Report - 2018 03 22

<Table border>
<th align="center" FILTER=ALL><FONT SIZE=3 COLOR="000000">Date<th align="center"

FILTER=ALL><FONT SIZE=3 COLOR="0000FF">Company<th align="center" FILTER=ALL><FONT
SIZE=3 COLOR="0000FF">Committee<th align="center" FILTER=ALL><FONT SIZE=3
COLOR="0000FF">IEC Standard<th align="center" FILTER=ALL><FONT SIZE=3
COLOR="0000FF">Free of charge
<tr><TD ALIGN="right" STYLE="vnd.ms-excel.numberformat:yyyy-mm-dd">2018-01-
08</td><td>Pilz GmbH Co. KG</td><td ALIGN="right">SC 65C</td><td
ALIGN="right">IEC 61158-3-22 fF Ed. 1.0</td><td> </td></tr>
ALIGN="right">IEC 61784-3-18 am1 Ed. 1.0</td><td> </td></tr>
20</td><td>Telefonaktiebolaget LM Ericsson (publ)</td><td ALIGN="right">ISO/IEC
JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 23009-1 2012</td><td> </td></tr>
15</td><td>ETRI</td><td ALIGN="right">ISO/IEC JTC 1/SC 35</td><td
ALIGN="right">ISO/IEC 20382-1 2017</td><td> </td></tr>
30</td><td>Panasonic Corp..</td><td ALIGN="right">TC 100</td><td
ALIGN="right">IEC 62943 Ed. 1.0</td><td> </td></tr>
25</td><td>NTT Nippon Telegraph and Telephone Corporation</td><td
ALIGN="right">ISO/IEC JTC 1/SC 27</td><td ALIGN="right">ISO/IEC 19592-2
2017</td><td> </td></tr>
13</td><td>Nokia (FI)</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
06</td><td>Toshiba Corporation</td><td ALIGN="right">ISO/IEC JTC 1/SC 17</td><td
30</td><td>FieldComm Group</td><td ALIGN="right">SC 65E</td><td ALIGN="right">IEC
61804-2 Ed. 2.0</td><td> </td></tr>
24</td><td>Yaskawa Electric Corporation</td><td ALIGN="right">SC 65C</td><td
ALIGN="right">IEC 61158-4-24 Ed. 1.0</td><td> </td></tr>
14</td><td>BlackBerry LTD</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
02</td><td>BJB GmbH CO KG</td><td ALIGN="right">SC 34B</td><td
ALIGN="right">IEC 60061-1 am24 f7 Ed. 3.0</td><td> </td></tr>
27</td><td>Mastercard</td><td ALIGN="right">ISO/IEC JTC 1/SC 27</td><td
ALIGN="right">ISO/IEC 11770-3 2015/AMD1 2017</td><td> </td></tr>
07</td><td>Huawei Technologies Co., Ltd</td><td ALIGN="right">SC 46F</td><td
ALIGN="right">IEC 63138-2 Ed. 1.0</td><td> </td></tr>
07</td><td>China Mobile COMM Corp. </td><td ALIGN="right">SC 46F</td><td
15</td><td>Velos Media International Ltd</td><td ALIGN="right">ISO/IEC JTC 1/SC
29</td><td ALIGN="right">ISO/IEC 23008-2 2015</td><td> </td></tr>
12</td><td>Helvar Oy Ab</td><td ALIGN="right">SC 34C</td><td ALIGN="right">IEC
62386-201 Ed. 1.0</td><td> </td></tr>
09</td><td>Orange</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
21</td><td>QUALCOMM Incorporated</td><td ALIGN="right">TC 100</td><td
21</td><td>Thomson Licensing</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
11</td><td>Google Inc.</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
24</td><td>Keio University</td><td ALIGN="right">TC 100</td><td
ALIGN="right">IEC/TR 63094 Ed. 1.0</td><td> </td></tr>
10</td><td>Unicorn Energy GmbH</td><td ALIGN="right">TC 69</td><td
ALIGN="right">IEC/TS 61851-3-4 Ed. 1.0</td><td> </td></tr>
04</td><td>Cisco Systems Inc.</td><td ALIGN="right">JTC 1</td><td
ALIGN="right">ISO/IEC 29341-1 Ed. 2.0</td><td> </td></tr>
08</td><td>SRT Marine Systems plc</td><td ALIGN="right">TC 80</td><td
02</td><td>Philips International B.V.- IP S</td><td ALIGN="right">ISO/IEC JTC 1/SC
29</td><td ALIGN="right">ISO/IEC 23008-3 2015/AMD3 2017</td><td> </td></tr>
26</td><td>Klafs GmbH Co.KG</td><td ALIGN="right">TC 61</td><td
ALIGN="right">IEC 60335-2-53 am1 Ed. 4.0</td><td> </td></tr>
19</td><td>BJB GmbH Co KG</td><td ALIGN="right">SC 34B</td><td
ALIGN="right">IEC 60061 f17 Ed. 3.0</td><td> </td></tr>
17</td><td>Tyco Technology Resources</td><td ALIGN="right">SC 48B</td><td
06</td><td>National Institute of information and communication technology</td><td
