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1. General description
The 74HC4052; 74HCT4052 is a high-speed Si-gate CMOS device and is pin compatible
with the HEF4052B. The device is specified in compliance with JEDEC standard no. 7A.
VCC and GND are the supply voltage pins for the digital control inputs (pins S0, S1 and E).
The VCC to GND ranges are 2.0 V to 10.0 V for the 74HC4052 and 4.5 V to 5.5 V for the
74HCT4052. The analog inputs/outputs (pins nY0 to nY3 and nZ) can swing between VCC
as a positive limit and VEE as a negative limit. VCC VEE may not exceed 10.0 V.
3. Applications
Analog multiplexing and demultiplexing
Digital multiplexing and demultiplexing
Signal gating
4. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC4052
74HC4052N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
74HC4052D 40 C to +125 C SO16 plastic small outline package; 16 leads; body SOT109-1
width 3.9 mm
74HC4052DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; body SOT338-1
width 5.3 mm
74HC4052PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1
body width 4.4 mm
74HC4052BQ 40 C to +125 C DHVQFN16 plastic dual-in line compatible thermal enhanced very SOT763-1
thin quad flat package; no leads; 16 terminals;
body 2.5 3.5 0.85 mm
74HCT4052
74HCT4052N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
74HCT4052D 40 C to +125 C SO16 plastic small outline package; 16 leads; body SOT109-1
width 3.9 mm
74HCT4052DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; SOT338-1
body width 5.3 mm
74HCT4052PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1
body width 4.4 mm
74HCT4052BQ 40 C to +125 C DHVQFN16 plastic dual-in line compatible thermal enhanced very SOT763-1
thin quad flat package; no leads; 16 terminals;
body 2.5 3.5 0.85 mm
74HC_HCT4052 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.
5. Functional diagram
10 0 0
4
3
13 9 1
6 G4
1Z
1Y0 12
10 S0 1Y1 14 MDX
0 1
9 S1 1Y2 15 1 5
3
1Y3 11 2 2
2Y0 1 3 4
2Y1 5 12
2Y2 2 14
13
6 E 2Y3 4 15
2Z
11
001aah824
3 001aah825
nYn
VCC VEE
VCC VCC
VCC VEE
VEE nZ
from
logic
mnb043
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VDD
16 13
1Z
12
1Y0
14
1Y1
15
1Y2
10
S0
11
1Y3
9 LOGIC
1-OF-4
S1 LEVEL
DECODER
CONVERSION
1
2Y0
6
E
5
2Y1
2
2Y2
4
2Y3
3
2Z
8 7
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6. Pinning information
6.1 Pinning
74HC4052
74HC4052
74HCT4052
74HCT4052
16 VCC
2Y0
2Y0 1 16 VCC terminal 1
index area
1
2Y2 2 15 1Y2
2Y2 2 15 1Y2
2Z 3 14 1Y1
2Z 3 14 1Y1
2Y3 4 13 1Z 2Y3 4 13 1Z
9
VEE 7 10 S0
GND
S1
GND 8 9 S1 001aah823
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7. Functional description
8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to VEE = GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage [1] 0.5 +11.0 V
IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA
ISK switch clamping current VSW < 0.5 V or VSW > VCC + 0.5 V - 20 mA
ISW switch current 0.5 V < VSW < VCC + 0.5 V - 25 mA
IEE supply current - 20 mA
ICC supply current - 50 mA
IGND ground current - 50 mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation DIP16 package [2] - 750 mW
SO16, (T)SSOP16, and DHVQFN16 [3] - 500 mW
package
P power dissipation per switch - 100 mW
[1] To avoid drawing VCC current out of pins nZ, when switch current flows in pins nYn, the voltage drop across the bidirectional switch must
not exceed 0.4 V. If the switch current flows into pins nZ, no VCC current will flow out of pins nYn. In this case there is no limit for the
voltage drop across the switch, but the voltages at pins nYn and nZ may not exceed VCC or VEE.
[2] For DIP16 packages: above 70 C the value of Ptot derates linearly with 12 mW/K.
[3] For SO16 packages: above 70 C the value of Ptot derates linearly with 8 mW/K.
For SSOP16 and TSSOP16 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K.
For DHVQFN16 packages: above 60 C the value of Ptot derates linearly with 4.5 mW/K.
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mnb044 mnb045
12 12
VCC GND
VCC GND (V)
10
(V)
8 8
operating area 6
operating area
4 4
0 0
0 4 8 12 0 4 8 12
VCC VEE (V) VCC VEE (V)
Fig 7. Guaranteed operating area as a function of the Fig 8. Guaranteed operating area as a function of the
supply voltages for 74HC4052 supply voltages for 74HCT4052
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74HC_HCT4052 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.
Table 6. RON resistance per switch for 74HC4052 and 74HCT4052 continued
VI = VIH or VIL; for test circuit see Figure 9.
