microSD™ Card Connectors

DM3 Series
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

■Features
◆ Common to the entire Series ◆ DM3D (Push -Pull, manual, without
1. Extremely small in size ejection mechanism)
Small external dimensions and the above-the-board height · Partial card insertion hold
make the connectors the smallest on the market. Card will not fall-out even when it is not fully inserted. Full
insertion and electrical / mechanical connection is confirmed
2. Reverse card insertion protection with a distinct tactile feel.
Unique card slot design (patented) protects the connector
from damage when the card is attempted to be inserted in · Accessible termination areas
reverse, allowing it to re-inserted correctly. An inner lead system that can be reworked is used in this design.
Contact solder terminations may be inspected and reworked.
3. Effective ground and shield configuration
4-connection points of the metal cover to the printed circuit
board assures secure connection of the ground circuit and
provides EMI protection.
4. Rigid and strong construction
Despite its small size, high-strengths materials used in the
connectors produced a strong and rigid structure.
5. Card detection switch Card insertion-ejection Series Image Page
The card detection switch is Normally Open

◆ DM3AT and DM3BT (Push - Push, with

DM3AT 2~4
ejection mechanism)
· Card fall-out prevention
Built-in card tray and the unique push insertion-push ejection
mechanism (patented) prevent accidental card ejection or fall- Push-Push
out.
Despite its small size the connectors will eject the card to a
distance of 4.0mm, allowing easy hold and removal of the card. DM3BT 5~6
· Exposed termination leads
Easy inspection and rework of the solder termination joints.
◆ DM3CS (Hinge, Push-Pull, manual, without
ejection mechanism)
· Simple and reliable card insertion Hinge-manual
insertion/ DM3CS 7~8
Hinged metal cover provides location and guides the card ejection
during the insertion / removal. Closing of the cover confirms
the electrical and mechanical connection with a tactile click
sensation.
· Reliable contact with the card contact pads
Unique contact design and card slide action will clean the Push-Pull
contact areas of the card. manual insertion/ DM3D 9~10
ejection
· Accessible termination areas
Contact solder terminations may be inspected and reworked.

2017.1③ 1
 DM3 Series●microSD™ Card Connectors

■Product Specifications (DM3 Series)

Current rating : 0.5A Operating temperature range : -25ç to +85ç (Note 1) Operating humidity range : RH 95% max.
Ratings
Voltage rating : 125V AC Storage temperature range : -40ç to +85ç (Note 2) (No condensation)

Item Specification Conditions

1. Insulation resistance 1000Mø min. (Initial value) Measure at 500V DC
2. Withstanding voltage No flashover or insulation breakdown 500 V AC / 1 minute
3. Contact resistance 100mø max. (Initial value) 1mA

No electrical discontinuity of 100 ns or longer Frequency : 10 to 55Hz, single amplitude of 0.75mm,

4. Vibration
No damage, cracks or parts dislocation. 3 directions for 2 hours
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Contact resistance : 40mø max. (change from initial value)

5. Humidity Insulation resistance : 100Mø min. 96 hours at of 40 ± 2ç, and humidity of 90 to 95%
No damage, cracks or parts dislocation.

Contact resistance : 40mø max. (change from initial value) -55ç ➝ 5 to 35ç ➝85ç ➝ 5 to 35ç
6. Temperature cycle Insulation resistance : 100Mø min. Times : 30 min. ➝ 5 min. ➝ 30 min. ➝ 5 min.
No damage, cracks or parts dislocation. 5 cycles

10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B)

7. Durability Contact resistance : 40mø max. (change from initial value)
5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D)

8. Resistance to Reflow : At the recommended temperature profile

No deformation of components affecting performance.
soldering heat Manual soldering : 350ç for 3 seconds

Note 1 : Includes temperature rise caused by current flow.

Note 2 : The term "storage" refers to products stored for long period prior to mounting and use.

■Materials / Finish
DM3AT, DM3BT
Part Material Finish Remarks
Insulator LCP Color : Black UL94V-0
Contact area : Gold plated
Contacts Copper alloy -------------------
Lead area : Gold plated
Stainless steel (DM3AT)
Guide cover Lead area : Gold plated -------------------
Copper alloy (DM3BT)
Stainless steel (DM3AT, DM3BT) -------------------
Other components -------------------
Piano wire (DM3BT) Nickel plated

DM3CS, DM3D
Part Material Finish Remarks
Insulator LCP Color : Black UL94V-0
Contact area : Gold plated
Contacts Copper alloy -------------------
Lead area : Gold plated

------------------- (DM3CS)
Guide cover Stainless steel -------------------
Tin plated (DM3D)

■Product Number Structure

Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.