2005</td><td> </td></tr>
18</td><td>Xidian University</td><td ALIGN="right">ISO/IEC JTC 1/SC 31</td><td
18</td><td>Conlog (Pty) Ltd</td><td ALIGN="right">TC 13</td><td ALIGN="right">IEC
62055-41 Ed. 1.0</td><td> </td></tr>
11</td><td>Koninklijke KPN N.V.</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
26</td><td>ITRON Inc.</td><td ALIGN="right">TC 13</td><td ALIGN="right">IEC
62056-6-2 Ed. 3.0</td><td> </td></tr>
17</td><td>KYOCERA Corporation</td><td ALIGN="right">TC 100</td><td
16</td><td>Kathrein Werke</td><td ALIGN="right">SC 46F</td><td ALIGN="right">IEC
61169-54 Ed. 1.0</td><td> </td></tr>
13</td><td>Telecom Italia</td><td ALIGN="right">JTC 1</td><td
ALIGN="right">ISO/IEC 29341-2 Ed. 1.0</td><td> </td></tr>
07</td><td>AIST National Institute of Advanced Industrial Science and
Technology</td><td ALIGN="right">ISO/IEC JTC 1/SC 27</td><td
2015</td><td> </td></tr>
02</td><td>Nanyang Technological University-NTUitive Pte Ltd</td><td
2016</td><td> </td></tr>
10</td><td>QUALCOMM Incorporated</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
05</td><td>Microsoft Corporation</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
03</td><td>EnergyBus e.V</td><td ALIGN="right">TC 69</td><td ALIGN="right">IEC
61851-3 Ed. 1.0</td><td> </td></tr>
23</td><td>Asahi Glass Ltd</td><td ALIGN="right">TC 110</td><td ALIGN="right">IEC
61747-40-5 Ed. 1.0</td><td> </td></tr>
21</td><td>Bender GmbH</td><td ALIGN="right">SC 23E</td><td ALIGN="right">IEC
62955 Ed. 1.0</td><td> </td></tr>
18</td><td>QUALCOMM Incorporated</td><td ALIGN="right">JTC 1</td><td
ALIGN="right">ISO/IEC 29341-1-1 Ed. 1.0</td><td> </td></tr>
10</td><td>ABB Research Ltd</td><td ALIGN="right">CIS/B</td><td
ALIGN="right">CISPR 11 2009</td><td> </td></tr>
10</td><td>ABB Switzerland Ltd</td><td ALIGN="right">TC 57</td><td
24</td><td>GE Consumer and Industrial</td><td ALIGN="right">SC 34B</td><td
ALIGN="right">IEC 60061 f72 Ed. 3.0</td><td> </td></tr>
06</td><td>Fuji Electric Co., Ltd</td><td ALIGN="right">TC 91</td><td
15</td><td>Bernecker Rainer, Industrie-Elektronik Ges.m.b.H</td><td
ALIGN="right">SC 65C</td><td ALIGN="right">IEC 61784-3-13 Ed. 1.0</td><td>
</td></tr>
09</td><td>Huawei Technologies Co., Ltd</td><td ALIGN="right">ISO/IEC JTC 1/SC
23</td><td>ABB Technology</td><td ALIGN="right">SC 65C</td><td ALIGN="right">IEC
62439-3 Ed. 2.0</td><td> </td></tr>
21</td><td>FieldComm Group</td><td ALIGN="right">SC 65C</td><td ALIGN="right">IEC
62591 fF Ed. 1.0</td><td> </td></tr>
17</td><td>Siemens Aktiengesellschaft</td><td ALIGN="right">SC 65C</td><td
09</td><td>Korea Institute of Industrial Technology</td><td ALIGN="right">TC
91</td><td ALIGN="right">IEC 61190-1-3 am1 Ed. 2.0</td><td> </td></tr>
07</td><td>Heesung Material Ltd</td><td ALIGN="right">TC 91</td><td
27</td><td>Telecom Italia</td><td ALIGN="right">TC 25</td><td ALIGN="right">IEC
60027-1 am2 f1 Ed. 6.0</td><td> </td></tr>
26</td><td>Senju Metal Industry</td><td ALIGN="right">TC 91</td><td
25</td><td>Toyota Central</td><td ALIGN="right">TC 91</td><td ALIGN="right">IEC
61190-1-3 Ed. 3.0</td><td> </td></tr>
17</td><td>Nihon Superior Co</td><td ALIGN="right">TC 91</td><td
05</td><td>Panasonic Corporation</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
15</td><td>QUALCOMM Incorporated</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
10</td><td>Samsung Electronics Co Ltd</td><td ALIGN="right">ISO/IEC JTC 1/SC
03</td><td>Sharp Corporation (Nara)</td><td ALIGN="right">ISO/IEC JTC 1/SC
29</td><td>Mitsubishi Electric Corporation</td><td ALIGN="right">ISO/IEC JTC
25</td><td>Sony Corp.</td><td ALIGN="right">TC 110</td><td ALIGN="right">IEC/TR
62977-3-2 Ed. 1.0</td><td> </td></tr>
ALIGN="right">ISO/IEC JTC 1</td><td ALIGN="right">ISO/IEC 11889-1 2015</td><td>
