PCB Manufacturing Process — A Step-by-Step Guide

Printed circuit boards (PCBs) form the backbone of all major electronics. These miraculous

inventions pop up in nearly all computational electronics, including simpler devices like digital

clocks. For the uninitiated, a PCB routes electrical signals through your electronics, which

satisfies the device's electrical and mechanical circuit requirements. In short, PCBs tell the

electricity where to go, bringing your electronics to life.

PCBs direct current around their surface through a network of copper pathways. The complex

system of copper routes determines the unique role of each PCB.

At PCBCart we handle the PCB manufacturing process for you from start to finish, but we

believe it's important that our clients understand what we do - this ensures that your design

specifications better serve your interests. Proper understanding of the PCB manufacturing

steps prevents unnecessary errors from getting transmitted during the design stage. It also

helps designers stay abreast of the latest printed circuit board manufacturing methods.

In this guide, we'll cover the entire PCB manufacturing process for a standard PCB. From

design to completion, and take you through a step-by-step PCB fabrication process.

Basic Anatomy of a PCB Board

Before discussing the PCB manufacturing steps, it's wise to learn about the basic anatomy of a

PCB board. The primary component of a PCB is the fiberglass substrate board. The sturdy

material provides the strength of the board. We add layers of copper and additional layers of

fiberglass substrate and copper onto the substrate, which comprises a typical four layer board.

In addition, the PCB board receives a solder mask layer.

To employ a biological analogy, consider the fiberglass substrate as the skeleton, the copper

layers as the nervous system, carrying electrical signals, and the solder mask layer as the skin,

which protects the copper entering into contact with the environment, resulting in a short circuit.

How Is a PCB Manufactured?

Let's examine the full manufacturing process of a PCB — a process that involves 16 steps.

Step 1: Design and Output

It probably comes as no surprise that the first step involves designing the PCB. Technically the

first step occurs in the mind of the designer, but we'll skip that part. Like all manufactured

goods, PCB relies on a plan. Depending on the PCB requirements, the designer creates a

layout using industry standard design software.

The most frequently used program is called extended Gerber. The 1980's baby food ad

campaign sought beautiful babies, and this software creates some beautifully designed

offspring. Gerber also goes by the name IX274X.

The PCB industry birthed extended Gerber as the perfect output format. The software encodes

all vital information — the copper tracking layers, component notations, and the solder masks.

All aspects of the PCB design undergo checks at this point. The software performs oversight

algorithms on the design to ensure that no errors go undetected. The designer also examines

the plan with regard for elements relating to track width, board edge spacing, trace and hole

spacing and hole size.

After a thorough examination, the designer outputs the PCB design to the fabrication house for

them to build. Once received, the PCB fabricator performs a check, called a Design for

Manufacture (DFM) check, to ensure the design will fulfill requirements for the minimum

tolerances during the manufacturing process.

Step 2: From File to Film

After the designer outputs the PCB schematic files and the manufacturer conducts a DMF

check, it's time to print. PCB files don't print to a regular printer. The manufacturer uses a

special printer called a plotter, which makes photo films of the PCBs. The manufacturer will use

the films to image the PCBs. Although they're laser printers, they aren't a standard laser jet

printer. Plotters use incredibly precise printing technology to provide a highly detailed film of

the PCB design.

The manufacturer also controls the temperature and humidity of the printing environment to

mitigate any outside influences in printing the film, which resembles the transparencies used to
project images on a screen. Depending on your age, you might remember them from high

school. Sheets of clear plastic enter the plotter and receive the PCB design in black ink.

The final product results in a plastic sheet with a photo negative of the PCB in black ink. For

the inner layers of the PCB, black ink represents the conductive copper parts of the PCB. The

remaining clear portion of the image denotes the areas of non-conductive material. The outer

layers follow the opposite pattern: clear for copper, but black refers to the area where the

manufacturer will remove existing copper. The plotter automatically develops the film, and the

film is securely stored to prevent any unwanted contact.

Each layer of PCB and solder mask receive their own clear and black film sheet. In total, a two-

layer PCB needs four sheets: two for the layers and two for the solder mask. Of course, the

films correspond perfectly to each other. When used in harmony, they map out the PCB

alignment.