DM3 AT – SF – PEJM5
1 2 3 4
1 Series name : DM3 3 Termination type : SF Right-angle SMT(Standard)
2 Connector type : AT Push-Push (ejection mechanism), Top board mounting (Standard) DSF Right-angle SMT(Reverse)
BT Push-Push (ejection mechanism), Bottom board mounting (Reverse) 4 Card ejection code : PEJM5, PEJS
CS Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard) (Push insert/push eject)
D Push-Pull (no ejection mechanism), Top board mounting (Standard) None : Manual card
Number of contacts : 8 insertion/ejection

2
 DM3 Series●microSD™ Card Connectors

■DM3AT Push-Push (ejection mechanism), Top board mounting (Standard)

#5(CLK)
#4(VDD)
#6(VSS)
#3(CMD)
#7(DAT0) #2(CD/DAT3)
#8(DAT1) #1(DAT2)

13.85
CARD DETECTION (7.35) 1.68
2
SWITCH(B) (3.2)

(16.75):CARD OVER STROKE POSITION

(17.55):CARD LOCK POSITION
(21.55):CARD EJECT POSITION
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

15.95

15.95
(15)
Part No. HRS No.
DM3AT-SF-PEJM5 609-0031-0

2
CARD DETECTION
SWITCH(A)
(0.8)

microSD CARD
(5.5) CL 1

(11)
All dimensions : mm

2.9±0.15
■Recommended PCB mounting pattern
10MIN
9.25MAX
8.65
7.7
0.7 1.55
1
P=1.1
0.15MIN

0.7
Note CL indicates the center line of the
1.2

1
1.2

microSD card slot.

4.4MAX
5.7MAX

8.9MIN 2
3.7

Card detection switch

6MIN

8.2MIN 0.5
7.9MIN

Without the card Card inserted

9.9
13.3MIN

14.1MAX
14.05

3
14.5

Open Closed
15.1

  3
(A) (B) (A) (B)

3 No conductive traces.
1.9

0.15
2.8
0.8

1 Ｃ
0.

Ｌ (3.2) 2.7
15

1 9.1 3.25 1.3 All dimensions : mm

3
 DM3 Series●microSD™ Card Connectors

BPackaging Specifications
● Embossed carrier tape dimensions (1,500 pcs/reel)

UNREELING DIRECTION
P=4
20 (3.2)
1.75 2
Ø1
.5
14.2

(16.35)
28.4
32
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

All dimensions : mm

● Reel Dimensions

PORTION EQUIPPED
TRAILER WITH COMPONENTS LEADER(400mm MIN)
32.4 CIRCLE

START END
Ø380
Ø80

OVAL EMPTY(100mm MIN)

EMPTY(160mm MIN)
TOP COVER TAPE
EMBOSSED CARRIER TAPE

4
 DM3 Series●microSD™ Card Connectors

■DM3BT, Push-Push (ejection mechanism), Bottom board mounting (Reverse)

#4(VDD) #5(CLK)
#3(CMD) #6(VSS)
#2(CD/DAT3) #7(DAT0)
#1(DAT2) #8(DAT1)

(3.2)
2.38MAX 13.85
1.83 CARD DETECTION
(6.5) 2
SWITCH(B)

2.7MAX
(16.75):CARD OVER STROKE POSITION
3

6.7MAX
(17.55):CARD LOCK POSITION
3

(21.55):CARD EJECT POSITION

Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

15.45
15.1
15.95
16.05
3

(15)
Part No. HRS No.
DM3BT-DSF-PEJS 609-0029-9
(0.55) CARD DETECTION 2
SWITCH(A)
microSD CARD
1 CL (5.5)
(11)

■Recommended PCB mounting pattern 2.9±0.15 All dimensions : mm

10MIN
9.25MAX
8.65
7.7
1.9 0.7
P=1.1 CL indicates the center line of the
0.35MIN

1±0.05
Note 1
0.7
1.4

microSD card slot.

0.2

2
Card detection switch
1.2
3.5
7.7MIN

Without the card Card inserted

9.7

Open Closed
13.3

4
14.75
14.3

(A) (B) (A) (B)

15
0.
Ｃ

3 Oblique-hatched area is projection

0.8
3.2

of contact.
1.9

Ｃ
Ｌ 1

0.5
(3.2)
4 No conductive traces.
1.5
3.05 8.9 1.2 All dimensions : mm

5
 DM3 Series●microSD™ Card Connectors

BPackaging Specifications
● Embossed carrier tape dimensions (1,200 pcs/reel)

P＝4
20 UNREELING DIRECTION
1.75
Ø1 2 (3.75)
.5
14.2

(16.35)
28.4
32
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

All dimensions : mm

● Reel Dimensions

32.4 PORTION EQUIPPED

TRAILER WITH COMPONENTS LEADER(400mm MIN)
CIRCLE
Ø380
Ø80

START END

OVAL EMPTY(100mm MIN)

EMPTY(160mm MIN)
EMBOSSED CARRIER TAPE TOP COVER TAPE

6
 DM3 Series●microSD™ Card Connectors

■DM3CS, Hinge, Push -Pull (no ejection mechanism), Top board mounting (Standard)
CARD DETECTION SWITCH 2

13.8
(6.9)
(0.2) 1.83

(15.45):LOCK POSITION

12
13.9
14.1
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

0.1

Part No. HRS No. (5.5)

Ｃ
Ｌ 1
microSD CARD
(0.93)
DM3CS-SF 609-0032-3 (11)
(1.78)

＃8(DAT1) ＃1(DAT2)
All dimensions : mm
＃7(DAT0) ＃2(CD/DAT3)
＃6(VSS) ＃3(CMD)
■Recommended PCB mounting pattern ＃5(CLK) ＃4(VDD)

(13.8)
8.25MIN 0.55MIN
6.3 1.65
1.4
2.7 1.2
2.7
Note 1 CL indicates the center line of the
2.9MAX

microSD card slot.

