Introduction

High Reliability User Interface Solutions

Epec Engineered Technologies is a premier supplier of OEM human

machine interface assemblies. With a main focus to support Tier 1 & 2
level companies within the military, aerospace, medical, SATCOM, and lab/
test equipment industries. Our Largo, FL facility is a full machine shop with
15,000 sq. ft. of manufacturing space which allows us to be a one stop
shop to keep production costs down and speed up development time for
our customers.

Inside our Human-Machine Interface (HMI) Design Considerations

Ebook you will find design and manufacturing tips to help with any user
interface project. With tons of components to consider when dealing
with HMI projects, we decided to give you a jump start on the design and
manufacturing aspects.

Below you will find several design & manufacturing (DFM) tips for your
custom Human-Machine Interface project. There are several mechanical
design constraints you should know when manufacturing turnkey HMI
switch assemblies.
 Design Consideration
#1
Overall Height of Assembly:

• Membrane switch thickness without embossments is about

0.030” - 0.035”.
• Membrane switch thickness with embossments is about
0.042” - 0.045”.

Non-Embossed Key Assembly Thickness, Side View

 Embossed Key Assembly Thickness, Side View

Graphic Overlay Layer:

• Switch assembly through-holes should be 0.030” overall larger than

chassis openings unless a bezel covers the opening.
• Allow at least 0.125” between cutouts and active switch or window
areas.
• The membrane overlay shall be slightly larger than the layers beneath
and recesses should be 0.010” larger all around to assure a proper fit.
• Minimum rim emboss thickness is 0.030”.
• Minimum emboss spacing is 0.050”.
• Minimum rim emboss width is 0.040”.±0.005”.
• Minimum inside and outside radius of emboss is 0.005”.
• Registration shall be ±0.015” with respect to other images and
features.
Support Subpanel Layer:

• The subpanel should be the same size as the membrane in both height
and width.
• All subpanel cutouts and holes should be .030” larger than membrane
UNLESS SPECIFICALLY USED IN MOUNTING OF HARDWARE (See
illustration below).
• Subpanel cutouts behind windows should be .060” larger than the
window. These general guidelines are intended to help insure that the
subpanel is not visible after assembly.

Graphic Overlay Specifications

HMI Circuit Layers:

• NOTE 1: Minimum center-center switch spacing with LEDs is 0.875”.

• NOTE 2: Minimum center-center switch spacing without LEDs is
0.750”.
• NOTE 3: Minimum spacing from tail edge to circuit is 0.100”.
• NOTE 4: Minimum spacing between circuit traces is 0.040”.
• NOTE 5: Minimum inside and outside corner radius is 0.032”.
• NOTE 6: Minimum slot widths are 0.063”.
• NOTE 7: Minimum hole diameter is 0.063”.
• NOTE 8: Minimum clearance between holes and cutouts is 0.063”.
• NOTE 9: Minimum edge to any cutout is 0.050”.

HMI Circuit Layer Specifications

Graphics and Text Layers:

• Minimum line thickness is 0.007”.

Graphics Line Thickness – Minimum

“
GRAPHICS AND TEXT SHOULD AVOID LINES OR
DETAILS THAT ARE TOO FINE.
 Design Consideration
#2
Embossed Keys:

Perimeter Emboss (aka: Rim, Ridge, Rail, Ring)

• Two-dimensional embossing.
• Used to raise the perimeter of the key and add a border effect.
• Maximum height is 2 ½ times the material thickness.

Perimeter Emboss (aka: Rim, Ridge, Rail, Ring)

Plateau Emboss (aka: Pillow, Dome, Round, Spherical, Machined)
• Two-dimensional embossing.
• Used to raise the entire surface of the key.
• Maximum height is 2 ½ times the material thickness.

Plateau Emboss (aka: Pillow, Dome, Round, Spherical, Machined)

Multi-Level Emboss
• Three-dimensional embossments.
• Used to raise the overlay surfaces in many shapes and axis.
• Maximum height up to 3 times the material thickness.

