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International Journal of Electronics Engineering, 3 (2), 2011, pp.

179– 183  Serials Publications, ISSN : 0973-7383

RF MEMS Switches: Fabrication,


Key Features, Application & Design Tools
Rekha Yadav1, Rajesh Yadav2, Vijay Nehra3 & K. J. Rangara4
1
Department of Electronics & Communication Engineering, Deenbandu Chottu Ram University of
Science &Technology, Murthal, India
2
Department of Electronics & Communication Engineering, HMR Institute of
Technology & Management Hamidpur, Delhi, India
3
School of Engineering & Science, B.P.S. Mahila Vishwavidyalaya, Khanpur Kalan, India
4
Sensors and Nanotechnology Group, CEERI Pilani, Rajasthan, India
E-mail: rekha_7r@yahoo.co.in, raj_opyadav@yahoo.co.in, nehra_vijay@yahoo.com, kjrangra@gmail.com

Abstract: During the past decade, several new fabrication techniques have evolved which popularize micro electromechanical
systems (MEMS), and many novel devices have been reported in various areas of engineering and science. One such area is
microwave and millimetre wave systems. The recent developments in wireless communication devices forced the market to
obtain miniaturized efficient devices, which is possible only by the development of radio frequency (RF) MEMS. RF MEMS
switches have become one of the fast rising technologies in recent years due to their superior RF performance. In this paper,
RF MEMS Switch: an overview includes RF MEMS fabrication technology, application area, advantages of RF MEMS
switches and MEMS design tools. Two types of RF MEMS switches are presented in this paper: one is the shunt MEMS
switch, and the other one is the series MEMS switch.
Keywords: RF MEMS Switch, Ohmic contact switch, Micromachining, Insertion loss, isolation.

1. INTRODUCTION same package. MEMS is an emerging technology which uses


Micro-Electro-Mechanical Systems (MEMS) is a technology the tools and techniques that were developed for the
that in its most general form can be defined as miniaturized Integrated Circuit industry to build microscopic machines.
mechanical and electro-mechanical elements (i.e., devices These machines are built on standard silicon wafers. There
and structures) that are made using the techniques of micro are several different broad categories of MEMS
fabrication. The critical physical dimensions of MEMS technologies, outlined below:
devices can vary from well below one micron on the lower
end of the dimensional spectrum, all the way to several 2.1. Bulk Micromachining
millimetres [1]. MEMS is the integration of a number of In bulk micromachining, the single crystal silicon is etched
micro components on a single chip which allows the micro to form three-dimensional MEMS devices. Bulk
system to both sense and control the environment. micromachining is a fabrication technique which builds
mechanical elements by starting with a silicon wafer, and
2. FABRICATION TECHNOLOGIES then etching away unwanted parts, and being left with useful
The electronics, mechanical and electromechanical mechanical devices. Typically, the wafer is photo patterned,
components are fabricated using technologies borrowed leaving a protective layer on the parts of the wafer that you
heavily, but not exclusively, from integrated circuit want to keep. The wafer is then submersed into a liquid
fabrication technology. There are three principal steps: etchant, like potassium hydroxide, which eats away any
Deposition processes (thin films of material are placed on a exposed silicon. This is a relatively simple and inexpensive
substrate), Lithography (a patterned mask is applied on top fabrication technology, and is well suited for applications
of the films), Etching processes (the films are etched which do not require much complexity, and which are price
selectively to provide relief the mask outlines). MEMS sensitive [2].
functionality can be integrated on the same silicon or in the
same package, which reduces the component count and 2.2. Surface Micromachining
contributes to overall cost savings. System in-a-package While Bulk micromachining creates devices by etching into
includes the MEMS device and the integrated circuit in the a wafer, Surface Micromachining builds devices up from
180 International Journal of Electronics Engineering

