CTS-7700 Service Manual PDF

DCY2.782.
7700WC/E-A00
CTS-7700
Digital Ultrasound Imaging System
SERVICE MANUAL
SHANTOU INSTITUTE OF ULTRASONIC INSTRUMENTS, INC.

SHANTOU, CHINA
CONTENTS
1. System Composition and Technical Specifications…………….…….… 1-1
1.1 System Composition….…………………………………………………………………………… 1-1
1.2 Technical Specifications….………………………..………..……………………………………. 1-1
2. System Working Principle…...…………………………..………………………………... 2-1
2.1 Brief Introduction of Working Principle……………………..…………………………………… 2-1
2.2 Introduction of PCB……………………..……..…..……..……. ……………………………….. 2-3
2.2.1 Control Panel………………………………………….……………………………………… 2-3
2.2.2 Digital Processing Board..…………………………………..………………………………. 2-6
2.2.3 Order and Amplification Board.……………………………..……………………………… 2-13
2.2.4 Probe Interface Board………………………………………..……………………………… 2-19
2.3 Interconnection Signal List Between PCBs…...………………………………………………... 2-25
2.3.1 Probe Interface Board………………………………………..………………………………. 2-25
2.3.2 Order and Amplification Board……………………………..……………………………….. 2-27
2.3.3 Industrial Control Board..…………..………..………………………………………………. 2-29
2.4 Connection Diagram Between PCBs……………………………………………………………. 2-30
2.5 Disassemble Instruction..………………………………………………………………………… 2-31
2.5.1 General………………………………………………………………………………………… 2-31
2.5.2 Disassemble Plastic Housing..……………………………………………………………… 2-32
2.5.3 Disassemble Keyboard…..………………………………………………………………….. 2-34
2.5.4 Disassemble Rear Panel….………………………………………………………………… 2-35
2.5.5 Disassemble industrial control board……...……………………………………………….. 2-36
2.5.6 Disassemble PR board and RVA board……………………………………………………. 2-37
2.5.7 Disassemble Power Supply and Hard Disk…...…………………………………………… 2-38
2.5.8 Disassemble MONIT Board…………………………………………………………………. 2-39
2.5.9 Disassemble FEP Board…………………………………………………………………….. 2-42
2.5.10 Assemble Schematic of Main Unit………………………………………………………….. 2-42
2.6 Installation Instruction for Computer Main Board (Industrial Control Board).. ……………… 2-48
I
2.6.1 Appearance of Computer Main Board..…………………………………………………… 2-48
2.6.2 Interface Position Map..…………………………………………………………………….. 2-48
2.6.3 Installation of System Memory….…………………………………………………………. 2-49
2.6.4 USB Port……………………………………………………………………………………… 2-49
2.6.5 IDE Port……..……………………………………………………………………………….. 2-50
2.6.6 Floppy Disk Port…..…………………………………………………………………………. 2-51
2.6.7 Display Port...………………………………………………………………………………... 2-52
2.6.8 Network Port…………………………………………………………………………………. 2-52
2.6.9 Keyboard and Mouse Port..……….……………………………………………………….. 2-53
2.6.10 Power Supply Port.…….…………………………………………………………………… 2-53
2.6.11 Fan Port..……….……………………….…………………………………………………… 2-55
2.6.12 Status Indication Port……………………………………………………………………….. 2-55
2.6.13 TV Output Port……………………………………………………………………………….. 2-56
3. Troubleshooting………………………………………………..……………..…..….…….. 3-1
3.1 PCB Function and Potential Failure……………………………………………………………... 3-1
3.1.1 Main Function and Potential Failure of Probe Interface Board…………………………... 3-1
3.1.2 Main Function and Potential Failure of Order and Amplification Board………………… 3-2
3.1.3 Main Function and Potential Failure of Digital Processing Board……………………….. 3-4
3.1.4 Main Function and Potential Failure of Power Supply Module………………………….. 3-7
3.1.5 Main Function and Potential Failure of Control Panel …………………………………… 3-8
3.1.6 Main Function and Potential Failure of Computer Main Board…………………………... 3-11
3.2 Common Failure and Troubleshooting………………………………………………………….. 3-12
3.2.1 System Cannot Start Up……………………………………………………………………... 3-12
3.2.2 Lowered Image Quality………………………………………………………………………. 3-14
3.2.3 Abnormal Image………………………………………………………………………………. 3-14
3.2.4 Failure Analysis on Monitor………………………………………………………………….. 3-16
3.2.5 Other Common Failures and Troubleshooting…………………………………………….. 3-20
4. Software Maintenance....…….……………………………………………………….……. 4-1
4.1 System Update...…….……………………………………………………………………………. 4-1
II
4.1.1 Update System Online.………………………………………………………………………. 4-1
4.1.2 Update System from USB disk……………………………………………………………… 4-3
4.1.3 Network Setup.……………………………………………………………………………….. 4-3
4.2 Software and System Recovery.…….…………………………………………………………… 4-4
4.2.1 Software Recovery..…….……………………………………………………………………. 4-4
4.2.2 System Recovery and Backup..…….………………………………………………………. 4-5
4.3 Creation of USB Startup Disk and Batch File.…….…………………………………………… 4-17
4.3.1 Creation of USB Startup Disk………………………………………………………………... 4-17
4.3.2 Create Batch File ( AUTOEXEC.BAT)……………………………………………………… 4-20
4.4 Troubleshooting...…….…………………………………………………………………………… 4-21
4.5 Collect Information...…….………………………………………………………………………... 4-26
III
System Composition & Technical Specifications
Chapter 1
System Composition & Technical Specifications
1.1 System Composition
The system as shown below consists of a main unit, an operation panel, probes and
peripheral devices. The main unit includes Probe Interface Board, Order and Amplification
Board, Digital Processing Board, Control Platform, Monitor and Power Supply.
Main Unit
Ultrasound Monitor
Receive/Transmit
Probe 1
Order Front-end
and Image Data
Probe Digital USB Port
Ampli- Control
Interface Processing Platform
fication Board Control
Probe 2 Board Network Port
Board
Video
Output
Operation
Power Panel
Fig. 1-1 Block Diagram of System Composition
1.2 Technical Specifications
For detailed system specifications, please refer to the system operation manual.
1-1
System Working Principle
Chapter 2
2.1 Brief Introduction of Working Principle
The fundamental working principle of the main unit is as follows:
The Probe Interface Board receives transmit excitation signals from the Digital Processing
Board and generates transmit high-voltage pulse through high-voltage drive circuit. The
high-voltage pulse then is sent to the working elements of the probe to generate
ultrasound through the Probe Interface Board. The echo from the ultrasound during
propagation in human body is received by the same group of working elements and
converted into feeble echo electric signals, which will be sent to the Order and
Amplification Board through pre-amplification. There are two probe connectors available
on the Probe Interface Board, to which two probes can be connected at the same time.
The T/R control FPGA on the Digital Processing Board yields transmit excitation signals of
the current transmission based on control signals. This group of signals is then sent to the
Probe Interface Board. The pre-amplified echo signals from the Probe Interface Board is
ordered, and sent to the Digital Processing Board after two-step TGC amplification.
The echo signals are converted into digital signals via ADC by the Digital Processing
Board, and further into digital image signals after a series of processing, including beam
focusing, aperture control, dynamic apodization and beam forming, dynamic filtering,
dynamic range conversion, demodulation, persistence processing and scan conversion
and sent to the Ultrasound Control Platform through the Digital Processing Board.
The Digital Processing Board on one hand transmits the digital image signals to the
Control Platform, on the other hand receives control information from the Control Platform
2-1
and generates corresponding control data to achieve control of the front end.
The Control Platform is the management center of the whole system control, which
receives operation commands from the control panel to manage the whole system control
in accordance with the current system state. The other functions the Control Platform
fulfills also include measurement and calculation, interface display and video processing,
management of patient data and images, control of storage, printing and communication.
The wiring diagram of the whole system is shown below:
24cm
Monito
r tube
23
22
CH5
CH4
12 Monito CH8
r boar
d
CH6
20
14 4
13 XS1 Key XS8 Adjus
board tin g plate
XS3 XS2
XS2
17
d
XS4
ar
bo
XS1 21
e
ob
pr
3
6
XS18
5
XS8
XS
XS
ar ol l
XS
bo ntr tria
d
ar
co d u s
bo
d
4
ar
In
g
PR
XS
15 10
in
bo
digital Hard di
ify
board sk
e
pl
19
ul
Am
XS
od
m
er
3
w
XS
11
Po
16
7
XS11
XS10 8
XS12 4P p o
wer
XS9 ATX po
20P p wer
ower
Rear pa
nel
6
2
1 5
3
18
1— Internal AC Wire 7— PS/2 and Start-up Wire 13— +12V Fan Wire 19— ±5V, ±12V, HVC Power Wire
2— Extended Network Card Wire 8— COM2 Wire 14— +5V, +12V Power Wire 20— Contrast & Brightness Adjust Control Wire
3— Extended USB Wire 9— Print Control Wire 15— ±60V Power Wire 21— Contrast & Brightness Adjust DIsplay Wire
4— Extended VGA Wire 10— Front-end Data Wire 16— Hard Disk Data Wire 22— Deflecting Coil Connecting Wire
5— Power Indicator Wire 11— Hard-disk Data Wire 17— Keyboard Data Wire 23— Monitor Tube High-voltage Wire
6— Video Print Wire 12— +15, +30V Power Wire 18— External AC Power Wire
Fig. 2-1 Wiring Diagram for Whole System
2-2
2.2 Introduction of PCB
2.2.1 Control Panel
2.2.1.1 Functional Description
The Control Panel as shown below in Fig. 2-2 consists of a keyboard (KB), a silicon-gel
membrane of the keyboard, a keyboard interface board (KBIF) and a trackball.
Trackball
Industrial
ADC0809
Control Board
8 Gain control
potentiometers Single chip
Micro-
ADC0809
Computer
Control
logic
Encoder 1 Decoder 1
Additional Serial
Encoder n Decoder n FEP Board
logic Interface
circuit
Key Array Scanning

Toggle Switch Logic
FPGA
Operation Panel Main Unit
Fig. 2-2 Diagram of Control Panel
The keyboard mainly includes a printed circuit board (PCB) key array. Two key contact
points that are directly formed by exposed copper with gold plating on the printed circuit,
and an LED on each key for backlight. The keyboard button silicon gel membrane covers
on the keyboard. When the key on the silicon gel membrane is pressed, the conductive
silicon under the keys will connect the two contact points on the PCB to complete the key
operation for other circuit inspection.
The Keyboard Interface Board is the primary connection of control knobs, TGC adjust
potentiometers, and the required control circuit for the control panel. The primary task of
the Keyboard Interface Board is to monitor all the actions on the receiving panel, converts
them into established protocols and sends them to the main unit. Meanwhile, it receives
various control signals from the main unit and controls the related circuits on the Keyboard
2-3
Interface Board.
The displacement signals directly outputted from the trackball are PS/2 protocol signals,
which will be combined with other signals to XS4 via XS8 plug on the Keyboard Interface
Board. XS4 plug is connected to the FEP board via a 34-core cable, and XS10 plug on the
FEP board is connected to the PS/2 port on the Industrial Control Board via another cable.
There are several control knobs and subsection gain controls on the keyboard. Configure
an FPGA (XCS10XL-TQ100) as a logic interface, a single chip microcomputer (also called
micro controller unit, MCU) AT89C51-24JI as the overall control and protocol conversion,
and RS-232 as the communication interface. Use an MAX232 as switchover between TTL
level and RS-232 level.
The MCU of the keyboard controls the FPGA to output line-scanning signals, reads array
signals from P1 on the MCU to obtain key information, converts it into established
protocols and sends it to the main unit. All the line and array signals on the Interface Board
are connected to the keyboard via XS1.
All the interfaces are connected to the FEP board through XS4 on the Interface Board,
and XS4 also provides the power supply for the keyboard board. The power input is +5V,
and the measuring point is +5V. All kinds of signals are connected to the corresponding
ports on computer main board via the FEP board.
Because the working voltage of FPGA is +3.3V, the voltage converting circuit is configured
to convert the voltage from +5V to +3.3V required by the FPGA. The converting
component adopted is MIC39100.
The control knobs are placed on the keyboard panel. Using encoder OAK-700, 5 pairs of
orthogonal signals outputted from 5 encoders are connected to the FPGA for decoding.
The encoder actions are converted into enumerated data by using the FPGA built-in
decoder as an interface. The enumerated results are read in by the MCU, converted into
established protocols and sent to the main unit via the serial interface.
The subsection gain controls use sliding potentiometers, which are installed on the
2-4
interface board directly. The sliding end voltages of the 8 potentiometers are connected to
ADC0809 and converted into digital signals. Then the signals are read in by the MCU and
converted into established protocols and sent to the main unit via the serial interface.
2.2.1.2 Introduction of ADC0809
ADC0809 is an 8-bit A/D converter with an 8-channel analog switch, which has a universal
microprocessor interface. The 8-channel analog switch selects any channel of input and
connects to the converter via a 3-bit address decoder. The time needed for each A/D
conversion is about 100us. FPGA generates control signals to control ADC0809 to convert
the voltage input of the 8-channel TGC alternatively and saves the decoded results in the
FPGA temporarily, which will be read in for comparison by the MCU if required.
On the other hand, various control orders are sent as per the established protocols to the
keyboard via the serial port, light control and button sound for example. The light control is
placed on the keyboard panel, with the control signals (high for off, low for on) from the
71st pin of the FPGA sent to the voltage regulation circuit to control the output voltage of
LM1084IS-ADJ, which will be transmitted to the LED on the keyboard panel via XS1 to
control on/off of the backlight; The buzzer is placed on the Keyboard Interface Board. The
level signal from the 9th pin of the FPGA after being driven by D11 (74F14) controls the
buzzer.
The pin encapsulation drawing of the major components is displayed below:
2-5
LM1084IS-ADJ
AT89C51
ADC0809CN
Fig. 2-3 Pin Encapsulation of major Components
2.2.2 Digital Processing Board
The primary functions of the Digital Processing Board (DPB) include transmitting and
receiving controls, A/D conversion, digital beam forming, dynamic filtering, tissue imaging
processing, digital scan conversion, system control, PCI bus interface and also circuit for
voltage transform. The DPB receives multi-channel analog ultrasound echo signals from
the front-end processing module, goes through A/D conversion, and forms a channel of
digital signals through digital beam-forming in combination with control signals from the
Control Interface Module. After signal processing such as dynamic filtering and tissue
imaging, these signals then will be sent to the DSC part and converted into corresponding
display frame shape. Finally, the image will be sent to the Control Interface Module frame
2-6
by frame. The Control Interface Module is a bridge between the Computer Module and the
Ultrasound Part. For the computer module at the upper level, it receives all kinds of data
from computer software via PCI bus, decomposes and distributes them to modules and
simultaneously yields control signals per requirements to control working of the whole
Ultrasound Part; for the Ultrasound Part at the lower level, it receives full frame image
signals from the DSC module and sends the image signals to the Computer Module via
PCI bus.
Based on Y_SYNC signals from the system control module and a series of parameters,
the T/R Control Module will configure the states of high voltage switch and folding matrix
switch at the front end according to related parameters when Y_SYNC is at low level.
When Y_SYNC signals turn high from low level, multi-channel transmit pulses are
outputted from FPGA and converted into high-voltage pulse excitation probe via the
high-voltage exciting circuit on the Probe Interface Board, thus to achieve an ultrasound
transmission. The ultrasonic signals reflected from tissues are amplified through the
pre-amplifier on the Probe Interface Board, and transmitted through two-level time gain
compensation amplification circuit on the Amplification Board, and the output echo signals
after symmetric folding are sent to the Digital Processing Board.
Having been sent to the Digital Processing Board, the multi-channel analog echo signals
are converted into multi-channel digital signals via A/D conversion, and sent to the
Beam-forming Module. As per relevant control parameters, the multi-channel digital
signals are delayed and added by the Beam-forming Module to achieve focusing function
of ultrasound receiving.
One essential problem of ultrasound diagnosis is that the relationship between
parenchyma (soft tissue) ultrasound attenuation and frequency is approximately in
linearity. Because the probes used for the system are broad-brand, center frequency of
transmit excitation signals will shift down as ultrasonic pulse transmits deeper. In order to
improve image quality, the near field receives high-frequency echoes only to improve
resolution, while the far field only receives low-frequency echoes to improve S/N ratio. A
time-variable band-pass filter is required, thus a Dynamic Filter Module is configured to
2-7
achieve this function.
The data going through dynamic filtering are sent to the Tissue Imaging Processing
Module, the functions of which are to optimize ultrasound images. The functions, including
dynamic range conversion, logarithm compression, gray scale mapping, smoothness
enhancement and lateral filtering, significantly improve ultrasound image display quality,
which are conducive to better clinical diagnosis. There is an additional transmit voltage
control signal D/A output on the Dynamic Filter Module. The Dynamic Filter receives 8-bit
control information from the system Control Module and outputs it to the D/A part, sends to
the Power Module to control the transmit voltage outputted from the Power Module.
Meanwhile, Time Gain Compensation curve is sent out from the same module. After D/A
conversion and buffering, it is sent to the Amplification Board to control the corresponding
time gain compensation circuit.
Having been processed by the Tissue Imaging Processing Module, the ultrasonic signals
are sent to the Digital Scan Conversion Module in the form of scanning lines. The Digital
Scan Conversion Module coverts the image signals in line form to images in the same
geometric shape of the actual ultrasound scanning range (e.g. sector image of the convex
probe, rectangular image of the linear probe), as per the current probe and other control
parameters. At the same time, the image will be processed with interpolation when
required. Finally, an image is acquired for display.
The system Control Module receives image signals from the Digital Scan Conversion
Module and buffers them before sending them to the PCI Interface Module frame by frame
at an appropriate time. Meanwhile, the system Control Module receives and processes
the control parameters from the PCI Interface Module and yields the overall control
signals for ultrasound scanning and distributes some of the parameters to the modules
that need these parameters.
The PCI Interface Module is an important bridge in the whole ultrasound system. It via the
communicates with the computer via the PCI bus and acquires all kinds of settings and
control commands from the computer system; at the same time it reads in various state
2-8
information from the Digital Processing Board and sends them to the computer via the PCI
bus. The most important task of it is to receive image signals from the system Control
Module and send them to the computer via the PCI cable, and to obtain a real-time
ultrasound image in the computer. The ultrasound image will be displayed on the screen
after being processed in the computer application.
The power supply changeover circuit transforms the inputted +5V voltage on the Power
Module into +3.3V and +2.5V for low-voltage parts like FPGA or SRAM on circuit boards.
The power changeover adopted is TPS76833QPWP and TPS76825QPWP manufactured
by TI. The schematic is shown below.
Fig. 2-4 Schematic of Power Supply Changeover Circuit
Indicators for the major power supplies on the circuit boards are for indicating whether the
voltages are proper or not. If any of the indicators is off, please use a multimeter to
measure the corresponding measured points to verify if the voltage meets the rated
values.
2-9
104
104
104
C157
104
C87
104
C142
C158
C159
R5 103
104
C52
104
C56
104
C160
104
104
104 103 R8 R451
104
R69
C131
472
103
C132 C234 R231
104
202
C145
C84
C29
104
104 202
C161
C28
R68
R22
C233
R232 202 C78
156/25V
104
C80
104 202
C53
C236 104
104
C128 R27
104
C26
104
104
C51 C235 104
C162
C144
104
C136 104
C48
101
104
104
104
C55
104
104
C126
R67
R21 511
681 R463 331
C241
104
104 C243
C129
472 R10 104 681 R464 R31
C79
R35 472 R51 681 C127 R241 104
202 472 R9 681
104
681 R131 156/25V
C141 104
C147
R34 472 R52 681 104 C134 C27 104 681 R465
202 R242 472
R474
472 472
R32
R33 R30
681 R132 C471 222 C473
R48 472 C379 C33 C49 R25
681 681 104 C245 681
R133 156/25V 104
104 104 C36 156/25V
152
101
104 C244
R472
R471
C383
R53 156/25V
104
C138 104 104 202 104
C54 101 R75 C242 R473
C137 C149 104 152
Component composition:
202
C472
470
156/25V
152
152
101
222 C483
C232
R76
R72
R70
470 470
681 104
R47 472 104
C381
152
R477 R487
R475 C481
C140 152 104 156/25V
C382
R482
R481
104
R71
156/25V 102
104 104 C151 R74 C231
R485
152 R73
R78
C146
C380 R77
102 104 102 R484
104
104 C35 220uH 156/25V
C34 104 C12
104
C86 C491
101 104 C482