</td></tr>
25</td><td>NTT Nippon Telegraph and Telephone Corporation</td><td ALIGN="right">TC
25</td><td ALIGN="right">IEC 60027-1 Ed. 7.0</td><td> </td></tr>
15</td><td>Dan Gavish and/or Hanna Gavish</td><td ALIGN="right">TC 61</td><td
07</td><td>Rockwell Automation Technologies</td><td ALIGN="right">SC 65C</td><td
05</td><td>Nokia (FI)</td><td ALIGN="right">ISO/IEC JTC 1</td><td
12</td><td>Siemens Aktiengesellschaft</td><td ALIGN="right">TC 57</td><td
10</td><td>Sony Corp.</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
10</td><td>Sony Corp.</td><td ALIGN="right">ISO/IEC JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-10/AMD2 2013</td><td> </td></tr>
ALIGN="right">IEC 62439-2 fF Ed. 1.0</td><td> </td></tr>
23</td><td>Dolby International AB</td><td ALIGN="right">ISO/IEC JTC 1/SC
20</td><td>Rockwell Automation Technologies</td><td ALIGN="right">SC 65E</td><td
03</td><td>Apple Computer, Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 23003-4</td><td> </td></tr>
26</td><td>QUALCOMM Incorporated</td><td ALIGN="right">JTC 1/SC 29</td><td
21</td><td>EUROMICRON Werkzeuge GmbH</td><td ALIGN="right">SC 86B</td><td
21</td><td>EUROMICRON Werkzeuge GmbH</td><td ALIGN="right">SC 86B</td><td
15</td><td>Zebra Technologies Corporation</td><td ALIGN="right">JTC 1/SC
31</td><td ALIGN="right">ISO/IEC 18000-63</td><td> </td></tr>
12</td><td>China IWNCOMM Co.</td><td ALIGN="right">JTC 1/SC 31</td><td
08</td><td>NISSAN MOTOR CO, LTD</td><td ALIGN="right">TC 69</td><td
ALIGN="right">JTC 1/SC 27</td><td ALIGN="right">ISO/IEC 18033-5</td><td>
</td></tr>
17</td><td>Intel Corp</td><td ALIGN="right">JTC 1/SC 27</td><td
15</td><td>Nokia (FI)</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 29157</td><td> </td></tr>
11</td><td>Impinj, Inc.</td><td ALIGN="right">JTC 1/SC 31</td><td
17</td><td>Panasonic Corpo.</td><td ALIGN="right">JTC 1/SC 29</td><td
06</td><td>Mitsubishi Electric Corporation</td><td ALIGN="right">JTC 1/SC
01</td><td>ODVA, Inc.</td><td ALIGN="right">SC 22G</td><td ALIGN="right">IEC
61800-7-202 Ed. 1.0</td><td> </td></tr>
25</td><td>Dolby Laboratories Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
18</td><td>ABB Research LTD</td><td ALIGN="right">SC 65E</td><td
18</td><td>ABB Research LTD</td><td ALIGN="right">SC 65E</td><td
28</td><td>Fisher Controls International LLC</td><td ALIGN="right">SC 65E</td><td
24</td><td>Trellis Management Co Ltd</td><td ALIGN="right">ISO/IEC JTC 1/SC
19</td><td>Phoenix Contact GmbH Co. KG</td><td ALIGN="right">SC 65E</td><td
24</td><td>Telecom Italia</td><td ALIGN="right">JTC 1/SC 29</td><td
30</td><td>Google Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-31</td><td>F</td></tr>
19</td><td>Thomson Licensing</td><td ALIGN="right">JTC 1/SC 29</td><td
16</td><td>Electronics Telecommunications Research Institute</td><td
ALIGN="right">JTC 1/SC 6</td><td ALIGN="right">ISO/IEC 17811-2</td><td> </td></tr>
ALIGN="right">JTC 1/SC 6</td><td ALIGN="right">ISO/IEC 17821</td><td> </td></tr>
12</td><td>HUBER AND SUHNER AG</td><td ALIGN="right">SC 86B</td><td
06</td><td>Toshiba Corporation</td><td ALIGN="right">SC 34B</td><td
30</td><td>Disney Enterprises, Inc</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 23008-2 2013/PDAM 4</td><td> </td></tr>
22</td><td>Panasonic Corpo.</td><td ALIGN="right">SC 34B</td><td
10</td><td>iControl</td><td ALIGN="right">JTC 1/SC 31</td><td
31</td><td ALIGN="right">ISO/IEC 18000 Part4</td><td> </td></tr>
</td></tr>
11</td><td>TDvision Corporation SA</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-10,11,14,15,16,25,27</td><td> </td></tr>
03</td><td>KISA</td><td ALIGN="right">JTC 1/SC 31</td><td ALIGN="right">ISO/IEC
29168-1</td><td> </td></tr>