Multi-Level Emboss

“
EMBOSSING ADDS DIMENSION TO YOUR
GRAPHIC OVERLAY. PLATEAU AND RIM
EMBOSSING IS GREAT FOR LOCATING KEYS IN
LOW LIGHT CONDITIONS.
 Design Consideration
#3
Embossing is Performed Using Two Methods,
Magnesium Dies or a Method Called Hydroforming:

Magnesium Dies – This process uses a male and female die to emboss
features. Emboss heights are 0.010” high maximum and/or 2 ½ times the
embossed material thickness.

Punch

Blank

Blank Holder
Guide Plate

Die

Die Embossing
Hydroforming – This process uses a one sided tool. Embossment heights
can be up to 3 times the overlay material thickness and 3-dimensional dies
can be produced. Hydroforming is considerably more expensive than the
standard embossing die process.

Pressure-Control Valve

Forming Cavity (Oil Filled)

Blank

Rubber Diaphragam

Draw Ring

Punch

Hydroforming
 Design Consideration
#4
Adhesive Selection is Dependent On the Mounting
Surface Finish:

Low Surface Energy (LSE) adhesives are designed to bond too hard to
stick to surfaces such as plastics, polypropylene, polyethylene, polystyrene,
thermoplastic polyolefin, EVA, PTFE, powder coated paints and oily metal
surfaces. Epec recommends the use of 3M 300LSE and 4952 VHB
adhesive for LSE surfaces. (See illustration below)

High Surface Energy (HSE) adhesives are designed to bond to are

designed to bond to substrates such as steel, aluminum, polycarbonate,
polyimide, polyester, PVC, acrylic, and rigid polyurethane. Epec
recommends the use of 3M’s 467MP and 468MP adhesives for all HSE
surfaces. (See illustration below)
 Mounting Surface Energy Material Identification Table
Low Surface Energy (LSE) High Surface Energy (HSE)
Plastics, Rubber, and Composites Metals, Oxides, and Ceramics
ABS Plastic Aluminum - Anodized
Acrylic Aluminum
Epoxy - Typical Amine-cured Copper
Epoxy - Typical Rubber Toughened Copper
Epoxy Paint Glass
Phenol-resorcinol Resin (Phenolic) Graphite
Poly(Chlorotrifluoroethylene) Iron
Poly(Ethylene Terephthalate) Kapton
Poly(Methylmethacrylate) - PMMA Lead
Poly(Vinyl Alcohol) - PVA Mica
Poly(Vinylchloride) - PVC, Rigid Nickel
Poly(Vinylidene Chloride) Nylon
Poly(vinylidene Fluoride) - PVF Platinum
Polyamide - PA, Nylon-6,6 Porcelain
Polycarbonate Silica
Polyester Silicone
Polyethylene - PE Silver
Polyhexafluoropropylene (Teflon) Stainless Steel
Polypropylene - PP Tin
Polystyrene - PS
Polytetrafluoroetylene - PTFE
Polyurethane Paint
Powder Coated Paint
PVC Rigid
Urea-formaldehyde Resin

“
LOW SURFACE ENERGY MATERIALS DO NOT
ALLOW ADHESIVES TO WET OUT, MAKING
THEM DIFFICULT FOR ADHESIVES TO ADHERE.
HIGH SURFACE ENERGY MATERIAL ALLOW FOR
ADHESIVE WET OUT, MAKING THEM EASY FOR
ADHESIVE TO BOND.
 Design Consideration
#5
Switch Venting:

The volume of air located under the switch contact must be vented when
the switch is depressed. Not venting the switch will cause loss of tactical
feel and possibly switch failure. Vent is never routed to the outside world in
efforts to avoid airborne contamination. (See illustration below)

HMI Switch Vent Channels

 Design Consideration
#6
Tactile Operator Feedback is Critical to the Design
Properties of the Metal Snap Dome:

The snap action of a momentary metal snap dome in a tactile membrane

switch is what provides the positive on/off feedback to the operator.
Stainless steel domes have the best tactile feedback, reliability and can be
selected in many shapes, sizes and trip force.

