IoT - With Great Power Comes Great Challenges - Application Note

Keysight Technologies
IoT – With Great Power Comes Great Challenges
Application Note
Rising challenges for IoT device designers and developers –

component, circuit and system levels. What are the tools and
solutions available? What are the test considerations that
might help save time and cost?
02 | Keysight | IoT — With Great Power Comes Great Challenges - Application Note
Table of Contents
1. Introduction........................................................................................................................ 3
2. Challenges in IoT................................................................................................................ 4
a) Higher Level Integration of Circuits and Components................................................. 4
b) Energy Efficiency and Battery Life................................................................................. 5
c) Signal Integrity (SI) and Power Integrity (PI)................................................................. 6
d) Heterogeneous Mix of Wireless Technologies and Multi-Standard Devices............... 6
e) Interference, Compliance and Conformance................................................................ 7
3. Solutions and Test Considerations - Software and Hardware......................................... 8
(i) Design and Simulation (a-e).......................................................................................... 8
(ii) Battery Current Drain Analysis (b).............................................................................. 11
(iii) Signal Integrity and Power Integrity Tools (c)........................................................... 13
(iv) Wireless Test Solutions (d)......................................................................................... 16
(v) Real-Time Spectrum Analysis (d, e)........................................................................... 18
(vi) EMI /EMC (e).............................................................................................................. 19
4. Conclusion........................................................................................................................ 20
5. References........................................................................................................................ 20
There is a storm coming – the explosion of the Internet of Things (IoT)1. It is estimated
there will be more than 30 billion ‘Things’ or smart objects, the building blocks for IoT,
everywhere and always connected. IoT applications, like smart homes and healthcare,
are already gaining popularity in the consumer market. There is even a smart city near
completion in Korea, with more planned elsewhere. Ongoing advances in the technologies
enabling the IoT are giving way to a wave of new and unimaginable applications for both
the consumer and enterprise markets. At the same time, software and services, hardware
and connectivity are evolving rapidly. To fully leverage these advances, IoT device
designers and developers need tools and solutions to help them overcome the complex
design and integration challenges, thus enabling their fast and successful development
and deployment of IoT devices.
1. Introduction
Kevin Ashton first coined the phrase “The Internet of Things” in 1999 when discussing
applications for RFID tags. From the simple tracking and counting of RFID objects, the
Internet of Things has taken off with Machine-to-Machine (M2M), Big Data and Machine
Learning, enabling applications such as the smart building, smart grid and intelligent
transport systems.
IoT devices at the end nodes connect to the cloud or server for intelligence and analytics.
Some connect directly and some via gateways, as shown in Figure 1. Gateways aggregate
traffic from lower power networks onto higher capacity LANs and WANs. They typically
include greater power supply and computing resources than end-nodes. Edge or fog
applications running in gateways offload processing from both cloud and end-node sensors
and actuators. End-nodes are often designed to have a long battery life, necessitating
the efficient use of embedded computers and radio transmission. Intelligent threshold
triggers in gateway applications make traffic more efficient by passing actionable
information to central cloud servers. Gateways interface with the cloud and end-nodes
via a heterogeneous mix of wireless technologies, both cellular and non-cellular. Radio
interfaces address varying application needs depending on coverage, latency, throughput,
energy efficiency, and cost.
Massively scaling a heterogeneous mix of wireless communication technologies introduces

challenges like interoperability and interference, which have to be addressed during the
design and development of IoT devices. Besides conforming to network requirements and
wireless regulatory standards, design aspects such as energy consumption and battery
lifetime must also be considered. IoT devices are often expected to operate for many years
in deployment.
Cloud storage,
intelligence and analytics
Cable/fiber
ADSL
Cellular
Satellite
WiFiAP TE e.g
.L
e.g .L
TE
ium
Irid
e.g.
Industrial,
WiFi vehicle, maritime, e.g. WiFi
Ethernet aviation, gateways
e.g.
LoR
WiFi e.g a
WiFi .S
0.11a
Consumer IG
gateway FO
Bluetooth X
A 10
e.g.
e.g. Wi-SUN
e.g. IS
Tele
NFC
n
sa
Thread,
ZigBee,
Z-Wave
Sensors and actuators
Figure 1. Myriad pathways and gateways provide access to the cloud.1

2. Challenges in IoT
The massive increase in the number and density of devices deployed for IoT applications
and services is giving rise to an array of challenges that must be addressed to ensure
successful implementation. In this section, we will discuss some of the specific challenges
facing IoT device designers and developers.
a) Higher Level Integration of Circuits and Components

