 4 2 3 4
10 10 10 f (MHz) 10 10 10 10 10
f (MHz)
MBB253 MBB254
40 handbook,
30
handbook, halfpage B halfpage
S
BS F = 4.0 dB
(mS)
(mS) 20
20
3.5
10
3.0
1.6 2.0 2.5 3.0 F = 3.5 dB 2.5
0 0 2.3
10
20
20
40 30
0 20 40 60 80 0 20 40 60
G S (mS) G S (mS)
IC = 4 mA; VCE = 8 V; f = 800 MHz; Tamb = 25 C. IC = 4 mA; VCE = 8 V; f = 800 MHz; Tamb = 25 C.
Fig.11 Circles of constant noise figure; Fig.12 Circles of constant noise figure;
typical values. typical values.
1997 Oct 29 6
NXP Semiconductors Product specification
MCD094 MCD095
4 4
handbook, halfpage handbook, halfpage
F F
f = 2 GHz
(dB) (dB)
3 3
1 GHz
2 500 MHz 2
I C = 30 mA
10 mA
1 1
5 mA
0 0
1 10 I C (mA) 10 2 10 2 10 3 10 4
f (MHz)
VCE = 8 V. VCE = 8 V.
Fig.13 Minimum noise figure as a function of Fig.14 Minimum noise figure as a function of
collector current; typical values. frequency; typical values.
MBB263 MBB264
40 30
handbook, halfpage handbook, halfpage
d im d2
(dB) (dB)
45 35
50 40
55 45
60 50
65 55
0 10 20 30 40 0 10 20 30 40
I C (mA) I C (mA)
1997 Oct 29 7
NXP Semiconductors Product specification
0.5 2
0.2 5
0.5 10
+j 1200
0.2 800 1000 1 2 5 10
0
500
j
200 10
0.5 2
MBB259
1
120 o 60 o
100
150 o 200
30 o
500
1000 800
1200 MHz 10 20 30
180 o 0o
150 o 30 o
120 o 60 o
90 o MBB261
1997 Oct 29 8
NXP Semiconductors Product specification
120 o 1200 60 o
1000
800
150 o 30 o
500
200
100 MHz
0.05 0.1 0.15
180 o 0o
150 o 30 o
120 o 60 o
90 o MBB262
0.5 2
0.2 5
10
+j
0.2 0.5 1 2 5 10
0
1000 800
j 500
1200 200 10
0.5 2
MBB260
1
1997 Oct 29 9
NXP Semiconductors Product specification
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads SOT23
D B E A X
HE v M A
A1
1 2 c
e1 bp w M B Lp
e
detail X
0 1 2 mm
scale
04-11-04
SOT23 TO-236AB
06-03-16
1997 Oct 29 10
NXP Semiconductors Product specification
DOCUMENT PRODUCT
DEFINITION
STATUS(1) STATUS(2)
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
1997 Oct 29 11
NXP Semiconductors Product specification
NXP Semiconductors does not accept any liability related Export control This document as well as the item(s)
to any default, damage, costs or problem which is based described herein may be subject to export control
on any weakness or default in the customers applications regulations. Export might require a prior authorization from
or products, or the application or use by customers third national authorities.
party customer(s). Customer is responsible for doing all
Quick reference data The Quick reference data is an
necessary testing for the customers applications and
extract of the product data given in the Limiting values and
products using NXP Semiconductors products in order to
Characteristics sections of this document, and as such is
avoid a default of the applications and the products or of
not complete, exhaustive or legally binding.
the application or use by customers third party
customer(s). NXP does not accept any liability in this Non-automotive qualified products Unless this data
respect. sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
Limiting values Stress above one or more limiting
product is not suitable for automotive use. It is neither
values (as defined in the Absolute Maximum Ratings
qualified nor tested in accordance with automotive testing
System of IEC 60134) will cause permanent damage to
or application requirements. NXP Semiconductors accepts
the device. Limiting values are stress ratings only and
no liability for inclusion and/or use of non-automotive
(proper) operation of the device at these or any other
qualified products in automotive equipment or
conditions above those given in the Recommended
applications.
operating conditions section (if present) or the
Characteristics sections of this document is not warranted. In the event that customer uses the product for design-in
Constant or repeated exposure to limiting values will and use in automotive applications to automotive
permanently and irreversibly affect the quality and specifications and standards, customer (a) shall use the
reliability of the device. product without NXP Semiconductors warranty of the
product for such automotive applications, use and
Terms and conditions of commercial sale NXP
specifications, and (b) whenever customer uses the
Semiconductors products are sold subject to the general
product for automotive applications beyond NXP
terms and conditions of commercial sale, as published at
Semiconductors specifications such use shall be solely at
http://www.nxp.com/profile/terms, unless otherwise
customers own risk, and (c) customer fully indemnifies
agreed in a valid written individual agreement. In case an
NXP Semiconductors for any liability, damages or failed
individual agreement is concluded only the terms and
product claims resulting from customer design and use of
conditions of the respective agreement shall apply. NXP
the product for automotive applications beyond NXP
Semiconductors hereby expressly objects to applying the
Semiconductors standard warranty and NXP
customers general terms and conditions with regard to the
Semiconductors product specifications.
purchase of NXP Semiconductors products by customer.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
1997 Oct 29 12
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R77/02/pp13 Date of release: 1997 Oct 29