An exact overlapping of the films is achieved when the technician punches a hole through all

the films. The registration hole serves as an alignment guide. The exactness of the hole occurs

by adjusting the table on which the film sits. When the tiny calibrations of the table lead to an
optimal match, the hole is punched. The holes will fit into the registration pins in the next step

of the imaging process.

Step 3: Printing the Inner layers: Where Will the Copper Go?

This step in PCB manufacture prepares to make actual PCB. The basic form of PCB comprises

a laminate board. Laminate serves as an ideal body for receiving the copper that structures the

PCB. The epoxy resin and glass fiber core of the laminate sheet provides a sturdy and dust-

resistant starting point for the PCB. Copper is pre-bonded on both sides. The process involves

whittling away the copper to reveal the design from the films.

In PCB construction, cleanliness is key. The copper-sided laminate is cleaned and passed into

a decontaminated environment. During this stage, it's vital that no dust particles settle on the

laminate. An errant speck of dirt might otherwise cause a circuit to short or remain open.

Next, the clean panel receives a layer of photo-sensitive film called the photo resist. The photo

resist comprises a layer of photo reactive chemicals that harden after exposure to ultra violet

light. This ensures an exact match from the photo films to the photo resist. The films fit onto

pins that hold them in place over the laminate panel.

The film and board line up and receive a blast of UV light. The light passes through the clear

parts of the film, hardening the photo resist on the copper underneath. The black ink from the

plotter prevents the light from reaching the areas not meant to harden, and they are slated for

removal. The aspect of light control is vital during this stage, and only yellow light floods the

interior of the room. Yellow light carries the least UV level wavelengths.

After the board becomes prepared, it is washed with an alkaline solution that removes any

photo resist left unhardened. A final pressure wash removes anything else left on the surface.

The board is then dried.

The product emerges with resist properly covering the copper areas meant to remain in the

final form. A technician examines the boards to ensure that no errors occurred during this

stage. All the resist present at this point denotes the copper that will emerge in the final PCB.

This step only applies to boards with more than two layers. Simple two-layer boards skip ahead

to drilling. Multiple-layer boards require more steps.

Step 4: Removing the Unwanted Copper

With the photo resist removed and the hardened resist covering the copper we wish to keep,

the board proceeds to the next stage: unwanted copper removal. Just as the alkaline solution

removed the resist, a more powerful chemical preparation eats away the excess copper. The

copper solvent solution bath removes all of the exposed copper. Meanwhile, the desired

copper remains fully protected beneath the hardened layer of photo resist.

Not all copper boards are created equal. Some heavier boards require larger amounts of

copper solvent and varying lengths of exposure. As a side note, heavier copper boards require

additional attention for track spacing. Most standard PCBs rely on similar specification.
Now that the solvent removed the unwanted copper, the hardened resist protecting the

preferred copper needs washing off. Another solvent accomplishes this task. The board now

glistens with only the copper substrate necessary for the PCB.

Step 5: Layer Alignment and Optical Inspection

With all the layers clean and ready, the layers require alignment punches to ensure they all line

up. The registration holes align the inner layers to the outer ones. The technician places the

layers into a machine called the optical punch, which permits an exact correspondence so the

registration holes are punched perfectly.

Once the layers are placed together, it's impossible to correct any errors on the inner layers.

Another machine performs an automatic optical inspection of the panels to confirm a total

absence of defects. The original design from Gerber, which the manufacturer received, serves

as the model. The machine scans the layers using a laser sensor and proceeds to

electronically compare the digital image with the original Gerber file.

If the machine finds an inconsistency, the comparison is displayed on a monitor for the

technician to assess. Once the layer passes inspection, it moves to the final stages of PCB

production.

Step 6: Lay-up and Bond

In this stage, the PCB takes shape. All the separate layers await their union. With the layers

ready and confirmed, they simply need to fuse together. Outer layers must join with the

substrate. The process happens in two steps: lay-up and bonding.

The outer layer material consists of sheets of fiber glass, pre-impregnated with epoxy resin.