Advances in mixed signal integrated circuit (IC) technology have been a key enabler of
IoT devices. By reducing part-counts, for example, smaller footprints can be achieved.
And, with greater integration comes lower cost, lower energy consumption and better
performance. However, mixed signal integration may also introduce new design
complexities. Current mixed signal ICs integrate digital, analog and RF functionalities into
a single chip. Systems on chip (SoCs) integrate previously discrete system components
onto a single substrate. Low-power wireless microcontroller SoCs with integrated
wireless connectivity, sensing and actuating interfaces are being deployed in many IoT
applications.
PCB integrated antenna are often used to replace chip or external antennas for wearable
and compact low-cost devices such as smartwatches.2 With devices increasingly using
printed antennas, multiple antennas and multiple radios, it becomes ever more important
to model and measure antenna performance and self-interference in a variety of real-
world conditions. Antenna match, efficiency, radiation, and reception patterns need to
be evaluated, often with consideration to walls, mounting structures or, in the case of
wearable devices, clothing and the human body.
With increasing complexity, electrical, thermal and mechanical behaviors need to be

fully evaluated. These effects can impact the performance and reliability of other device
subsystems. To address this challenge, design and simulation tools that support an
accurate and seamless flow of co-simulation across multiple realms and technologies—
from component to system level—are necessary to help realize success and provide
in-depth design insight into a device’s real-world operation.
b) Energy Efficiency and Battery Life

Simple devices like sensors are often battery driven and have limited energy storage.
For networks with a large-scale deployment of sensor-nodes or medical implants, these
devices should have lifetimes of months or years. Frequent battery replacement is costly
and not practical in some operating environments. To save energy, devices usually operate
with a very low duty-cycle and reside mostly in idle or sleep mode, activating only when
necessary.
In higher performance devices and gateways, the processor, display and wireless modules
account for a large part of the total energy consumption. These devices are equipped with
multiple wireless interfaces and are more often required to be in active-mode for heavier
processing tasks. To understand the energy consumption of these devices, the power
management and complex interaction of the different components and modules must be
adequately considered, as shown in Figure 2.
Sensor/actuator mesh e.g. Backhaul antenna e.g.

Zigbee, Thread, Z-wave 802.11a/b/g/n, NB-IoT
RFI enclosures
Frontend Frontend
module/PA module/PA
Radio Radio
MCU
SoC SoC
Power Sensor
Flash
management Interface
User
Battery Sensors
Interface
Figure 2. Typical components of an IoT gateway/sensor (e.g., a heating thermostat, smoke alarm,
security alarm, or utility meter gateway).
To optimize battery life, it is important to know the current use and duration of each
operating mode. The duration and amount of current consumed determine the
effectiveness and efficiency of each activity. Current drain may be the only good way of
determining the time duration of a certain processing event or activity. A key challenge
is to measure current drain that spans a wide dynamic range; from sub µA in sleep mode
to hundreds of mA in active mode. Battery drain analysis with seamless current ranging
(to capture high peak, low duty cycle and low average values) and simulated network
conditions is desired. Whether using an actual battery or power supply, the designer must
ensure the device is properly powered so that battery drain results are representative of
the device when it’s in actual use.
With advances such as energy harvesting, new battery technology and low power design,
battery life is being prolonged. Utilization of smaller cell size, narrower bandwidths low
power communication networks also helps to alleviate energy constraints. To achieve
lifetime and thermal requirements, it is necessary to conduct systematic energy analysis.
Doing so helps maintain good control of the device’s hardware and software performance.
This is especially important in real-life operation where environmental and network condi-
tions may significantly decrease a device’s operating lifetime.
c) Signal Integrity (SI) and Power Integrity (PI)

SI can be categorized into four groups: issues related to one net, coupling between
multiple nets, power and ground paths in power distribution network (PDN), and electro-
magnetic interference (EMI).4 Methods to minimize SI issues include maintaining con-
trolled impedances through interconnects, attention to trace spacing to minimize mutual
inductance or capacitance, correcting longer than ideal return paths, minimizing PDN
impedance, and ensuring good grounding and shielding. Even so, as semiconductor tech-
nology advances with smaller gate or channel length and faster switching, rise-times are
decreasing and clock frequencies are increasing, making SI issues inevitable. In low power
circuits, there is less tolerance for SI issues like crosstalk.
PI is the analysis of how effectively power is converted and delivered from the source to
the load within a system. The power is delivered through a PDN that consists of passive
components and interconnects from the source to the load. With the drive towards low
power electronics, DC supply voltages and tolerances have been reduced. In some cases,
supply tolerances have dropped from +/-5% to +/-1%. Ripple, noise and transients riding
on these low-voltage rails can adversely affect clocks and digital data. To ensure clean
power rails, supply lines need to be examined for quality and integrity. The challenge is to
measure ever smaller and faster AC signals riding on top of DC supplies.
With increased functionality, higher density, higher speed and lower power electronics, SI
and PI issues are becoming more common. Using system modeling and simulation tools to
predict performance, complemented by measurement tools to evaluate implementations,
enables design teams to reduce both project risk and time-to-market.
d) Heterogeneous Mix of Wireless Technologies and Multi-Standard

