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Experimental study of a latent heat thermal energy storage system assisted by a heat pipe network
Songgang Qiu
23.98 · West Virginia University
Abstract
The charging and discharging processes of a latent heat thermal energy storage system assisted by a heat pipe network was experimentally studied.
Rubitherm RT55 was chosen as the phase change material (PCM) and was enclosed within a vertical cylindrical container. A network of simulated heat
pipes was embedded within the PCM to enhance the heat transfer. The heat pipe array consisted of a primary central heat pipe with an array of
secondary heat pipes. The primary heat pipe transfers the thermal energy from the heat source to the heat sink while the secondary heat pipes transport
the extra thermal energy into to the phase change material during the charging process or retrieve it from the phase change material during the
discharging process. The heat pipe network was simpli ed by employing an arrangement of copper and acrylic pipes. Water was used as the heat
transport uid, which was circulated through the pipe network with a relatively high velocity to decrease the temperature drop, similar to what happens
inside a real heat pipe. The effects of different heat transfer uid ow rates and temperatures on the thermal performance of the latent heat energy
storage system were studied. The results indicated that the heat transfer uid ow rate and temperature have signi cant impacts on the total charging
time of the system. It was also found that the while the ow rate of the heat transfer uid has minimal effect on the discharging process, the
temperature of the heat transfer uid plays a signi cant role.
Figures
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Experimental study of a latent heat thermal energy storage system assisted MAR
by a heat pipe network
a a b,⁎
Saeed Tiari , Mahboobe Mahdavi , Songgang Qiu
a
Department of Mechanical Engineering, Gannon University, 109 University Square MS30, Erie, PA 16541, USA
b
Department of Mechanical and Aerospace Engineering, West Virginia University, 395 Evansdale Drive Morgantown, WV 26506, USA
A R T I C L E I N F O A B S T R A C T
Keywords: The charging and discharging processes of a latent heat thermal energy storage system assisted by a heat
Latent heat network was experimentally studied. Rubitherm RT55 was chosen as the phase change material (PCM) and
Thermal energy storage enclosed within a vertical cylindrical container. A network of simulated heat pipes was embedded withi
Heat pipe network PCM to enhance the heat transfer. The heat pipe array consisted of a primary central heat pipe with an arr
Phase change material
secondary heat pipes. The primary heat pipe transfers the thermal energy from the heat source to the heat
Experimental study
while the secondary heat pipes transport the extra thermal energy into to the phase change material durin
Charging
Discharging
charging process or retrieve it from the phase change material during the discharging process. The heat
network was simplified by employing an arrangement of copper and acrylic pipes. Water was used as the
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transport fluid, which was circulated through the pipe network with a relatively high velocity to decrease
See all › See all › See all › temperature drop, similar to what happens inside a real heat pipe. The effects of different
Download heat PDF
full-text transfer fluid
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1 Citation 42 References 3 Figures rates and temperatures on the thermal performance of the latent heat energy storage system were studied
results indicated that the heat transfer fluid flow rate and temperature have significant impacts on the
charging time of the system. It was also found that the while the flow rate of the heat transfer fluid has min
effect on the discharging process, the temperature of the heat transfer fluid plays a significant role.
⁎
Corresponding author.
E-mail addresses: tiari001@gannon.edu (S. Tiari), mahdavi001@gannon.edu (M. Mahdavi), songgang.qiu@mail.wvu.edu (S. Qiu).
http://dx.doi.org/10.1016/j.enconman.2017.10.019
Received 26 June 2017; Received in revised form 17 September 2017; Accepted 7 October 2017
0196-8904/ © 2017 Elsevier Ltd. All rights reserved.