Tactile feedback is determined by the design factors below:

• Material Type: Stainless Steel, Plated options Gold, Silver or Nickel
• Key Travel: 0.004” - 0.084”
• Trip Force: 10 - 3000 grams
• Diameter: 4 - 30mm
• Life Cycles: 1 - 10 million
• Shape: Various (See illustration below)
 Design Consideration
#7
Do Not Run the ESD/EMI Shield Ground in the Same
Connector:

The ESD/EMI shield ground should be electrically bonded directly to the

assemblies chassis ground and not routed out of the same connector as
the switches and LEDs. Physically separating the shield ground from the
rest of the switch and LED circuits provides the best shielding operation.
(See illustration below)

HMI ESD/EMI Shield Ground Layer Seperate from Main Connector Ground
 Design Consideration
#8
The Connector Flex-Tail Cannot Exit Under or Within
0.125” of the Active Keypad Area:

The connector flex-tail should not exit under the keypad and shall exit
from the side or the rear of the assembly. Exiting from the rear will provide
a more watertight design. The illustration below identifies the many exit
locations for Epec’s assemblies.

Connector Flex-Tail and Keep-Out Area

 Design Consideration
#9
HMI Connector Flex-Tail Sharp Bends Should Be
Avoided!

The inside bend radius of a single circuit layer flex-tail shall be a minimum
of 0.100”. Bends near the membrane flex-tail connector or exit location are
not recommended. If a flex-tail bend is required it should not be stressed
due to bending. (See illustration below)

Minimum Flex-Tail Bend Radius

 Design Consideration
#10
Use a Rigid Printed Circuit Board (PCB) When High
Circuit Density Is Required:

Flexible HMI assemblies are constructed using polyester sheets and

cannot tolerate soldering temperatures. Replacing the polyester layer with
a rigid PCB allows components to be soldered directly.

Switching to a rigid PCB allows the following:

• Electronic components can be incorporated into the keypad assembly,

these include LEDs, resistors, capacitors, diodes, and even integrated
circuits can also be mounted to the rear side of the printed circuit.

• Electronic components can be directly soldered to the printed circuit

board, thereby eliminating potential intermittent or open circuits caused
by external stresses.

• Keypad interconnections to the application’s electronics are greatly

expanded as a wide variety of connectors can be soldered on the rear
surface of the printed circuit board through cutouts in the metal support
plate.

• Many connector styles can be selected to include high density,

through-hole, surface-mounted, polarized, latching, or shielded.
HMI Design with Rear Side of Rigid PCB for Added Electronics Componets
Bonus: Design Consideration
#11
Advantages/Disadvantages of Polycarbonate (PC) vs.
Polyester (PET):

Property Polycarbonate (PC) Polyester (PET)

Physical Copper 50

Life Cycle POOR (250,000 MAX) GREAT (2,000,000+)

Flexibility GOOD POOR

Flex Fatigue POOR GOOD

Tensile Strength GOOD POOR

Tear Resistance POOR GOOD

Abrasion Resistance POOR GOOD

Wear Resistance POOR GOOD

Die Cutting GOOD POOR

Embossment Height GOOD POOR

Optically Clear GOOD POOR

Dimensional Stability GOOD POOR

Thermal
Temperature Resistance POOR GOOD

Shrink Resistance POOR GOOD

Flame Retardant - UL Approved GOOD POOR

Chemical
Chemical Resistance POOR GOOD

Ink Adhesion GOOD POOR

Electrical
Membrane Circuit Layer POOR GOOD

Dielectric Strength POOR GOOD

ESD Protection GOOD POOR

 Contact Us
Our knowledgeable staff has over 60 years of experience in the industry.
We welcome the opportunity to put our skills to work for you! Please
contact us with any questions or requests.

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174 Duchaine Blvd.
New Bedford, MA 02745
Toll Free: (888) 995-5171
Tel: (508) 995-5171

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