Devices
To serve the diverse nature and needs of IoT applications, numerous wireless technologies
and standards have emerged.1 Varied networks are able to support applications ranging
from simple battery-powered sensors to the high-bandwidth, mission-critical services
for autonomous cars. Figure 1 shows devices like a smartphone supporting cellular and
non-cellular radio interfaces like NFC, WiFi, Bluetooth®, and LTE. The fact that there are
so many standards available for IoT presents a measurement challenge. These standards
have many different physical layers, each of which has its own unique RF test require-
ments. Further complicating matters, each physical layer can potentially support multiple
modulation schemes.
As an ever growing number of devices support multiple standards, testing these devices
becomes all the more complex. Each standard has its own set of test requirements and
challenges. Developers also need to verify that devices interoperate well together and
can handle multiple standards concurrently. Nevertheless, test equipment can become
expensive when a separate instrument is needed for each individual standard. A more
cost-effective approach is to have a single instrument that is capable of testing all of the
necessary standards, and supports the addition of new standards as they emerge.
e) Interference, Compliance and Conformance

With the high density of IoT connected devices, wireless technologies that share similar
frequency bands can cause co-channel and adjacent channel interference with one
another. As an example, an increasingly large number of IoT devices use the unlicensed
Industrial, Scientific and Medical (ISM) frequency band. As a result, the 2.4-GHz ISM
band, which is used by cordless phones, wireless video cameras, microwave ovens, and
wearable devices, is getting quite crowded. It is critical that devices be thoroughly tested
to ensure they meet network requirements and regulatory standards, as well as have the
ability to operate in this dense signal environment. This includes meeting conformance
and compliance standards. In addition, real-time spectrum analysis which allows detection
and capture of spectral environment is a valuable way to identify time-varying sources of
interference.
Another concern with the large number of IoT devices operating simultaneously in close
proximity to one other is electromagnetic interference (EMI). There are four broad types
of electromagnetic compatibility (EMC) testing: radiated and conducted emissions
testing, and radiated and conducted immunity testing. One party wants to avoid
creating unwanted emission and the other works towards robustness against unwanted
emission. To make compliance certification measurements, solutions that comply with the
requirements of the respective standard are required.
3. Solutions and Test Considerations - Software and Hardware

Keysight Technologies provides a broad range of integrated solutions for design, valida-
tion, conformance, and manufacturing test. In this section, a number of them are pro-
posed for designers and developers working at the component, circuit and system level to
address the challenges previously described.
(i) Design and Simulation (a-e)
Design and simulation tools provide designers with an understanding of the underly-
ing physics of complex systems. Complex, sensitive and high-performance mixed signal
circuits can be modelled and integrated without significant compromises in performance.
Keysight EEsof’s Electronic Design Automation (EDA) software addresses the inherent
challenges in system, circuit and physical-level design by providing solutions for the com-
plete design-flow as shown in Figure 3. Using design-flows built on these system, compo-
nent and physics-level design tools, design engineers can create better products faster.
Moreover, Keysight’s EDA software is fully compatible with Keysight’s test and measure-
ment equipment, offering designers a complete solution from design to validation test.
Figure 3. Keysight’s design software provides designers with complete design-flows from design to validation and
test.
Early in the development process, a new product can be simulated using SystemVue, a
focused EDA environment for electronic system level (ESL) design. As seen in Figure 4,
SystemVue enables system architects and algorithm developers to innovate the PHY layer
of wireless communications systems, and provides unique value to RF, DSP and FPGA/
ASIC implementers. SystemVue also includes virtual measurement tools that can be
attached to nodes in the simulation to predict system performance.
Figure 4. SystemVue is the nucleus for cross-domain development environment.
Advanced Design System (ADS) is the tool for RF, microwave and high-speed digital
applications. It includes a design simulation environment that enables co-design of the IC,
package and board to help save time and reduce errors introduced when using multiple
tools. Tradeoffs can be made interactively on the IC, package and board while they are
being co-designed. Circuits designed in multiple technologies can be combined and
simulated at both the circuit and full 3D EM level.
ADS features a complete schematic capture and layout environment, circuit and system
simulator, native access to 3D planar and full 3D EM field solvers, accurate and efficient
electro-thermal analysis, and the largest number of process design kits (PDKs). It also
offers EDA and design flow integration with companies such as Cadence, Mentor and
Zuken. Moreover, an optimization cockpit allows for real-time feedback and control, while
up-to-date wireless libraries allows designers to work with the latest emerging wireless
standards. X-parameters* model generation is also possible for nonlinear high-frequency
design.
With low power circuit design, noise calculation may be important, especially as signal
levels get closer to the noise floor. ADS provides linear noise simulation with AC and
S-parameter simulators. The noise simulation computes the noise generated by each 1. X-parameters is a trademark and
element and then determines how it affects the noise properties of the overall network. In registered trademark of Keysight
most cases, noise generated by circuit elements is calculated automatically. For example, Technologies in the US, EU, JP, and
elsewhere. The Xparameters format
lossy passive elements contribute noise according to their ability to deliver thermal noise and underlying equations are open and
power. The noise contributions from nonlinear devices are computed by models that documented. For more information,
include temperature and bias dependence, similar to those models used by SPICE. visit http://www.Keysight.com/find/
eesof-x-parameters-info.
ADS also offers SI and PI analysis with SIPro and PIPro.1 SIPro provides speed and
accuracy for the EM characterization of high-speed links on densely-routed, highly
complex PCBs. Compared to gold-standard Finite-Element-Method (FEM) simulation,
SIPro demonstrates very good agreement at a small-fraction of the time and memory
consumption. PIPro provides PI analysis of PDN and includes DC IR drop analysis, AC
impedance analysis and power-plane resonance analysis. The DC IR drop simulator
provides a table of DC voltages and currents for each PCB-via, pin, sink, and voltage
regulator module in the PDN, enabling SI and PI engineers to predict DC voltage at the
pins of the ICs sinking the current. With the visualization of voltages, current-density and
power dissipation on power and ground nets, trouble spots can be easily identified.
With one common environment for both SI and PI analyses, a single setup can be easily
copied from one analysis type to another. Resulting EM models transfer seamlessly
back to the schematic for further simulation. The integrated schematic capture, layout
and data analysis environment with multiple simulators including IBIS-AMI channel,
transient, S-parameter, and physical layer EM, ensure designs comply with the latest
standards. In support of channel simulation within the ADS environment, designers can
use EMPro software for full 3D EM simulation of complex channel component models,
and SystemVue software to generate custom IBIS-AMI transmitter (Tx) and receiver (Rx)
behavioral models for fast channel simulation. This flow eliminates the need to switch
between different tools, enabling better engineering collaboration and time saving.
Keysight EDA offers a broad selection of EM simulation technologies covering Method