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Nomenclature Greek
model to analyze the thermal response of a heat pipe assisted LHTES examine the effects of the HTF temperature and flow rate on
with potassium nitrate as the PCM. Liu et al. [31,32] experimentally thermal performance of the LHTES system during the charging,
studied the thermal performance of a heat pipe assisted LHTES system charging, and partial charging processes.
with paraffin wax as the PCM. They analyzed the charging and dis-
charging processes individually as well as a simultaneous charging/ 2. Experimental setup
discharging operation mode of the system. Mahdavi et al. [33,34] de-
veloped a new heat pipe configuration for a specific application in 2.1. Phase change material
concentrated solar power generation. They optimized the geometry of
the heat pipe to enhance the performance of the system. Sharifi et al. RUBITHERM RT55 was chosen as the PCM for the experiment
[35] used a novel heat pipe-metal foil approach to enhance the thermal to its relatively low cost, lab safe melting temperature, stable ther
performance of a LHTES system with n-Octadecane. Murray and Groulx physical properties during experiment testing, and relatively high la
[36,37] experimentally investigated the phase change heat transfer of a heat of fusion. The thermophysical properties of RUBITHERM RT55
LHTES with dodecanoic acid as the PCM during consecutive and si- listed in Table 1.
multaneous charging and discharging operations. Nithyanandam and
Pitchumani [38] numerically studied the influence of quantity and or-
ientation of embedded heat pipes on the thermal performance of a 2.2. Apparatus
LHTES system during charging and discharging. Lohrasbi et al. [39]
employed a two-dimensional numerical model to analyze the dischar- The PCM container was made of a 30.48 cm (1 ft.) long, 21.5
ging process of a heat pipe assisted LHTES system with nano-enhanced (8.5 in) outer diameter clear cast acrylic tube with a 0.635 cm (0.2
wall thickness. The container was wrapped by a 3.81 cm (1.5 in) t
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Table 1
Thermophysical properties of RUBITHERM RT55 [45].
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70 LHTES system was investigated for both the charging and dischar
65 process. For the charging process, the temperature of the HTF was s
60 155 °F (68.3 °C) and three flow rates, 0.5, 1 and 2 gpm (1.89, 3.79
7.57 L/min, respectively), were examined. As shown in Fig. 3, three
Temperature (°C)
55
of thermocouples are inserted into the PCM container at three diffe
50
axial locations to measure the PCM temperature. At each axial loca
45 there are four radially distributed thermocouples. The first set of a
40 thermocouples (T1–T4) was located 2.54 cm (1 in) above the co
35 T1 (first trial) T5 (first trial) T9 (first trial)
base wall. The second set of thermocouples (T5–T8) was inserted
30
the middle of the cylindrical PCM container at a height of 10.1
(4 i ) h fi l f h l ( 9 12) i l d h
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T1 (second trial) T5 (second trial) T9 (second trial) (4 in). The final set of thermocouples (T9–T12) is located at the to
25
See all › See all › See all › the PCM container, 17.78 cm (7 in) Download
from the bottom. Fig. 7 show
full-text PDF
T1 (third trial) T5 (third trial) T9 (third trial) Download citation Share
1 Citation 4220References 3 Figures temperature of the PCM at different locations during the char
15 process for three different HTF flow rates. The system had an in
0 5000 10000 15000 20000 25000 30000 35000 40000 45000 50000
temperature of 19 °C for all of the experiments conducted. The char
Time (s) process started at time t = 0 when the HTF (155 °F or 68.3 °C) bega
Fig. 5. Measured temperatures by repeating the charging process for HTF with tem- circulate through the system.
perature of 68.3 °C and flow rate of 1.89 L/min. As shown in Fig. 7, the HTF flow rate (which is directly proporti
to heat transfer rate from heat source) has a significant effect on
80 overall charging time of the LHTES system. For the lowest flow ra
75 T1 T5 T9 1.89 L/min, the total charging time is 14 h (50,000 s). For the cases
70 T1 (benchmark) T5 (benchmark) T9 (benchmark) flow rate of 3.79 L/min and 7.57 L/min, it took 12 h (43,000 s) and
65 (36,000 s) respectively for the system to become entirely molten
Temperature (°C)
60 creasing the flow rate of the incoming HTF from 1.89 to 7.57 L/
55 results in an approximately 30% increase in the charging rate of
50 system. In all cases, the thermocouples T1, T5, and T9 have the hig
45 temperature during the early stage of the charging process due to t
40 proximity to the secondary heat pipe. As conduction is the sole mod
35 heat transfer at this point in the melting process, the PCM tempera
30
measured by these thermocouples increases at a rate that is nearly
25
dependent of axial location. However, these thermocouples show
20
15 ferent behaviors during the later stages of the charging process after
0 5000 10000 15000 20000 25000 30000 35000 40000 45000 50000 PCM begins to melt and natural convection starts to affect the ov
Time (s) heat transfer within the system. As the charging process proceed
layer of molten PCM is formed near the heated base wall and
Fig. 6. Comparison between benchmark case and heat pipe-assisted case with HTF
around the secondary heat pipes. The higher temperature at the to
temperatures of 68.3 °C and flow rate of 1.89 L/min.