the wafer layer-by-layer. A typical Surface Micromachining are based on RF MEMS switches. The main application
process is a repetitive sequence of depositing thin films on areas of RF MEMS switches are:
a wafer, photo patterning the films, and then etching the
patterns into the films. In order to create moving, functioning 3.1. Radar Systems for Defence Applications (5-94 GHz)
machines, these layers are alternating thin films of a Phase shifters for satellite-based radars (20 billion cycles),
structural material (typically silicon) and a sacrificial missile systems (0.1-1 billion cycles), long range radars
material (typically silicon dioxide). The structural material (20-200 billion cycles) [4].
will form the mechanical elements, and the sacrificial
material creates the gaps and spaces between the mechanical 3.2. Satellite Communication Systems (12-35 GHz)
elements. At the end of the process, the sacrificial material
A satellite system would typically have 100’s of switches
is removed, and the structural elements are left free to move
on-board integrated in the form of switch matrices to provide
and function. The MEMS switches are fabricated using a
system redundancy. The receiver input/output and low
surface micromachining process, and they have been
power switch matrices are typically implemented using
implemented on Si, GaAs, and quartz substrates.
coaxial switches while the high power switch matrix is
implemented using waveguide switches [5].
2.3. LIGA
LIGA is a German acronym for Lithographie, 3.3. Wireless Communication Systems (0.8-6 GHz)
Galvanoformung, Abformung (Lithography, Electroplating, RF-MEMS technology has the potential of replacing many
and Molding) that describes a fabrication technology used of the mechanical and semiconductor switches used in
to create high-aspect-ratio microstructures.LIGA is a mobile and wireless communication systems [l]. RF-MEMS
technology which creates small, but relatively high aspect switches and multi-port RFMEMS would not only reduce
ratio devices using x-ray lithography. The process typically size and power consumption, but also have superior
starts with a sheet of PMMA. The PMMA is covered with a performance.
photo mask, and then exposed to high energy x-rays. The
mask allows parts of the PMMA to be exposed to the x- 3.4. Instrumentation Systems (0.01-50 GHz)
rays, while protecting other parts. The PMMA is then placed
These require high-performance switches, programmable
in a suitable etchant to remove the exposed areas, resulting attenuators, SPNT networks, and phase shifters capable of
in extremely precise, microscopic mechanical elements. at least 20-40 billion cycles and 10 years of operation,
LIGA is a relatively inexpensive fabrication technology, and especially in industrial test benches.
suitable for applications requiring higher aspect ratio devices
than what is achievable in Surface Micromachining. 4. RF MEMS SWITCHES
RF MEMS switches are micro machined devices which use
2.4. Deep Reactive Ion Etching a mechanical movement to achieve a short circuit or an open
Deep reactive ion etching is a type of Bulk Micromachining circuit in the RF transmission-line. RF MEMS switches are
which etches mechanical elements into a silicon wafer. classified by actuation method (electrostatic, electro thermal,
Unlike traditional Bulk Micromachining, which uses a wet magnetic, piezoelectric), axis of deflection (lateral, vertical),
chemical etch, Deep Reactive Ion Etching micromachining circuit configuration (series, shunt), clamp configuration
uses a plasma etch to create features. This allows greater (cantilever, fixed-fixed beam), or contact interface
flexibility in the etch profiles, enabling a wider array of (capacitive, ohmic). There are two main types of forces that
mechanical elements. The fabrication tools needed to can be used for the actuation of RF Switches:
perform Deep Reactive Ion etching are somewhat expensive, electromagnetic and electrostatic [6]. The electromagnetic
to this technology is typically more expensive than force has a low actuation voltage, but a high current
traditional Bulk Micromachining based on wet etching. consumption. On the other hand, the electrostatic force has
no current consumption, but has a high actuation voltage.
3. SCOPES OF RF MEMS TECHNOLOGY The electrostatic switches are most common switches
Today, Radio Frequency Micro Electron Mechanical System that are used in the microwave and mm-wave regions.
(RF-MEM) has been an attractive field for both scientific Electro statically actuated RF MEMS components offer low
research and industry due to its promising application in insertion loss and high isolation, linearity, power handling,
future civil & military wireless communication and remote and Q factor[7-9]. There are two kinds of electrostatic
controlling & sensing system. There are various types of switches: series and shunt. Both ohmic and capacitive
quintessential RF MEMS components, such as RF MEMS coupling switches can be used either as a serial or a shunt
resonators and oscillators, RF MEMS tuneable inductors switch, generally ohmic switches are used in serial mode
[3], and RF MEMS switches, switched capacitors and [10-11], while capacitive coupling switches are preferred
varactors. The components and subsystems discussed here as shunt switches. Series switch is initially disconnected,
RF MEMS Switches: Fabrication, Key Features, Application & Design Tools 181