The shorthand for this is called prepreg. A thin copper foil also covers the top and bottom of the

original substrate, which contains the copper trace etchings. Now, it's time to sandwich them

together.
The bonding occurs on a heavy steel table with metal clamps. The layers securely fit into pins

attached to the table. Everything must fit snugly to prevent shifting during the alignment.

A technician begins by placing a prepreg layer over alignment basin. The substrate layer fits

over the prepreg before the copper sheet is placed. Further sheets of prepreg sit on top of the

copper layer. Finally, an aluminum foil and copper press plate complete the stack. Now it's

prepped for pressing.

The technician slides the stack over to the mechanical press, which compresses the layers.

Then, pins are driven through the stack to ensure its fixation together. Next, the stack is placed

on a tray and taken to the bonding press.

The bonding press employs heat controlled plates to apply pressure to the stack. The heat in

the press melts the epoxy resin while the press applies pressure to fuse the stack together.

The entire operation undergoes an automatic routine run by the bonding press computer. The

computer orchestrates the process of heating up the stack, the point in which to apply

pressure, and when to allow the stack to cool at a controlled rate.

Next, a certain amount of unpacking occurs. With all the layers molded together in a super

sandwich of PCB glory, the technician simply unpacks the multi-layer PCB product. It's a

simple matter of removing the restraining pins and discarding the top pressure plate. The PCB

goodness emerges victorious from within its shell of aluminum press plates. The copper foil,

included in the process, remains to comprise the outer layers of the PCB.

Step 7: Drill

Finally, holes are bored into the stack board. All components slated to come later, such as

copper-linking via holes and leaded aspects, rely on the exactness of precision drill holes. The

holes are drilled to a hairs-width-the drill achieves 100 microns in diameter, while hair averages

at 150 microns.

To find the location of the drill targets, an x-ray locator identifies the proper drill target spots.

Then, proper registration holes are bored to secure the stack for the series of more specific

holes.
Before drilling, the technician places a board of buffer material beneath the drill target to

ensure a clean bore is enacted. If you've ever used a home drill and placed a piece of scrap

wood below your drill site to eliminate splintering, it's the same idea. The exit-material prevents

any unnecessary tearing upon the drill's exits.

A computer controls every micro-movement of the drill — it's only natural that a product that

determines the behavior of machines would rely on computers. The computer-driven machine

uses the drilling file from the original design to identify the proper spots to bore.

The drills use air-driven spindles that turn at 150, 000 rpm. At this speed, you might think that

drilling happens in a flash, but there are many holes to bore. An average PCB contains well

over one hundred bore intact points. During drilling, each needs its own special moment with

the drill, so it takes time. The holes later house the vias and mechanical mounting holes for the

PCB. The final affixation of these parts occurs later, after plating.

After the drilling completes itself, the additional copper that lines the edges of the production

panel undergoes removal by a profiling tool.

Step 8: Plating and Copper Deposition

After drilling, the panel moves onto plating. The process fuses the different layers together

using chemical deposition. After a thorough cleaning, the panel undergoes a series of chemical

baths. During the baths, a chemical deposition process deposits a thin layer — about one
micron thick — of copper over the surface of the panel. The copper goes into the recently

drilled holes.

Prior to this step, the interior surface of the holes simply exposes the fiber glass material that

comprises the interior of the panel. The copper baths completely cover, or plate, the walls of

the holes. Incidentally, the entire panel receives a new layer of copper. Most importantly, the

new holes are covered. Computers control the entire process of dipping, removal and

procession.

Step 9: Outer Layer Imaging

In Step 3, we applied photo resist to the panel. In this step, we do it again — except this time,

we image the outer layers of the panel with the PCB design. We begin with the layers in a

sterile room to prevent any contaminants from sticking to the layer surface. We apply a layer of

photo resist to the panel. The prepped panel then passes into the yellow room. UV lights affect

photo resist. Yellow light wavelengths don't carry UV levels sufficient to affect the photo resist.

Black ink transparencies are secured by pins to prevent misalignment with the panel. With

panel and stencil in contact, a generator blasts them with high UV light, which hardens the

photo resist. The panel then passes into a machine that removes the unhardened resist,

protected by the black ink opacity.