ALIGN="right">ISO/IEC 23008-2HEVC</td><td> </td></tr>
21</td><td>MEDIATEK INC</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 23008-2HEVC</td><td> </td></tr>
12</td><td>Pantech Co. Ltd</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 23008-2 HEVC</td><td> </td></tr>
31</td><td>ETRI</td><td ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC
23000-13</td><td> </td></tr>
23000-13</td><td> </td></tr>
22</td><td>Bosch Rexroth AG</td><td ALIGN="right">SC 65C</td><td
ALIGN="right">IEC 61158-4-19 Ed. 3.0</td><td>F</td></tr>
22</td><td>Rexroth Indramat GmbH</td><td ALIGN="right">SC 65C</td><td
21</td><td>Mitsubishi Electric Corporation</td><td ALIGN="right">65C</td><td
ALIGN="right">61158-6-23</td><td>F</td></tr>
15</td><td>Alcatel Lucent</td><td ALIGN="right">SC 86C</td><td ALIGN="right">IEC
61280-2-12 Ed. 1.0</td><td> </td></tr>
14</td><td>Trellis Management Co Ltd</td><td ALIGN="right">JTC 1/SC 29</td><td
09</td><td>Toshiba Corporation</td><td ALIGN="right">SC 65C</td><td
19</td><td>SUPCON Group Co., Ltd Zhejiang University</td><td ALIGN="right">SC
65C</td><td ALIGN="right">IEC 61158-4-14 Ed. 3.0</td><td> </td></tr>
10</td><td>ODVA Inc.</td><td ALIGN="right">SC 65C</td><td ALIGN="right">IEC
61158-2 Ed. 3.0</td><td> </td></tr>
10</td><td>ODVA Inc.</td><td ALIGN="right">SC 65C</td><td ALIGN="right">IEC
61158-4-2 Ed. 1.0</td><td> </td></tr>
03</td><td>JDS Uniphase Corporation</td><td ALIGN="right">86C</td><td
ALIGN="right">IEC 61282-13 Ed1</td><td> </td></tr>
02</td><td>Broadcom Advanced Compression Group LLC</td><td ALIGN="right">JTC 1/SC
25</td><td>EXFO Electro-Optical Engineering Inc.</td><td ALIGN="right">86C</td><td
ALIGN="right">IEC 61282-13Ed1</td><td> </td></tr>
ALIGN="right">ISO/IEC 23008-2 HEVC</td><td> </td></tr>
21</td><td>Siemens Aktiengesellschaft</td><td ALIGN="right">SC 22G</td><td
15</td><td>Mitsubishi Electric Corporation</td><td ALIGN="right">SC 65C</td><td
24</td><td>Diamond SA</td><td ALIGN="right">SC 86B</td><td ALIGN="right">IEC
61754-32 Ed. 1.0</td><td> </td></tr>
22</td><td>WITRICITY Corp</td><td ALIGN="right">TC 69</td><td ALIGN="right">IEC
61980-1 Ed. 2.0</td><td> </td></tr>
18</td><td>JVC Kenwood Corporation</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 13818-1, ISO/IEC 13818-2, ISO/IEC 14496-10</td><td>
</td></tr>
18</td><td>JVC Kenwood Corporation</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 11172-1,2, ISO/IEC 13818-3, ISO/IEC 14496-1,2,3,5,6, ISO/IEC
15938-1,2,3,4,5,6</td><td> </td></tr>
15</td><td>GEMALTO SA</td><td ALIGN="right">JTC 1/SC 17</td><td
04</td><td>Murata Machinery</td><td ALIGN="right">JTC 1/SC 27</td><td
02</td><td>LS INDUSTRIAL SYSTEMS CO. LTD</td><td ALIGN="right">SC 65C</td><td
19</td><td>Fast VDO LLC</td><td ALIGN="right">JTC 1/SC 29</td><td
14</td><td>Sony Corp.</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC
62889 Ed. 1.0</td><td> </td></tr>
05</td><td>Motorola Mobility Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
02</td><td>Siemens Aktiengesellschaft</td><td ALIGN="right">JTC 1/SC 29</td><td
29</td><td>Koninklijke Philips Electronics N. V.</td><td ALIGN="right">JTC 1/SC
01</td><td>Nagoya Inustrial Science Research Institute</td><td ALIGN="right">JTC
1/SC 29</td><td ALIGN="right">ISO/IEC 14496-10 2012/AMD 3</td><td> </td></tr>
21</td><td>Fraunhofer-Gesellschaft zur Foerderung der angewandten forschung</td><td
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 23008-2 ITU-T
H.265</td><td> </td></tr>
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 14496-10 amd2 ITU-T
H.264</td><td> </td></tr>
29</td><td ALIGN="right">ISO/IEC 14496-10 amd2 ITU-T H.264</td><td> </td></tr>
29</td><td ALIGN="right">ISO/IEC 23008-2 ITU-T H.265</td><td> </td></tr>
