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Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 1
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin 1
or button style batteries
Mercury-containing components For example, mercury in lamps, display backlights, 0
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas 0
than 100 sq cm discharge lamps
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring 0
greater than 2.5 cm in diameter or height
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos 0
Components, parts and materials containing 0
refractory ceramic fibers
EL-MF877-00 Page 1
Template Revision B
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
Step:
1. Press the latch and disassemble the rear cover.
(Fig. 1)
Fig. 2
Fig. 3
Step:
Latch
Fig. 3
Hook
Middle Hook
Fig. 1
Step:
1. Loosen screws (6052B0259601) * 2. (Fig. 1)
2
Disassemble Fan cable.
Fig. 2
Fan holder
Step:
[With VGA card SKU]
1. Disassemble VGA card(6042B0220801) (Fig. 1) .
Withdraw VGA card bracket from rear bracket
hole.(Fig. 2)
Fig. 1
Fig. 2
Step:
Fig. 1
[Non Fiber NIC SKU]
1. Disconnect MAIN & AUX antenna cables from
WLAN card. (Fig. 1)
Disassemble MAIN & AUX antenna cables.
(Fig. 2)
Fig. 2
MAIN 天线
Step:
Fig. 1 MAIN [Non Fiber NIC SKU]
1. Loosen screw (6052B0259201) * 1,
disassemble MAIN antenna. (Fig.1)
啟碁 6036B0119203 6036B0119303
Fig. 2 表一
AUX
Step:
Step:
[With Fiber NIC SKU] Trial Run Build Only
Fig. 1
Fig. 2
Step:
[With Fiber NIC SKU] Trial Run Build Only
Fig. 1
Latch
Fig. 2
Step:
1 [With Fiber NIC SKU] Trial Run Build Only
2
1. Loosen set screw * 2 (Fig.1), disassemble
Fig.1 BRKT Rear Fiber-NIC (6070B0710201) .
(Fig.1)
NGFF
Fig. 2
Step:
Fig. 1 [ Non Fiber NIC SKU]
NGFF screw
Step:
Pull up Serial port cable
[ With Serial SKU]
1. Disassemble Serial port cable (Fig. 1).
Fig. 2
Fig. 3
Step:
1. Disassemble Riser/B (Fig. 1).
2. Disconnect Serial Plus cable & Parallel port cable from
Riser/B. (Fig. 2).
3. Rip Gasket (6054B0088001)*1 from thermal module. (Fig. 3)
Fig. 1
Hook
Pull
Fig. 2
Fig. 3
Pull
Step:
1 2
Fig. 1
Step:
1. Loosen screw (6052B0259201) * 2. (Fig.1)
Fig. 1
Green slide
Fig. 2
Fig. 3
Step:
[ With VGA SKU]
Fig. 1
1. Put Rear BRKT (6070B0706701) module
on support fixture.
2 1
Fig. 2
3 1 2
Step:
Fig. 1
1. Loosen set screw * 2. (Fig.1)
Fig. 2
Step:
1 2
1. Loosen screw (6052B0259201) * 2, then
disassemble m-SATA. (Fig.1)
Fig. 1
Fig. 2
Step:
Fig. 1 [With Hood Sensor SKU]
Fig. 2
Push out Hood sensor
Step:
Fig. 1
5 1. Loosen M/B screw (6052B0259401) * 5.
1
(Fig.1)
3 2
Fig. 2
Fig.3
Step:
1. Put the M/B on support fixture.
Fig. 1
1 4
Align
boss
3 2
Align
boss
Step:
1. Put the chassis (6070B0707701) on support
Fig. 1 fixture. (Fig.1)
Fig. 2