152 152 R483
C85
104 104 104 C493
L1 C92
104
103
C143
472
R83
The layout of major components:
104 C47
R6
220uH 156/25V
C64
C501
104 104 C503
L2 C94
C58 104
104
104
C125
104
C11
C88
104
C62 220uH 156/25V
C511
104
C60
L3 C95
C10
104 104 C513
472 R12 R411 681
104 C124
104
C44
104
R412 681 220uH 156/25V
104
472 R11
C521
C121
104 C46
472 R40
104
681
L4 C96
104 104 C523
C122
C15 104 R413
parts, SRAM part, resistors and capacitors.
R29 681 R161

220uH 156/25V
104
104
R7 103
C150 C152
C531
472 681 R162
R28 472 C69 104
L5 C97
104 104 C533
104
C89
R46 472 681 R163
C45 104
2-10
220uH 156/25V
C63
C541
C61 104
C68 C66
104
L6 C98
104 104 C543
C37
104
104 104
C14 104
R44 472
C13 104
681 R223 220uH 156/25V
104
C551
104
R19 472
R1 470
R2 470
R3 470
R4 470
R66 470
R65 470
681 R222
104
C114
R20 472
C67
681 R221 104 104 C553
L7 C99
C59
104 C139
C57
R18 472 R421 681
104
R79 R17 472 R422 681 220uH 156/25V
C561
512 R43 472
104
104
C30
C110
681
104
104 512 104 104 C563
C115 R85 104 R423
C18 220uH 156/25V
C38
C571
C116 104 104 C573
104
Fig. 2-5 FEP Welding Surface

104
104
C65
C50
220uH 156/25V
156/25V
C73
C581
104
C154
104 C39 C70 104 104 C583
104 104
104
220 R89
C17
C16 104
C72 220uH 156/25V

C591
104
104 C43
C153
104 104 C593
104 C130 R431 681
104 C120 R16 472
C71 104
R15 472 R432 681 220uH 156/25V

C601
R42 472
C25 681 104 104 C603
L8 C100 L9 C101 L10 C102 L11 C104 L12 C105
104 C133 104 R433

C117 104 R84 000
104
104
C40
C42
201 R101 104 C119 R49 R36
201 R102 R64 000 000 000
104 C135 R37
000
R80 R63 000 000 000 R38
104 C103 R50
R62 000 R54 000 000
R26 472 C118 681 R211 R61 000 R55 000 000
R24 472 104 681 R212 R60 000 R56 000 R39
104 C82
R45 472 681 R213 104 C148 R57 000
201 R91
104
C155
R58 000
201 R92 104
C81
156/25V
R59 000
104 C93 C41
C4
R81 201 104 C91 104 C163

R82 201
156/25V
C83 104 104 C164
C111 156/25V
C6
C8
104
201 R87
156/25V
331 R88
The components on the Digital Processing Board mainly include power supply
changeover, A/D converter part, FPGA part and its configured FLASH ROM, signal drive
156/25V
C5
104 C90 473/500V X 3

C3
C2
C1
104
104
104
201
331
201
331
C7
156/25V
156/25V
156/25V
C112
R121
R122
C123
R111
R112
C113
C9 C21
1A 5 10 15 20 25A 1A 5 10 15 20 25A WW17-215 X 6
V11
V10
V12
V8
V9
V7
DHB-RB100-S13NN DHB-RB100-S13NN
D1 5 10 15 20 D25 D1 5 10 15 20 D25
XS4 XS5
U72 U71 U70 U69

XS3 XS2
D25 20 15 10 5 D1 D25 20 15 10 5 D1 74LVC245A 74LVC245A
74LVC245A 74LVC245A
74LVC245A
U67
25A 20 15 10 5 1A 25A 20 15 10 5 1A
U46
GND
74LVC245A
AD712JR AD712JR
U48
U47
U66
101 R601
104 C604
104 C602
101 R591
104 C594
104 C592
101 R581
104 C584
104 C582
101 R571
104 C574
104 C572
101 R561
104 C564
104 C562
101 R551
104 C554
104 C552
101 R541
104 C544
104 C542
101 R531
104 C534
104 C532
104 C522
101 R511
104 C514
104 C512
101 R501
104 C504
104 C502
101 R491
104 C494
104 C492
101 R521
104 C524
74LVC245A
XC2S200-5PQ208
U65
NS-1*2
XS6
AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057
U60 U59 U58 U57 U56 U55 U54 U53 U52 U51 U50 U49
U41
U43 U42 GND
NS-1*2
XS11
XS13
1
C32
1
XS8
2
U68
XS12
104
NF3 473
1 XCF02S
XC2S200-5PQ208 XC2S200-5PQ208 XC2S200-5PQ208
C23
104
473
AT27C1024-70JI
NF4 AT27C020-70JI
JS-1001-14
JS-1001-11
C22
104
LH-34R
NF5 NF1 NF2
473 D45
D40
1
473 U34 U36 U35 U81 U33 U31 U73 1
XCF02S XCF02S XCF02S IDT74FCT3807 XCF02S XCF02S 74LVC245A
473 V13 GND
11 14
HZ5C1
C31 104 1
WW17-215 X 6
U25 IS63LV1024L-12H IS63LV1024L-12H DAC0800LCM DAC0800LCM
U18 U17 U20 U19 U75 LIGHT1 U27 U26
1 50.0000MHz U24 U23
74LVC245A 74LVC245A 74LVC245A LIGHT2
V4
JS-1001-10
BH-10S
33
34
74LVC245A 74LVC245A V3 U13
V2
NS-1*2
XS15
V1
GND IS63LV1024L-12H
AD712JR
XS9 U21 U16 U2
U15
IS61LV12816L
10 XC2S200-5PQ208
XS10
U28
XS14
6
NS-1*2
DAC0800LCM
U11 U3
IS63LV1024L-12H
JS-1001-6
GND
XS18
LM1084
U14
XCF02S
U5
XS16
NS-1*2
IS61LV12816L
U30
U12 U22
1
GND
U29
LM1084
IS63LV1024L-12H
U76 U32 U6
74LVC245A XCF02S XCF02S XC2S200-5PQ208
U1
A1 A49 A61
RJB60DCHN-S578
U4 U8 U9 U10
B2 B48 B62
74LVC245A 74LVC245A
LM1084 LM1084 LM1084 LM1084 XS1 U74 U7
XS7
1 JS-1001-6 6
Fig. 2-6 FEP Component Surface
2-11
Fig. 2-7 Silk-Screen Diagram of FEP (1174E) Board
Sockets and Connection:
The Digital Processing Board (DPB) also works as the connection bridge for the whole
system. The Probe Interface Board is connected to the DPB via sockets XS4 and XS5;
The Order and Amplification Board is connected to the DPB via sockets XS2 and XS3; the
Industrial Control Board of the Computer Module is connected to PCI socket on the DPB
via PCI socket XS1; The Keyboard Board is connected to the DPB via a 34-core socket
XS8; the power from the system Power Module is inputted to the DPB via sockets XS11
and XS12 before it is distributed to other ultrasonic circuits. Some of the signals from the
keyboard send keyboard information to the Industrial Control Board via sockets XS9 and
XS10 on the DPB as well at the same time.
2-12
For the specific sockets, other circuit boards or modules, please refer to Fig. 2-1.
2.2.3 Order and Amplification Board
2.2.3.1 General
The Order and Amplification Board consists of the impedance transform circuit 3904, the
order folding matrix switch circuit MT8816 or CD22M3494, the two-step TGC amplification
circuit AD602, the drive and amplitude control circuit AD817 and the control signal
interface circuit SN74LVC245. The diagram for the Order and Amplification Board is
shown below in Fig. 2-8. After the echo signals are sent from the Pre-amplification Circuit
on the Probe Interface Board and before the signals enter the Folding Circuit, the emitter
made up of primary 3904 audion follows the circuit, in order to enhance loading capacity
of the Pre-amplification Circuit output, which also serves for impedance transform.
Resettle
Impedance -ment
Preamp AD602 ADC
Transform Echos and
Echos Array Echos Driver RF Echos
Folded
Output
3904 Circuit
TGC AD817 Output
Audion
Amplifier Array
Array MT8816
Array
Control signals
Fig. 2-8 Circuit Diagram of Order and Amplification Board
The power voltages on the Order and Amplification Board are ±5 and ±12V. The
voltages of MT8816 or CD22M3494 and AD602 are ±5V. The voltages of 3904 and
AD817 are ±12V. The voltage of the Bus Interface Circuit SN74LC245 is +5V.
The channel parallel echo signals on the Probe Interface Board, after being pre-amplified
are ordered, with channel symmetry superposed and amplified, are finally sent to the
Digital Processing Board for A/D and following processing.
2.2.3.2 Order and Folding Circuit
The circuit adopted by the Order and Folding Circuit is CD22M3494E-MQ or MT8816
manufactured by INTERSIL, the chip of which has 16×8＝128 analog switches. Its
2-13
appearance is shown below in Fig. 2-9. The chip has 44 pins, which is very convenient for
connection. It can be connected with 16 inputs and 8 outputs, or 8 inputs and 16 inputs.
The input and output pins are controlled separately. AX0~3 control pins X0~15, and
AY0~2 control pins Y0~Y7. The DATA pin can be disconnected against access. When
DATA is “0”, the addressed switch is disconnected. When DATA is “1”, the addressed
switch is connected. The RESET signal can reset all the switches. When RESET is high,
all the switches are disconnected.
Fig. 2-9 Outside Drawing of CD22M3494E-MQ
2-14
Fig.2-10 Sequence Chart of CD22M3494E-MQ
The configured sequence chart of CD22M3494E-MQ or MT8816 chip is shown above in
Fig. 2-10.
And the truth tables are showed below in Table 2-1.
2-15
Table 2-1 Truth Table of CD22M3494E-MQ or MT8816
As the central element for each transmission varies with the difference in each line, the
task of order and folding is to link echoes of the Amplification Circuit corresponding to the
current transmitted central elements to the channel center, to link the echoes of the
Amplification Circuit corresponding to echoes of the current transmitted edge elements to
the edge channel, and the rest may be deduced by analogy. The channels not to be
compounded are linked to pin XX12, which is linked to 0.1uF capacitance to ground.
Finally, the output signals from CD22M3494E-MQ or MT8816 chip are the channel echo
signals going through channel symmetric superposition and ordering.
2.2.3.3 Two-step TGC Amplification Circuit
The output signals of the echo signals from the folding circuit are pre-amplified by the
two-step TGC Amplification Circuit composed of AD602 part array.
The internal block diagram of one channel of AD602 is shown below in Fig. 2-11.
2-16
Fig. 2-11 Internal Block Diagram of AD602
Table2-2 Pin Definition of AD602
2-17
The pin definition of AD602 is shown above in Table 2-2.
a) Main features of AD602:
z Each AD602 has two independent channels, namely two amplifiers;
z The gain dB value of each channel is in direct proportion to the control voltage;
z Low input noise 1.4nV/ Hz ;
z High bandwidth, with -3dB bandwidth at DC~35MHz;
z Each channel consists of a precise passive input attenuator and a fixed gain
amplifier (31dB);
z The input attenuator is controlled by control voltage (CHI-CLO), the control
sensitivity is: 31.25mV/dB;
z Power consumption of each channel is 125mW;
z Gain control range of each channel is: -10dB~+30dB.
b) Calculation equation ofAD602 gain control:
Gain (dB)=32Vg+10
Vg (V)=CHI-CLO
Range of Vg: -625mv ~ +625mv
If: CHI1=0V~1.35V
CHI2= 0.312V~1.35V
When CLO is about 0.625V, the gain that first-step AD602 acquires is about
–10dB~+31.07dB, and the gain that the second-step AD602 acquires is about
0~+31.07dB. The second control voltage works only if the gain in the first stage runs out.
Including pre-amplification, in theory the maximum gain of the entire channel can reach
82.14dB, and the gain variable range is -10dB~62.14dB. Due to the resistance between
steps, the gain may decrease several dB.
2-18
After processed by the folding circuit and the two-step TGC, the RF echoes are driven by
high speed operational amplifier comprised by AD817, the output echo range is limited
below 1.2 V p − p to meet requirements of the latter analog parts.
2.2.3.4 Input Power Supply
a) +5VA:
+5V analog power supply for AD602, interface circuit and CD22M3494E-MQ or MT8816
b) –5VA:
–5VA analog power supply for AD602 and CD22M3494E-MQ or MT8816
c) ±12V: For AD817 chip circuit.
2.2.4 Probe Interface Board
2.2.4.1 Introduction of the Probe Interface Board (PIB)
The Probe Interface Board provides connectors between the transducers and the main
unit. Two probe connectors are available on the PIB of CTS-7700. Each connector has a
corresponding high-voltage switch, which is HV232 or like products from Hitachi. Each
PIB has a SIUI912x2 pre-amplification and high-voltage pulse drive thick- film circuit.
There are several power voltages on the PIB:+5, ±12V, high-voltage switch power over
±60V and +HV. +5V voltage is used for logical configuration of high voltage switch, ±
12V for SIUI912x2 T/R circuit, +HV for transmit high voltage, the value of which is variable
between 0V~60V and above. The main unit provide excitation high-voltage pulse to
piezoelectric crystal array of the probe via the high-voltage switch array on the PIB,
pre-amplifies the ultrasound from the probe, and sends it to the Order and Amplification
Board. Another function of the high-voltage switch is selection of the current working
probe.
The top-level connection block diagram of the PIB is follows:
2-19
156Pin High Voltage