the container (T9–T12) results from the relatively warmer HTF at
entrance of the secondary heat pipes. As the temperature of the PC
temperatures are affected by the heat conduction from the top and the lower elevation (T1–T4) reaches the upper bound of the P
bottom surfaces. Because the distance from T1 to bottom surface is melting range, 57 °C, the temperature profiles begin to flatten as
shorter than the distance from T9 to top surface, T1 is a little hotter PCM starts melt which results in a transition from sensible heat sto
than T9. At around 8000 s, the natural convection of liquid PCM starts to isothermal latent heat storage process. A similar pattern can be
to affect the temperature distribution. Liquid PCM moves upwards due for the temperature profiles (T9–T12) at the top of the containe
to density change while the cold solid PCM moves downwards, leading well.
to more rapid temperature increase of T1. At around 30,000 s, the The majority of the PCM that resides in the middle of the conta
temperature of T5 also catches up T1 because the majority of the PCM remains solid until the later stage of the charging process. Again
around T5 is melted. heat transfer in this area is dominated by conduction until the
perature of the PCM reaches the 51 °C melting point. At this time
effects of natural convection in the thick molten layers of PCM at
3.1.2. Effect of heat transfer fluid flow rate
bottom of the container as well as in the vicinity of the secondary
The effect of the HTF flow rate on the thermal performance of the
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55
50
the charging process with a HTF flow rate of 7.57 L/min. The
picture was taken a few minute after the start of the charging pro
45
and therefore almost all of the PCM inside the container is still in
40
solid phase and the temperature is close to the initial 19 °C except
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0
Temp
solid phase and the temperature is close to the initial 19 C except
35 thin layer of hot solid PCM near the top and bottom copper walls. A
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T1 T2 T3 T4 Download
charging citation
process Sharethe temperature
continues, of the solid PCM incre
1 Citation 4230References 3 Figures
T5 T6 T7 T8
25 and the thin layer of the hot solid PCM near the top and bottom w
T9 T10 T11 T12
20 T13 T14 has melted. The effect of the secondary heat pipe array on the P
temperature distribution can be observed at time t = 2 h. The PC
15
0 5000 10000 15000 20000 25000 30000 35000 40000 45000 50000 the secondary heat pipes (between thermocouple columns) has a hi
Time (s) temperature than in the other surrounding areas. It can also be seen
the thickness of the molten PCM at the top and bottom of the conta
(a)
grows quickly starting from t = 6 h due to the increase in heat tran
70 resulting from natural convection occurring within the molten P
After eight hours, only a small portion of the PCM in the middle pla
65
still in the solid phase. Continued charging for two more hours resul
60
all of the PCM being melted and the LHTES system is now fully char
55 The evolution of the melting front (solid-liquid transition) of the sys
Temperature (°C)
55 crease in the heat transfer rate to PCM. The higher HTF flow rate re
50 in a higher HTF velocity within the secondary heat pipes, and hen
45 higher rate of convection between the hot HTF and the copper p
40 while also lowering the total thermal resistance between the PCM
the HTF. For the experiment with the highest flow rate of 7.57 L/
35
the heat transfer rate drops quickly to under 300 W whereas the in
30
T1 T2 T3 T4 thermal power for the 3.79 L/min case is around 200 W and it is
25 T5 T6 T7 T8
100 W for the 1.89 L/min case. The net thermal energy stored in
T9 T10 T11 T12
20 T13 T14 LHTES system is equal to the total thermal energy transferred into
15 system via the HTF minus the heat lost from the system during
0 5000 10000 15000 20000 25000 30000 35000 course of the charging process.