of Moments (MoM), FEM and Finite Difference Time Domain (FDTD). The Momentum
simulator employs MoM for passive circuit modeling and analysis to accurately simulate
coupling and parasitic effects of complex multi-layer designs. The FEM simulator based
on FEM, accurately simulates 3D structures such as packaging, bond-wires, connectors,
and other components. EMPro with its FDTD solver, is the most efficient solution for
antenna, EMI/EMC, radar cross section, and biomedical applications.
GoldenGate is an advanced simulation, analysis and verification solution for integrated

mixed signal RFIC designs. It is fully integrated into the Cadence ADE and includes
Momentum for 3D planar electromagnetic simulation, SystemVue and Ptolemy wireless
test benches for system-level verification, and the ADS Data Display for advanced data
analysis. GoldenGate links system, subsystem and component-level design and analysis
as part of a comprehensive design-flow for complete IoT design.
As the design moves from simulation to realization, actual device modules can be
substituted into the simulation. Real measurements or hardware-in-the-loop replace
virtual tools and enable developers to compare simulated versus measured performance.
For greater visibility, simulation can be used to interpolate and extrapolate waveforms in
locations inaccessible by measurement probes. For continuity from design to prototype
validation, Keysight offers an unparalleled range of lab-grade test equipment—from
benchtop to modular and handheld.
(ii) Battery Current Drain Analysis (b)

Keysight’s N6781A and N6786A 2-quadrant Source Measure Units (SMUs) are
specifically developed for battery drain analysis of wireless devices.5-7 The N6781A offers
high accuracy for low current measurements with specifications up to 20 V, 3 A and 20
W. The N6786A is good for higher power devices like the latest smart phones/phablets,
tablets and notebooks, with up to 20 V, 8 A and 80 W of output power.
The most important feature of the SMUs is their seamless measurement ranging, which
spans over 7 decades for accurate measurement of dynamic current drain signals
(Figure 5). They also feature settable battery emulation characteristics to provide results
comparable to an actual battery, as well as a zero-burden ammeter and voltmeter
logging operation mode for performing run-down testing with an actual battery when
necessary. A fast transient response minimizes the transient voltage drop for pulsed
currents drawn by wireless devices, while a 200-kHz sampling rate provides detailed
measurement insight.
Figure 5. Seamless measurement ranging allows Keysight’s SMUs to track the level of the dynamic signal in real time
and use the most optimum measurement range for the given signal level.
Both SMUs operate within the mainframe of the N6705B DC power analyzer. The
N6705B provides a platform for power, waveform capture, long-term current drain
data-logging and display, plus analysis of results. The 14585A software compliments the
solution by adding advanced battery drain functionalities such as statistical analysis and
energy measurements.
An example of insight provided by greater time-resolution when optimizing the battery

run-time of a GPRS device is shown in Figure 6. On the left, a good portion of current
drain for the DRX standby operation is captured. The exploded view on the right shows
details of each Rx current burst, which provides insight into the baseband and receiver
activities during this period.
Figure 6. Better insight for optimizing the battery run-time with the zoom-in view.
It is often useful to evaluate a device powered by a battery-emulator power supply that

