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MS Micro Electronics
FIRST SEMESTER
Subject Theory Lab Total
Subject Name
Code Credits Credits Credits
MEL 601 Foundations of VLSI CAD 03 01 04
MEL 603 Microelectronics Fabrication Technology 03 01 04
MEL 605 Physics of Semiconductor Devices 03 01 04
MEL 607 CMOS Analog Integrated Circuit Design 03 01 04
MEL 609 Digital VLSI Design 03 01 04
MEL 611 Elective I 03 01 04
Term Paper-I -- -- 01
TOTAL 18 06 25
Second Semester
MEL 602 Nanomaterials and Nanoelectronics 03 01 04
MEL 604 Mixed Signal IC Design 03 01 04
MEL 606 System on Chip Design 03 01 04
Design for Manufacturability and Yield
MEL 608 03 01 04
Management
MEL 610 Elective II 03 01 04
MEL 612 Elective III 03 01 04
Term Paper-II -- -- 01
TOTAL 18 06 25
THIRD & FOURTH SEMESTER
Project Work -- -- 40
Page 1 of 19
MS Microelectronics(Syllabus)
MEL 612.4 Low Power VLSI Design
FIRST SEMESTER
Matrices: Linear dependence of vectors, solution of linear equations, bases of vector spaces,
orthogonality, complementary orthogonal spaces and solution spaces of linear equations.
Graphs: representation of graphs using matrices; Paths, connectedness; circuits, cutsets, trees;
Fundamental circuit and cutset matrices; Voltage and current spaces of a directed graph and their
complementary orthogonality.
Algorithms and data structures: efficient representation of graphs; Elementary graph algorithms
involving bfs and dfs trees, such as finding connected and 2- connected components of a graph, the
minimum spanning tree, shortest path between a pair of vertices in a graph; Data structures such as
stacks, linked lists and queues, binary trees and heaps. Time and space complexity of algorithms.
References
K. Hoffman and R.E. Kunze, Linear Algebra, Prentice Hall (India), 1986
N.Balabanian and T.A. Bickart, Linear Network Theory :Analysis, Properties, Design and
Synthesis, Matrix Publishers, Inc.,1981.
T.Cormen, C.Leiserson and R.A.Rivest, Algorithms, MIT Press and McGraw-Hill, 1990.
Environment for VLSI Technology: Clean room and safety requirements. Wafer cleaning processes
and wet chemical etching techniques.
Impurity incorporation: Solid State diffusion modelling and technology; Ion Implantation
modelling, technology and damage annealing; characterization of Impurity profiles.
Oxidation : Kinetics of Silicon dioxide growth both for thick, thin and ultrathin films. Oxidation
technologies in VLSI andULSI; Characterisation of oxide films; High k and low k dielectrics for
ULSI.
Chemical Vapour Deposition techniques : CVD techniques for deposition of polysilicon, silicon
dioxide, silicon nitride and metal films; Epitaxial growth of silicon; modelling and technology.
Page 2 of 19
MS Microelectronics(Syllabus)
Metal film deposition : Evaporation and sputtering techniques. Failure mechanisms in metal
interconnects; Multi-level metallisation schemes.Plasma and Rapid Thermal Processing: PECVD,
Plasma etching and RIE techniques; RTP techniques for annealing, growthand deposition of
various films for use in ULSI.
Process integration for NMOS, CMOS and Bipolar circuits; Advanced MOS technologies.
References:
C.Y. Chang and S.M.Sze (Ed), ULSI Technology, McGraw Hill Companies Inc, 1996.
S.K. Ghandhi, VLSI Fabrication Principles, John Wiley Inc., New York, 1983.
S.M. Sze (Ed), VLSI Technology, 2nd Edition, McGraw Hill, 1988.
Semiconductor junctions: Schottky, homo- and hetero-junction band diagrams and I-V
characteristics, and small signal switching models; Two terminal and surface states devices based
on semiconductor junctions.
MOS structures: Semiconductor surfaces; Theideal and nonideal MOS capacitor band diagrams and
CVs; Effects of oxide charges, defects and interface states; Characterization of MOS capacitors: HF
and LF CVs, avalanche injection; High field effects and breakdown.
Characterization of semi conductors: Four probe and Hall measurement; CVs for dopant profile
characterization; Capacitance transients and DLTS.