and gets connected when the switch is actuated. Shunt switch capacitive reactance restricts high quality performance to
is initially connected, and gets disconnected when a required high RF signal frequencies (5-100 GHz), whereas the contact
voltage is applied. For a series-contact switch showed in switch can be used from dc levels [16].
Figure 1(a) the signal transmission line is normally OFF, it
means the signal will pass the line only when the switch Table 1
membrane is pulled down and the conductor touches both Advantages and Disadvantages of Ohmic and Shunt Switch
side of gap on transmission line. This type has good isolation Type Advantage Disadvantage
characteristic from DC to RF signal, but the insertion loss
Series • Very low ON insertion loss • Stiction
control and reliability are the issues need to be noted. It is
because self-welding may happen at the metal-to–metal • Very high OFF state isolation • Microscopic banding
contact area between membrane and transmission line. For Shunt • Long life time • High Potentials
a capacitive shunt switch showed in Figure 1(b), the • ON state insertion loss
transmission line is normally ON and there is a dielectric • Independent from contact force
layer laid between switch membrane and transmission line.
When membrane is pulled down, it will form a parallel plate
4.1. Switching Parameters
capacitor structure [13,14]. The RF signal will be conducted
to ground via the capacitor. The RF characteristics of this Various parameters to be considered in the design of RF
type are affected by capacitance ratio between ON/OFF switches are [17]:
state, and because of its principal the isolation characteristic
of this type will be better at higher frequency. 4.1.1. Transition Time
Transition time is defined as the time required for the output
RF signal to rise from 10% to 90% of its value for off-to-on
transition and 90% to 10% for on-to-off transition. In a
simple mechanical switch, the transition time is the time
required for the moving contact to leave one stationary
contact and strike the opposite stationary contact.

4.1.2. Switching Rate


The switching rate is the time required for the switch to
respond at the output due to the change in control voltage.
The switching rate, also referred to as switching speed, is
always larger than the transition time of a switch.

4.1.3. RF Power Handling


RF power handling is a measure of how efficiently a switch
Figure 1: (a) A Capacitive Fixed-fixed Beam RF MEMS
passes the RF signal. This is commonly specified in terms
Switch, Connected in Shunt to a CPW Line. (b) An Ohmic of dB.
Cantilever RF MEMS Switch, Connected in Series to a
Micro Strip 4.1.4. Insertion Loss
The insertion loss of an RF device is a measure of its
If apply a DC voltage so that both ends of the switch efficiency for signal transmission. If the power transmitted
are charged differently & create an electrostatic force. This to the load before insertion is PT and the power received by
force causes an attraction between the two areas. The the load after insertion is PR, then the insertion loss in dB is
attractive force causes the switch to close. This allows the T
given by 10log10 P .
RF power to flow through the switch but the dielectric layer PR
does not allow the electricity to flow through. When the
voltage is turned off the switch open back due to the 4.1.5. Isolation
dielectric layer. Without the dielectric layer the DC current The isolation of a switching system is specified when there
would flow through the switch causing it to stick closed is no signal transmission. A large value (in decibels)
permanently. It would be a onetime switch. The series indicates very small coupling between input and output
contact switch [15], the beam in the up position corresponds terminals.
to a low-loss RF path to the output load, while the beam in
the down position results in RF shunted to ground and 4.1.6. Linearity and Intermodulation
no RF signal at the output load. MEMS series contact Linearity is the behaviour of a switch in which the output
switch (Table 1), the frequency dependence of the signal strength varies in direct proportion to the input signal
182 International Journal of Electronics Engineering