Vis is the input voltage at a nYn or nZ terminal, whichever is assigned as an input.
Vos is the output voltage at a nYn or nZ terminal, whichever is assigned as an output.
For 74HC4052: VCC GND or VCC VEE = 2.0 V, 4.5 V, 6.0 V and 9.0 V.
For 74HCT4052: VCC GND = 4.5 V and 5.5 V, VCC VEE = 2.0 V, 4.5 V, 6.0 V and 9.0 V.
Symbol Parameter Conditions Min Typ Max Unit
RON(rail) ON resistance (rail) Vis = VEE
VCC = 2.0 V; VEE = 0 V; ISW = 100 A [2] - - -
VCC = 4.5 V; VEE = 0 V; ISW = 1000 A - - 210
VCC = 6.0 V; VEE = 0 V; ISW = 1000 A - - 180
VCC = 4.5 V; VEE = 4.5 V; ISW = 1000 A - - 160
Vis = VCC
VCC = 2.0 V; VEE = 0 V; ISW = 100 A [2] - - -
VCC = 4.5 V; VEE = 0 V; ISW = 1000 A - - 240
VCC = 6.0 V; VEE = 0 V; ISW = 1000 A - - 210
VCC = 4.5 V; VEE = 4.5 V; ISW = 1000 A - - 180
001aai068
100
(1)
RON
()
80
60 (2)
Vsw
V
(3)
40
VCC
from select Sn
input
20
nYn nZ
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74HC_HCT4052 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.
74HC_HCT4052 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.
VCC
from select Sn
input Isw Isw
Yn Z
A A
001aan383
VCC
HIGH
Sn
from select
input Isw
Yn Z Vos
A
001aan384
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74HC_HCT4052 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.
74HC_HCT4052 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.
Vis input 50 %
tPLH tPHL
Vos output 50 %
001aad555
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VI
E, Sn inputs VM
0V
tPZL
tPLZ
Vos output 50 %
10 %
tPHZ tPZH
90 %
50 %
Vos output
001aae330
tW
VI
90 %
negative
pulse VM VM
10 %
0V
tf tr
tr tf
VI
90 %
positive
pulse VM VM
10 %
0V
tW
VI Vos RL S1
PULSE
DUT open
GENERATOR
RT CL
GND
VEE
001aae382
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[1] tr = tf = 6 ns; when measuring fmax, there is no constraint to tr and tf with 50 % duty factor.
[2] VI values:
a) For 74HC4052: VI = VCC
b) For 74HCT4052: VI = 3 V
[1] Adjust input voltage Vis to 0 dBm level (0 dBm = 1 mW into 600 ).
[2] Adjust input voltage Vis to 0 dBm level at Vos for 1 MHz (0 dBm = 1 mW into 50 ).
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VCC
Sn
10 F
nYn/nZ nZ/nYn
Vis Vos
VEE GND RL CL dB
001aah829
VCC
Sn
0.1 F
nYn/nZ nZ/nYn
Vis Vos
VEE GND RL CL dB
001aah871
001aae332
0
iso
(dB)
20
40
60
80
100
10 102 103 104 105 106
fi (kHz)
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VCC
Sn
0.1 F RL
nYn/nZ nZ/nYn
Vis
VEE GND RL CL
VCC
Sn
nYn/nZ nZ/nYn
Vos
RL VEE GND RL CL dB
001aah873
Fig 18. Test circuits for measuring crosstalk between any two switches/multiplexers
Sn, E
Vct
nYn nZ
001aah913
Fig 19. Test circuit for measuring crosstalk between control input and any switch
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VCC
Sn
10 F
nYn/nZ nZ/nYn
Vis Vos
VEE GND RL CL dB
001aah829
001aad551
5
Vos
(dB)
3
5
10 102 103 104 105 106
f (kHz)
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SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D E A
X
y HE v M A
16 9
Q
A2
(A 3) A
A1
pin 1 index
Lp
1 8 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT109-1 076E07 MS-012
03-02-19
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
D E A
X
c
y HE v M A
16 9
Q
A2 A
A1 (A 3)
pin 1 index
Lp
L
1 8 detail X
w M
e bp
0 2.5 5 mm
scale
mm 2
0.21 1.80 0.38 0.20 6.4 5.4 7.9 1.03 0.9 1.00 8o
0.25 0.65 1.25 0.2 0.13 0.1 o
0.05 1.65 0.25 0.09 6.0 5.2 7.6 0.63 0.7 0.55 0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT338-1 MO-150
03-02-19
D ME
seating plane
A2 A
L A1
c
Z e w M
b1
(e 1)
b b2
16 9 MH
pin 1 index
E
1 8
0 5 10 mm
scale
UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 1.25 0.36 19.50 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 0.76
1.30 0.38 0.85 0.23 18.55 6.20 3.05 7.80 8.3
inches 0.068 0.021 0.049 0.014 0.77 0.26 0.14 0.32 0.39
0.17 0.02 0.13 0.1 0.3 0.01 0.03
0.051 0.015 0.033 0.009 0.73 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
95-01-14
SOT38-4
03-02-13
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D E A
X
y HE v M A
16 9
Q
A2 (A 3)
A
A1
pin 1 index
Lp
L
1 8
detail X
w M
e bp
0 2.5 5 mm
scale
mm 1.1
0.15 0.95 0.30 0.2 5.1 4.5 6.6 0.75 0.4 0.40 8o
0.25 0.65 1 0.2 0.13 0.1 o
0.05 0.80 0.19 0.1 4.9 4.3 6.2 0.50 0.3 0.06 0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT403-1 MO-153
03-02-18
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm SOT763-1
D B A
A
A1
E c
terminal 1 detail X
index area
terminal 1 C
e1
index area
e b v M C A B y1 C y
w M C
2 7
1 8
Eh e
16 9
15 10
Dh
X
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
A(1)
UNIT
max.