5.4MIN

1.2
1.4
7.8MAX

7.8MAX

2
Card detection switch
12.4

10.1MIN 4.1MIN Without the card Card inserted

12.9

12.9
(14.1)
14.4

9.5MAX 3.5MAX
Open Closed
3 3
3 GND(1) GND(1)
2.6

GND(2) GND(2)
GND(3) GND(3)
GND(4) GND(4)
2.6

1 Ｃ
Ｌ 0.7
P＝1.1
(3.2)
3 No conductive traces.
7.7 1.5
All dimensions : mm
１ 9.3 2.8

7
 DM3 Series●microSD™ Card Connectors

BPackaging Specifications
● Embossed carrier tape dimensions (1,300 pcs/reel)

P＝4 UNREELING DIRECTION

20
1.75 2 (3.4)

Ø1
.5
14.2
28.4
32
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

All dimensions : mm

● Reel Dimensions

PORTION EQUIPPED
32.4 TRAILER WITH COMPONENTS LEADER(400mm MIN)
CIRCLE
Ø380
Ø80

START END

OVAL
EMPTY(160mm MIN) EMPTY(100mm MIN)

EMBOSSED CARRIER TAPE TOP COVER TAPE

8
 DM3 Series●microSD™ Card Connectors

■DM3D, Push-Pull (no ejection mechanism), Top board mounting (Standard)

2
Card Detection
Switch (B) 11.95
(6) Card Detection 2
1.55 Switch (A)

2.7
3.35

(15.8):CARD FULLY INSERTED

1

0.9
9.65
11.45

11.45
(15)
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Part No. HRS No.

Card microSD Card
DM3D-SF 609-0025-8 (4.5) Center
(0.7) (5.5)
(11)

＃8(DAT1) ＃1(DAT2)
＃7(DAT0) ＃2(CD/DAT3)
＃6(VSS) ＃3(CMD)
＃5(CLK) ＃4(VDD) All dimensions : mm

■Recommended PCB mounting pattern

8.1MIN
5.05 MIN
2.55 MAX 1
0.4MIN 3

CL indicates the center line of the

1

Note 1
microSD card slot.
10.2MIN

1.4

2
10.7
1.5

Card detection switch

8.2MAX

9.15
8.35

7.5
6.85
6MIN

0.8 0.8 Without the card Card inserted

4MAX

( 4.5 )
Open Closed
1.5
1.5

(A) (B) (A) (B)

1.75

0.55
CL 1
1.1
1.85 7.7
9.4
3 No conductive traces.
10.9
All dimensions : mm

9
 DM3 Series●microSD™ Card Connectors

BPackaging Specifications
● Embossed carrier tape dimensions (2,000 pcs/reel)

P= 4
Unreeling direction

1.75
2 16

Ø1
.5
11.5
22.25
(11.85 )
24
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

All dimensions : mm

● Reel Dimensions

End section Lead section (400mm min.)

Unreeling direction
24.4
Blank section Mounting section Blank section
(160mm min.) (100mm min.)
Ø380
Ø80

Embossed carrier tape Top cover tape

10
 DM3 Series●microSD™ Card Connectors

BRecommended temperature profile

(ç)
HRS test condition
Peak:250ç MAX Solder method : Reflow, IR/hot air
250
230ç min. Environment : Room air
200 50
seconds
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
Temperature

200ç
Soldering (Senju Metal Industry, Co., Ltd.'s
150
150ç Part Number:M705-GRN360-K2-V)
Test board : Glass epoxy 60mm∞100mm∞1.0mm thick
100 90 to 120 seconds
Preheating Metal mask : 0.12mm thick
Number of reflow cycles : 2cycles max.
Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

50

The temperature profiles shown are based on the above

Time (Seconds) conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.

BPrecautions
1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the
ejection mechanism and electrical performance of the connector

2. Do not apply excessive force to the connector when handling or after installation on the PC board.

3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards.
Follow the correct insertion / ejection procedure for the specific connector in use.
Attempts of incorrect insertion of the card may cause damage to the connector or the card.

4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in
the un-mounted connector.

5. Mounting on the Flexible Printed Circuit (FPC)

To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under
the FPC.

6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance.

7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on
the connector performance.

● Refer to applicable Operation Manual listed below for additional precautions.

Series Operation Manual Number
DM3AT Series ETAD-F0345
DM3BT Series ETAD-F0324
DM3CS Series ETAD-F0335
DM3D Series ETAD-F0353

11
 Sep.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved. DM3 Series●microSD™ Card Connectors

The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use.
12 The contents of this catalog are current as of date of 01/2017. Contents are subject to change without notice for the purpose of improvements.
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