strength. When signals of two different frequencies are (d) Reliability: The reliability of mature MEMS
applied to the switch through the line there is practically no switches is 0.1-40 Billion cycles. However,
mixing between the two signals. many systems require switches with 20-200
Billioncycles [21].
4.1.7. Return Loss
(e) Packaging: MEMS switches need to be packaged
The return loss of an RF switch refers to the RF loss reflected in inert atmospheres (Nitrogen, Argon, etc..) and
back by the device. in very low humidity, resulting in hermetic or near
hermetic seals.
4.2. Advantages and Disadvantages of RF MEMS
Switches (f) Cost: While MEMS switches have the potential
of very low cost manufacturing, one must add
The advantages of MEMS switches over PIN diode or FET
the cost of the packaging and the high-voltage
switches are:
drive chip.
4.2.1. Near-Zero Power Consumption
5. MEMS DESIGN TOOLS
Electrostatic actuation requires 30-80 V, but does not
consume any current, leading to very low power dissipation MEMS are designed by drawing individual 2-D layers,
(10- 100 nJ per switching cycles). While magnetic switches which when stacked on top of each other, create complex
consume a lot of current unless they are made to latch in 3-D devices [22-24]. Many tools from various technical
the down-state position once actuated [18]. fields are therefore being used for MEMS computer-aided
design (CAD). These tools range from basic solutions to
4.2.2. Very High Isolation advanced tools that incorporate finite-element modelling,
RF MEMS metal-contact switches are fabricated with air analysis and layout support given in Table 2.
gaps, and therefore, have very low off-state capacitances
Table 2
(2-4 fF) resulting in excellent isolation at 0.1-60GHz. Also,
MEMS Design Tools
capacitive switches with a capacitance ratio of 60-160
provide excellent isolation from 8-100GHz [19]. Product Company Features

4.2.3. Very Low Insertion Loss AutoCAD Auto Desk Mostly 2D advanced curves,
precision snapping
RF MEMS metal-contact and capacitive switches have an
insertion loss of 0.1dB up to 100GHz. Coventor Coventor MEMS design from system level
Ware modelling to detailed 3D simulation
4.2.4. Linearity and Intermodulation Products and optimization, develop MEMS
devices at a lower cost and rapidly
MEMS switches are extremely linear devices and therefore
explore and optimize design and
result in very low Intermodulation products in switching
process options
and tuning operations. Their performance is 30-50 dB better
than PIN or FET switches [20]. L-Edit Tanner Design Rule Checking, Enhanced
MEMS EDA Boolean operations eliminate manual
4.2.5. Potential for Low Cost Design steps
RF MEMS switches are fabricated using surface Intelli Suite IntelliSence 3D process visualization tool &
micromachining techniques and can be built on quartz, export a PowerPoint file with a slide
Pyrex, LTCC, mechanical grade high-resistivity silicon or for each process step
GaAs substrates. MEMSolver MEMSolver Create a mathematical model of the
RF MEMS switches also have some problems, and these system and generates analytical
are: solutions to explain the behaviour of
the MEMS device.
(a) Relatively Low Speeds: The switching speed of
Ansoft ANSYS 3D full-wave electromagnetic field
most electrostatic MEMS switches is 2-40µs, and
HFSS simulation and design of high-
thermal/magnetic switches are 200-3,000µs.
frequency and high-speed component
(b) High Voltage or High Current Drive: Electrostatic
MEMS COMSOL MEMS Module solves problems that
MEMS switches require 30-80V. Thermal/ Module & couple structural mechanics, micro
magnetic switches can be actuated using 2-5 V, but RF Module fluidics, and electromagnetic. The RF
require 10-100 mA of actuation current. Module providing advanced
(c) Power Handling: Most MEMS switches cannot post-processing features such as
handle more than 200mW although some switches S-parameter computation and
have shown up to 500 mW power handling. far-field analysis.
RF MEMS Switches: Fabrication, Key Features, Application & Design Tools 183

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