A1 b c D (1) Dh E (1) Eh e e1 L v w y y1
02-10-17
SOT763-1 --- MO-241 ---
03-01-27
14. Abbreviations
Table 13. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
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[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term short data sheet is explained in section Definitions.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Draft The document is a draft version only. The content is still under
malfunction of an NXP Semiconductors product can reasonably be expected
internal review and subject to formal approval, which may result in
to result in personal injury, death or severe property or environmental
modifications or additions. NXP Semiconductors does not give any
damage. NXP Semiconductors and its suppliers accept no liability for
representations or warranties as to the accuracy or completeness of
inclusion and/or use of NXP Semiconductors products in such equipment or
information included herein and shall have no liability for the consequences of
applications and therefore such inclusion and/or use is at the customers own
use of such information.
risk.
Short data sheet A short data sheet is an extract from a full data sheet
Applications Applications that are described herein for any of these
with the same product type number(s) and title. A short data sheet is intended
products are for illustrative purposes only. NXP Semiconductors makes no
for quick reference only and should not be relied upon to contain detailed and
representation or warranty that such applications will be suitable for the
full information. For detailed and full information see the relevant full data
specified use without further testing or modification.
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the Customers are responsible for the design and operation of their applications
full data sheet shall prevail. and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
Product specification The information and data provided in a Product design. It is customers sole responsibility to determine whether the NXP
data sheet shall define the specification of the product as agreed between Semiconductors product is suitable and fit for the customers applications and
NXP Semiconductors and its customer, unless NXP Semiconductors and products planned, as well as for the planned application and use of
customer have explicitly agreed otherwise in writing. In no event however, customers third party customer(s). Customers should provide appropriate
shall an agreement be valid in which the NXP Semiconductors product is design and operating safeguards to minimize the risks associated with their
deemed to offer functions and qualities beyond those described in the applications and products.
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
16.3 Disclaimers customers applications or products, or the application or use by customers
third party customer(s). Customer is responsible for doing all necessary
testing for the customers applications and products using NXP
Limited warranty and liability Information in this document is believed to
Semiconductors products in order to avoid a default of the applications and
be accurate and reliable. However, NXP Semiconductors does not give any
the products or of the application or use by customers third party
representations or warranties, expressed or implied, as to the accuracy or
customer(s). NXP does not accept any liability in this respect.
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no Limiting values Stress above one or more limiting values (as defined in
responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC 60134) will cause permanent
source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
In no event shall NXP Semiconductors be liable for any indirect, incidental,
the Recommended operating conditions section (if present) or the
punitive, special or consequential damages (including - without limitation - lost
Characteristics sections of this document is not warranted. Constant or
profits, lost savings, business interruption, costs related to the removal or
repeated exposure to limiting values will permanently and irreversibly affect
replacement of any products or rework charges) whether or not such
the quality and reliability of the device.
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory. Terms and conditions of commercial sale NXP Semiconductors
Notwithstanding any damages that customer might incur for any reason products are sold subject to the general terms and conditions of commercial
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changes to information published in this document, including without purchase of NXP Semiconductors products by customer.
limitation specifications and product descriptions, at any time and without
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conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
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authorization from competent authorities. liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors
Non-automotive qualified products Unless this data sheet expressly
standard warranty and NXP Semiconductors product specifications.
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested Translations A non-English (translated) version of a document is for
in accordance with automotive testing or application requirements. NXP reference only. The English version shall prevail in case of any discrepancy
Semiconductors accepts no liability for inclusion and/or use of between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 16.4 Trademarks
(a) shall use the product without NXP Semiconductors warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond
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18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Functional description . . . . . . . . . . . . . . . . . . . 6
7.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Recommended operating conditions. . . . . . . . 7
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 13
12 Additional dynamic characteristics . . . . . . . . 17
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 26
15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
17 Contact information. . . . . . . . . . . . . . . . . . . . . 28
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.