delivers a constant DC source to the device. At other times, it is useful to use the device’s
actual battery, such as when conducting an actual battery run-down test. This test
setup reveals additional insight into the device when it’s operated with its battery. The
N6705B coupled with the E7515A UXM Wireless Test Set’s flexible network emulation
and configurable sleep mode capabilities enable characterization of device battery life
and current drain under realistic operating conditions (Figure 7). Besides evaluating the
resulting impact of different operating modes over various settings, the user equipment’s
applications and network conditions on battery consumption, users can analyze the
impact from design changes, firmware updates and the addition of complex transmission
and reception capabilities such as carrier aggregation and higher-order MIMO.
Voltage
Current
Power
Base station & server (e.g. IMS, cloud) emulation
Source Measurement Unit
E7515A UXM Wireless Test Set Device under test N6705B DC Power Analyzer
Figure 7. Designers can characterize battery and current drain with the UXM and DC power analyzer.
Other applications offered by the N6705B DC power analyzer and tips to optimize
device’s battery life can be found in reference 5 and 6, respectively. For even lower
current and higher bandwidth measurements, the CX3300A Device Current Waveform
Analyzer can be used. It measures current down to 150 pA and bandwidth up to 200
MHz.
(iii) Signal Integrity and Power Integrity Tools (c)
There is a wide range of measurement tools available to validate and correlate SI and
PI simulation with actual measurement. For example, the ENA Option TDR addresses
interconnect test, the Infiniium oscilloscopes support transmitter test, and the Bit Error
Ratio Test (BERT) solutions can be used for receiver test. Supporting software serves to
enhance the measurement value of these tools.
The E5071C ENA Option TDR8 is a one-box solution for analyzing high-speed serial
interconnects. It enables time-domain (TDR/TDT), frequency-domain (S-parameters,
which can be used to describe crosstalk) and eye-diagram analysis, as shown in Figure
8. The ENA replaces traditional solutions such as vector network analyzers and TDR
oscilloscopes. It incorporates a setup wizard that automatically adjusts skew and makes
measurements with just a few clicks. Moreover, it allows fast and accurate measurement
of small discontinuities. The superior noise performance enables real-time measurements
without the averaging traditionally needed with TDR oscilloscopes. Another advantage is
ESD robustness; ESD protection circuits are difficult to implement on a TDR oscilloscope.
The ENA supports compliance test and is certified for major communication standards.
Together with differential and single-ended TDR/TDT probes, the ENA can also be used
for PCB quality control and failure analysis.
Time domain Frequency domain

Time domain
Frequency domain
Eye diagram
Figure 8. The E5071C ENA Option TDR is used for real-time measurement of the time and frequency domains.
Figure 9. Real-world jitter measurements with the Infiniium S-Series oscilloscopes.
The Physical Layer Test System (PLTS) software9 is specifically designed for SI in
interconnects. It works with the PNA, ENA, and PXI vector network analyzers, as well
as TDR oscilloscopes. The PLTS guides users through hardware setup and calibration,
and controls the data acquisition. It also provides de-embedded model creation for
automatic fixture removal that allows engineers to examine only the component of
interest. The system is easy-to-use with one-button compliance tests.
To measure jitter and observe waveforms, high bandwidth measurement solutions

are required. The Infiniium S-Series oscilloscopes10 offer the industry’s best SI with
10-bit ADC, a low-noise front end (90 µV RMS noise at 1-GHz bandwidth), up to 8-GHz
bandwidth, a 20 GSa/s sample rate, and less than 200 fs RMS intrinsic noise. Figure 9
shows actual jitter measurements using these oscilloscopes. All models in the family
utilize the same time-base technology block and a low horizontal component of jitter
that measures less than 130 fs over short record lengths. The S-Series supports
compliance applications like DDR, eMMC, MIPI, USB, and many more.
Software applications that enable better measurement insight are available for
the S-Series. The InfiniiScan rapidly triggers on complex events that can be seen
but may be impossible to specify using hardware triggers. It quickly scans through
thousands of acquired waveform cycles and isolates anomalous signal behavior. The
Serial Data Analysis provides quick SI validation for high-speed serial interfaces with
embedded clocks. The EZJIT, EZJIT-Plus, and EZJIT-Complete help to characterize and
evaluate most commonly needed jitter measurements. The N8833A crosstalk analysis
application11 assists in the diagnosis of crosstalk by detecting and quantifying sources
of crosstalk. The N8833A also enables users to visualize expected improvements to help
quantify the amount of design margin recovered when specified aggressors are removed
from victims (Figure 10).
Figure 10. Before and after view of a victim waveform with FEXT. The top plot shows the victim waveform in
green, the aggressor in orange, and the crosstalk removed waveform in red. The middle plot is the eye diagram
of the victim with the bulging indicative of FEXT. The bottom plot is the eye diagram of the victim after removing
crosstalk.
An important thing to consider is that oscilloscopes themselves are subject to SI