Drive and
Connector Array A DIND0-3 DIN0-3
Echo A SN74LVC245
Probe A HV232
PROBE1
Preamp and ECHO

156Pin High Voltage HV Drive and Echo
Drive and HV generator
Connector Array B
Echo B SIUI912X2
Probe B HV232 HV Drive
Array
Two
PROBE2 100
Pin
PROBE1-2 PRS1-2
Sockets
PIDSEL1-2 SN74LVC245 PIDS1-2
PID0-7
SN74LVC245 PIDSEL2
DC Power DC Power
DC Power
Output Input
PIDSEL1 Filter
SN74LVC245
Fig.2-12 Schematic of Probe Interface Board
2.2.4.2 High-Voltage Switch Circuit
The high-voltage switch adopted for CTS-7700 is HV232 manufactured by Supertex or the
same chip type with the same encapsulation manufactured by Hitachi. Each probe
connector is linked to a high-voltage switch and independent to its corresponding
high-voltage switch array.
Each high-voltage switch has 8 channels, which are connected to 8 elements, with the
8-channel outputs merged in parallel into 2-channel outputs
The configured sequence diagram of HV232 high-voltage switch is shown below:
2-20
Fig. 2-13 Configured Sequence Diagram of HV232 High-voltage Switch
Each high-voltage switch has 48 pins. Definitions for the pins are as follows:
a) Ultrasonic Signal Pin:
Pins 1, 3, 5, 8, 10, 12,14, 16, 18, 20, 22, 39, 41, 43, 45, 47 are signal pins
connected to element SWx.
b) Parameter Setup Pin:
Pin 33 is parameter input pin Din.
Pin 37 is parameter output pin Dout.
c) Power Connection Pin:
Pin 24 is connected to over +60V.
Pin 25 is connected to over -60V.
Pin 29 is connected to +5V.
Pins 27 and 28 are grounded.
2-21
d) Control Signal Pin:
Pin 36 is connected to chip selection signal CLR. When connecting this pin to “0” is
selected, Pin36 of the high-voltage switches corresponding to each probe are
connected together as a select signal for the working probe.
Pin 35 is a logical input enabled port/LE. When “1” is connected, parameter setup
this chip for is allowed.
Pin 34 is a logical input clock. The control data series shifts 1 bit whenever a clock
comes.
e) Void Pin:
Pins 2, 4, 6, 7, 9, 11, 13, 15, 17, 19, 21, 23, 26, 30, 31, 32, 38, 40, 42, 44, 46, 48
are void, which are suspended.
The internal logical circuit of HV232 is shown below in Fig. 2-14:
Fig. 2-14 Internal Logic Circuit of HV232
2-22
The working process of high-voltage switches:
The parameter setup pins of each group of high-voltage switches are in serial connection.
DOUT of the first high-voltage switch is linked to DIN of the second high-voltage switch.
The working state of the high-voltage switches should be preset for the preset period of
each line transmission. When the corresponding data of this channel is “1”, the input of
this channel is connected to output. When the corresponding data of this channel is “0”,
this channel is disconnected with output.
The maximum clock setup of high-voltage switch is 5MHz, namely 200ns. The
high-voltage switch control data is 4 bits, namely D0~D3. DIN of the first high-voltage
switch in each group is linked to one of these bits. For example: D0 is linked to DIN of the
first high-voltage switch in the first group, D1 to DIN of the first high-voltage switch in the
second group, D2 to DIN of the first high-voltage switch in the third group, and D3 to DIN
of the first high-voltage switch in the fourth group. The parameters are outputted from the
DIN of Pin 16 of the first high-voltage switch in each group, and DOUT of Pin 20 serial
shifted to DIN of the next switch. The rest may be deduced by analogy. All the current
work state setups are completed via 32 shift clocks. What shall be closed are closed,
and what shall be ducted are ducted.
The truth table of HV232 is shown below in Table 2-3.
Table 2-3 Truth Table of HV232
2-23
2.2.4.3 Transmit Drive and Echo Pre-amplification
In the CTS-7700, the yield of transmit drive high-voltage pulse and the echo
pre-amplification are processed in the SIUI912x2 array. A piece of MOS field-effect tube in
each transmit circuit serves as a switch, with one end connected to transmit high voltage
and the drive pulse of which is 0~12V. This tube is ducted as drive pulse comes, and
forms high-voltage pulse, which will connect to probe elements via high-voltage switch.
The ultrasound received is also from the same path. The echo will have about 20dB
amplification in the pre-amplification Circuit SIUI912x2. Then the echo signals are sent to
the subsequent TGC Amplification Circuit for amplification.
2.2.4.4 Interface Circuit of the Probe Interface Board (PIB)
The Interface Circuit on the PIB consists of two pieces of SN74LVC245. U18 is for driving
probe select signals PRS1~2 and probe code select signals PIDS1~2. The driven
PROBE1~2 are linked respectively to Pin 36 of two groups of high-voltage switches as
selection signals of the working probe, and the driven PIDSEL1~2 is linked respectively to
Pin19 of U19 and U20 as the probe code gating circuit for the two probes. When any of
the signals of PIDSEL1~2 is at low level, the probe code of SN74LVC245 is sent to the
bus, otherwise the output of it is at high resistance. U17 is for driving high-voltage switch
data DIND0~DIND3, clock STROBEP and enabling signal LED.
Description of input and output signals on the PIB: There are two 100-pin sockets on the
PIB linking to 2 corresponding sockets on the Digital Board.
Description of input power
a) VCC:
+5V analog power to Pin29 on high-voltage switch;
b) ±12V:
To Pin7 and Pin8 on SIUI912x2 respectively;
c) Above ±60V:
2-24
To Pin24 and P25 on high-voltage switch respectively;
d) +HV:
Variable input high voltage, varying from above 0V~60V, linked to Pin2 of SIUI912X2 for
generating transmit high-voltage pulse.
2.3 Interconnection Signal List Between PCBs
2.3.1 Probe Interface Board
Table 2-4 Interconnection Signal List for Probe Interface Board XS4
Probe Interface Board XS4 (XS4)

Pin Signal Pin Signal Pin Signal Pin Signal
A25 GND B25 GND C25 GND D25 GND
A23 +5VA B23 +5VA C23 +5VA D23 +5VA
A22 +5VA B22 +5VA C22 +5VA D22 +5VA
A19 -12V B19 -12V C19 -12V D19 -12V
A18 -12V B18 -12V C18 -12V D18 -12V
A15 +12V B15 +12V C15 +12V D15 +12V
A14 +12V B14 +12V C14 +12V D14 +12V
A12 -NV B12 -NV C12 -NV D12 -NV
A11 -60V B11 -60V C11 -60V D11 -60V
A10 -NV B10 -NV C10 -NV D10 -NV
A8 +PV B8 +PV C8 +PV D8 +PV
A7 +60V B7 +60V C7 +60V D7 +60V
A2 +HV B2 +HV C2 +HV D2 +HV
A1 +HV B1 +HV C1 +HV D1 +HV
2-25
Table 2-5 Interconnection Signal List for Probe Interface Board XS5
Probe Interface Board XS5 (XS5)

A25 GND B25 PID0 C25 GND D25 PID1
A21 GND B21 STROBEP C21 GND D21 LE
A20 GND B20 PRS1 C20 PRS3 D20 DIN0
A19 GND B19 PRS2 C19 PIDS3 D19 DIN1
A18 GND B18 PIDS1 C18 GND D18 DIN2
A17 GND B17 PIDS2 C17 GND D17 DIN3
A16 GND B16 DH2 C16 GND D16 DH1
2-26
2.3.2 Order and Amplification Board
Table 2-6 Interconnection Signal List for Order and Amplification Board XS2
Order and Amplification Board XS2 (XS2)

A25 GND B25 GND C25 GND D25 NC
A24 GND B24 RF8 C24 GND D24 NC
A22 GND B22 GND C22 GND D22 NC
A20 GND B20 RF7 C20 GND D20 GND
A19 NC B19 -5V C19 NC D19 -5V
A18 GND B18 RF6 C18 NC D18 -5V
A16 NC B16 +5VA C16 NC D16 +5VA
A15 GND B15 RF5 C15 NC D15 +5VA
A10 -12V B10 -12V C10 -12V D10 -12V
A9 GND B9 RF3 C9 -12V D9 -12V
A4 +12V B4 GND C4 +12V D4 +12V
A3 GND B3 RF1 C3 +12V D3 +12V
A1 TGC1 B1 GND C1 GND D1 TGC2
2-27
Table 2-7 Interconnection Signal List for Order and Amplification Board XS3
Order and Amplification Board XS3 (XS3)

25A GND B25 RF10 C25 GND D25 DCS4
18A GND B18 RF14 C18 GND D18 DAX3
10A GND B10 RF10 C10 GND D10 DAY2
5A GND B5 RF10 C5 GND D5 !TGATE
4A GND B4 GND C4 GND D4 RESSET
3A GND B3 RF9 C3 GND D3 DDATA
2A GND B2 RF9 C2 GND D2 STROBE
1A GND B1 GND C1 GND D1 STROBE
2-28
2.3.3 Industrial Control Board
Table 2-8 Interconnection Signal List for Industrial Control Board
Industrial Control Board (XS1)

Pin Signal Pin Signal
A1 +5VP 1B NC
A2 NC 2B GND
A3 +5VP 3B GND
A4 +5VP 4B NC
A5 +5VP 5B +5VP
A6 INTA 6B NC
A7 NC 7B NC
A8 NC 8B NC
A9 NC 9B NC
A10 NC 10B REQ
A11 NC 11B NC
A12 GND 12B GND
A13 GND 13B GND
A14 GNT 14B NC
A15 RST 15B GND
A16 NC 16B CLK
A17 NC 17B GND
A18 GND 18B NC
A19 NC 19B NC
A20 AD30 20B AD31
A21 NC 21B AD29
A22 AD28 22B GND
A23 AD26 23B AD27
A24 GND 24B AD25
A25 AD24 25B NC
A26 NC 26B C_BE3
A27 NC 27B AD23
A28 AD22 28B GND
A29 AD20 29B AD21
A30 GND 30B AD19
A31 AD18 31B NC
A32 AD16 32B AD17
A33 NC 33B C_BE2
A34 FRAME 34B GND
A35 GND 35B IRDY
A36 TRDY 36B NC
A37 GND 37B DEVSEL
2-29
Industrial Control Board (XS1)

A38 STOP 38B GND
A39 NC 39B NC
A40 NC 40B PERR
A41 NC 41B NC
A42 GND 42B SERR
A43 PAR 43B NC
A44 AD15 44B C_BE1
A45 NC 45B AD14
A46 AD13 46B GND
A47 AD11 47B AD12
A48 GND 48B AD10
A49 AD9 49B GND
A50 NC 50B NC
A51 NC 51B NC
A52 C_BE0 52B AD8
A53 NC 53B AD7
A54 AD6 54B NC
A55 AD4 55B AD5
A56 GND 56B AD3
A57 AD2 57B GND
A58 AD0 58B AD1
A59 NC 59B NC
A60 NC 60B NC
A61 NC 61B NC
A62 NC 62B NC
2.4 Connection Diagram Between PCBs
For the connection diagram between PCBs, please refer to Fig. 2-1. The Industrial Control
Board diagram is shown below in Fig. 2-15:
2-30
From main board
XS10
VGA wire
To print control plug
CH8
3
XS3 of the rear panel
2 7
4 To monitor CH8
From rear panel
Color
patch 3 S-start-up wire
8
wire
To main board
Color patch wire VGA1
KM1
LAN1
USB2
COM2
1
FP1
80-cores hard disk wire
Color patch wire
IDE1 11 To hard disk
4P-ATX
ATXPWR
6
J2
XS7
To video plug XS7
of the rear panel
Wire from ATX power
2 Network card wire 7 PS/2 and start-up wire