Time (s)
(c)
3.1.3. Effects of heat transport fluid temperature
Fig. 7. Measured temperatures during the charging process for different flow rates: (a)
The influence of the HTF temperature on the thermal perform
1.89 L/min (b) 3.79 L/min, and (c) 7.57 L/min.
of the system during the charging process was analyzed by varying
inlet temperature of the HTF fluid. The temperature was set to 6
pipes results in an increase in the overall heat transfer rate. This leads to 68.3 °C, and 73 °C at a flow rate of 7.57 L/min (2 gpm). The tempera
a rapid increase in the temperature of the remaining solid PCM as it profiles at the various thermocouple locations over the entire char
melts. This can be seen in the temperature profiles of thermocouple process for the three HTF temperatures are shown in Fig. 12.
T6–T8. system has an initial temperature of 19 °C for all three experiment
In order to capture the axial or lateral motion of the melting front illustrated in Fig. 12, the incoming HTF temperature plays a signifi
within the PCM, two symmetric thermocouples were inserted into the role in the total charging time of the system. The overall charging
container at each axial location midway between the secondary heat of the system is 16 h (60,000 s) for the 63 °C case, 10 h (36,000 s) for
pipes. Thermocouple T2 and T4 are at the bottom, T6 and T8 are in the 68.3 °C case and only 7 h (26,000 s) for the 73 °C case. Increasing
middle and T10 and T12 are at the top of the container. For all three temperature of the incoming HTF by 10 degrees resulted in a 55%
HTF flow rates, the thermocouple pairs recorded nearly the same duction in the overall charging time of the LHTES system.
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Fig. 9. Temporal evolution of charging process with HTF flow rate of 7.57 L/min and HTF temperature of 68.3 °C.
2.5 600
550
1.89 L/min 1.89 L/min
2 500
3.79 L/min 3.79 L/min
Temperature (°C)
450
7.57 L/min 400 7.57 L/min
Power (W)
1.5
350
300
1 250
200
0.5 150
100
0 50
0 5000 10000 15000 20000 25000 30000 35000 40000 45000 50000 0
Time (s) 0 5000 10000 15000 20000 25000 30000 35000 40000 45000 50
Time (s)
Fig. 10. Temperature difference between inlet and outlet of HTF during charging process
for different HTF flow rates. Fig. 11. Average input thermal power during the charging process for different HTF
rates.
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70 70
T1 T2 T3 T4
65 65
T5 T6 T7 T8
60 60 T9 T10 T11 T1
Temperature (°C)
Temperature (°C)
55 55 T13 T14
50 50
45
45
40
40
35 T1 T2 T3
35
30 T4 T5 T6
T7 T8 T9 30
25
T10 T11 T12 25
20
T13 T14
15 20
0 10000 20000 30000 40000 50000 60000 15
Time (s) 0 10000 20000 30000 40000 50000 600
Time (s)
(a)
(a)
70 70
T1 T2 T3 T4
65 65
T5 T6 T7 T8
60 60 T9 T10 T11 T12
Temperature (°C)
55
Temperature (°C)
55 T13 T14
50 50
45 45
40 40
35 35
30 30
T1 T2 T3 T4
25 T5 T6 T7 T8 25
T9 T10 T11 T12
20 20
T13 T14
15 15
0 5000 10000 15000 20000 25000 30000 35000 0 10000 20000 30000 40000 50000 600
Time (s) Time (s)
(b) (b)
75 70
T1 T2 T3 T4
70 65
T5 T6 T7 T8
65 60 T9 T10 T11 T12
erature (°C)
60 55 T13 T14
ature (°C)
55 50
50 45
45 40
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45
Tempera
40
Temp
40 35
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Download citation Share
1 Citation 4235References 3 Figures 30
30 T1 T2 T3 T4 25
25 T5 T6 T7 T8
20
T9 T10 T11 T12
20 15
T13 T14
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Fig. 15. Temporal evolution of discharging process with HTF flow rate of 7.57 L/min and HTF temperature of 20 °C.