challenges like distortion, noise and loss.12 Scopes with superior SI attributes provide a
better representation of signals under test and vice-versa. Table 1 shows seven critical
oscilloscope attributes that are important to obtaining an accurate representation of
measured signals under test.
Table 1. Important oscilloscope attributes in providing accurate representation of a signal under test.
Signal Intergrity Metric Scope Technology Block Where can you find the answer?
Resolution ADC bits Product data sheet
Noise Front-end Most vendors include in product data sheet.
Vertical scaling ADC/front-end Datasheets don’t always specify when SW maginification starts. Some
supported in HW vendors BW limit at small sensitivities.
Frequency response flatness Analog filters and Not typically included in product datasheets. You will need to ask the vendor
correction filters to see a magnitude and phase response for the model you are evaluating.
Time scale accuracy Time base Product data sheet
Amount of intrinsic jitter Time base Some vendors include, others don’t. If not in the data sheet, ask the vendor.
ENOB (Effective Number of Bits) Combination of both vertical and Some vendors include, others don’t. If not in the data sheet, ask the vendor.
horizontal scope system
For receiver test, Keysight’s BERT solutions cover affordable manufacturing test and
high-performance characterization, and compliance testing up to 32 Gb/s. For example,
the J-BERT M8020A13 is designed for R&D and test engineers who characterize and
verify compliance of chips, devices, boards, and systems with serial I/O ports. It has all
the needed receiver test capabilities built-in and can be used to test popular serial bus
standards such as USB Super Speed, and MIPI™ M-PHY.
To measure small AC signals riding on top of DC supplies and capture transients created
by high frequency loading, PI solutions with low noise, support of popular rail voltages,
low loading, and high bandwidth are desired. Together with the Infiniium S-Series, the
N7020A power rail probe and N2820A high-sensitivity current probes present the PI
analyzer reference solution.14 This solution enables complete visibility into the signals
hiding on DC power rails (Figure 11). The N7020A has a 1:1 attenuation ratio, ± 24-V
offset, and 2-GHz bandwidth to capture high-frequency noise and transients that can
cause clock and data jitter. It can be bandwidth-limited to reduce noise. The N2820A
enables current probing down to the 50-µA range for low power measurements.
Figure 11. Zoom-in view of the ripple, noise and transients on top of a typical 1.8-V DC supply.
(iv) Wireless Test Solutions (d)
For those developing IoT devices and looking for solutions to support the wireless
formats of today and tomorrow, Keysight offers a range of hardware platforms;
benchtop, modular and one-box testers (Figure 12). These products are complemented
with software that provide greater features and measurement insight. The advantage
of using Keysight’s solutions is the common measurement science ensures consistent
and comparable measurement results for the entire product lifecycle from R&D to
manufacturing.
In the design and prototype evaluation phase, benchtop instruments like the X-Series
Signal Analyzers and Signal Generators are ideal as they provide the benefits of high
performance and front panel capabilities. Later in the product lifecycle, where criteria
like test speed, flexibility, and footprint are of greater importance, modular and one-box
tester solutions like the M9420A VXT PXIe vector transceiver and the E6640A EXM
wireless test set, respectively are better candidates. For example, the EXM15 provides the
broadest multi-format coverage of any one-box tester in its class, with regular updates
that add new formats. Current supporting formats include 2G/3G/4G cellular formats,
WLAN, ZigBee, Bluetooth®, and Wi-SUN. It can also be scaled up to four TRX channels.
Each TRX is a complete vector signal analyzer (VSA), vector signal generator (VSG) and
four-port RFIO, with up to 6 GHz frequency coverage and 160MHz bandwidth. Ports can
be configured as two half-duplex and two full-duplex or 4 full-duplex.
Figure 12. Keysight’s measurement science across benchtop, modular and wireless test set. The software below,
complement these hardware to provide greater features and measurement insight.
To accelerate design and test, Keysight offers three popular software applications to be
used with the benchtop, modular and one-box tester platforms. Signal Studio software
enables the creation of custom and standards-compliant waveforms, while the X-Series
measurement applications enable one-button testing for the various IoT wireless
formats. Aside from the signal generation software and measurement applications, the
89600 VSA software is the industry-leading tool for digital modulation analysis and is
useful for deeper troubleshooting of wireless formats.
As an alternative to integrated test-sets, some small to medium-sized manufacturers

may select cost-effective solutions16-19 for implementations such as ASK/FSK and the
lowest-cost Bluetooth® and ZigBee. The N9320B/N9322C Basic Spectrum Analyzer
(BSA) can be used as a cost-effective solution for testing low-cost devices and
modules. The BSA is ideal for the research, development and manufacture of consumer
electronics, as well as for bench-repair, universities and colleges, and general-purpose
spectrum monitoring.
The T3111S RIDER NFC Conformance Test System in Figure 13 is a one-box solution for
RF analog and digital protocol testing of NFC, EMV and ISO devices. The test system is
based on the T1141A NFC Test Set and is complemented by either the Keysight or FIME
robots for accurate and repeatable RF testing. The T3111S is an officially validated test
platform for the NFC Forum Certification program. It is also recognized for EMV Level
1 Card and Terminal type approvals. In addition, Keysight offers a solution for NFC R&D
engineers with the Infiniium S-Series Scope and the 33522B Waveform Generator.
Figure 13. The T3111S RIDER NFC Conformance Test System for RF analog and digital protocol testing of NFC, EMV
and ISO devices.
(v) Real-Time Spectrum Analysis (d, e)
Real-time spectrum analysis can be used to address a number of challenges, including