3 USB wire 8 COM2 wire
4 VGA wire 11 Hard disk data wire
6 Video print wire
Fig. 2-15 Connection Diagram for Industrial Control Board
2.5 Disassemble Instruction
2.5.1 General
2.5.1.1 This instruction covers disassembly of the system only. On how to assemble the
system, please follow the reverse procedures of disassembly.
2.5.1.2 The expression and meaning of all the screws involved in this instruction are
shown in the following examples:
Example 1: countersunk head screws, spec M3, metric length 6 mm, expressed as:
countersunk head screws M3X6.
2-31
Example 2: screws assemblies, spec M4, expressed as: screws assemblies M4.
2.5.1.3 All the screws for disassembling are Phillips screws, so the operator of the
disassembly shall use corresponding Philips screwdrivers. Due to the heads of Phillips
screws have two types: shallow and deep, to avoid any damage to the screws and
consequent failure of screw disassembling, please select appropriate screwdrivers for the
screws when disassembling the screws. A small slotted screwdriver may be required
when disassembling some special parts.
Note: Generally, the screws we use are M3 or under M3 pan screws, as well as
under M3 (excluding M3) cheese head screws, whose Philips head are
shallow, while the others are deep.
2.5.1.4 Before disassembly, make sure that the power cable is unplugged, and all the
probes are disconnected and laid aside properly.
2.5.1.5 When unplugging the cables from the system, please mark the corresponding
plugs and sockets to facilitate plugging the plugs into the right sockets during reassembly.
2.5.1.6 During disassembly, the exterior plastic parts and the keyboard silicon-gel
buttons demounted shall be placed upon a bubble wrap bag or a PE foam, keeping them
away from the work area as far as possible to avoid any disfigurement caused by
disassembling other structural parts.
2.5.1.7 Due to updates of system parts and consequent structure changes, there might
be some tiny differences in disassembly of systems from different lots. This instruction
may not cover all these differences.
2.5.2 Disassemble Plastic Housing
2.5.2.1 Disassemble lower cover of back housing from main unit
The lower cover shall be disassembled following the steps below:
a) Unclench the left, right rubber stoppers on the back enclosure cover with a slotted
screwdriver. Remove two M4X8 pan screws fixing the back enclosure cover, and
2-32
then remove the back enclosure cover.
Note: The left and right rubber stoppers are not symmetric. Please be
cautious to distinguish the left and the right ones for the sake of
reassembling them properly.
b) Turn the main unit 180 degrees to show its bottom up.
Note 1: Before turning over the main unit, lay a pad such as bubble wrap bag
or PE foam on worktable to avoid any damage to the plastic housing.
Note 2: For the upper cover of back housing of main unit, the side with no
probe connectors is vulnerable to pressure. Please pay special
attention when tuning the main unit over.
c) Remove six M4X8 pan screws fixing the lower cover of the back housing, and then
remove the lower cover of back housing.
d) After removing the lower cover of back housing, remove the front, left and right
cover for ventilation openings, and clean the dust off the dustproof nets.
2.5.2.2 Disassemble upper cover of back housing from main unit
After completing the operation in Section 3.2.1 (disassemble lower cover of back housing
from main unit), the upper cover of back housing shall be disassembled following the
steps below:
a) Turn the main unit 180 degrees to show its top up.
b) Remove two M4X6 pan screws on both sides of the upper cover of handle, and
remove the upper cover of handle;
c) Remove two M4X16 pan screws fixing the handle, and the reinforcing plate and the
lower cover of handle.
d) Unclench the left, right rubber stoppers at the back of the upper cover of back
housing with a slotted screwdriver. Remove two M4X8 pan screws and the back
enclosure cover.
2-33
Note: The left and right rubber stoppers are not symmetric. Please be cautious to
distinguish the left and the right ones for the sake of reassembling them
properly.
2.5.3 Disassemble Keyboard
2.5.3.1 Disassemble keyboard form main unit
The disassembly of the keyboard from the main unit shall follow the steps below:
a) Unfold the keyboard by pressing the buttons at the top of the front frame and lay it
down horizontally. Unclench the two rubber stoppers at the top of the keyboard
upper housing with a slotted screwdriver, and remove two M3X12 cheese head
screws.
b) Turn the keyboard 45 degrees proximately. Hold on the projection of the lower
cover of the keyboard tightly. Press upon the left and right edge of the upper cover
of keyboard with two thumbs, and draw the lower cover of keyboard toward the
operator to displace it from the upper cover of keyboard. And then unclench the
fixing buckles on the left and the right with a slotted screwdriver to remove the
lower cover of the keyboard.
c) Turn the keyboard vertically. Remove three M3X10 screw assemblies at the bottom
left, then withdraw the left turning shaft.
d) Unplug all the flat cables connecting to the main unit, withdraw the left side of the
keyboard slightly, remove the right turning shaft from the right supporting fixture of
keyboard, and then remove the keyboard.
2.5.3.2 Disassemble parts from the keyboard
After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),
the parts of the keyboard shall be disassembled following the steps below:
a) Unplug the cable of the trackball. Remove two M3X8 screw assemblies fixing the
trackball to remove the trackball.
2-34
b) Remove five knobs and eight slides on the keyboard with a slotted screwdriver, and
seven M3×20 screw assemblies of the KBIF board at the back of the keyboard.
Then remove the KBIF board.
Note: Please be cautious not to scratch the knobs or the keyboard surface
when unclenching the keyboard knobs. After the KBIF board is
removed, keep the seven braces of the KBIF board in place for
reassembly.
c) Having finished steps a) & b), remove all M3×6 screw assemblies on the KB board
at the back of the keyboard to remove the KB board.
Note: During disassembling the KB board, when splitting the positioning
nails at the back of the silicon-gel buttons embedded in the KB board,
special attention shall be paid to avoid breaking the positioning gel
nails.
d) Having removed the KB board, withdraw the silicon-gel buttons through the holes
on the plastic housing carefully.
Note: To prevent any scratch, the silicon-gel surface of the keyboard shall be
placed with the buttons upward.
2.5.4 Disassemble Rear Panel
2.5.4.1 Disassemble rear panel from main unit
After completing the operation in Section 2.5.2 (disassemble plastic housing), the rear
panel shall be disassembled following the steps below:
a) Remove six M3X6 screw assemblies in the right, left and upper parts.
b) Unplug all the cables connecting the real panel with the main unit, then
disassemble the real panel.
2.5.4.2 Disassemble platelets of the rear panel
After completing the operation in Section 2.5.4.1 (disassemble rear panel from main unit),
2-35
all the platelets on the real panel shall be disassembled following the steps below:
a) Unplug the plug connecting the Fan Patch Board. Remove two M3×6 screw
assemblies and then remove the Fan Patch Board;
b) Unplug the plug connecting the Net Port Board. Remove two M3×6 screw
assemblies and then the Net Port Board;
c) Unplug the plug connected to the USB board. Remove four M3X6 screw
assemblies, and then take out USB board.
d) Unplug the plug connected the LED board. Remove M3X6 screw assembly, and
then take out LED board.
e) Unplug the plug connecting the Print Control Interface Board. Remove two M3X6
screw assemblies and then remove the Print Control Interface Board.
2.5.5 Disassemble Industrial Control Board
2.5.5.1 Solution 1:
After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),
follow the steps below to disassemble the Industrial Control Board:
a) Unplug all plugs on the top of the Industrial Control Board connecting to other
components;
b) Remove four M3×6 screw assemblies fixing the Industrial Control Board shield
enclosure, then remove the shield enclosure.
c) Unplug all plugs connecting to the Industrial Control Board.
d) To withdraw the Industrial Control Board from the slot, remove two M3×6 screw
assemblies fixing both corners of the Industrial Control Board.
2.5.5.2 Solution 2:
After completing the operation in Section 2.5.2 (Disassemble plastic housing), follow the
steps below to disassemble the Industrial Control Board:
2-36
a) Unplug all plugs on the top of the Industrial Control Board connecting to other
components;
b) Remove four M3×6 screw assemblies fixing the Industrial Control Board shield
enclosure, then remove the shield enclosure.
c) Unplug all plugs connecting to the Industrial Control Board.
d) To withdraw the Industrial Control Board from the slot, remove two M3×6 screw
assemblies fixing both corners of the Industrial Control Board.
2.5.6 Disassemble PR Board and RVA Board
follow the steps below to disassemble the PR Board and the RVA Board:
a) Remove two M2.5×6 screw assemblies and three M3×8 screw assemblies fixing
the lower housing of the installation sleeve, then remove the lower housing of the
installation sleeve;
b) Remove eight M3X6 screw assemblies fixing the probe press board, and then
remove the probe press board.;
c) Remove the linking wires between the PR Board and the RVA Board, and withdraw
the RVA Board along the sliding guides from the FEP board;
d) Remove six M3×6 screw assemblies fixing the probe cover board to take out the
probe cover board;
e) Having finished step d), withdraw the PR Board along the sliding guide from the
FEP board;
Note 1: Given that the printed board cannot be removed easily due to tight
binding, the screws fixing the back of the shield plate shall be loosened
appropriately.
Note 2: Having removed four M2.5X6 countersunk head screws on the earth
board, the earth board can be removed from the PR Board.
2-37
2.5.7 Disassemble Power Supply and Hard Disk
2.5.7.1 Disassemble hard disk
follow the steps below to disassemble the hard disk:
a) Unplug all the plugs connecting to the hard disk;
b) Remove two M3×6 screw assemblies fixing the Hard Disk Fixture to withdraw the
hard disk together with the fixture;
c) To remove the IDE interface board, remove two M3×6 screw assemblies;
d) Remove four M3×8 screw assemblies on both sides to take out the hard disk from
the fixture.
2.5.7.2 Disassemble power supply module from main unit
follow the steps below to disassemble the power supply:
a) Unplug all the plugs connecting to the power supply module and the plugs
connecting to the FEP Board;
b) Remove two M3×6 screw assemblies through the gap at the top of the Monitor
Board Fixture, and two M3×6 screw assemblies on the left of the frame through two
holes on the Industrial Control Board shield enclosure. Withdraw the power supply
module from the main unit.
Note: If it is too tight between the power supply module and the frame, loosen four
screw assemblies fixing the monitor back supporting board, then to withdraw
the power supply module from the frame.
2.5.7.3 Disassemble ATX power supply
After completing the operation in Section 2.5.7.2 (Disassemble power supply from main
unit), follow the steps below to disassemble the ATX power supply:
2-38
a) Unplug all the plugs connecting the ATX power supply with the PW board;
b) Follow the process in Section 2.5.7.1(Disassemble hard disk) to withdraw the hard
disk together with the fixture from the hard disk box.
c) Remove three M3×6 screw assemblies to disassemble the fan and the fan fixture;
d) Remove four M3×6 screw assemblies and two M3×6 countersunk head screws of
the hard disk box to disassemble the ATX power supply cover;
e) Remove four M3×6 screw assemblies to withdraw the ATX power supply.
2.5.7.4 Disassemble PW board
After completing the operation in Section 2.5.7.2 (Disassemble power supply module from
main unit), follow the steps below to disassemble the PW board:
a) Remove eight M3×6 screw assemblies at the front and the back to disassemble the
power supply frame cover board and the hard disk box;
b) Remove four M3×6 screw assemblies and a M3×6 pan head screw on the right
side, then withdraw the PW board.
2.5.8 Disassemble MONIT Board
2.5.8.1 Disassemble front frame
2.5.8.1.1 Disassemble color filter
The color filter shall be disassembled as the following:
Unfold the keyboard and then level it. Toggle up the right and left buckles locking the top
of the color filter on the front frame, when the buckles are in place, the top of the color filter
will be ejected automatically with the bounce of the post at the top of the color filter. Then
draw out the whole color filter from the top.
Note: The operator shall wear gloves during the whole disassembly process. Dust
or fingerprint on the surface of the color filter, if any, could be wiped off with
lens cleaning paper. Attention shall be paid to prevent any scratch upon the
color filter.
2-39
2.5.8.1.2 Disassemble front frame from main unit
After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),
the front frame shall be disassembled following the steps below:
a) Remove six M3X10 screw assemblies fixing the front frame on the left and right
sides.
b) Draw out the front frame a little bit, and unplug the cables connecting the back of
the front frame with the contrast platelet. Then remove the whole front frame.
Note: Attention shall be paid to prevent any scratch upon the color filter after
disassembly of the front frame.
2.5.8.1.3 Disassemble contrast adjust platelet
After completing the operation in Section 2.5.8.1.2 (disassemble front frame from main
unit), remove three M3X8 screw assemblies to take out the contrast adjust platelet.
Note: After disassembling the contrast adjust platelet, take out four adjust knobs
and polyester plates, then place them aside properly for reassembly.
2.5.8.2 Disassemble MONIT board and monitor tube
2.5.8.2.1 Disassemble MONIT board
After completing the operation in Section 2.5.6 (disassemble PR Probe Board and RVA
Board), the MONIT board shall be disassembled following the steps below:
a) Remove four M3×6 screw assemblies, then remove the probe shield board on the
right side of the main unit.
b) Remove two M3×6 screw assemblies and two M3×6 countersunk head screws,
then remove the front board of the probe shied board.
c) Unclench the anode cap of the monitor tube carefully.
d) Remove four M4X8 screw assemblies and then rear arm of the handle.
e) Remove two M3X6 screw assemblies and turn the MONIT board to the vertical
2-40
position.
f) Remove a M4X8 screw assembly on the front arm of the MONIT board to loosen
the earth cable.
g) Take out the mounting plate at the tail of monitor tube.
h) Unplug all the plugs connecting the MONIT board.
i) Draw out the tail of the rotation-supporting axis at the fixture tail of the monitor
board from the slot of the back supporting plate, then draw out the whole MONIT
board fixture backward.
j) Remove four M3X6 screw assemblies and then take out the MONIT board.
2.5.8.2.2 Disassemble monitor tube
After completing the operation in Section 2.5.8.2.1(Disassemble MONIT board), follow the
steps below to disassemble the Video Tube:
a) Remove four M4×8 screw assemblies on the top to disassemble the front
supporting piece of the handle.
b) Hold on the bottom of the monitor tube, remove six M4×8 screw assemblies on the
left and the right to withdraw the monitor tube together with the fixing structure
forward slowly.
Note: When drawing out the monitor tube, attention shall be paid to prevent
any collision with the tail of the tube. After the monitor tube is drawn
out, it shall be placed upon spacer such as bubble wrap bag with the
surface of the tube downward to avoid any scratch upon the surface of
the tube.
c) Remove four M4×8 screw assemblies and the fixing structure. Then remove the
monitor tube.
2-41
2.5.9 Disassemble FEP Board
2.5.5 (Disassemble Industrial Control Board) and 2.5.6 (Disassemble PR Board and RVA
Board), follow the steps below to disassemble the FEP board:
a) Unplug all the plugs linking to the FEP board;
b) Remove two screw assemblies and six countersunk head screws fixing the frame
and the base to separate the frame from the base;
c) Remove twelve M3×6 screw assemblies to take out the FEP board.
2.5.10 Assemble Schematic of Main Unit
The assemble schematics of the main unit of the main unit are shown in Fig. 2-16 and Fig.
2-17, which can be used as an auxiliary reference chart for disassemble and assemble
process.
2-42
Fig. 2-16 Assemble Schematic of CTS-7700 Main Unit (1)
(Please refer to Table 2-9 for the corresponding numbers and descriptions)
2-43
Fig. 2-17 Assemble Schematic of CTS-7700 Main Unit (2)
(Please refer to Table 2-9 for the corresponding numbers and descriptions)
2-44
Table 2-9 Checklist for numbers and descriptions of main unit assembly
No. Description Quantity

1 Monitor tube 1
2 Spacer 2
3 Supporting fixture of keyboard shaft (left) 1
4 Supporting fixture of keyboard shaft (right) 1
5 Supporting fixture of keyboard shaft (front) 1
6 Supporting fixture of keyboard shaft (back) 1

7 Base 1
8 Industrial control board shield enclosure 1
9 Industrial control board 1
10 Handle arm (rear) 1
11 Display board joint (rear) 1
12 Display board joint (front) 1
13 Base plate for display board 1
14 Ground board 1
15 Fixing bracket of monitor 1
16 Probe board cover plate 1
17 Shield board (front) 1
18 Shield board (middle) 1
19 Shield board (back) 1
20 Shield board press board 1
21 PR board 1
22 RVA board 1
23 Hard disk fixture 1
24 Locating pin bracket 2
25 Plank 1
26 Hard disk 1
27 IDE patch panel 1
28 PW board 1
29 ATX power supply 1
30 Fan rack 1
31 Soleplate of power supply rack 1
32 Cover plate of power supply rack 1
33 Cover plate of ATX power supply 1
34 Hard disk mounting deck 1
35 Rear panel 1
36 Hard disk fixture 1
37 Fan 1
2-45
Table 2-9 (Continued)

38 Fan cover 1
39 Power socket 1
40 Fan socket strips 1
41 LED board 1
42 USB board 1
43 Net port board 1
44 Print control port board 1
45 Switch 1
46 Fuse holder 2
47 Video output 1
48 Ground pole 1
49 MONIT board 1
50 Panel fixture (left) 1
51 Panel fixture (right) 1
52 Frame 1
53 Handle fixture (front) 1
54 KB board 1
55 KBIF board 1
56 Trackball 1
57 Reversal seating (left) 1
58 Reversal seating (right) 1
59 Slider 8
60 Keyboard knob 5
61 Keyboard silicon-gel button panel 1
62 Keyboard panel stopper 2
63 Keyboard sleeve 7
64 Keyboard housing (upper) 1
65 Keyboard housing (lower) 1
66 Color filter 1
67 Dustproof net 1
68 Dustproof net 2
69 Front frame 1
70 Cover for ventilation opening (left) 1
71 Cover for ventilation opening (right) 1
72 Cover for ventilation opening (front) 1
73 Button 2 4
74 Button 1 1
75 Hook 1
76 Hook fixing press board 1
77 Polyester spacer 1
78 Contrast adjust board 1
2-46
Table 2-9 (Continued)