References
J. P. McKelvey, introduction to Solid State and Semiconductor Physics, Harper and Row and John
Weathe Hill, 1966.
E. H. Nicollian and J. R. Brews, MOS Physics and Technology, John Wiley, 1982.
K. K. Ng, Complete Guide to Semiconductor Devices, McGraw Hill, 1995.
D.K. Schroder, Seminconductor Material and Device Characterization, John Wiley, 1990.
S. M. Sze, Physics of Semiconductor Devices, 2nd edition John Wiley, 1981.
C. T. Sah, Fundamentals of Solid-State Electronic Devices, Allied Publishers and World Scientific,
1991.
E. F. Y. Waug, Introduction to Solid State Electronics North Holland, 1980.
Page 3 of 19
MS Microelectronics(Syllabus)
MEL 607 CMOS Analog Integrated circuit design
MEL 607 CMOS Analog Integrated Circuit Design
Introduction and Background: MOS Device Basics, MOS Device Models, RC Circuits, Passive
Devices, Layout, Design Rules.
3 hours
Single Stage Amplifiers: Common Source Amplifiers, Source Follower Common Gate, Cascode
Structures and Folded Cascode Structures.
3 hours
Differential Amplifier: Introduction to Differential Pair Amplifier, Quantitative Analysis to
Differential Pair Amplifier, Common Mode Response, Differential Amplifiers with Different Loads,
Effects of Mismatches. 4 hours
Current Mirrors/Sources: Simple Current Mirrors/Sources, Cascode Current Mirrors/Sources,
Differential Pair with Current Mirror Load.
4 hours
Output Stages:
Operational Amplifiers: Op Amps Low Frequency Analysis, Telescopic Op Amps, Folded
Cascode Op Amps, Two Stage Op Amps, Common Mode Feedback.
4 hours
Frequency Response: Frequency Response of Common Source Amplifiers, Source Follower
Common Gate, Cascode Structures and Folded Cascode Structures, Differential Amplifiers, Single
Ended Differential Pair. 4 hours
Feedback: Voltage-Voltage, Current -Voltage, Voltage-Current & Current-Current Feedback,
Loading. 3 hours
Frequency Compensation & Stability: Frequency Compensation Techniques in Telescopic Op
Amps, Folded Cascode Op Amps, Two Stage Op Amps.
4 hours
Operational Amplifier Applications: Filters, Applications, A/D's & D/A's, Pipeline A/D with
Open Loop Op Amp Wireless Circuits, RF Frontend and Review.
3 hours
Text Book
Design of Analog CMOS Integrated Circuits, Behzad Razavi, McGraw-Hill, 2000.
References
Analysis and Design of Integrated Circuits, Paul R. Gray, Paul J. Hurst, Stephen H. Lewis, Robert
G. Meyer, 4th Ed., Wiley, 2001.
Analog Integrated Circuit Design, D. Johns and K.Martin, Wiley, 1997.
The Designers Guide to SPICE & SPECTRE,K. S. Kundert, Kluwer Academic Press, 1995.
Operation and Modeling of the MOS Transistor, Y. Tsividis, McGraw-Hill, 2nd Edition, 1999.
Page 4 of 19
MS Microelectronics(Syllabus)
GaAs devices and circuits. Comparison of MOS,CMOS,BICMOS technologies. Realization of basic logic
gates using MOS,CMOS, BICMOS technologies.
Fabrication of ICs:
Lithographic process of MOS NMOS process,PMOS process CMOS fabrication- N-well, P-well and twin
tub processes. Latch-up in CMOS. Physical origin of Latch-up Latch-up prevention Internal Latch-up
prevention techniques I/O Latch-up prevention SOI process. VLSI Yield and economics.
VLSI Circuit Design:
Pass transistors and transmission gates. Implementation of Boolean functions and combinational circuits
using switch logic & gate logic. Pseudo NMOS inverter, Dynamic and clocked CMOS inverters. Clocking
strategies, single and two phase clocking, Clock distribution. Scaling of MOS circuits.