troubleshooting performance problems in real-world environments and capturing
interfering signals (intentional or unintentional) that may be present and impacting
performance—even if they are transient and very short in duration. This capability can
be upgraded as an option on the UXA, PXA and MXA signal analyzers. The Real-Time
Spectrum Analyzer (RTSA)20,21 option enables detection of signals as short as 3.33 ns
and scanning up to 510-MHz real-time bandwidth, with real-time signal analysis for
frequencies up to THz using external mixing. Effective triggering allows users to focus on
the signal of interest in complex signal environments and even see small signals in the
presence of large ones.
The 89600A VSA software complements the RTSA, enabling deeper analysis of captured
complex signals. The N9077A WLAN measurement application and RTSA capability
enable the signal analyzer to pinpoint interference caused by many signals in the ISM
and UNII (2.4 GHz or 5 GHz) bands. Figure 14 depicts real-time spectrum analysis results
in different formats to reveal agile, elusive or unexpected signals. The density display
provides a detailed view of ongoing changes in the content of the spectral environment.
Here, the color scale shows the frequency of occurrence. The spectrogram presents
frequency spectra versus time and uses color to indicate magnitude. Information is
updated in real-time, displaying signal changes in the spectrum domain, time domain
and spectrogram views.
Figure 14. Real-time spectrum analysis results are displayed in (a) density format, (b) spectrogram and power versus
time.
(vi) EMI /EMC (e)
Early in the development cycle, Keysight’s EDA EMPro software can be used to simulate
the radiated emissions of electronic circuits and components. Calculated results help
to determine whether emissions are within levels specified by common EMC standards,
such as CISPR, FCC Part 15 and MIL-STD-461G. Modeling can help designers estimate
emissions levels before the hardware is developed.
To avoid costly project delays due to EMC compliance failures, development teams
perform early pre-compliance testing on their new designs to help identify EMI
problems. The N/W6141A EMI measurement application, running on the X-Series
spectrum analyzers (PXA/MXA/EXA/CXA), facilitates pre-compliance testing with a
broad suite of EMC-focused data collection and analysis tools.
The success of EMC compliance testing depends on moving products through the
test queue quickly and efficiently. Full standards-compliant testing can be conducted
in accordance with CISPR and MIL-STD with the upgradeable N9038A MXE EMI
receiver. For a complete EMI test solution, Keysight Solutions Partners provide a single
point-of-contact to combine the MXE with chambers, antennas, software, value-
added integration, probes, and more. Figure 15 shows the test setup for radiated EMI
measurements.
CISPR radiated EMI test setup

1-4 meters above
ground plane
Antenna
Equipment
under test
EMI
receiver
360°
Table is 80 cm high,
non-conductive
Ground plane
Figure 15. This test setup is used to perform radiated EMI measurements.
4. Conclusion
Addressing the rising challenges faced by IoT device designers and developers requires
reliable and accurate test and measurement solutions. Using Keysight solutions, engineers
can not only gain a faster time-to-market advantage, but also the increased likelihood that
their devices will be successfully implemented in the market.
Keysight offers an array of solutions covering all phases of the product lifecycle to help device
designers and developers address their challenges head on. Each solution is bolstered by
Keysight’s continuous innovation and investment in developing new technologies to support
evolving standards and meet new and emerging test and measurement needs. To ensure it
provides today’s device designers and developers access to leading-edge solutions, Keysight
sits on many industry committees and works closely with customers. By doing so, it is able to
keep up with technology via upgrades, updates and retrofits.
5. References
[1] The Internet of Things: Enabling Technologies and Solutions for Design and Test
(5992-1175EN)
[2] Sojuyigbe, S.; Daniel, K., “Wearables/IOT devices: Challenges and solutions to
integration of miniature antennas in close proximity to the human body,” in
Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium, pp.
75-78, 15-21, March 2015
[3] W2360EP/ET SIPro, W2359EP/ET PIPro (5992-1291EN)
[4] Understanding Signal Integrity (5988-5978EN)
[5] Enhance the Battery Life of your Mobile or Wireless Device (5991-0519EN)
[6] 10 Tips to Optimize a Mobile Device’s Battery Life (5991-0160EN)
[7] Battery Life Challenges in IoT Wireless Sensors and the Implications for Test
(5991-2698EN)
[8] E5071C ENA Option TDR Enhanced Time Domain Analysis (5990-5237EN)
[9] Physical Layer Test System (PLTS) 2016 (5989-6841EN)
[10] Infiniium S-Series High-Definition Oscilloscopes (5991-3904EN)
[11] N8833A and N8833B Crosstalk Analysis Application for Real-Time Oscilloscopes
(5992-1308EN)
[12] Evaluating Oscilloscope Signal Integrity (5991-4088EN)
[13] J-BERT M8020A High-Performance BERT (5991-3647EN)
[14] Power Integrity Analyzer, Reference Solution (5992-1292EN)
[15] E6640A EXM Wireless Test Set (5991-4287EN)
[16] A Cost-effective Way to Test Sub 1-GHz Wireless Modules (5992-1142EN)
[17] A Cost-effective Way to Test Bluetooth® Modules on Smart Devices (5992-1118EN)
[18] A Flexible Test Solution for 2.4 GHz ZigBee Transmitter and Receivers (5992-0464EN)
[19] A Cost-Effective Solution to Test Zigbee-enabled Smart Home Devices (5992-1298EN)
[20] Real-Time Spectrum Analyzer, X-Series Signal Analyzers (5991-1748EN)
[21] Real-Time Spectrum Analysis for Troubleshooting 802.11n/ac WLAN Devices
(5991-2652EN)
Evolving For more information on Keysight

