9th International Conference on Microelectronics and Computer Science, Chisinau, Republic of Moldova, October 19-21, 2017

Instructions to Authors Preparing Their

Camera Ready Papers

Abstract These instructions provide basic guidelines to help possible contributors prepare their final
camera-ready papers for submission to the International Conference on Microelectronics and Computer
Science. The aim of the Conference will be to bring together scientists, engineers, manufacturers and users
from all over the world in order to provide and exchange information on recent developments and future
trends in: Automatics and Robotics, Biomedical Systems, Micro-opto-electronics, Nano-science and
Nanotechnology, Computer Science and Networks, Information Security, Communication and Electronic
Systems, New Technology for University Education. Abstracts (maximum 250 words) should be self-
explanatory and summarize the essential qualities of the paper.
Index Terms five key words or phrases arranged alphabetically and separated by commas.

1
 9th International Conference on Microelectronics and Computer Science, Chisinau, Republic of Moldova, October 19-21, 2017

Victor ABABII
Technical University of Moldova
icmcs@mail.utm.md
Text, Formulae TNRoman 10 Norm
Algorithms Courier New 10 Norm
References TNRoman 10 Norm
I. INTRODUCTION
Prospective authors are invited to submit papers that fit References to cited sources should be incorporated
within the scope of the journal. Papers should be written in within the text (e.g. [2]). Bibliographical references must
English and submitted in final camera-ready form. For be placed at the end of the paper and comply with the
more details, please visit the IEEE web page [1] and follow model below.
the instructions in TRANS-JOUR.DOC files.
IV. CONCLUSION
II. PAPER AND TEXT FORMAT
A conclusion section is not compulsory. Make sure that
Margins: top 2.00 cm, bottom 2.00 cm, left and right the whole text of your paper observes the textual
1.80 cm, gutter 0 cm. Orientation: portrait. Paper size: A4. arrangement on this page.
Line spacing: single. Text organization: two columns.
Column width: 8.3. Space between columns: 0.9 cm. Last APPENDIX A
page columns must be equal in length. Header and footer:
Appendices, if present, must be marked A, B, C, and
different for odd and even pages.
placed before Acknowledgment.
Author name, affiliation and complete address are to be
placed underneath the title. In case of multiple authorship
ACKNOWLEDGMENTS
of a submitted paper, the affiliation and complete address
of each author must be specified. Place your acknowledgments before References. Do not
mention the sponsors and/or financial support obtained in
III. TABLES, FIGURES, EQUATIONS this section. These specifications are to be included in an
unnumbered footnote on the first page of the paper.
Illustrations and tables should be progressively
numbered, following the order cited in the text; they may
be organized in one or two columns. Tables must be
accompanied by a caption placed at the top. Figures
(abbreviated Fig.) must be accompanied by a caption
placed underneath. References made to tables in text will
not be abbreviated e.g. in Table I, TN Roman means
Times New Roman.
Each formula should occupy one line. Consecutive
numbers should be marked in brackets.
REFERENCES
[1] IEEE Transactions LaTeX and Microsoft Word Style
Files, Available:
http://www.ieee.org/web/publications/authors/transjnl/i
ndex.html
[2] J. U. Duncombe, Infrared navigation Part I: An
assessment of feasibility (Periodical style), IEEE
Trans. Electron Devices, vol. ED-11, pp. 3439, Jan.
1959.
TABLE I. THE RECOMMENDED FONTS
Item Font Size Style [3] D. Knuth, The Art of Programming. Addison-Wesley,
Title of paper TNRoman 24 Norm 1973
Authors' names TNRoman 11 Norm [4] IEEE Criteria for Class IE Electric Systems (Standards
Authors' address TNRoman 11 Italic style), IEEE Standard 308, 1969.
Abstract TNRoman 10 Bold
Title of sections TNRoman 10 Norm

2
9th International Conference on Microelectronics and Computer Science, Chisinau, Republic of Moldova, October 19-21, 2017