Digital circuit design
Implementation of Boolean functions using basic gates Synchronous and Asynchronous Sequential circuits-
FlipFlops,Registers,Counters Mealy and Moore state machines Clocked sequential circuits
and combinational circuits using switch logic & gate logic.ROM, PAL, PLA
Layout Generations:
MOS Circuit designs Layer representations CMOS Design rules-spacing and dimension checks Stick
diagrams Layouts of basic gates using different CMOS logics-
Basic circuit concepts and performance estimation :
Sheet resistance, Standard unit of capacitance. Estimation of delay in NMOS and CMOS inverters. Driving
of large capacitive loads. Super buffers. Estimation of power. Power reduction techniques.
System design methods
Design description domains and design strategies-Hierarchy, regularity, Modularity,Locality Design
methods Bhavioral synthesis RTL synthesys Logic optimization structural to Layout synthesis placement,
routing
Sub system design
Issues in Subsystem design. Design examples such as Adders-Serial,parallel adders,carry save
addition,Carry lookahead adder, carry select adder design of simple ALU, Shifters Array shifters using
transmission gates
Memories:
Static RAM four transistor SRAM cell and six transistor SRAM cell Dynamic RAMs-one transistor
DRAM cell, three transistor DRAM cell different topologies and performance analysis.
References:
1. Pucknell D.A and Eshraghian K, Basic VLSI Design, PHI publication.
2. West N and Eshraghian K, Principles of CMOS VLSI Design, Addison Wesley Publication.
3. Tsividis and Yannis, Operation and Modeling of the MOS Transistors, 2nd Edn. Oxford University
Press.
4. Amar Mukherjee, Introduction to NMOS & CMOS VLSI systems Design, PHI publication.
5. Allen, CMOS Analog Circuit Design, 2nd Edn. Oxford University Press.
6. Priciples of CMOS VLSI Design 2nd Edn.-Neil H. E. Weste Kamran Eshraghian
Page 5 of 19
MS Microelectronics(Syllabus)
MEL 611 Elective I:
MEL 611.1 RF Microelectronics Chip Design
Reference
B.Razavi, RF Microelectronics, Prentice-Hall PTR,1998 T.H.Lee.
Design of CMOS Radio-Frequency Integrated Circuits, Cambridge University Press, 1998.
Physical Microsensors : Classification of physical sensors, Integrated, Intelligent, or Smart sensors, Sensor
Principles and Examples : Thermal sensors, Electrical Sensors, Mechanical Sensors, Chemical and
Biosensors
Surface Micromachining: One or two sacrificial layer processes, Surface micromachining requirements,
Polysilicon surface micromachining, Other compatible materials, Silicon Dioxide, Silicon Nitride,
Piezoelectric materials, Surface Micromachined Systems : Success Stories, Micromotors, Gear trains,
Mechanisms
Application Areas: All-mechanical miniature devices, 3-D electromagnetic actuators and sensors,
RF/Electronics devices, Optical/Photonic devices, Medical devices e.g. DNA-chip, micro-arrays.
Page 6 of 19
MS Microelectronics(Syllabus)
References
Stephen D. Senturia, "Microsystem Design" by, Kluwer Academic Publishers, 2001.
Marc Madou, Fundamentals of Microfabrication by, CRC Press, 1997.Gregory Kovacs, Micromachined
Transducers Sourcebook WCB McGraw-Hill, Boston, 1998.
M.-H. Bao, Micromechanical Transducers: Pressure sensors, accelrometers, and gyroscopes by Elsevier,
New York, 2000.
Page 7 of 19
MS Microelectronics(Syllabus)
B. Verilog:
C. Testing:
Reference Books
Page 8 of 19
MS Microelectronics(Syllabus)
Verilog HDL by Samir Palnitkar, Pearson Education, 2001.
Digital Systems Testing and Testable Design by Miron A, Melvin A.B., Arthur D.F.
SECOND SEMESTER
MEL 602 NANOMATERIALS AND NANOELECTRONICS
MEL602 Nanomaterials and Nanoelectronics
1.Introduction to nanomaterials & nanotechnology-3 Hrs
1.1Introduction
1.1.1What is nanotechnology?
