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1. General
A. The maintenance procedures that follow are to be used to carry out tinning and soldering
electrical/electronic components.
2. Conditions
3. Procedure
PART NUMBER OR
NOMENCLATURE VENDOR
SPECIFICATION
P/N 484−2
Dri−Wick
.05 in wide (1.3 mm)
American Electrical Heater Co.
P/N 484−4
Dri−Wick
.095 in wide (2.4 mm)
B. Materials
PART NUMBER OR
NOMENCLATURE VENDOR
SPECIFICATION
Flux,
Soldering Liquid, MIL−F−14256, Type A
Rosin Base
Flux,
MIL−F−14256, Type RA,
Soldering Liquid,
(Kester Flux MIL 1544)
Rosin Base
Sn 50 Wire − Specification,
Solder,
QQ−S−571
Solid Metal
Comp, Sn 50, Type S
Nonactivated
Solder, Sn 50 Wire − Specification,
Rosin Core QQ−S−571
Comp, Sn 50, Type S
PART NUMBER OR
NOMENCLATURE VENDOR
SPECIFICATION
Sn 60 Wire − Specification,
Solder,
QQ−S−571
Solid Metal
Comp, Sn 60, Type W−R−P2
Nonactivated
Solder, Sn 60 Wire − Specification,
Rosin Core QQ−S−571
Comp, Sn 60, Type W.S.
Solvent,
MIL−T−81533
1.1.1 Trichloroethane
Solvent,
P−D−680
Dry Cleaning
C. Process
(1) Cleaning
(a) Sand with an emery cloth or remove with a blunt knife, any oxidation from the entire
surface before tinning electrical/electronic components.
WARNING: OBEY THE PRECAUTIONS THAT FOLLOW WHEN YOU USE CLEANING
AGENTS:
(b) After sanding, the surfaces will be cleaned with a brush and 1.1.1 Trichloroethane
NOTE: LPS Electro 140°, LPS NoFlash, Isopropyl Alcohol or Methyl Ethyl Ketone
are permitted as a replacement cleaning solvent.
Refer to Figure 1.
(a) Strip the wire ends in accordance with ESPM 20−11−00, paragraph 2 or paragraph 3.
(b) For MS connectors the insulation should be removed from the wire, to the correct
length, as follows:
(c) For connectors other than MS, refer to the P/N in the proper section for the correct
length of insulation removal.
(d) Make sure a clearance of .062 in to .093 in (1.6 mm to 2.4 mm) between wire
insulation and the solder cup. This will prevent wire strands from breaking. (Refer to
Figure 1).
Refer to Figure 2.
(a) Each wire and component lead, to be assembled in a solder connection, shall be
tinned immediately after the wire has been stripped. This condition applies regardless
of whether the conductor is supplied in a pre−tinned condition.
(b) Tinning shall cover approximately 1/3 to 1/2 the stripped length of the wire and shall be
located at the tip end of the wire.
3 No clean, flux core, solder wire Sn 63/Pb 37 (IF 14 solder wire or Kester #245
solder wire).
NOTE: When MIL−F−14256 LRL flux and/or No clean, flux core, solder wire Sn
63/Pb 37 are used in the tinning or subsequent solder process, no post
cleaning is required.
(d) Nickel clad copper wire (LAC 01−159 and MIL−C−25038) shall be tinned using rosin
based flux MIL−F−14256, Type RA and Sn 60 solder.
NOTE: MIL−F−14256, type RA flux can also be used to flux nickel coated
terminals.
(e) When Chromel−Alumel thermocouple wires are tinned with Ag 5.5 or Ag 5.1
(QQ−S−571) solid metal solder, Kester Formula #1588 flux is to be used.
(f) Because of the passivity of the tin coated conductors of Kapton wire and cable
(MIL−W−81381/21, MIL−W−81381/22 and MIL−C−27500 cable symbols NK, NL), the
following method should be employed prior to the soldering of these conductors:
(g) Flux shall be poured into a shallow container to a depth, which will provide wetting of
the wire to the desired height when inserted vertically in the flux.
(h) Tinning is carried out by passing the wire through a molten bead of solder on the tip of
the soldering iron. (Refer to Figure 2). The tinned length will depend on the amount of
flux, the wire gauge, the temperature of the solder and the length of time the wire is
held in the solder.
(i) Wicking of solder beyond the wire insulation can be prevented by using a thermal
shunt or heat sink during the tinning process.
(j) Tinning can also be carried out by dipping the wire into a solder pot.
(l) The solder shall be stirred each time it is remelted and shall be discarded, rather than
replenished, when the tinning action becomes sluggish due to contamination.
(m) Before wires are inserted in the solder pot, the surface of the solder shall be skimmed
clean of dross by means of a piece of cardboard.
(n) After tinning, excess solder shall be shaken or knocked off the wire.
(o) Wire which has been tinned using the rosin−based flux MIL−F−14256, {Type R, RMA
or R} or Kester Formula #1588, shall be post cleaned with a brush and isopropyl
alcohol.
NOTE: Where reference is made to solder or rosin core solder Sn 60 in this proceeding
process, No−clean, flux core, solder wire Sn 63/Pb 37 may be substituted.
(a) All solder cups, other than those that have been gold−plated or pre−tinned, shall be
prefilled with solder before the wire is soldered into the cup.
(b) Contacts size #4 and larger shall be removed from the connector inserts before tinning
and soldering. Smaller contacts may be removed where practical.
(c) Contacts, which have been removed, shall be placed in a non−metallic block held in a
vice.
(d) For large size solder cups, which have been removed, heat shall be applied by means
of a soldering iron as close as possible to the bottom of the cup.
(e) Rosin core solder Sn 60 shall be melted into the cup to an amount where it will not
overflow the cup when the wire is inserted.