79 Pin (fixed) 1
80 Pin (removable) 1
81 FEP board 1
82 Reinforcing plate of handle 1
83 Upper cover of handle 1
84 Lower cover of handle 1
85 Upper cover of back housing 1
86 Lower cover of back housing 1
87 Back enclosure cover 1
88 Lower housing of sleeve 1
89 Stopper of back housing (right) 1
90 Stopper of back housing (left) 1
91 Stopper of back enclosure cover (right) 1
92 Stopper of back enclosure cover (left) 1
93 Amplification board fan cover 1
94 Fan 1
95 Fan 1
96 Fan fixture 4
97 Torsion spring 1
98 Dual probe sleeve 1
99 Hard disk mounting deck cover board 1
100 Fan brace 4
2-47
2.6 Installation Instruction for Computer Main Board (Industrial
Control Board)
2.6.1 Appearance of Computer Main Board
Unit: mm
Fig. 2-18 Appearance of Computer Main Board
2.6.2 Interface Position Map
Fig. 2-19 Interface Position Map
2-48
2.6.3 Installation of System Memory
2.6.3.1 Please pay attention to the following when installing memory bank:
a) To install the memory bank, match the gap of DIMM memory bank and DIMM Slot,
then press down DIMM memory bank in place.
b) The 184Pin SO-DIMM memory module adopted for the Computer Main Board
(Industrial Control Board) shall be compliant with DDR 266/DDR333 specifications,
with the maximum capacity up to 1GMB.
2.6.4 USB Port
USB1 provides two standard USB ports, and USB2 is a set of 2×5 Pin USB device pin.
USB2 needs a conversion cable to connect the USB port signal to a standard USB port.
The pin definitions of USB ports are shown in Table 2-10 and Table 2-11:
Table 2-10 Pin Definition of USB1 Port
USB1 Signal
1 +5V
2 USB Data-
3 USB Data+
4 GND
Table 2-11 Pin Definition of USB2 Port
1 +5V 2 +5V
3 USB Data- 4 USB Data-
5 USB Data+ 6 USB Data+
7 GND 8 GND
9 VOID 10 GND
2-49
2.6.5 IDE Port
This single-chip computer provides a set of 40-pin IDE port. Please be noted for the
following when installing IDE devices:
a) Two IDE devices can be connected to the IDE port: one is a Master, and the other a
Slave. Connection method: the Master shall be connected to the end of the cable,
and the Slave to the middle of the cable.
b) When connecting to Ultra100 or Ultra66 hard disk, It is recommended to use a
80-line special flat cable (The pin on the IDE cable marked in red is first pin).
See Table 2-12 for the pin definitions.
Table 2-12 Pin Definition of IDE Port

1 Reset IDE 2 Ground
3 Data7 4 Data8
5 Data6 6 Data9
7 Data5 8 Data10
9 Data4 10 Data11
11 Data3 12 Data12
13 Data2 14 Data13
15 Data1 16 Data14
17 Data0 18 Data15
19 Ground 20 Key
21 DRQ0 22 Ground
23 IOW 24 Ground
25 IOR 26 Ground
27 IOCHRDY 28 Host ALE
29 DACK0 30 Ground
31 IRQ14 32 No connect
33 Address 1 34 No connect
35 Address 0 36 Address 2
37 Chip select 0 38 Chip select 1
39 Activity 40 Ground
2-50
2.6.6 Floppy Disk Port
The CPU card provides a set of 34-pin floppy drive port, which can be connected to at
most two 3.5-inch or 5.25-inch floppy disk drives. Please pay attention to the orientation of
the cables and the sockets during connection (The pin on the floppy drive cable marked in
red is first pin). See Table 2-13 and Table 2-14 for pin definition of the ports COM1, COM2,
COM3 and COM4.
Table 2-13 Pin Definition of Port COM1
Pin Signal
1 DCD, Data Carrier Detection
2 RXD, Receive Data
3 TXD, Transmit Data
4 DTR, Data Terminal Ready
5 GND, Ground
6 DSR, Data Set Ready
7 RTS, Request To Send
8 CTS, Clear To Send
9 RI, Ring Indicator
Table 2-14 Pin Definition of Port COM2/ COM3/COM4
Pin Signal
1 DCD, Data Carrier Detection
2 RXD, Receive Data
3 TXD, Transmit Data
4 DTR, Data Terminal Ready
5 GND, Ground
6 DSR, Data Set Ready
7 RTS, Request To Send
8 CTS, Clear To Send
9 RI, Ring Indicator
10 Not used
2-51
2.6.7 Display Port
A 15-core model D VGA monitor socket can be connected to any monitor with standard
VGA port.
Table 2-15 Pin Definition of Display Port

1 Red 2 Green
3 Blue 4 Pull up to +5V
5 GND 6 GND
7 GND 8 GND
9 +5V 10 GND
11 Pull up to +5v 12 DDCDATA
13 HSYNC 14 VSYNC
15 DDCCLK
2.6.8 Network Port
LAN1 is a 10/100Mbps Ethernet port on the Main Board. LILED and ACTLED are the
green and the yellow LEDs on both sides of the Ethernet port, which indicates LAN activity
and transmitting status. Please refer to the following status description of each LED:
Fig. 2-20 Network Port
TD+,TD-：Positive/Negative Transmitting Data Signal
RD+,RD-：Positive/Negative Receiving Data Signal
ACTLED：Network Activity Indicator
LILED：Network Link Indicator
LILED
On: Network line available
(Green Light) Off: Network line not available
Indication State
2-52
ACTLED
On: Transmitting or Receiving Data
（Yellow Light） Off: No Data being transmitted or received
Indication State
2.6.9 Keyboard and Mouse Port
KM1 is a 6-pin mini DIN socket for the keyboard and the mouse, which can be connected
to a PS/2 keyboard directly. A 1 to 2 PS/2 keyboard mouse cable configured with the
single-chip computer is required for connecting the keyboard and the mouse at the same
time.
Table 2-16 Pin Definition of KM1
Pin Signal
1 Keyboard data
2 Mouse data
3 GND
4 +5V
5 Keyboard clock
6 Mouse clock
2.6.10 Power Supply Port
Note:
a) To avoid any damage to the CPU card, please use the 12V (4P to 2xP standard
port) power switchover cable (attached with the CPU card) to connect the PW2
(+12V power outlet) on the CPU card with the 4P power cable of the power supply,
or connect the special power cable on P4 power supply with PW2, so as to ensure
sufficient power supply to the CPU card.
b) Before using the ATX power supply, unplug AC power (100/200V), then plug the
ATX power supply plug into the ATX power supply socket tightly. Connect other
2-53
related accessories properly before connecting AC power (110/220V) to the AC
power socket.
1) ATX Power Supply Port
Table 2-17 Pin Definition of ATX Power Supply
1 +3.3V 11 +3.3V
2 +3.3V 12 -12V
3 GND 13 GND
4 +5V 14 PS-ON (power
switch control)
5 GND 15 GND
6 +5V 16 GND
7 GND 17 GND
8 Power Good 18 -5V
9 +5V SB (backup +5V) 19 +5V
10 +12V 20 +5V
2) +12V Power Supply Port
Table 2-18 Pin Definition of +12V Power Supply Port
Pin Signal
1 GND
2 GND
3 +12V
4 +12V
2-54
2.6.11 Fan Port
The CPU card provides two sets of standard fan sockets [FAN1 (CPU fan), FAN2
(Housing fan)]. Please pay attention to the following 3 points when using the fan sockets:
a) The current for the fan shall be less than 350mA (4.2W, 12V).
b) Ensure that the connection of the fan matches the fan socket. The power wire
(normally in red) is in the middle, and the others are ground wire (normally in black)
and fan rotation speed output pulse signal wire (in other color). Some fans do not
have rotation speed detection, but this wire has an output as high as 12V, which
might damage the CPU card, and this is not a standard connection wire. It is
recommended to use a fan with rotation speed detection.
c) The direction of the fan air current shall be adjusted to exhaust heat from the
cabinet.
Table 2-19 Pin Definition of Fan Port
Pin Signal
1 GND
2 +12V
3 Rotation speed pulse
2.6.12 Status Indication Port
Pin definition of FP1 is shown below:
Table 2-20 Pin Definition of FP1
1 Power Button 2 VCC5SB
3 GND 4 RESET
5 IDELED 6 IDELED1
2-55
Pin Signal
1 Speaker out
2 NC
3 GND
4 +5V
Pin Signal
1 Power LED+
2 NC
3 GND
2.6.13 TV Output Port
a) J2:TV-OUT Port is shown below:
Table 2-23 Pin Definition of J2: TV-OUT Port
Pin Signal
1 GND
2 TVCVB
b) CN1: S-VIDEO Port is shown below:
Table 2-24 Pin Definition of CN1: S-VIDEO Port
Pin Signal
1 Chroma signal C
2 GND
3 Brightness signal Y
2-56
Troubleshooting
Chapter 3
Troubleshooting
3.1 PCB Function and Potential Failure
As shown in Fig. 1-1 Block Diagram of System Composition, the system consists of 8
modules. In practice, it consists of 9 PCBs. They are: 1) Probe Interface Board (PBSW
Board); 2) Order and Amplification Board (RVA Board); 3) Digital Processing Board (FEP
Board); 4) Power Supply Module (ATX power supply); 5) Power Module (DC-DC power
supply); 6) Control Panel (KB Board); 7) Control Panel (KBIF Board); 8) Computer Main
Board (Industrial Control Board); and 9) Monitor Board. Here is a detailed introduction to
the main functions and potential failures of the PCBs.
3.1.1 Main Function and Potential Failure of Probe Interface Board (PBSW Board)
The main functions of the Probe Interface Board include probe interface, probe switching,
T/R pre-amplification circuit, and T/R element select.
If any failure occurs on this PCB, the following (but not limited to the following) failures
may be found:
a) The probe cannot be switched; the screen prompts no probe, or cannot identify the
probe, or probe code identification error;
b) One or more black strip(s) in the ultrasound image;
c) One or more white strip(s) in the ultrasound image;
d) Multiple echo signals are displayed when using a coin to inspect (one echo signal
only in normal situation).
3-1
Troubleshooting
Fig. 3-1 Silk Screen Diagram of Probe Interface Board
3.1.2 Main Function and Potential Failure of Order and Amplification Board (RVA
Board)
The main functions of the Order and Amplification Board include: order folding circuit and
its control, two-section TGC amplification circuit.
may be found:
a) Many black strip(s) in the ultrasound image;
b) Many white strip(s) in the ultrasound image;
c) Black strip(s) in the echo signal when using a coin to inspect (no black strip in
normal echo signals).
3-2
C94 R101
C237 C238 R269
R52 C305 C96 R314
C269 C15
R196
104 C17 C28 473 100 C201 C202 R290 C203 C204
181
511 R34 C25
R102
R53 181 102 226/16 226/16 226/16 226/16 R106 C99
U36
U35
511 R33 R212 C241 C239
C29 473 102 0R0 R180
473
152
R263
100 102 104 102 104 C33 C134
C27
R100 R51 R35
104 C16 R103 C273
R105
R197
100
R55 C306 103 101 101 473 332 101 101 473 181 R54
R213
C270
SN74LVC245APW
SN74LVC245APW
C35 473 100
181
104 104 152 104 104 681
473
104
101
181
C11 104
102
510
103
102
510
R56 181 102
C274
R107
R228 103 102 102 103 C98 R104 102 R36
C7
681
C37 473 102 0R0 R181
C13
104 104 473 201 104 104 473
R108
101
C93 R99 C26

R59 C307 C97 C95 0R0 473 C32 C135 C100 C31
R229
C36 473 100 C205 C206 R179 C207 C208
C14
R112 C138
181
R118 C139
R113
R60 181 102 226/16 226/16 C243 C240 226/16 226/16
R214 C141 R215 C244 C242
C8 473
104
C42 473 102 0R0 R182 C276 C142
C12 104
R111
R198
100 102 104 100 102 104 C277
R117
R199
R115 C34 C40

R61 C308 103 101 101 473 103 101 101 473 181 R58 R1 681
C278
R57
C41 473 100 C20 103 R2 681
101 104 104 181 101 104 104 681
181
102
510
102
510
C279 R231
R62 181 102 103 R3 681
R114
R230 103 102 681 103 102 R38
GND
C136 R109
C44 473 102 0R0 R183 R4 681
C137 R110
R37 C271
104 104 473 104 104 473 C24
473
C5
R116 R5 681
C9 104 R76 C313 C143 C133 C39 C144 C140 C43 473 R6 681
156/25V C63 473 100 C209 C210 R141 C166 C211 C212 R146 C171 R7 681
181
C254 C253 C256 C255
R142
R77 181 102 226/16 226/16 C168 226/16 226/16 C173
Q12
R8 681
Q11
U12
AD602JR AD602JR R220 C289 R221 C291
2
R140
R204
1
C64 473 102 0R0 R188
U27
U28
156/25V
R145
R205
XS3
R9 681
C124 C123
AD817AR 100 102 104 C62 100 102 104 C66
3904
3904
R143 R75
R79 C314 103 101 101 473 181 103 101 101 473 181 R10 681
C290
R78
C68 473 100 R11 681
156/25V 101 104 104 681 101 104 104 681 R44
DHB-PA100-R13NN
C10 104
C122
181
102
510
102
510
C292 R237
R80 181 102 R12 681
473
C6
R43
R147
22uH 22uH 22uH 22uH R236 103 102 103 102
L22
L23
L24
U11
L21
C170 R144
C165 R139
C69 473 102 0R0 R189 R13 681

156/25V 104 104 473 104 104 473
AD817AR R148 R14 681
R83 C315 C169 C167 C61 C174 C172 C65
R15 681
S3
C72 473 100 C272 C21 103
C213 C214 R152 C177 C215 C216 R158 C178
156/25V R16 681
181
C259 C257 C260 C258 103
R153
R84 181 102 226/16 226/16 226/16 C182

R222 226/16 C181 R223
U10
C294
Q10
Q9
C74 473 102 0R0 R190 C293
R157
R207
R151
R206
AD602JR AD602JR 100 102 104 100 102 104 C30
U25
U26
156/25V C67 C71
R155
1
AD817AR 473
3904
3904
R85 C316 103 101 101 473 181 103 101 101 473 181 R82
BH-34R
R81
C73 473 100
MT8816AP
101 104 104 681 101 104 104 681
181
156/25V
102
510
102
510
C296 R239
R86 181 102

C295 R154
R238 103 102 R45 103 102 R46

C175 R149
U9
C176 R150
22uH 22uH 22uH 22uH C76 473 102 0R0 R191
L20
L17
L18
L19
104 104 473 104 104 473 R17 681
156/25V R156
XS1
AD817AR R64 C309 C183 C179 C70 C184 C180 C75 R18 681
C47 473 100 C217 C218 C219 C220 R19 681
R121 C146
3-3
R126 C151
181
R122
156/25V R65 181 102 226/16 226/16 C246 C245 226/16 226/16 C248 C247 R20 681
R216 C148 R217 C153
C48 473 102 0R0 R184 C281 C283 R21 681
U8
R120
R200
GND
R125
R201
Q7
Q8
100 102 104 C46 100 102 104 C50
156/25V AD602JR AD602JR R123 R22 681
U23
U24
AD817AR R67 C310 103 101 101 473 103 101 101 473 181 R66 C22 103
R63
3904
3904
R23 681
S2
C52 473 100 103
101 104 104 181 101 104 104 681
181
R24 681
102
510
102
510
C284 R233
181 102
XS2
R68 R232 R40 C275
C282 R127
156/25V
2
103 102 681 103 102
XS4
C150 R124
C53 473 102 0R0 C38

R185 R39
C145 R119
U7
22uH 22uH 22uH 22uH 104 104 473 104 104 473 473
L13
L14
L15
L16
R128
1
156/25V R71 C311 C149 C147 C45 C154 C152 C49
AD817AR
C56 473 100 C221 C222 C223 C224 R138 C158
R132 C157
MT8816AP
C252 C250
181
C251 C249
R133
R72 181 102 226/16 226/16 226/16 226/16 C162