1.1.2History of nanomaterials
1.1.3Influence on properties by "nano-structure induced effects"
1.1.4Applications of nanomaterials in different fields
1.1.5Societal implications of Nanoscience and Nanotechnology
2.Atoms, molecules and nanomaterials 3 Hrs
2.1 Introduction
2.1.1Molecular orbital theory
2.1.2 Angular momentum quantum number , ,, ,.
2.1.3.Chemical bond theory
3.Preparation/Synthesis of nanomaterials - 6 Hrs
3.1Methods for creating nanostructures
3.1.1Gas phase clusters
3.1.2Self assembled monolayers
3.1.3Nano powders
3.1.4Nanoshells
3.1.5Nno crystals
3.2Chemical Synthesis
3.2.1catalysis
3.2.2Solgel method
3.2.3Sonochemical method
3.3Physical Synthesis
3.3.1Chemical Vapor Synthesis
3.3.2Spray Pyrolysis
3.3.3Laser Pyrolysis/ Photochemical Synthesis
3.3.4Thermal Plasma Synthesis
3.3.5Flame Synthesis
3.3.6Low-Temperature Reactive Synthesis
3.4Biomimetic processes
3.4.1Supramolecular chemistry
3.4.2Molecular recognition
3.4.3Molecular template
4Analytical tools for characterizing nano-materials 3Hrs
4.1Electon probe micro-ananlysis
4.2Scanning probe microscopy
4.3Atomic force microscopy
4.4Scanning tunneling microscopy
4.5Chemical force microscopy
Page 9 of 19
MS Microelectronics(Syllabus)
4.6Other kind of microscopies
5Introduction to Carbon nanotubes 3Hrs
5.1Single wall and multi wall nanotubes
5.2Synthesis of carbon nanotubes
5.3Structure of nanotubes
5.4Properties ( Kinetics,thermal,electrical)
5.5Application of carbon nanotube
5.6Fullerenes
5.7Percolation theory
6 Properties of materials due to the scaling of size 3 Hrs
6.1Physical
6.1Friction and wear
6.1.2Nanotribology
6.2Mechanical
6.2.1Strength and composite
6.3Optical
6.3.1Absorption of light in semiconductor materials
6.3.2Surface plasmon
6.4 Thermal
6.5Chemical
6.6Magnetic
7Quantum dot 3 Hrs
7.1Preparation and synthesis
7.2Qantum confinement and energy model
7.3Qantum well
7.4Qantum tunneling
7.5Application
8NENO SENSORS 6 Hrs
8.1Different types of senors
8.2Fabrication
8.2.1Top down approach
8.2.1.1bulk micromaching
8.2.1.2surface micromachining
8.2.1.3steolithography and LIGA
8.2.2Bottom up approach
8.2.2.1Effect of scaling
8.2.2.2Semiconducting polymers
8.2.2.3Self assembled monolayers
9 Nano- applications 3 Hrs
9.1Snsors
9.2Nano machine
9.3energy
9.4Quantum dot application
9.5Medical application
10Nano electronics 3 Hrs
10.1Quantum size effect in nanoparticles
10.2Single electron transistor.
10.2.1Coulomb blockade
Page 10 of 19
MS Microelectronics(Syllabus)
10.3Qubits
10.4Phase change memory
10.5Millipede
10.6The red brick wall in microelectronics
10.7Future needs
References:
Nano- the essentials by T. PradeepMcGraw Hill
Nanotechnology by Richard Brooker and Earl Boyson Wiley
Microsensors, MEMS and Smart material by J.W.Gardner, V.K.Vardan, O.O.Awadelkarim
Wiley
References
Monolithic Phase-locked loops and clock recovery circuits: Theory and design, IEEE Press, 1996.
Page 11 of 19
MS Microelectronics(Syllabus)
8085 Architecture, I/O Devices 8355/8755, DMA Controller 8237, 8279 8253 Programmable
Peripheral Interface 8255 Interrupt System, Digital Interfacing, Multiple Microprocessor Systems,
8051 Microcontroller Architecture, 8051 Microcontroller System design
Architecture of 16/32/ 64 bit Microcontroller, System Architecture, Different aspects of
architecture design, Macros, CPU Organization, Data Path Design, Memory Organization, Control
Design
System on Chip Design Issues, SOC Design Methodology, Power Considerations, SOC Case study,
Design Consideration Challenges, Memories, Parameterized Systems-on-a- Chip , System-on-a-
chip Peripheral Cores , SOC and interconnect centric Architectures
IP Core Design issues, IP Core Design Methodology, Reusability and intellectual property, IP Core
Applications
Micro Networks, SoC protocols, OC, VSI, Hardware/Software Co-Design
Reference Books:
1. Edwards M.D, Automatic Logic Synthesis Techniques for Digital Systems', Macmillan New
Electronic series, 1992.