The process stands as an inversion to that of the inner layers. Finally, the outer plates undergo

inspection to ensure all of the undesired photo resist was removed during the previous stage.

Step 10: Plating

We return to the plating room. As we did in step 8, we electroplate the panel with a thin layer of

copper. The exposed sections of the panel from the outer layer photo resist stage receive the

copper electro-plating. Following the initial copper plating baths, the panel usually receives tin

plating, which permits the removal of all the copper left on the board slated for removal. The tin
guards the section of the panel meant to remain covered with copper during the next etching

stage. Etching removes the unwanted copper foil from the panel.

Step 11: Final Etching

The tin protects the desired copper during this stage. The unwanted exposed copper and

copper beneath the remaining resist layer undergo removal. Again, chemical solutions are

applied to remove the excess copper. Meanwhile, the tin protects the valued copper during this

stage.

The conducting areas and connections are now properly established.

Step 12: Solder Mask Application

Before the solder mask is applied to both sides of the board, the panels are cleaned and

covered with an epoxy solder mask ink. The boards receive a blast of UV light, which passes

through a solder mask photo film. The covered portions remain unhardened and will undergo

removal.

Finally, the board passes into an oven to cure the solder mask.

Step 13: Surface Finish

To add extra solder-ability to the PCB, we chemically plate them with gold or silver. Some

PCBs also receive hot air-leveled pads during this stage. The hot air leveling results in uniform

pads.

Step 14: Silkscreen

The nearly completed board receives ink-jet writing on its surface, used to indicate all vital

information pertaining to the PCB. The PCB finally passes onto the last coating and curing

stage.

Step 15: Electrical Test

As a final precaution, a technician performs electrical tests on the PCB. The automated

procedure confirms the functionality of the PCB and its conformity to the original design. At

PCBCart, we offer an advanced version of electrical testing called Flying Probe Testing. This

testing depends on moving probes to test electrical performance of each net on a bare circuit

board.

Step 16: Profiling and V-Scoring

Now we've come to last step: cutting. The different boards are cut from the original panel. The

method employed either centers on using a router or a v-groove. A router leaves small tabs

along the board edges while the v-groove cuts diagonal channels along both sides of the

board. Both ways permit the boards to easily pop out from the panel.

What to Look For in a PCB Manufacturer

As you can see, a lot of work goes into the PCB fabrication process. At PCBCart, we are

always focused on the care and attention to detail that each PCB manufacturing step requires.

We also offer vacuum packaging, weighing and delivery to make sure your PCB order arrives

safely and free of damage.

When picking a PCB manufacturer, be sure to choose a company with a high level of expertise

and a focus on quality at each stage. Our knowledge, consideration and technical ability shows

in every part of our work.

If you are interested in learning more, check out our PCB Fabrication or Assembly sections.

We offer fast turnaround and free PCB quotes.

 A PCB is used to connect electronic components electrically. This is done
by making conductive path ways for circuit connections by etching tracks
from copper sheet laminated onto a non-conductive substrate.

A PCB consists of a conducting layer that is made up of thin copper foil.

The insulating layer di-electric is laminated together with epoxy resin
prepreg. The most commonly used PCB type is the FR-4. Boards may be
single sided or double sided. Double sided PCB can be used to connect
electronic components on both sides through through-hole plating. This is
done by copper plating the walls of each hole so as to connect the
conductive layers of the PCB.

Advantages of PCB over Bread-board

1. You can get a much higher density board with PCB.

2. You will find the PCB design to be more reliable than the one made on a
bread board. The circuit will look neat without any wires popped up and will
not fall apart.
3. You can have very precise control over the circuit component you are
using, and you can comfortably fit in odd shaped components that are
difficult to fix on a bread board.
4. For production of large volume of circuit boards, the costs become less and
the soldering can be done by fully automated machines.

For PCB fabrication, some basic steps have to be followed. The detailed
description on how to make PCB is explained below. The step by step
procedure can be obtained by checking the following links.