19</td><td>Giesecke Devrient GmbH</td><td ALIGN="right">JTC 1/SC 31</td><td
18</td><td>Rosenberger Hochfrequenztechnik GmbH Co. KG</td><td ALIGN="right">SC
23H</td><td ALIGN="right">IEC 62196-3 Ed. 1.0</td><td> </td></tr>
17</td><td>SK Telecom, CO, Ltd</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 23008-2 ITU-T H.265</td><td> </td></tr>
14</td><td>Fujitsu Limited</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 23008-2 ITU-T H265</td><td> </td></tr>
13</td><td>National Institute of Information and Communication Technology</td><td
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 14496-10 2012/AMD
3</td><td> </td></tr>
07</td><td>Canon Kabushiki Kaisha</td><td ALIGN="right">JTC 1/SC 29</td><td
06</td><td>Spinner GmbH</td><td ALIGN="right">SC 46F</td><td ALIGN="right">IEC
61169-54 Ed. 1.0</td><td> </td></tr>
23</td><td>Intel Corp</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC
62680-1-1 Ed. 1.0</td><td> </td></tr>
62680-3 Ed. 1.0</td><td> </td></tr>
62680-2 Ed. 1.0</td><td> </td></tr>
62680-4 Ed. 1.0</td><td> </td></tr>
21</td><td>NEC Corporation</td><td ALIGN="right">JTC 1/SC 27</td><td
23</td><td>CommScope</td><td ALIGN="right">SC 48B</td><td ALIGN="right">IEC
60603-7-81 Ed. 1.0</td><td> </td></tr>
19</td><td>eBrisk Video Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
15</td><td>PKWARE</td><td ALIGN="right">JTC 1/SC 34</td><td ALIGN="right">ISO/IEC
26300</td><td> </td></tr>
20009-2</td><td> </td></tr>
20008-2</td><td> </td></tr>
05</td><td>KDDI Corporationt</td><td ALIGN="right">JTC 1/SC 29</td><td
12</td><td>Telefonaktiebolaget LM Ericsson (publ)</td><td ALIGN="right">JTC 1/SC
12</td><td>Nokia (FI)</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC
62680-3 Ed. 1.0</td><td> </td></tr>
18</td><td>Hitachi Consumer Electronics Co. Ltd</td><td ALIGN="right">JTC 1/SC
23</td><td ALIGN="right">ISO/IEC 30192</td><td> </td></tr>
29</td><td ALIGN="right">ISO/IEC 23008-2 ITU-T H265</td><td> </td></tr>
13</td><td>Vidiyo Inc</td><td ALIGN="right">JTC 1/SC 29</td><td
25</td><td>Yokogawa Electric Corporation</td><td ALIGN="right">SC 65C</td><td
07</td><td>CISC Semi Conductor</td><td ALIGN="right">JTC 1/SC 31</td><td
</td></tr>
29</td><td>Huawei Technologies Co., Ltd</td><td ALIGN="right">JTC 1/SC 29</td><td
26</td><td>Panasonic Corp.</td><td ALIGN="right">JTC 1/SC 23</td><td
13</td><td>Agency for Science, Technology and Research </td><td ALIGN="right">JTC
1/SC 27</td><td ALIGN="right">ISO/IEC 29192-4</td><td> </td></tr>
13</td><td>Sony Corp.</td><td ALIGN="right">JTC 1/SC 23</td><td
11</td><td>NTT DOCOMO, INC</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">-</td><td> </td></tr>
22</td><td>Pioneer Corporation</td><td ALIGN="right">JTC 1/SC 23</td><td
ALIGN="right">ISO/IEC FCD 30190</td><td> </td></tr>
ALIGN="right">ISO/IEC FCD30191</td><td> </td></tr>
19</td><td>Radiall Shanghai Electronics</td><td ALIGN="right">SC 46F</td><td
15</td><td>Microsoft Corporation</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 23008-2-ITU-T H.HEVC</td><td> </td></tr>
14</td><td>KiloLambda Technologies, Ltd.</td><td ALIGN="right">SC 86B</td><td
05</td><td>Cisco Systems Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
26</td><td>Research in Motion</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC23008-2</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496 15 2004 amd2 2008</td><td> </td></tr>
ALIGN="right">TC 103</td><td ALIGN="right">IEC 62802 Ed. 1.0</td><td> </td></tr>
31</td><td>Sumitomo Osaka Cement</td><td ALIGN="right">TC 103</td><td
24</td><td>Molex Incorporated</td><td ALIGN="right">SC 48B</td><td
01</td><td>Sharp Corporation (Osaka)</td><td ALIGN="right">JTC 1/SC 29</td><td
31</td><td>HUMAX</td><td ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC
23001-4,23002-4</td><td> </td></tr>
ALIGN="right">ISO/IEC18033-4</td><td>F</td></tr>
01</td><td>Ren�-Michael Cordes/Ernst Schobesberger/M C Consult Invest Trade
GmbH</td><td ALIGN="right">JTC 1/SC 27</td><td ALIGN="right">ISO/IEC 29192-
3</td><td> </td></tr>
29</td><td>Samsung Electronics Co Ltd</td><td ALIGN="right">JTC 1/SC 29</td><td
26</td><td>Sisvel Technology SRL</td><td ALIGN="right">JTC 1/SC 29</td><td
25</td><td>Panasonic Corpo.</td><td ALIGN="right">JTC 1/SC 29</td><td
21</td><td>Alcatel Lucent</td><td ALIGN="right">JTC 1/SC 29</td><td
12</td><td>Hitachi Industrial Equipment Systems Co. Ltd</td><td ALIGN="right">JTC
1/SC 27</td><td ALIGN="right">ISO/IEC 29192-3</td><td> </td></tr>
14496-29</td><td> </td></tr>
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 14496-
29</td><td>F</td></tr>
23007-2</td><td> </td></tr>
11</td><td>SAMSUNG ELECTRONICS CO.,LTD</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-10 ITU.T H. 264</td><td> </td></tr>
61754-7-1 Ed. 1.0</td><td> </td></tr>
15</td><td>EMBLAZE LTD</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">86C</td><td ALIGN="right">IEC 61292-9</td><td> </td></tr>
10</td><td>DENTSU INC.</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC
62227 Ed. 1.0</td><td> </td></tr>
13818-1 2007/AMD 7</td><td> </td></tr>
30</td><td>Original Design</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC
62665 Ed. 1.0</td><td> </td></tr>
23009-1</td><td> </td></tr>
22</td><td>France Telecom R D</td><td ALIGN="right">JTC 1/SC 27</td><td
29177</td><td> </td></tr>
14</td><td>TAGSYS SA</td><td ALIGN="right">JTC 1/SC 31</td><td
ALIGN="right">ISO/IEC 18000-63 typeC</td><td> </td></tr>
23006-4</td><td> </td></tr>
02</td><td>GEMALTO SA</td><td ALIGN="right">JTC 1/SC 27</td><td
01</td><td>IPICO South Africa (Pty) Ltd</td><td ALIGN="right">JTC 1/SC 31</td><td
30</td><td>ATMEL Automotive GmbH</td><td ALIGN="right">JTC 1/SC 31</td><td
23006-5</td><td> </td></tr>
21000-19</td><td> </td></tr>
05</td><td>Schneider Electric Industries SAS</td><td ALIGN="right">TC 57</td><td
ALIGN="right">IEC 61850-10 Ed. 1.0</td><td>F</td></tr>
18000-63</td><td> </td></tr>
21</td><td>Kosaido co. Ltd and Original Design CO. Ltd</td><td ALIGN="right">TC
100</td><td ALIGN="right">IEC 62665 Ed. 1.0</td><td> </td></tr>
15938-12 Amd1</td><td> </td></tr>
15938-12</td><td> </td></tr>
01</td><td>IBM Corporation</td><td ALIGN="right">JTC 1/SC 25</td><td
23003-3</td><td> </td></tr>
11</td><td>VoiceAge Corporation</td><td ALIGN="right">JTC 1/SC 29</td><td
27</td><td>ABB AG</td><td ALIGN="right">SC 65B</td><td ALIGN="right">IEC 61131-9
Ed. 1.0</td><td> </td></tr>
20</td><td>NXP BV.</td><td ALIGN="right">JTC 1/SC 31</td><td
14</td><td>Magellan Technology Pty. Limited</td><td ALIGN="right">JTC 1/SC
09</td><td>Hitachi Industrial Equipment Systems Co. Ltd</td><td ALIGN="right">TC
2</td><td ALIGN="right">IEC 60034-18-41 Ed. 1.0</td><td> </td></tr>
05</td><td>Symbol Technologies Inc.</td><td ALIGN="right">JTC 1/SC 31</td><td
ALIGN="right">ISO/IEC 15962</td><td>F</td></tr>
02</td><td>LG Electronics </td><td ALIGN="right">JTC 1/SC 29</td><td
30</td><td>CISC Semiconductor Design Consulting</td><td ALIGN="right">JTC 1/SC
24</td><td>Nanotron Technologies GmbH</td><td ALIGN="right">JTC 1/SC 31</td><td
24</td><td>National University Corporation Chiba</td><td ALIGN="right">TC
100</td><td ALIGN="right">IEC/TS 62312-1-2 Ed. 1.0</td><td> </td></tr>
29</td><td ALIGN="right">ISO/IEC 14496-15/amd.1</td><td> </td></tr>
29</td><td ALIGN="right">ISO/IEC 14496-15amd3</td><td> </td></tr>
09</td><td>DecaWave Ltd.</td><td ALIGN="right">JTC 1/SC 31</td><td
09</td><td>DecaWave Ltd.</td><td ALIGN="right">JTC 1/SC 31</td><td