2. F. Balarin, Hardware-software co-design of embedded systems: Kluwer academic publishers,
1997.
3. J.Rozenblit, K.Buchenrieder: Co-design: Computer-Aided software/hardware engineering,
Piscataway, NJ; IEEE Press, 1995.
4. Myke Predko, Programming and Customizing the 8051 Microcontroller, Tata McGraw Hill,
ISBN: 0-07-042140-4, 1999.
5. Barry B.Brey, Intel Microprocessors, Architecture, Programming and Interfacing, Prentice-Hall
India, ISBN: 81-203-1220-1, 2000.
Page 12 of 19
MS Microelectronics(Syllabus)
Functional Yield Modeling
Critical Area and Fault Probability Prediction
Statistical Methods of Parametric Yield and Quality Enhancement
Architectural Fault Tolerance
Design for Test and Manufacturability
Testing Solutions for MCM Manufacturing
Introduction: Biological neurons and memory: Structure and function of a single neuron; Artificial
Neural Networks (ANN); Typical applications of ANNs : Classification, Clustering, Vector
Quantization, Pattern Recognition, Function Approximation, Forecasting, Control, Optimization;
Basic Approach of the working of ANN - Training, Learning and Generalization.
References
K. Mehrotra, C.K. Mohan and Sanjay Ranka, Elements of Artificial Neural Networks, MIT Press,
1997 - [Indian Reprint Penram International Publishing (India), 1997]
Simon Haykin, Neural Networks - A Comprehensive Foundation, Macmillan Publishing Co., New
York, 1994.
Page 13 of 19
MS Microelectronics(Syllabus)
A Cichocki and R. Unbehauen, Neural Networks for Optimization and Signal Processing, John
Wiley and Sons, 1993.
J. M. Zurada, Introduction to Artificial Neural Networks, (Indian edition) Jaico Publishers,
Mumbai, 1997.
VI FA Lab Management
Page 14 of 19
MS Microelectronics(Syllabus)
4. Experiments of Comparison
5. Accelerated Experiments
6. Sequential Experiments
7. Fatigue Experiments
Review: Signals and systems, Time and frequency analysis of signals and systems, Z Transform.
Discrete Fourier Transform: Frequency domain sampling and reconstruction of discrete time
signals DFT, DFT as a linear transformation, properties of the DFT, use of DFT in linear filtering,
filtering of long data sequences Efficient computation of the DFT: FFT Algorithms Radix 2
DITFFT and DIFFFT, in-place COMPUTATION. Goertzel Algorithm.
Implementation of Discrete time Systems: Structures for FIR systems Direct form, cascade
form, Frequency sampling and lattice structures. Structures for IIR systems Direct form, cascade
and parallel form, lattice ladder structures.
Design of IIR filters: Classical design by impulse invariance, bilinear transformation and matched
Z transform, characteristics and design of commonly used filters butter worth, chebyshev and
elliptic filters, Spectral transformations, Direct design of IIR filters.
Design of Digital FIR Filters: General considerations, Linear phase FIR Filters, Symmetric and
antisymmetric impulse response, Design using windows, frequency sampling design, Optimum
design, Remez Algorithm.
Power Spectrum Estimation: Estimation of power spectra from Finite duration of observation of
signals. Non-parametric and Parametric methods of power spectrum estimation.
06 hrs.
Digital Signal Processors: Architecture, features and instructions of Fixed point and Floating
Point Processors(TMS320c25 and TMS32030).