156/25V R218 C161 C286
R219
C121 C120 C119 C118 C117 C116 C115 C114 C113 C112
R137
R203
C58 473 102 0R0 R186 C285

R131
R202
476/16V
C2
100 102 104 C51 100 102 104
U6
C55
Q5
Q6
R135
AD602JR AD602JR R73 C312 103 101 101 473 103 101 101 473
U22
156/25V
U21
R69
AD817AR C57 473 100
3904
3904
101 104 104 181 101 104 104 181 R70
-5V
181
223Q
102
510
102
510
C288 R235
R74 181 102 R234

C287 R134
103 102 681 103 102 681 R42

156/25V
C156 R130
C60 473 102 0R0 R187

C155 R129
104 104 473 R41 104 104 473
Z2 Z1
U5
22uH 22uH 22uH 22uH R136
BH-34R
L10
L12
L11
C163 C159 C54 C164 C160 C59
GND
223Q 156/25V
L9
C111 C110 C109

AD817AR
VCC
S1
Fig. 3-2 RVA Board Welding Surface
476/16V 156/25V
C1
Fig. 3-3 Component Side of RVA Board

U4
Q3
Q4
1
AD602JR AD602JR
Z3
156/25V
U20
U19
C108 C107
AD817AR
3904
3904
223Q
MT8816AP
-12V
DHB-PA100-R13NN
156/25V
VCLO
476/16V
C4
U3
L6
L7
L8
22uH 22uH 22uH 22uH
156/25V
L5
C106 C105
AD817AR L44 L46
L45
Z4
223Q 156/25V
102K
102K
102K
U2
Q2
156/25V AD602JR AD602JR C18 103 103 C19
U17
U18
C104 C103
476/16V AD817AR
3904
Q1
3904
+12V
C3
156/25V
C102
U1
102K
102K
102K
22uH 22uH 22uH 22uH
156/25V
AD817AR
C101
L1 L2 L42 L41 L43 L3 L4
Troubleshooting
Troubleshooting
Fig. 3-4 Silk Screen Diagram of RVA
3.1.3 Main Function and Potential Failure of Digital Processing Board (FEP Board)
The main functions of the Digital Processing Board include: A/D conversion, digital beam
forming, dynamic filtering, tissue imaging processing, digital scan conversion (DSC),
transmit pulse generation, probe switch control, and T/R element select control.
may be found:
a) No ultrasound image is displayed;
b) The ultrasound image is mal-positioned, or only half of the image is displayed;
c) Black strip in the echo signal when using a coin to inspect (no black strip in normal
3-4
104
104
104
C157
104
C87
104
C142
C158
C159
R5 103
104
C52
104
C56
104
C160
104
104
104 103 R8 R451
104
R69
C131
472
103
C132 C234 R231
104
202
C145
C84
C29
104
104 202
C161
C28
R68
R22
C233
R232 202 C78
156/25V
104
C80
104 202
C53
C236 104
104
C128 R27
104
C26
104
104
C51 C235 104
C162
C144
104
C136 104
C48
101
104
104
104
C55
104
104
C126
R67
R21 511
681 R463 331
C241
104
104 C243
C129
472 R10 104 681 R464 R31
C79
R35 472 R51 681 C127 R241 104
202 472 R9 681
104
681 R131 156/25V
C141 104
C147
R34 472 R52 681 104 C134 C27 104 681 R465
202 R242 472
R474
472 472
R32
R33 R30
echo signal);
681 R132 C471 222 C473

R48 472 C379 C33 C49 R25
681 681 104 C245 681
R133 156/25V 104
104 104 C36 156/25V
152
101
104 C244
R472
R471
C383
R53 156/25V
104
C138 104 104 202
C54 104 101 R75 C242 R473
C137 C149 104 152
202
C472
470
156/25V
152
152
101
222 C483
C232
R76
R72
R70
470 470
681 104
R47 472 104
C381
152
R477 R487
R475 C481
C140 152 104 156/25V
C382
R482
R481
104
R71
156/25V 102
104 104 C151 R74 C231
R485
152 R73
R78
C146
C380 R77
102 104 102 R484
104
104 C35 220uH 156/25V
C34 104 C12
104
C86 C491
101 104 C482

152 152 R483
C85
104 104 104 C493
L1 C92
104
103
C143
472
R83
104 C47
R6
220uH 156/25V
C64
C501
104 104 C503
L2 C94
C58 104
104
104
C125
104
C11
C88
104
C62 220uH 156/25V
C511
104
C60
L3 C95
C10
104 104 C513
472 R12 R411 681
104 C124
104
C44
104
R412 681 220uH 156/25V
104
472 R11
C521
C121
104 C46
472 R40
104
681
L4 C96
104 104 C523
C122
C15 104 R413
R29 681 R161
220uH 156/25V
104
104
R7 103
C150 C152
C531
472 681 R162

R28 472 C69 104
L5 C97
104 104 C533
104
C89
R46 472 681 R163
C45 104
220uH 156/25V
C63
C541
3-5
C61 104
C68 C66
104
L6 C98
104 104 C543
C37
104
104 104
C14 104
R44 472
C13 104
681 R223 220uH 156/25V
104
104
C551
e) Many black strips in the ultrasound image.
R19 472
R1 470
R2 470
R3 470
R4 470
R66 470
R65 470
681 R222
104
C114
R20 472
C67
681 R221 104 104 C553
L7 C99
C59
104 C139
C57
R18 472 R421 681
R79 104 R422 681 220uH 156/25V
R17 472
C561
512 R43 472
104
104
C30
C110
681
104
104 512 104 104 C563
C115 R85 104 R423
C18 220uH 156/25V
C38
C571
C116 104 104 C573

104
104
104
C65
C50
220uH 156/25V
156/25V
C73
C581
d) The whole ultrasound image is too dark or too bright;
104
C154
104 C39 C70 104 104 C583
104 104
104
220 R89
C17
C16 104
C72 220uH 156/25V
Fig. 3-5 FEP Board Welding Surface

C591
104
104 C43
C153
104 104 C593

104 C130 R431 681
104 C120 R16 472
C71 104
R15 472 R432 681 220uH 156/25V

C601
R42 472
C25 681 104 104 C603
L8 C100 L9 C101 L10 C102 L11 C104 L12 C105
104 C133 104 R433

C117 104 R84 000
104
104
C40
C42
201 R101 104 C119 R49 R36
201 R102 R64 000 000 000
104 C135
000
R63 000 000 000 R37

R80
104 C103 R50 R38

R62 000 R54 000 000
R26 472 C118 681 R211 R61 000 R55 000 000
R24 472 104 681 R212 R60 000 R56 000 R39
104 C82
R45 472 681 R213 104 C148 R57 000
201 R91
104
C155
R58 000
201 R92 104
C81
156/25V
R59 000
104 C93 C41
C4
R81 201 104 C91 104 C163

R82 201
156/25V
C83 104 104 C164
C111 156/25V
C6
C8
104
201 R87
156/25V
331 R88
156/25V
C5
104 C90 473/500V X 3

C3
C2
C1
Troubleshooting
104
104
104
201
331
201
331
C7
156/25V
156/25V
156/25V
C112
R121
R122
C123
R111
R112
C113
C9 C21
Troubleshooting
1A 5 10 15 20 25A 1A 5 10 15 20 25A WW17-215 X 6
V11
V10
V12
V8
V9
V7
D1 5 10 15 20 D25 D1 5 10 15 20 D25
XS4 XS5
U72 U71 U70 U69

XS3 XS2
D25 20 15 10 5 D1 D25 20 15 10 5 D1 74LVC245A 74LVC245A
74LVC245A 74LVC245A
74LVC245A
U67
25A 20 15 10 5 1A 25A 20 15 10 5 1A
U46
GND
74LVC245A
AD712JR AD712JR
U48
U47
U66
101 R601
104 C604
104 C602
101 R591
104 C594
104 C592
101 R581
104 C584
104 C582
101 R571
104 C574
104 C572
101 R561
104 C564
104 C562
101 R551
104 C554
104 C552
101 R541
104 C544
104 C542
101 R531
104 C534
104 C532
104 C522
101 R511
104 C514
104 C512
101 R501
104 C504
104 C502
101 R491
104 C494
104 C492
101 R521
104 C524
74LVC245A
XC2S200-5PQ208
U65
NS-1*2
XS6
AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057 AD9057
U60 U59 U58 U57 U56 U55 U54 U53 U52 U51 U50 U49
U41
U43 U42 GND
NS-1*2
XS11
XS13
1
C32
1
XS8
2
U68
XS12
104
NF3 473
1 XCF02S
C23
104
473
AT27C1024-70JI
NF4 AT27C020-70JI
JS-1001-14
JS-1001-11
C22
104
LH-34R
NF5 NF1 NF2
473 D45
D40
1
473 U34 U36 U35 U81 U33 U31 U73 1
XCF02S XCF02S XCF02S IDT74FCT3807 XCF02S XCF02S 74LVC245A
473 V13 GND
11 14
HZ5C1
C31 104 1
WW17-215 X 6
U25 IS63LV1024L-12H IS63LV1024L-12H DAC0800LCM DAC0800LCM
U18 U17 U20 U19 U75 LIGHT1 U27 U26
1 50.0000MHz U24 U23
74LVC245A 74LVC245A 74LVC245A LIGHT2
V4
JS-1001-10
BH-10S
33
34
74LVC245A 74LVC245A V3 U13
V2
NS-1*2
XS15
V1
GND IS63LV1024L-12H
AD712JR
XS9 U21 U16 U2
U15
IS61LV12816L
10 XC2S200-5PQ208
XS10
U28
XS14
6
NS-1*2
DAC0800LCM
U11 U3
IS63LV1024L-12H
JS-1001-6
GND
XS18
LM1084
U14
XCF02S
U5
XS16
NS-1*2
IS61LV12816L
U30
U12 U22
1
GND
U29
LM1084
IS63LV1024L-12H
U76 U32 U6
74LVC245A XCF02S XCF02S XC2S200-5PQ208
U1
A1 A49 A61
RJB60DCHN-S578
U4 U8 U9 U10
B2 B48 B62
74LVC245A 74LVC245A
LM1084 LM1084 LM1084 LM1084 XS1 U74 U7
XS7
1 JS-1001-6 6
Fig. 3-6 Component Side of FEP Board
3-6
Troubleshooting
Fig. 3-7 Silk Screen Diagram of FEP (1174E) Board
3.1.4 Main Function and Potential Failure of Power Supply Module (ATX power
supply and DC-DC power supply)
The main function of the power supply module is: to transform AC power input into
different DC powers required by the system. The system consists of computer part and
ultrasound part, both of which have their own special requirements, so the power supply is
also divided into ATX power supply and DC-DC power supply. ATX power supply is for the
computer part, one +12V DC power from ATX power supply is for DC-DC power, and the
DC-DC power is transformed to different voltages required by the ultrasound part and
supplied to it. The main output voltages from DC-DC power are: +5VD, +5VA, -5V, +12V,
-12V, +60V, -60V, and HV (controllable high voltage).
If any failure occurs on this PCB, firstly check if voltage of each group is normal. If it is
abnormal, check if the abnormal situation comes from power output itself or from
3-7
Troubleshooting
abnormal loading. The following (but not limited to the following) failures may be found:
a) The system cannot start up (failure comes from ATX power supply);
b) The system can start up, but restart and shut off after starting up;
c) The system can start up, but no display on the screen;
d) The screen has display, but no ultrasound image;
e) Sensitivity of the ultrasound image is very low.
Fig.3-8 Silk Screen Diagram of Power Supply Board
3.1.5 Main Function and Potential Failure of Control Panel (KB Board and KBIF
Board)
The main function of the Control panel is to serve as an end-user operation interface,
providing operation objects such as keys, trackball, knobs and TGC slider. When the user
operates these objects, the control panel will detect these actions, convert them into
agreed signals and send them to the computer module for corresponding processing. On
the other hand, the backlight and the buzzer on the control panel are controlled by
3-8
Troubleshooting
software: When the software sends control commands, the control panel receives these
commands and thus controls the backlight or the buzzer.
may be found:
a) All the operations (including knobs) do not work;
b) Some of the keys do not work;
c) TGC controls do not work;
d) The trackball does not work;
e) The screen has display, but no ultrasound image.
R135
R134
R11
R15
R14
R13
R12
R10
510
510
510
510
510
510
510
510
510
510
510
510
510
510
R1
R9
R8
R7
R6
R5
R4
472
R21
R19
R18
R17
R16
R30
R29
R28
R27
R26
R25
R24
R23
R22
R20
510
510
510
510
510
510
510
510
510
510
510
510
510
510
510
R41
R31
R45
R44
R42
R39
R38
R36
R35
R33
R32
510
510
510
510
510
510
510
510
510
510
510
510 R43 510 R40 510 R37 510 R34
R51
R60
R59
R58
R57
R56
R55
R54
R53
R52
R50
R49
R48
471
471
510
510
510
510
510
510
510
510
510
510
510
510
510
R2
R3
R71
R61
R76
R75
R74
R72
R69
R68
R66
R65
R63
R62
510
510
510
510
510
510
510
510
510
510
510
510
510 R73 510 R70 510 R67 510 R64
R91
R81
R93
R92
R90
R89
R88
R87
R85
R84
R83
R82
R80
R78
R77
510
510
510
510
510
510
510
510
510
510
510
510
510
510
510
R86 510 510 R79
R136 R137 R133 R47 R46 R98 R97 R96 R95 R94
510 510 510 510 510 510 510 510 510 510
203S-3C/B-2X20P-8.5/3.0
R101
R100
510
510
XS1
510 R110
510 R99
510 R112
510 510
R103 R102
R126
R125
510
510
R127
R124
510
510
R111
510
R128
R123
510
510
510 R105
510 R114
510 R113
510 R104
R129 R122
510 R115
510 R116
510 R107
510 510
510 510
R106
510
R130 R121
R131 R120
510 R117
510 R109
510 R108
510 510
R118
R132 R119
510
510 510
Fig. 3-9 Welding Surface of KB Board
3-9
V31 V16
V77 V61 V3
V32
V78 V62
V2
V17
V94
V106 V99 V63
V33
V108 V104
V95 V79
102
102
102
102
102
102
102
102
V48
V18
V1
V109
104
104
104
104
104
104
104
104
V80 V64
104 C26
102
V34
R11
C8
C7
C6
C5
C4
C3
C2
C1
V49
V107
V19
V105 V102
V81 V65
V35
V82 V50
V96 V20
102
R21
V134
V66
V135
V97 V36
102
R27
V51
V103 V83 V21

V119 V120
V67
V122
V37
V121
V52
104
V4
C28
R9
102
V84
V22
V5
V68
V38
V123
V98
V85 V53
V23
V46
V124
V69
101
C41
102
R19
104 102 104 V39
C40 V6
R 36 V86 V54
330 104
C22
R26 C27
V7
3-10
V24
V125
V70
V87
C 37 V40
C 36 104 V55
104
104
C38
V126
V25
C 35 104 104 C 39 V71
102
V8
R10
V47 V41
C 34 104 V9
V88 V56
V26
104 C33
V133
104
C29
102
102
R30
R29
V127
V89 V72
V42
C24
V57
V128
102
104
R20
V27
V10
104 V90 V73
V11
C23
104 C31
104 C30
V43
V130
V91
V129
V58
V110
V28
Fig. 3-10 Component Side of KB Board

C 25 V132 V131
Fig. 3-11 Welding Surface of KBIF Board

V74
104 V137 V44
102
R13
R25 513 V92 V59 V12
104 C32 V75 V29
V111 V136
V13
V60
102 R28 V30
C 21 104 V93 V76 V45
V100
102
R23
V101
151 R 31 V14
V117
V15
V116 V113
V118
102
R12
C9 V115 V114 V112
C11 104
104 R 18
R16 151 510
R 24 510 151 R17
R14 102
102
R22
R15 102 104 C10
Troubleshooting
Troubleshooting
BH-34R
+3.3V RP1
+5V 2 34
KNH21473-3AA
1 33
NF1
XS4 RS30111A602N
LVC245APW 100
D11 D10 D5 D2
OBO-13240
XC17S10XLPD8C
C20
BP1 D7
N74F14D-T
1 RP2
C16
15uF/25v
+
15uF/25V
MAX232
15uF/25v
RS30111A602N
D9 D1
C19
D12 C13 12 34 15uF/25v
AT89C51-24JI
D4 D8
LM1084IS-ADJ RP3
MAX709
NS-1*2 XCS10XL-4VQ100C C17
XS5
MMBT3904
LVC245APW
C18
V1 50 15uF/25v 15uF/25v RS30111A602N
1
MIC39100
15uF/25V
126-16000
XS6 D3
B1 23 RP4
D6
C12
NS-1*2
8 ADC0809CCV 22
GND RS30111A602N
C14
15uF/25V 15uF/25V
C15
GND
(SMD) 11.0592MHz
15 RP5
RP12 RP13 RP10 RP9 RP11

