INTERCON 2018

25th International Conference on Electronics, Electrical Engineering and Computing

th th
Lima, Perú, 8 to 10 August 2018

CALL FOR PAPERS

Rama Estudiantil
UNMSM

www.intercon.org.pe
INTERCON 2018
25th International Conference on Electronics, Electrical Engineering and Computing
th th
Lima, Perú, 8 to 10 August 2018

General Chair: CALL FOR PAPERS

Santiago León Gómez
santiago.leon@ieee.org
Technical Program Chair:
Carlos Silva Cárdenas
csilvac@ieee.org
Publication Chair:
José Durán Talledo
joseduran@ieee.org
Conference Treasurer:
Robert Ramírez Chávez
robert.ramirez@ieee.org
The IEEE XXV International Conference on Electronics, Electrical Engineering and Computing - INTERCON 2018 aims to bring
together researchers, professionals, students and entrepreneurs to promote the exchange of ideas and the promotion and
production of research in various technological fields. INTERCON facilitate the approach, identification and commitment to joint
challenges that allow greater access to and development of technologies for the benefit of humanity, as it is the vision of the IEEE.
INTERCON 2018 will be held in Lima, World Heritage Site and Gastronomic Capital of Latin America with 483 years of creation.
Museums with great Works of art, archaeological sites, beaches, the boardwalk, valleys, natural reserves, the nightlife, the thrill of
adventure sports, and the exquisite cuisine gives Peru’s capital an authentic personality and makes tourism in Lima a unique
experience in the country.
The Conference Organizing Committee invites you to submit full length original research contributions from engineering
professionals from industries, R&D organizations, academic institutions, government departments and research scholars from
across the world.
Topics of interest include but are not limited to:

Information Contact:
Jorge Guzmán Paucar-ExCom Chair
jorgeluisgp@ieee.org
Adela Contreras Gamboa-ExCom
Vice Chair
adela.contreras.gamboa@ieee.org
Estefanie Espinoza Quispe-ExCom
Secretary
estefanie.espinozaquispe@ieee.org
Alessandra Olazabal Dominguez-
ExCom Member-at-Large
alessandra.olazabal@ieee.org
Computing (C)
Ÿ Algorithms and Complexity
Ÿ Architecture and Organization
Ÿ Graphics and Visualization
Ÿ Human-Computer Interaction
Ÿ Information Assurance and Security
Ÿ Information Management
Ÿ Intelligent Systems
Ÿ Networking and Communications
Ÿ Operating Systems
Ÿ Parallel and Distributed Computing
Ÿ Software Engineering
Ÿ Social Issues and Professional
Practice
Electronics and Communications (EC) Electrical Engineering (EE)
Ÿ Broad Band Communication
Ÿ Computer and Intelligent Communication
Ÿ Mobile and Optical Communication
Ÿ Wireless Communication
Ÿ Mobile and Optical Networks
Ÿ Wireless Sensor Networks
Ÿ Network Security
Ÿ Microelectronics
Ÿ Embedded Wireless Systems
Ÿ Signal and Image Processsing
Ÿ Artificial Intelligence
Ÿ Aerospace Technology
Ÿ Biomedical Engineering
Ÿ Control Systems
Ÿ Robotics
Ÿ Analog and digital circuits and systems
Ÿ Geo-informative Systems
Ÿ Soft Computing Techniques in
Power Systems
Ÿ Feedback Control Systems
Ÿ Power Electronics and Energy
Efficient Drives
Ÿ Renewable Power Conversion
Technologies
Ÿ Instrumentation and Control
Ÿ Power Quality Improvement
Techniques
Ÿ Expert Systems and Artificial
Intelligence Techniques

Paper submission information:

The official language of 2018 IEEE INTERCON is ENGLISH. Papers must be submitted in PDF and should be no longer than 4
pages, following the IEEE Conference format, available on:
http://www.ieee.org/conferences_events/conferences/publishing/templates.html
Papers can be submitted using the Easychair System by accessing the following address:
https://easychair.org/conferences/?conf=2018ieeeintercon
Accepted technical papers will be submitted to the IEEE Xplore Digital Library.

Important Dates
Full paper submission deadline: April 30th, 2018
Notification of acceptance: June 15th, 2018
Final paper submission deadline: June 30th, 2018
Conference dates: August 08th to 10th, 2018

Technical Sponsor:

Organized by:

Universidad Nacional Rama Estudiantil

Mayor de San Marcos IEEE UNMSM
Perú

www.intercon.org.pe