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NOTES
1 REMOVE INSULATION BLANKETS AS REQUIRED IN ORDER TO EXPOSE AIRCRAFT STRUCTURE IN FWD
THE AREAS IDENTIFIED IN TABLE 1.
FR55
FR44
FR56
FR29
FR28
FR43
2 SEE SHEET 2 FOR POSITIONING OF MOUNTING BRACKETS ONTO STRINGERS USING JIG PLATE SEE TABLE 1 FOR SEE TABLE 1 FOR
(ITEM 17). THE 2.6" DIMENSION PROVIDES THE PREFERRED LOCATION FOR THE POSITION OF FRAME BAY OUTB/D FRAME BAY
THE FORWARD MOUNTING BRACKETS. IT IS PERMISSIBLE TO INCREASE THIS DIMENSION UP TO
A MAXIMUM OF 3.6" IF THERE ARE ANY LOCAL OBSTRUCTIONS WHICH PREVENT INSTALLATION (STBD)
USING THE 2.6" DIMENSION.
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3 ATTACH 2 OFF ITEM 1 (MOUNTING BRACKET, INBOARD) AND 2 OFF ITEM 2 (MOUNTING BRACKET, VIEW (STARBOARD SIDE) LOOKING UP
OUTBOARD) TO JIG PLATE (ITEM 17) AS SHOWN ON SHEET 2. SECURE BRACKETS USING 4 OFF
ITEM 3 (SCREW). ON WAP STRUCTURAL PROVISION (TYPICAL)
SCALE 1:2 AIRCRAFT SKIN
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4 POSITION JIG PLATE & MOUNTING BRACKET ASSEMBLY ONTO STRINGERS. ENSURE FACES (REF)
OF BRACKETS ARE ALIGNED WITH FACES OF STRINGERS. USE SLOTTED HOLES AT OUTBOARD
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SIDE OF JIG PLATE TO ACHIEVE THIS ALIGNMENT. DRILL AND REAM 8 HOLES 0.169" (4.3mm)
DIA IN STRINGERS USING EXISTING PILOT HOLES IN MOUNTING BRACKETS FOR POSITIONING.
'A'
5. DEBURR ALL HOLES USING A SUITABLE DEBURRING TOOL. (SHT 3)
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6. REPROTECT ANY BARE METAL IN ACCORDANCE WITH SRM 51-21-11.
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7. REMOVE JIG PLATE (ITEM 17) FROM MOUNTING BRACKETS AND RETAIN FASTENERS FOR
ATTACHMENT OF WAP MOUNTING PLATE (ITEM 0).
8 WET ASSEMBLE MOUNTING BRACKETS TO STRINGERS WITH INTERFAY SEALANT IAW SRM 51-76-00.
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9. RE-FIT THE INSULATION BLANKET OVER THE BRACKETS. THIS WILL REQUIRE THE POSITIONING
AND MAKING OF A SMALL SLIT IN THE INSULATION BLANKET TO ENABLE THE MOUNTING FLANGES
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OF EACH BRACKET TO PROTRUDE. ALL CUT EDGES OF THE BLANKET TO BE RESEALED PER AMM
25-80 USING TAPE 05-TGA1.
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10. REMOVE OR RE-SITE ANY INSULATION BLANKET RETAINING HARDWARE IN THE WAY OF WAP
MOUNTING PLATE LOCATION AS NECESSARY. FRAME (REF)
11 WET ASSEMBLE WAP MOUNTING PLATE (ITEM 0) TO MOUNTING BRACKETS WITH INTERFAY SEALANT
ST
15. RE-FIT FRAME INSULATION BLANKET OVER THE GROUNDING MODULES AND BONDING LEAD. THIS
WILL REQUIRE THE POSITIONING AND MAKING OF A SMALL SLIT IN THE INSULATION BLANKET 5 4 OFF
© BAE SYSTEMS 2015 ALL RIGHTS RESERVED.
THIS DOCUMENT IS SUPPLIED IN CONFIDENCE. NO REPRODUCTION OF THE DOCUMENT OR OF THE
ITEMS SHOWN THEREON MAY BE MADE WITHOUT THE COPYRIGHT OWNERS'S WRITTEN PERMISSION.
TO ENABLE THE GROUNDING MODULES AND BONDING LEAD TO PROTRUDE. ALL CUT EDGES OF THE
BLANKET TO BE RESEALED PER AMM 25-80 USING TAPE 05-TGA1.
2 FOR GENERAL MANUFACTURING PROCESSES SEE PROCESS SPECIFICATION
AVP9-SERIES.
16 SAFELY STOW LOOSE END OF BONDING LEAD PRIOR TO EMBODIMENT OF MOD STM80016A. LIMITS TO S04 UNLESS OTHERWISE PART MARK TO S25 AVP3-500 WHERE SHOWN THUS
2 PLACES STATED.
BOND FLEXIFORM STRIP (ITEM 18) ONTO AFT EDGE OF WAP MOUNTING PLATE (ITEM 0) IAW
VIEW LOOKING AFT (STBD SIDE) SURFACE FINISH TO S90 UNLESS DRN. FOR AUTHORISING
A