DISP DEPTH MGain BGain VALUE RS30111A602N
RP6
RS30111A602N
RP7
RS30111A602N
RP8
RS30111A602N
XS8 XS3 XS1

VFUNC
JS-1001-4 1 JS-1001-6 1 201S-DL-2x20P(H=5.08)
Fig. 3-12 Component Side of KBIF Board
Fig.3-13 Silk Screen Diagram of KBIF Board
3.1.6 Main Function and Potential Failure of Computer Main Board (Industrial
Control Board)
The main functions of Computer Main Board (Industrial Control Board) include: receive,
conversion and processing of control panel signals, data transmission, image display
measurement & calculation function, storage function, etc. The computer module is the
running platform of the whole system, which is why ultrasound systems in this form being
called “PC based ultrasound system”. The generality of computer module enables easy
communication with peripheral devices like memory, monitor, printer, keyboard and
mouse. All these devices can be connected to universal ports on a computer. With control
3-11
Troubleshooting
of Windows operating system on these devices, various functions, such as image
measurement & calculation, storage and printing, are achieved conveniently. For the
wiring diagram of the Industrial Control Board, please refer to Fig.2-15.
If any failure occurs on this PCB, firstly verify if voltage of each group of power supply is
normal. If it is abnormal, check if the abnormal situation comes from power output or
loading (similar to Section 3.1.4). The following (but not limited to the following) failures
may be found:
a) The system cannot start up;
b) The system can start up, but it restart and shut off after starting up;
c) The system can start up, but has no display;
d) The system can start up and enter Windows, but cannot enter ultrasound interface
(firstly check if it is a software problem);
e) No ultrasound image is displayed;
f) Sensitivity of ultrasound image is very low.
3.2 Common Failure and Troubleshooting
Due to complexity of the system, certain failures might occur inevitably. Here is an
introduction to some troubleshooting methods and basic consideration, though they may
not cover all the problems. Whenever any failure occurs, it is important to record the
working environment, the working state and the problem of the system with failure. Then
follow the instruction in the manual to deal with the problem. If it does not work, to shoot
the problem as soon as possible, please contact SIUI service team immediately.
3.2.1 System Cannot Start Up
Generally, when such failure occurs, firstly check if the external power supply is normal,
the main power switch of the main unit is on, and the fuse in the main unit is normal. If the
power input requirement is AC220V(230V), then the input power voltage shall be AC220V
3-12
Troubleshooting
(230V)±10%; if the power input requirement is AC110V (120V), then the input power
voltage shall be AC110V (120V)±10%. Over high voltage may damage the system
(including fuse breakdown), over low voltage may not be sufficient to start up the system.
If the voltage and the fuse are in normal condition, and power supply main switch is on,
follow the steps below to do further inspection:
a) Check if the power indicator is on and the fan is working.
If the indicator is on, inspect if the sound “toot, toot” is heard after system powerup
for a while (the sound indicates that the Computer Main Board has passed
self-check and the system starts up properly). If the sound is heard, then go to the
next step for further inspection. If you cannot hear the sound, the problem may
come from the Computer Main Board (Industrial Control Board), or if you hear
continuous “toot, toot, toot…” sound, the problem may come from the memory
bank of the Computer Main Board.
b) Check if the ATX voltage is normal
If any abnormal situation occurs, please check if the problem comes from ATX itself
or loading.
When it is not loaded, measure the ATX power supply port. Connect Pin14 PS-ON
to ground short circuit, and switch on the main power. The ATX power supply starts
to work. Test the voltage of each pin on the port, as shown in Table 2-17 and 2-18.
If there is no voltage or abnormal voltage, it means the failure is in ATX power
supply.
c) Check if each group of DC-DC output is normal. When doing this, because the
input of DC-DC power is from ATX power supply, it is necessary to ensure ATX
power supply works normally and all the wires are connected properly.
If any abnormal situation occurs, please check if the problem comes from DC-DC
itself or loading.
d) If all the voltages are normal, the failure might be in the Computer Main Board
3-13
Troubleshooting
(Industrial Control Board) or the hard disk.
3.2.2 Lowered Image Quality
Because ultrasound front-end has direct relation with ultrasound image quality of the
system, if image quality is lowered, it is probably resulted from ultrasound front-end. The
situations of lowered image quality are mainly as follows:
a) Image pixel getting Coarse
The main reason that image pixel getting coarse may be degraded performance of
the amplifier on the ultrasound front-end board. When such problem occurs, it may
be RVA or FEP Board failure.
b) Image Depth decreased
Possible reasons for decreased image depth: decreased imaging channels,
abnormal transmit pulse, lowered transmitting voltage. If the image depth is
decreased, use a small metal stick (small screw driver or coin) to slide along the
surface of the probe to do the test. Under normal situation, a moving left-right
symmetric acute triangle will be shown on the screen. If the acute triangle is
complete except that the depth gets shallower, it may be due to lowered transmit
voltage, failure in a certain level of the amplification circuit on the front-end board,
or abnormal transmit pulse (less than normal pulse number). Check if the transmit
voltage is normal (over +60V) or not, so as to determine where the problem is: in
DC-DC board, PBSW Board, RVA Board or FEP Board; if a certain part in the acute
triangle is lost (black strip), the failure may come from some part of the front-end
board, including PBSW Board, RVA Board or FEP Board. In addition, the problem
in the probe is also possible. if there is any part missing in the acute triangle, and
the missing part varies as the acute triangle moves, the problem may be from RVA
Board.
3.2.3 Abnormal Image
If there is any problem with the ultrasound system, usually it can be found in the image. An
3-14
Troubleshooting
abnormal image usually has the following symptoms:
a) Fixed dark strip in the image;
There are many possible reasons that dark strips are found in the ultrasound image.
The main reasons are: failure in PBSW Board, RVA Board, FEP board or the probe.
There are a few situations that dark strips are found in the image: a black strip
appears at a fixed position in the image; several black strips appear repeatedly in
the image.
As the probe is a precision device, improper use might damage the probe.
Therefore, when black strips appear in the image, first of all please check if the
problem is due to probe damage. It is very easy to figure out. Connect another
good probe (It is not necessarily of the same model) to the system to see if there is
any similar problem in the image. If the problem is still there, the failure is from the
system; otherwise it is the probe problem. Please replace the probe. If the problem
is in the system, usually it is due to the front-end system. Usually breakdown in
high voltage switch of the PBSW board or the pre-amplifier in the front-end system
may result in such failure. Try to replace the PBSW Board first. If the problem still
exists, try to replace the RVA Board. If it does not work, further replace the FEP
Board.
b) Noise in the Image
There are many reasons that may cause noises in the image, for example: external
electromagnetic interference, power interference and interference from system
failure. Therefore, when interference is found in the screen, check if there is any
external interference before further inspection. External electromagnetic
interference generally lead to interference in the whole screen (but not limited to
the ultrasound imaging area). Interference due to front-end system failure usually is
found in the ultrasound imaging area only. Based on this characteristic, we can
distinguish whether the interference source is the external electromagnetic
interference. External power interference may also lead to noises in the ultrasound
3-15
Troubleshooting
imaging area. If external power interference is found, check if the ground terminal
of the system is well connected. In addition, please try to keep away from the
power interference source. It is recommended to use a well-grounded stabilized
voltage supply, so as to reduce power interference effectively.
If the system failure is due to noise, the failure position can be determined roughly
based on the noise features:
1) If there is one or more noise(s) in acute triangle shape, usually the problem is in
the pre-amplifier, the high-voltage switch or the relay of the PBSW Board.
Please replace the PBSW board.
2) If the noise is in irregular shape and appears in the whole ultrasound imaging
area at random, usually the problem is in the amplification circuit of the
Front-End Board. Please replace the PBSW board or the RVA board.
3) If the noise is in geometric form and regular, such as black strip, bright line,
black mass, or bright mass. The problem might not be from the front-end. The
failure inspection focus shall be in FEP board, computer part (Industrial Control
Board), and RAM.
In addition to the problems listed above, other failures might occur due to complexity of
the system.
3.2.4 Failure Analysis on Monitor
3.2.4.1 Inspection when the monitor display is not normal
For inspection on the main unit, please refer to other sections in this manual. For
inspection on video output signals, if possible, connect video out of the main unit to an
external monitor to check if the video output signals from the main unit is normal.
3-16
Troubleshooting
Fig. 3-14 Silk Screen Diagram of Monitor Board (1074H)
To determine the failure of monitor assembly, follow the instructions below to perform the
inspection.
Note: Due to high-voltage circuit inside the monitor assembly, all the inspection
shall be performed by a professional engineer.
a) Inspect the circuit board and its components to see if there is any abnormity, burn
or peculiar smell; if any wire is broken; if any connector comes off or gets loose.
3-17
Troubleshooting
Fig. 3-15 Inside View of Wiring
b) Power-up check the power input connector CH6. Measure voltage input +15V (in
yellow) and +30V (in red) with a multimeter. If the voltage is not normal, unplug the
connector, and measure the connector voltage with zero loading. If it is still not
normal, the initial identification is that it is the Power Board failure.
Fig. 3-16 The Picture of the Power Input Interface
3-18
Troubleshooting
c) If the power input and the video out signals of the main unit are working properly,
the initial identification is that it is the Monitor Board failure.
3.2.4.2 Common monitor failures and troubleshooting
a) No display: Adjust brightness and contrast potentiometers on the front panel to see
if there is any change or any scanning grating. If there is grating, usually the failure
is in the video amplification channel; check if the monitor tube filament is on: use a
multimeter to measure the voltage between pin 3 and 4 at the back of the monitor
tube and see if it is DC15V. If it is the normal value 15V, while the filament is off, a
possible cause of the failure is filament blowout or bad contact between the
monitor-end platelet and the monitor tube.
b) Asynchronous display line: Try to adjust the potentiometer 4VR2. If it does not work,
the failure is in the circuit.
c) Asynchronous display field: Try to adjust the potentiometer 5VR1. If it does not
work, the failure is in the circuit.
d) Abnormal brightness: adjust the brightness control potentiometer on the front panel,
or the assistant brightness control potentiometer 4VR4 on the main circuit board. If
it does not work, the failure is in the circuit.
e) Abnormal contrast: adjust the contrast control potentiometer on the front panel, or
the assistant contrast control potentiometer 1VR1 on the main circuit board. If it
does not work, the failure is in the circuit.
f) Improper grating size: adjust the potentiometer 5VR2 to adjust image size in
vertical direction; adjust the magnetic core of loop 4L2 to adjust image size in
horizontal direction.
g) Fuzzy focus in the image: adjust the potentiometer 4VR3 to see if there is any
change in the image focusing effect.
If the failure is identified from circuit board, if possible, perform corresponding circuit
troubleshooting with reference to circuit schematics and block diagram; otherwise, return
3-19
Troubleshooting
the board to us for service.
3.2.5 Other Common Failures and Troubleshooting
a) If the system can start up and enter Windows operation interface , but cannot enter
ultrasound software interface, inspect the connection between the Industrial
Control Board and the FEP board to see if it is normal, or any bad contact due to
connector dislocation; it may also due to oxidation of the contact point on the PCI
port of the Industrial Control Board, which results in bad contact. Use an eraser to
clear off the oxide on contact point surface.
b) If the screen stays in the BIOS initialization screen or Windows logging screen after
system startup, try to recover the system with GHOST. If it does not work, check if
the hard disk data wire and the hard disk power wire get loose, if the data wire is
damaged due to pressure. Lastly, if system recovery and data wire replacement do
not work, it can identified as a hard disk failure. Please replace the hard disk.
3-20
Software Maintenance
Chapter 4
4.1 System Update
System update includes Update System Online and Update System from USB disk.
Press Menu. Select Update System and press Enter. The window below will appear.
Move the trackball up or down to select.
Fig. 4-1 Update System Menu
4.1.1 Update System Online
Select Update System Online and press Enter. The following message will be displayed
on the screen:
Connecting, please waiting…
a) If network connection is failed, the following message will be displayed on the
screen:
Network Error! Please press ESC to return menu.
1) Press Esc to return to Fig. 4-1 window and enter Network Setup to check
whether the setting of IP and Port is correct. Then make sure the system is well
connected to the network (e.g. check the connection of netcable);
2) Select Update System Online again. If it still prompts Network Error, it may
be due to the server failure for file download. Please contact SIUI.
b) If network connection is successful, the following message will be displayed on the
4-1
screen:
Network connect successfully.
Please press Enter to copy file or press ESC to return menu.
1) Cancel system update: Press ESC to return to Fig. 4-1 window;
2) Copy file: Press Enter. The window below will appear, and it starts copying
update files. During copying, only Esc key is valid.
Copying files 9%
Press ESC to cancel
Fig. 4-2 Copy file window
3) Cancel copy: Press Esc to cancel copy. The following message will be
displayed on the screen:
Please press Enter to cancel copy or press ESC to return.
Press Esc key to continue copy, or press Enter to cancel copy, and the
following message pops up:
Copy Blackout! Please press ESC to return menu.
4) Copy completes: the following message pops up when copy completes:
The files download successfully.
Please press Enter to update system or press ESC to return menu.
If the user does not want to update the system, press Esc to return to the
window in Fig. 4-1.
5) Update system: If the user wants to update the system, press Enter, and the
system will automatically install the new software and be rebooted to achieve
update.
4-2
4.1.2 Update System from USB disk
Copy the .exe file required for system update to the root directory in the USB disk. Plug in
the USB disk and select Update System from USB Disk.
a) Select Update System From USB disk from the menu and press Enter;
b) If a USB disk containing system update files is plugged in the system, the following
message will be displayed on the screen:
The Udisk file is ready.
Please press Enter to update or press ESC to return menu.
c) Press Enter and the system will install the new software and be rebooted
automatically. System update is successful;
d) If the user does not want to update the system, press Esc to return to Fig. 4-1
window;
e) If a USB disk is not plugged in the system or there is no update file in the disk, the
following message will be displayed on the screen:
The Udisk file is not ready.
Please press ESC to return menu.
Press Esc to return to Fig. 4-1 window. Ensure that a USB disk is plugged in and it
contains update files. Press Enter key again to update the system.
4.1.3 Network Setup
a) This option is for setting server IP and port for downloading update files. The
system is set up well before delivery. Usually the user does not need to change
the setup.
Correct IP: 218.16.250.64
Port: 1234
4-3
b) If any modification is required, select Network Setup and press Enter. The
window below will appear:
Fig. 4-3 Upgrade server setup window
c) Move the cursor to IP or Port. Use Backspace to delete the original IP or Port.
Enter new IP or Port and move the cursor to select OK. Press Enter to return to
Fig. 4-1 window;
d) If Initialize is selected and Enter is pressed, then IP and Port are initialized to
factory setup;
e) If IP or Port is not modified, press Esc to return to Fig. 4-1 window.
4.2 Software and System Recovery
4.2.1 Software Recovery
Because the keyboard of the system is locked in default, an external USB keyboard via
the USB port is required for the following operation.
a) Exit the software to Windows interface:
z Method 1: Press Ctrl＋Alt＋Delete to pop up Windows Task Manager,
select Processes | 7700.exe |End Process to return to Windows interface as
shown in Fig. 4-4.
z Method 2: Press Alt＋F4 to close the software directly and return to Windows
interface.
b) Copy CD folder under the root directory of D drive to the folder Ultrasound under
the root directory of C drive. Software recovery is completed.
4-4
Fig. 4-4 Windows Task Manager Window
4.2.2 System Recovery and Backup
4.2.2.1 System Recovery
The software Ghost is required for system recovery. Ghost is a tool for system, data
backup and recovery released by Symantec, which can be downloaded from Internet.
There are two system recovery methods available for user selection: automatic and
manual recovery.
a) Boot up via USB Startup Disk and Automatic System Recovery
Plug the USB startup disk in the USB port, and press F7 when the system is
booting up. The screen as shown in Fig. 4-5 is displayed.
Select First Boot Device
USB RMD-FDD: Sigmatel MSCM