04</td><td>NIVIS LLC</td><td ALIGN="right">SC 65C</td><td ALIGN="right">IEC 62734
Ed. 1.0</td><td> </td></tr>
01</td><td>General Electric Company</td><td ALIGN="right">SC 65C</td><td
01</td><td>Certicom Corporation</td><td ALIGN="right">SC 65C</td><td
25</td><td>Fraunhofer-Gesellschaft zur Foerderung</td><td ALIGN="right">JTC 1/SC
20</td><td>Fujitsu Component Limited</td><td ALIGN="right">TC 23</td><td
ALIGN="right">IEC/TS 62735-1 Ed. 1.0</td><td> </td></tr>
19</td><td>NTT Facilities INC</td><td ALIGN="right">23</td><td ALIGN="right">IEC
62735</td><td> </td></tr>
12</td><td>Electronic Theatre Controls Inc.</td><td ALIGN="right">SC 34B</td><td
27</td><td>ODVA Inc.</td><td ALIGN="right">TC 9</td><td ALIGN="right">IEC 61375-1
Ed. 1.0</td><td> </td></tr>
06</td><td>Siemens Aktiengesellschaft</td><td ALIGN="right">SC 65B</td><td
27</td><td>SICK AG</td><td ALIGN="right">SC 65B</td><td ALIGN="right">IEC 61131-9
Ed. 1.0</td><td>F</td></tr>
27</td><td>Pepperl Fuchs GmbH</td><td ALIGN="right">TC 31</td><td
10</td><td>Panasonic Corp.</td><td ALIGN="right">SC 21A</td><td ALIGN="right">IEC
62133-1 Ed. 1.0</td><td>F</td></tr>
09</td><td>Sony Corp.</td><td ALIGN="right">SC 21A</td><td ALIGN="right">IEC
62133 Ed. 2.0</td><td>F</td></tr>
28</td><td>Sanyo Electric Co., Ltd.</td><td ALIGN="right">SC 21A</td><td
13</td><td>Malcom co., Ltd</td><td ALIGN="right">91</td><td ALIGN="right">IEC
60068-2-83</td><td> </td></tr>
13</td><td>Tarutin Kester CO LTD</td><td ALIGN="right">TC 91</td><td
13</td><td>GENB Systems Limited</td><td ALIGN="right">TC 91</td><td
05</td><td>Sony Corp.</td><td ALIGN="right">TC 91</td><td ALIGN="right">IEC
60068-2-83 Ed. 1.0</td><td> </td></tr>
18</td><td>Sony Corporation</td><td ALIGN="right">JTC 1/SC 27</td><td
10</td><td>Festo AG Co. KG</td><td ALIGN="right">SC 65B</td><td
28</td><td>Gwanju Institute of Science and Technology</td><td ALIGN="right">JTC
1/SC 29</td><td ALIGN="right">ISO/IEC 23005</td><td> </td></tr>
25</td><td>National Institute of Advanced Industrial Science and Technology</td><td
ALIGN="right">TC 90</td><td ALIGN="right">IEC 61788-17 Ed. 1.0</td><td>F</td></tr>
22</td><td>Korea Electronics Technology</td><td ALIGN="right">JTC 1/SC 6</td><td
08</td><td>Motorola Mobility Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ITU-T H264-30</td><td> </td></tr>
18</td><td>NSA</td><td ALIGN="right">TC 57</td><td ALIGN="right">IEC 62351-11 Ed.
1.0</td><td>F</td></tr>
62481-1 Ed. 1.0</td><td> </td></tr>
04</td><td>Narda Safety Test Solutions GmbH</td><td ALIGN="right">TC 106</td><td
29</td><td ALIGN="right">ISO/IEC 15938-3 2002 Amd4</td><td> </td></tr>
22</td><td>NEC Corporation</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 15938-3/Amd.4</td><td> </td></tr>
21</td><td>Alcatel Lucent</td><td ALIGN="right">SC 48D</td><td ALIGN="right">IEC
60917-2-5 Ed. 1.0</td><td> </td></tr>
16</td><td>Diamond SA</td><td ALIGN="right">SC 86B</td><td ALIGN="right">IEC
61754-28 Ed. 1.0</td><td> </td></tr>
</td></tr>
06</td><td>IPICO Innovation Inc</td><td ALIGN="right">JTC 1/SC 31</td><td
ALIGN="right">ISO/IEC 18000-6 2010(E)</td><td> </td></tr>
ALIGN="right">ISO/IEC 18000-6 2010(E)</td><td> </td></tr>
14496-16/Amd 1</td><td> </td></tr>
30</td><td>HUBER AND SUHNER AG</td><td ALIGN="right">SC 46F</td><td
ALIGN="right">IEC/PAS 61169-45 Ed. 1.0</td><td> </td></tr>
23</td><td>Thomson Licensing</td><td ALIGN="right">TC 100</td><td
21</td><td>Dolby International AB</td><td ALIGN="right">JTC 1/SC 29</td><td
18</td><td>Sharp Corporation (Nara)</td><td ALIGN="right">TC 100</td><td
08</td><td>Jinliang Qu</td><td ALIGN="right">SC 46F</td><td ALIGN="right">IEC/PAS
61169-45 Ed. 1.0</td><td> </td></tr>
ALIGN="right">ISO/IEC 11172-2 Cor.4</td><td> </td></tr>