PCB Etching Process | PCB Drilling | Conductor Plating | Solder

Resist | PCB Testing |PCB Assembling

Take a look at the video below to get a brief idea about how a PCB is made.

Once you have decided which electronic circuit is to be made on a PCB,

you will have to make the design for the board on your PC. You can use
different PCB designing CAD softwares like EAGLE. The most important
point to note is that everything has to be designed in reverse because you
are watching the board from above. If you need the circuit to be designed
on a PCB, the layout must have a 360 degree flip.

The next step is to print out the layout using a laser printer. You must take
special care in the type of paper that you are going to use. Though a little
expensive, photo basic gloss transparent papers are known to be the most
suitable for the process.

You must also make sure that you are able to fit all your components on to
the print. First take a copy of the print on ordinary paper and lay down all
the IC’s and other components. The size of the layout must also fit the size
of the PCB. Try to get the highest resolution when you are printing i on the
paper. Always use black ink to take the layout. Increase the contrast and
make the print more dark and thick. Do not take the print as soon as it
comes out. Wait for some time for the ink to dry out.

The above said method is a little unprofessional, and thus the colour may
not b dark enough that you may be able to see through it. There might also
be a few spots here and there. But this is more than enough as long as it
can block UV light compared to the blank area.

Cut the layout by leaving a generous amount of blank space. Place the
paper layout on the PCB and apply some heat by pressing an iron box on
top of the paper on to the printed circuit board. Apply pressure for some
time and keep the PCB intact for a few minutes. Now the layout is attached
to both the board and the paper. We have to get rid of the paper, so that it
gets permanently attached to the board. The only way to do this is to soak
it in water. After two minutes, peel off the first layer of paper. After two to
three hours of soaking, take it out and rub it with your finger to remove all
the paper bits off.

PCB Etching Process

All PCB’s are made by bonding a layer of copper over the entire substrate,
sometimes on both sides. Etching process has to be done to remove
unnecessary copper after applying a temporary mask, leaving only the
desired copper traces.

Though there are many methods available for etching, the most common
method used by electronics hobbyists is etching using ferric chloride ir
hydrochloric acid. Both are abundant and cheap. Dip the PCB inside the
solution and keep it moving inside. Take it out at times and stop the process
as soon as the copper layer has gone. After etching, rub the PCB with a
little acetone to remove the black colour, thus giving the PCB a shining
attractive look. The PCB layout is now complete.

PCB Drilling
The components that have to be attached to the multi-layered PCB can be
done only by VIAS drilling. That is, a pated-through hole is drilled in the
shape of annular rings. Small drill bits that are made out of tungsten carbide
is used for the drilling. A dremel drill press is normally used to punch the
holes. Usually, a 0.035 inch drill bit is used. For high volume production
automated drilling machines are used.

Sometimes, very small holes may have to be drilled, and mechanical

methods may permanently damage the PCB. In such cases, laser drilled
VIAS may be used to produce an interior surface finish inside the holes.

Conductor Plating

The outer layer of the PCB contains copper connections (the part where
the components are placed) which do not allow solderability of the
components. To make it solderable, the surface of the material has to be
plated with gold, tin, or nickel.

Solder Resist

The other areas which are not to be solderable are covered with a solder
resist material. It is basically a polymer coating that prevents the solder
from bringing traces and possibly creating shortcuts to nearby component
leads.

PCB Testing

In industrial applications, PCB’s are tested by different methods such as

Bed of Nails Test, Rigid Needle adaptor, CT scanning test, and so on. The
basic of all tests include a computer program which will instruct the
electrical test unit to apply a small voltage to each contact point, and verify
that a certain voltage appears at the appropriate contact points.

PCB Assembling

PCB assembling includes the assembling of the electronic components on

to the respective holes in the PCB. This can be done by through-hole
construction or surface-mount construction. In the former method, the
component leads are inserted into the holes drilled in the PCB. In the latter
method, a pad having the legs similar to the PCB design is inserted and
the IC’s are placed or fixed on top of them. The common aspect in both the
methods is that the component leads are electrically and mechanically fixed
to the board with a molten metal solder. To know more about basic
soldering tips and the materials used for soldering, check out the link
– Basic Soldering Tips