References:-
1. A.V.Oppenheim and R.W.Schafer, Descrete time signal Processing, PHI.
2. J.G.Proakis and D.G.Manolakis, Introduction to Digital Signal Processing
3. J.R.Johnson, Introduction to Digital Signal Processing PHI.
4. Rabiner & Gold, Theory and applications of digital signal processing, PHI.
5. Wills J.Tompkins, Biomedical Digital Signal Processing, Prentice-Hall
Page 15 of 19
MS Microelectronics(Syllabus)
6. Texas Instruments DSP Processors (320 family) data hand book.
Text Books:
1. Kerry Bernstein & et. al., High Speed CMOS Design Styles, Kluwer, 1999.
2. Evan Sutherland, Bob stroll, David Harris, Logical Efforts, Designing Fast CMOS Circuits, Kluwer, 1999.
3. David Harris, Skew Tolerant Domino Design.
4. William S. Dally & John W. Poulton; Digital Systems Engineering, Cambridge University Press, 1998.
5. Howard Johnson & Martin Graham; High speed Digital Design : A hand book of Black Magic, Prentice Hall PTR,
1993.
6. Jan M. Rabaey , et all; Digital Integrated Circuits: A Design perspective, second edition, 2003
Finite dimensional vector space, inner-product, complex numbers, linear adjoints, unitary maps,
projectors, tensor product of Hilbert spaces, bit, qubit, entanglement, no-cloning, quantum circuits,
quantum gates, Shor's algorithm, Grover's algorithm, quantum teleportation, quantum key-
Page 16 of 19
MS Microelectronics(Syllabus)
exchange, teleportation and measurement based quantum computing, decoherence, quantum error-
correction, mixed states, quantum information.
References
Nielsen, M. and Chuang, I. L. (2000) Quantum Computation and Quantum Information. Cambridge
University Press
References
Device configuration and Applications : P-I-N devices, Thin film transistors , LEDs , Memory
Switches , Novel Processing Technology for Macroelectronics, Amorphous silicon Solar cells ,TFT
based LCD displays, Passive and Active Matrix displays , Photoreceptors, Large Area Image
Sensor Arrays , Image pick up tubes or Vidicons, High energy Radiation imaging, Multilayer Color
Detectors, Thin Film Position Sensitive Detectors: From 1D to 3D Applications
Page 17 of 19
MS Microelectronics(Syllabus)
film transistors, Device structure and characteristics , Circuit systems based on organic devices,
Organic Lasers, Other application
Flat panel Display Technologies : LCD displays , Plasma Displays (PDP), Electroluminescent
Displays(EL), Electrophoretic Displays (Electronic paper), Field emission displays (FED),
Introduction to the concept of Flexible Electronics.
References
1.Hydrogenated amorphous silicon , R.A.Street, Cambridge University Press 1991
2.The Physics and Technology of Amorphous silicon A.Madan & M.P.Shaw, Elsevier Science &
Technology books 1988.
3.Technology and Applications of Amorphous Silicon: Technology and Applications ed.
Robert A. Street Springer-Verlag New York, LLC Series: Series in Materials Science. 2001
4.Properties of Amorphous Silicon and Its Alloys, Tim.M..Searle, IEE Publication 1998.
5.Latest MRS conference proceedings on amorphous and nanocrystalline semiconductors
6. Stephen Forrest, Paul Burrows, & Mark Thompson , IEEE Spectrum August 2000 Volume 37
Number 8 The dawn of Organic Electroncis
7. Prospects and Applications for Organic Light Emitting Devices," by P.E. Burrows, S.R. Forrest,
and M.E. Thompson in Current Opinion in Solid State and Materials Science, Vol. 2, pp. 236-243
(1997).
8. "Ultrathin Organic Films Grown by Organic Molecular Beam Deposition and Related
Techniques," by S.R. Forrest, Chemical Reviews, Vol. 97, pp. 1793-1896 (1997).
9. Additional references Special issues on Conducting polymers and Flat panel displays in journals
MRS Bulletin, IEEE Proceedings & Electronic Devices and SID Information Display magazine.
Page 18 of 19
MS Microelectronics(Syllabus)
Low power Clock Distribution: Power dissipation in clock distribution, single driver Vs distributed
buffers, Zero skew Vs tolerable skew, chip & package co design of clock network
Algorithm & architectural level methodologies: Introduction, design flow, Algorithmic level
analysis & optimization, Architectural level estimation & synthesis.
Text Books:
1. Gary K. Yeap, Practical Low Power Digital VLSI Design, KAP, 2002
2. Rabaey, Pedram, Low power design methodologies Kluwer Academic, 1997
3. Kaushik Roy, Sharat Prasad, Low-Power CMOS VLSI Circuit Design Wiley, 2000
Page 19 of 19