IDE-0: Maxtor6e030L0
Up/Dn: Select RETURN: Boot ESC: Cancel

Fig. 4-5 Startup Selection Menu
Use the up/down direction keys to select USB RMD-FDD: Sigmatel MSCM to boot
4-5
up the system (The descriptions following USB RMD-FDD and IDE-0 are
dependant to the actual situation).
If the USB startup disk contains a batch file (AUTOEXE.BAT) for automatic
recovery, the system will be recovered automatically after successful startup, and
then restart.
b) Manual System Recovery
Follow step a) to start up from the USB startup disk. If there is no batch file
(AUTOEXE.BAT) for automatic recovery in the USB disk, after successful startup
the system will go to DOS prompt A:\>. Input the commands below to enter Ghost
interface as shown in Fig. 4-6:
A:\D: (press Enter)
D:\ghost (pre
ss Enter)
Fig. 4-6 Startup Screen of Ghost8.0
4-6
Fig. 4-7 Select Recovery Menu
1) Select Local |Partition| From Image (Shown in Fig. 4-7) and press Enter to
confirm and go to the screen shown in Fig. 4-8.
Fig. 4-8 Select Partition of Image File
2) Select the partition of the image file. The image file SIUI.GHO is saved in the
root directory in D drive (the second partition of the first disk). Select D:1:2 []
FAT drive and press Enter.
3) After selecting the partition, the directory and files of this partition are displayed
in the second box (the biggest one). Use the direction keys to select the image
4-7
file SIUI.GHO, and press Enter to confirm. See Fig. 4-9. It displays backup
information of the selected image file when performing backup. Select OK to
confirm.
Fig. 4-9 Backup Information of the Selected Image File
4) Select to restore the image file to the hard disk. Since there is only one hard
disk available on the system, press Enter key directly and it displays Fig. 4-10.
Fig. 4-10 Select Destination Drive
5) Select the destination partition for recovery. The image file is to be recovered to
C drive (the first partition). Select the first item (the first partition). The display is
as shown in Fig. 4-11.
4-8
Fig. 4-11 Select Destination Partition
6) After selecting the destination partition for recovery, press OK. A prompt
message pops up: Proceed with partition restore? Destination partition will
be permanently overwritten. See Fig. 4-12.
Fig. 4-12 Prompt Message
4-9
7) Select Yes to start restoring. See Fig. 4-13.
Fig. 4-13 System Restoring
8) When the system is restored successfully, it displays as shown in Fig.4-14.
Press Enter to restart the system and finish recovery.
Fig. 4-14 Recovery Succeeds
4-10
4.2.2.2 System Backup
a) Select Local| Partition| To Image as shown in Fig. 4-15, and press Enter key.
Fig. 4-15 Select Backup Menu
b) It pops up a hard disk select window as shown in Fig. 4-16. There is only one hard
disk available in the system, so press Enter directly.
Fig. 4-16 Select Source Drive
4-11
c) Use the direction keys to select the first partition (C drive) as the backup partition.
See Fig. 4-17.
Fig. 4-17 Select Source Partition for Backup
d) Then select OK to confirm. It displays as shown in Fig. 4-18.
Fig. 4-18 Dialog Box
4-12
e) Select the desired storage partition, directory path and input the image file name.
First select the partition for storing the image file: Use Tab key to switch to Look in
box and use the direction keys to select desired partition as shown in Fig. 4-19.
Fig. 4-19 Switch to Look in Box
f) Use the down direction key to select D:1:2[]FAT drive (the second partition of the
first disk), the color of which will turn white (see Fig. 4-20).
Fig. 4-20 Select Desired Partition for Storing Image File
4-13
g) Having selected the desired partition, press Tab key to switch to image file name
input box (see Fig. 4-21).
Fig. 4-21 Switch to Image File Name Input Box
h) Input the image file name. To back up the system, input the image file name
SIUI.GHO as shown in Fig. 4-22.
Fig. 4-22 Input Image File Name
4-14
i) Having inputted the image file name, press Save, and it displays Compress image
file? See Fig.4-23.
Fig. 4-23 Query on Whether to Compress Image File
Three options are available for selection: No means no compression; Fast means
fast backup speed with a low percentage of compression (Recommended); High
means slow backup speed with a high percentage of compression. Use the right
direction key to select High. See Fig. 4-24.
Fig. 4-24 Select High
4-15
j) Having selected compression percentage, press Enter key to start backup. The
When it completes, it displays as shown in Fig. 4-25.
Fig. 4-25 Backup Completed
k) It prompts that the operation is completed. Press Enter key to return to the
program main screen. See Fig. 4-26.
Fig. 4-26 Exit to Program Main Interface
l) To exit Ghost, use the down direction key to select Quit and press Enter key. See
Fig. 4-27. It queries: Are you sure you want to quit? Select Yes to exit Ghost and
go back to DOS prompt A:\ >. Press Ctrl + Alt +Del to restart the system. So
4-16
far the system backup is completed.
Fig. 4-27 Exit Ghost
4.3 Creation of USB Startup Disk and Batch File (AUTOEXEC.BAT)
4.3.1 Creation of USB Startup Disk
The software HP USB Disk Storage Format Tool (HUDSFT) is required for the creation of
USB Startup Disk. It is recommended to back up information in the USB disk before
creating the USB startup disk.
a) Plug the USB disk in the computer and run HUDSFT. After starting up, it displays
as in Fig. 4-28.
Fig. 4-28 HUDSFT Running Screen
4-17
b) Select Create a DOS startup disk, and the followed Using DOS system files
located at ::will be activated. See Fig. 4-29.
Fig. 4-29
c) If you click Start, the following message will show up: Missing location of DOS
system files…See Fig. 4-30.
OK
Fig. 4-30 Error Message
d) The files COMMAND.COM and IO.SYS are required for DOS system files, which
are usually stored under the root directory of system drive (C drive). Input “C:\” in
the input box, and click Start. See Fig. 4-31.
Fig. 4-31 Select Directory of DOS System File
4-18
e) Having clicked Start key, if COMMAND.COM and IO.SYS files are missing from
the root directory of system drive C drive, the message will display: There are no
valid DOS system files at the specified location. See Fig. 4-32.
Fig. 4-32
f) If COMMAND.COM and IO.SYS files are not missing, it will prompt: All data on
the USB flash drive will be lost! Do you really want to proceed with format?
Fig. 4-33
g) Click Yes to continue creation of startup disk. The process is shown in Fig. 4-34.
Fig. 4-34
4-19
h) When formatting is completed, it prompts the following message (see Fig. 4-35).
Now the USB startup disk is created.
Fig. 4-35
Note: The software in use in the above case is for reference only. The user can
download the software from Internet, or use other software.
4.3.2 Create Batch File ( AUTOEXEC.BAT)
a) Click the right button of the mouse, and select New| Text Document to create a
new text document. Double click the document to open it. Add the following
command in the document: (See Fig. 4-36 and Fig. 4-37)
GHOST -clone, mode=pload,src=1:2\siui.GHO,dst=1:1 –fx –sure –rb
Fig. 4-36
4-20
Fig. 4-37
b) Save the text document as AUTOEXEC.BAT. Save as type shall be All Files (see
Fig. 4-38).
Fig. 4-38
c) Copy AUTOEXEC.BAT file to the root directory of the USB startup disk.
4.4 Troubleshooting
4.4.1 After Windows starts up, ultrasound software cannot start up
Solution: Select Start |Programs |Startup, and check if there is an item Shortcut to 7700
in the startup menu as shown in Fig. 4-39.
4-21
Fig. 4-39
If there is no Shortcut to 7700 in the startup menu, create a shortcut to 7700 under the
startup menu as shown in Fig. 4-40.
Fig. 4-40
4.4.2 After Windows starts up, ultrasound software enters its interface but returns
to Windows interface immediately
Solution: Select Start |Settings |Control Panel |System. Select Hardware and click
Device Manager to open Device manager to open it (see Fig. 4-41, Fig. 4-42 and Fig.
4-43).
4-22
Fig. 4-41
Fig. 4-42 Control Panel
Fig. 4-43 System Properties
4-23
Check if there is an item SIUI PCITest: PCITest Driver,checked build under Sound,
video and game controller menu, and if this item works properly (Fig. 4-44).
Fig. 4-44 Device Manager
If the driver was not installed successfully, or the contact between the Industrial Control
Board and the slot is not good, it may result in failure.
If the failure is due to unsuccessful installation of the driver, reinstall the driver and restart
the system.
If the failure is due to poor contact between the Industrial Control Board and the slot,
follow the procedure described in Chapter 2 to open the system housing, re-plug the
Industrial Control Board an ensure that it is fixed properly.
4.4.3 Error message pops up when running ultrasound software (see Fig. 4-45)
Fig. 4-45 Error Message
4-24
Solution: The error may be due to lack of the file 2k8HdCrlInit.dat, or lack of a data file
matching the corresponding probe type. To fix this issue, copy the lacked file to the
corresponding directory.
The file 2k8HdCrlInit.dat is backed up in the directory: D:\CD\7700\. Just copy the file
2k8HdCrlInit.dat to the directory for starting up the ultrasound software.
Fig. 4-46
Fig. 4-47
To open the directory of the startup ultrasound software, follow the procedure in Fig. 4-46
4-25
to open the properties of the startup software and click Find Target (Fig. 4-47).
Each probe has its corresponding folder (see Table 4-1). Each folder usually has three
files: data0.dat, data1.dat and data2.dat. An error message will show up when these files
are missing (see Fig. 4-45). To fix this issue, please copy the corresponding probe files to
the matched folder.
Table4-1
Probe Corresponding Folder
C3L60B D:\C3I60F\
L7I50B D:\L7I50F\
C3I20B D:\C3I20F\
V6L11B D:\V6I11F\
U5L50B D:\U5I50F\
C3L40B D:\C3I40F\
L7I38B D:\L7I38F\
C5I20B D:\C5I20F\
V5I11WB D:\V5I11F\
4.5 Collect Information
In order to provide good and fast service to fix the possible failures, whenever a failure
occurs, please collect relevant information and send to us.
a) Mark down the time when the failure occurred. It would be better to mark down the
failure time as accurate as minute, and see if the clock in the system stops.
b) If there is any sound like “di, di” from the probe, record the situation in details.
c) Press Freeze and Probe Select respectively to check if there is any
improvement or any new status, and record the situation in details.
d) Unplug the probe, observe the system; re-plug the probe and observe the system
again. Record the system status in details, and see if the failure is improved or
fixed.
e) Send us one copy of the file Error.ini under the folder C:\ Ultrasound\ Cd\ 7700\
files\ and the folder D:\test\.
4-26
Shantou Institute of Ultrasonic Instruments
SIUI Service Link
Mailing: Shantou Institute of Ultrasonic Instruments (SIUI)
77 Jinsha Road, Shantou, Guangdong 515041, China
Tel: 86-754-88250150 Fax: 86-754-88251499
E-mail: siui@siui.com or service@siui.com
October, 2004

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DCY2.782.

SHANTOU INSTITUTE OF ULTRASONIC INSTRUMENTS, INC.

1. System Composition and Technical Specifications…………….…….… 1-1

1.1 System Composition….…………………………………………………………………………… 1-1

1.2 Technical Specifications….………………………..………..……………………………………. 1-1

2. System Working Principle…...…………………………..………………………………... 2-1

2.1 Brief Introduction of Working Principle……………………..…………………………………… 2-1

2.2 Introduction of PCB……………………..……..…..……..……. ……………………………….. 2-3

2.2.1 Control Panel………………………………………….……………………………………… 2-3

2.2.2 Digital Processing Board..…………………………………..………………………………. 2-6

2.2.3 Order and Amplification Board.……………………………..……………………………… 2-13

2.2.4 Probe Interface Board………………………………………..……………………………… 2-19

2.3 Interconnection Signal List Between PCBs…...………………………………………………... 2-25

2.3.1 Probe Interface Board………………………………………..………………………………. 2-25

2.3.2 Order and Amplification Board……………………………..……………………………….. 2-27

2.3.3 Industrial Control Board..…………..………..………………………………………………. 2-29

2.4 Connection Diagram Between PCBs……………………………………………………………. 2-30

2.5 Disassemble Instruction..………………………………………………………………………… 2-31

2.5.1 General………………………………………………………………………………………… 2-31

2.5.2 Disassemble Plastic Housing..……………………………………………………………… 2-32

2.5.3 Disassemble Keyboard…..………………………………………………………………….. 2-34

2.5.4 Disassemble Rear Panel….………………………………………………………………… 2-35

2.5.5 Disassemble industrial control board……...……………………………………………….. 2-36

2.5.6 Disassemble PR board and RVA board……………………………………………………. 2-37

2.5.7 Disassemble Power Supply and Hard Disk…...…………………………………………… 2-38

2.5.8 Disassemble MONIT Board…………………………………………………………………. 2-39

2.5.9 Disassemble FEP Board…………………………………………………………………….. 2-42

2.5.10 Assemble Schematic of Main Unit………………………………………………………….. 2-42

2.6.2 Interface Position Map..…………………………………………………………………….. 2-48

2.6.3 Installation of System Memory….…………………………………………………………. 2-49

2.6.4 USB Port……………………………………………………………………………………… 2-49

2.6.5 IDE Port……..……………………………………………………………………………….. 2-50

2.6.6 Floppy Disk Port…..…………………………………………………………………………. 2-51

2.6.7 Display Port...………………………………………………………………………………... 2-52

2.6.8 Network Port…………………………………………………………………………………. 2-52

2.6.9 Keyboard and Mouse Port..……….……………………………………………………….. 2-53

2.6.10 Power Supply Port.…….…………………………………………………………………… 2-53

2.6.11 Fan Port..……….……………………….…………………………………………………… 2-55

2.6.12 Status Indication Port……………………………………………………………………….. 2-55

2.6.13 TV Output Port……………………………………………………………………………….. 2-56

3.1 PCB Function and Potential Failure……………………………………………………………... 3-1

3.2 Common Failure and Troubleshooting………………………………………………………….. 3-12

3.2.1 System Cannot Start Up……………………………………………………………………... 3-12

3.2.2 Lowered Image Quality………………………………………………………………………. 3-14

3.2.3 Abnormal Image………………………………………………………………………………. 3-14

3.2.4 Failure Analysis on Monitor………………………………………………………………….. 3-16

3.2.5 Other Common Failures and Troubleshooting…………………………………………….. 3-20

4. Software Maintenance....…….……………………………………………………….……. 4-1

4.1 System Update...…….……………………………………………………………………………. 4-1

4.1.2 Update System from USB disk……………………………………………………………… 4-3

4.1.3 Network Setup.……………………………………………………………………………….. 4-3

4.2 Software and System Recovery.…….…………………………………………………………… 4-4

4.2.1 Software Recovery..…….……………………………………………………………………. 4-4

4.2.2 System Recovery and Backup..…….………………………………………………………. 4-5

4.3 Creation of USB Startup Disk and Batch File.…….…………………………………………… 4-17

4.3.1 Creation of USB Startup Disk………………………………………………………………... 4-17

4.3.2 Create Batch File ( AUTOEXEC.BAT)……………………………………………………… 4-20

4.4 Troubleshooting...…….…………………………………………………………………………… 4-21

4.5 Collect Information...…….………………………………………………………………………... 4-26

1.1 System Composition

Fig. 1-1 Block Diagram of System Composition

1.2 Technical Specifications

2.1 Brief Introduction of Working Principle