Technologies’ products, applications or
Our unique combination of hardware, software, support, and people can help
services, please contact your local Keysight
you reach your next breakthrough. We are unlocking the future of technology. office. The complete list is available at:
www.keysight.com/find/contactus
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www.keysight.com/find/mykeysight Singapore 1 800 375 8100
A personalized view into the information most relevant to you. Taiwan 0800 047 866
Other AP Countries (65) 6375 8100
Keysight Services
www.keysight.com/find/service Europe & Middle East
Our deep offering in design, test, and measurement services deploys an Austria 0800 001122
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you implement new technologies and engineer improved processes that Finland 0800 523252
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lower costs.
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Luxembourg +32 800 58580
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custom products. Sweden 0200 882255
Switzerland 0800 805353
Keysight Assurance Plans Opt. 1 (DE)
www.keysight.com/find/AssurancePlans Opt. 2 (FR)
Up to ten years of protection and no budgetary surprises to ensure your Opt. 3 (IT)
instruments are operating to specification, so you can rely on accurate United Kingdom 0800 0260637
measurements.
For other unlisted countries:
Keysight Channel Partners www.keysight.com/find/contactus
www.keysight.com/find/channelpartners (BP-2-23-17)
Get the best of both worlds: Keysight’s measurement expertise and product
breadth, combined with channel partner convenience.
Bluetooth and the Bluetooth logos are trademarks owned by Bluetooth SIG, Inc., U.S.A.
and licensed to Keysight Technologies, Inc. All instances of Bluetooth should be in
DEKRA Certified
ISO9001 Quality Management System
italics
*X-parameters is a trademark and registered trademark of Keysight Technologies in www.keysight.com/go/quality
the US, EU, JP, and elsewhere. The Xparameters format and underlying equations are
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MIPI is a licensed trademark of MIPI, Inc. in the U.S. and other jurisdictions. Quality Management System
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This information is subject to change without notice.

© Keysight Technologies, 2016, 2017
Published in USA, March 1, 2017
5992-1478EN
www.keysight.com

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Keysight Technologies

IoT – With Great Power Comes Great Challenges

Rising challenges for IoT device designers and developers –

Massively scaling a heterogeneous mix of wireless communication technologies introduces

Sensors and actuators

Figure 1. Myriad pathways and gateways provide access to the cloud.1

a) Higher Level Integration of Circuits and Components

With increasing complexity, electrical, thermal and mechanical behaviors need to be

b) Energy Efficiency and Battery Life

Sensor/actuator mesh e.g. Backhaul antenna e.g.

c) Signal Integrity (SI) and Power Integrity (PI)

d) Heterogeneous Mix of Wireless Technologies and Multi-Standard

e) Interference, Compliance and Conformance

3. Solutions and Test Considerations - Software and Hardware

(i) Design and Simulation (a-e)

Figure 4. SystemVue is the nucleus for cross-domain development environment.

Keysight EDA offers a broad selection of EM simulation technologies covering Method

GoldenGate is an advanced simulation, analysis and verification solution for integrated

(ii) Battery Current Drain Analysis (b)

An example of insight provided by greater time-resolution when optimizing the battery

It is often useful to evaluate a device powered by a battery-emulator power supply that

Source Measurement Unit

(iii) Signal Integrity and Power Integrity Tools (c)

Time domain Frequency domain

Figure 9. Real-world jitter measurements with the Infiniium S-Series oscilloscopes.

To measure jitter and observe waveforms, high bandwidth measurement solutions

An important thing to consider is that oscilloscopes themselves are subject to SI

(iv) Wireless Test Solutions (d)

As an alternative to integrated test-sets, some small to medium-sized manufacturers

(v) Real-Time Spectrum Analysis (d, e)

Real-time spectrum analysis can be used to address a number of challenges, including

(vi) EMI /EMC (e)

CISPR radiated EMI test setup

Evolving For more information on Keysight

This information is subject to change without notice.

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