2 300
3.79 L/min
200 7.57 L/min
7.57 L/min
Power (W)
1 150
100
0.5
50
0 0
0 10000 20000 30000 40000 50000 60000 0 10000 20000 30000 40000 50000 6000
Time (s) Time (s)
Fig. 16. Average temperature difference between inlet and outlet of HTF during dis-
Fig. 17. Average power extracted from the PCM during the discharging process fo
charging process for different HTF flow rates.
ferent HTF flow rates.
temperature. As the discharging process progresses, a layer of cold so- by the HTF. Due to the low thermal conductivity of the PCM,
lidified PCM forms at the top and bottom of the container as well as temperature within the PCM decreases slowly, therefore, even
around the secondary heat pipes. However, at this time the bulk of the after the initiation of the discharging process, a portion of the P
PCM is still in molten or partially solidified state after 4 h. This can also located far from the secondary heat pipes and the bottom wall is
be seen in the temperature profiles of Fig. 13c and in the photos of the hot with a temperature around 35 °C. At the same time, the tempera
solid-liquid interface shown in Fig. 15. In Fig. 15, the clear, see-through of the PCM that is close to the cold HTF is around 20 °C. The temp
portion of the PCM is molten while the white opaque material is solid evolution of the solid-liquid interface for the case with a HTF flow
PCM. The solidification process completes around 6 h after the start of of 7.57 L/min and HTF temperature of 20 °C are shown in Fig. 15
discharging and all of the stored latent heat energy has been retrieved
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70 70
65 T1 T2 T3 T4
65
60 T5 T6 T7 T8
60
55 T9 T10 T11 T12
C)
55
C)
50 T13 T14
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Temperature (°C
50
Temperature (°C
T13 T14
45 50
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40 Download
45 citation Share
1 Citation 4235References 3 Figures
40
30
25 35
20 30 T1 T2 T3 T4
15 25
T5 T6 T7 T8
0 15
0 10000 20000 30000 40000 50000 60000 0 5000 10000 15000 20000 25000 30000 3500
Time (s) Time (s)
(a) (a)
70
70
65 T1 T2 T3 T4 65
60 T5 T6 T7 T8 60
55
Temperature (°C)
Temperature (°C)
55
50
T13 T14
45 50
40 45
35
30 40
25 35
20 30 T1 T2 T3 T
15 T5 T6 T7 T
10 25
T9 T10 T11 T
5 20
T13 T14 T15
0
0 10000 20000 30000 40000 50000 60000 15
0 5000 10000 15000 20000 25000 30000 35000
Time (s)
Time (s)
(b)
(b)
70 Fig. 19. Measured temperatures during the partial charging process for differen
T1 T2 T3 T4
65
T5 T6 T7 T8 ondary heat pipes flow rates: (a) 1.89 L/min (b) 3.79L/min.
60
T9 T10 T11 T12
Temperature (°C)
55
50 T13 T14
3.2.2. Effects of heat transfer fluid temperature
45
40 The effects of the temperature of the incoming HTF on the the
35 performance of the system was analyzed by setting the flow rat
30 1.89 L/min and setting the inlet temperature to 10 °C, 15 °C, or 20 °C
25
20 in the previous experiments, the discharging process was initiated
15 mediately after the completion of the charging process. The temp
10 ture profiles from all of the thermocouple locations are shown in Fig
5 for three inlet temperatures. It can be seen that it takes around 60,0
0
0 10000 20000 30000 40000 50000 60000 for the molten PCM to fully solidify and reach the inlet HTF temp
Time (s) ture for all cases. However, since the initial conditions and dischar
(c) time are the same for all three cases, higher amount of thermal en
was extracted from the PCM in the cases with the lower HTF
Fig. 18. Measured temperatures during the discharging process for different HTF tem-
temperature. In other words, decreasing the temperature of the
perature: (a) 10 °C (b) 15 °C, and (c) 20 °C.
coming HTF results in a quicker discharging process, as expected.
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Citations (1) References (42)
... This drawback hinders the heat transfer rate between the PCM and heat source or sink
resulting in slow charging and discharging of the thermal systems which are the main
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concern for many practical applications. To resolve the low heat transfer rate in PCMs,
See all › See all
several › transfer enhancement
heat See all › methods have been developed including employing Download full-text PDF
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1 Citation ns42 Referencesimpregnation
[13][14][15], 3 Figures of PCM in a porous structure such as metal matrix [16],
embedding heat pipe [17] , dis- persing high conductivity nanoparticles [18]. ...
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