(f) Small size solder cups shall be tinned by placing a small piece of rosin core solder Sn
60 at the bottom of the cup before the heat is applied and the wire is inserted.
QQ−S−571
Comp Ag 5.5
Type W.S.
Chromel−Alumel
Kester Formula #1588 Isopropyl Alcohol
Thermocouple Wire
QQ−S−571
Comp Ag 1.5
Type W.S.
IF 14
Electrical Wire MIL−F−14256
or Not Required
Solder Terminals Type LRL
Kester #245
(5) Soldering
(b) The rating of the iron, as well as the size and shape of the tip, will be determined by
the configuration of the joint and the amount of heat required to produce an acceptable
connection or joint.
(c) Any of the options listed in paragraph 3 may be employed in the soldering of the
following electrical/electronic components:
2 Tin coated conductors of Kapton wire and cable shall be fluxed with a minimum
quantity of two (2) drops of MIL−F−14256, Type RA. Post cleaning to be carried
out as per Table 2.
(d) Components which are to be soldered shall be free of dust, dirt, grease, etc. by means
of cleaning with a brush and 1.1.1 Trichloroethane.
(e) Components to be joined, shall be held together in such a manner that they will not
move in relation to each other during the soldering procedure.
(f) The heated soldering iron tip shall be applied to the connection area is such a manner
as to transfer optimum heat to the surfaces being soldered.
(g) Thermal shunts shall be used when required for the protection of insulation and heat
sensitive components, or when required to prevent wicking of solder under the
insulation of stranded wire. The connection areas shall not be overheated.
(h) Solder shall be applied to the connection when the temperature of the heated joint will
readily melt the solder.
NOTE: The melting point of Sn 60 solder is 375°F (190.5°C) and Ag 5.5 solder is
690°F (365.5°C).
Solder shall not be melted by the soldering iron tip and allowed to flow over the
connection.
The soldering iron shall be positioned to permit application of the solder directly to the
heated wire and terminal.
(i) Soldered connections shall be made using no more solder than necessary.
(j) For all terminal types (except solder cup terminals), sufficient solder shall be applied to
form a slight fillet between the terminal and each side of the wire.
(k) The contour of the wire shall be visible after soldering. Excessive solder, which
completely covers the wire and terminal, is not permitted. (Refer to Figure 3).
(l) For solder cup terminals, the solder cup shall contain a sufficient amount of solder to
completely fill the cup when solder is melted and the tinned wire is inserted to the
bottom of the cup.
(m) The solder shall follow the contour of the cup entry slot and shall not spill over or
adhere to the sides of the cup. (Refer to Figure 4).
(n) After the solder has been applied to the connection the flux in the joint shall be allowed
to boil to the surface before the heat is removed.
(o) Under no circumstances shall liquids be used to hasten cooling of the soldered
connection, nor shall the connection be moved during the cooling and solidification of
the solder.
(p) Parts which have been soldered using rosin−based flux or rosin−core solder shall have
any residual flux removed with a brush and 1.1.1 Trichloroethane. Refer to Table 2.
QQ−S−571
None Comp Sn 60
Type W−R−P2 1.1.1 Trichloroethane
All Standard electric
and electronic parts MIL−T−81533
Rosin Base QQ−S−571
MIL−F−14256 Comp Sn 60
Type R Type S
QQ−S−571
Comp Ag 5.5
Type W.S.
Chromel−Alumel
Kester Formula #1588 Isopropyl Alcohol
Thermocouple Wire
QQ−S−571
Comp Ag 1.5
Type W.S.
IF 14
MIL−F−14256
or Not Required
Type LRL
Electrical Wire Kester #245
(q) Parts which have been soldered using TEC flux shall be scrubbed with a neutralizing
solution of 2 oz/gal of sodium carbonate, then rinsed clean in water and dried.
NOTE: When removing the residual flux from electrical assemblies, position them
so the cleaning solvent or the flux does not enter the assemblies and make
them inoperable.
(a) The soldering iron tip shall be checked for full insertion into the heating element and
tight attachment to the iron.
(b) Oxidation scale shall not be allowed to accumulate between the heating element and
the tip.
(c) A bright, thin but continuous tinned surface shall be maintained on the tip working
surface to ensure proper heat transfer and to prevent transfer of impurities to the
solder connection.
(d) Only flat, fine, single−cut, shear−tooth type files shall be used for cleaning and
dressing unplated copper tips prior to tinning.
(e) When plated tips are used they shall be cleaned before tinning with a #320 or #400 grit
emery cloth in a manner which will not remove the plating. Files shall not be used for
cleaning plated tips.
(f) After tips have been prepared, the iron shall be heated to a temperature which will melt
solder. Solder shall then be applied in a thin coating to the tip.
(g) During soldering operations, make sure the hot tip is kept clean.
WIRE INSULATOR
SOLDER CUP
CONNECTOR
NOT SATISFACTORY
NO SOLDER BUILD UP
RELATIVE POSITION OF OR DRIP ON OUTSIDE
SOLDERING IRON, SOLDER OF THE CUP
CUP AND WIRE
SATISFACTORY SOLDERED CONNECTION
WITH SUFFICIENT SPACE FOR
INSPECTION OF STRANDS
TOO MUCH
SOLDER
SOLDER RUN−UP
UNDER INSULATION
NICKED
WIRE
COLD SOLDERED JOINT
INSUFFICIENT OR JOINT WHERE THE
SOLDER WIRE WAS MOVED BEFORE
SOLDER BECOME SOLID
rwm2011102_004.dg, rm, 03/06/02
INSULATION NOT
NO TINNING CUT BACK FAR
ENOUGH AND FRAYED