ALIGN="right">ISO/IEC 23002-4/AMD 1</td><td> </td></tr>
ALIGN="right">ISO/IEC 13818-1/AMD 4</td><td> </td></tr>
25</td><td ALIGN="right">ISO/IEC FCD14543-5-21</td><td> </td></tr>
29143</td><td> </td></tr>
23</td><td>Sony Corp.</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC/TS
62592 Ed. 1.0</td><td> </td></tr>
16</td><td>SAGEM</td><td ALIGN="right">JTC 1/SC 17</td><td ALIGN="right">ISO/IEC
7501</td><td>F</td></tr>
09</td><td>Fraunhofer-Gesellschaft zur Foerderung</td><td ALIGN="right">JTC 1/SC
07</td><td>Texas Instruments Incorporated</td><td ALIGN="right">JTC 1/SC
01</td><td>Nokia Corporation (FI)</td><td ALIGN="right">ISO/IEC JTC 1/SC
23</td><td>Intermec Technologies Corporation</td><td ALIGN="right">JTC 1/SC
31</td><td ALIGN="right">ISO/IEC FCD 18000-3</td><td> </td></tr>
31</td><td ALIGN="right">ISO/IEC FCD 18000-3</td><td> </td></tr>
31</td><td ALIGN="right">ISO/IEC FCD18000-6REV1</td><td> </td></tr>
31</td><td ALIGN="right">ISO/IEC FCD18000-6REV1 </td><td> </td></tr>
23</td><td>EM Microelectronic Marin SA</td><td ALIGN="right">JTC 1/SC 31</td><td
22</td><td>IKLAX Media</td><td ALIGN="right">JTC 1/SC 29</td><td
22</td><td>LG Electronics Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 18000-3-2</td><td> </td></tr>
11</td><td>IDENTEC SOLUTIONS AG</td><td ALIGN="right">JTC 1/SC 31</td><td
ALIGN="right">IEC/PAS 61076-2-110 Ed. 1.0</td><td> </td></tr>
01</td><td>ABB Research Ltd</td><td ALIGN="right">SC 65C</td><td
22</td><td>VectorDynamics Corporation</td><td ALIGN="right">SC 47E</td><td
22</td><td>National Institute of Advanced Industrial Science and Technology</td><td
ALIGN="right">SC 47E</td><td ALIGN="right">IEC 60747-14-4 Ed. 1.0</td><td>
</td></tr>
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">IEC 23000-12</td><td> </td></tr>
01</td><td>ODVA, Inc.</td><td ALIGN="right">SC 65C</td><td ALIGN="right">IEC
61158-4-2 Ed. 3.0</td><td> </td></tr>
28</td><td>LS INDUSTRIAL SYSTEMS CO. LTD</td><td ALIGN="right">65C</td><td
ALIGN="right">IEC 61158-4-21 2010</td><td> </td></tr>
06</td><td>Panasonic Corporation</td><td ALIGN="right">SC 34A</td><td
18</td><td>EXFO Electro-Optical Engineering Inc.</td><td ALIGN="right">SC
86C</td><td ALIGN="right">IEC 61280-4-4 Ed. 1.0</td><td> </td></tr>
17</td><td>Toshiba Corporation</td><td ALIGN="right">SC 65C</td><td
15</td><td>QUALCOMM Incorporated</td><td ALIGN="right">JTC1/SC29</td><td
ALIGN="right">IEC 13818-1 2007 PDAM 6</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-10 2009 DCOR1</td><td> </td></tr>
ALIGN="right">ISO/IEC 15444-1 2004 FDAM 4</td><td> </td></tr>
15</td><td>QUALCOMM Incorporated</td><td ALIGN="right">JTC1/SC29</td><td
ALIGN="right">IEC 14496-10 2009 FDAM 1</td><td> </td></tr>
08</td><td>Beckhoff Automation GmbH</td><td ALIGN="right">SC 65C</td><td
02</td><td>Yazaki Corporation</td><td ALIGN="right">SC 23H</td><td
24</td><td>HART Communication Foundation</td><td ALIGN="right">SC 65C</td><td
06</td><td>Sony Corp.</td><td ALIGN="right">CIS/I</td><td ALIGN="right">CISPR
I/301/CD</td><td> </td></tr>
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 23000-9 2008/AMD1</td><td>
</td></tr>
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 14496-12 2008/AMD1,
ISO/IEC 15444-12 2008/AMD1</td><td> </td></tr>
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 23000-9 2008/AMD2</td><td>
</td></tr>
ALIGN="right">ISO/IEC 13818-1 2007/FDAM 4</td><td> </td></tr>
ALIGN="right">ISO/IEC 23003-2.2</td><td> </td></tr>
ALIGN="right">ISO/IEC FCD 29199-5</td><td> </td></tr>
ALIGN="right">ISO/IEC 23002-4/FPDAM 1</td><td> </td></tr>
21</td><td>Agency for Science, Technology and Research </td><td ALIGN="right">JTC
1/SC 17</td><td ALIGN="right">ISO/IEC 24787</td><td> </td></tr>
16</td><td>Giesecke Devrient GmbH</td><td ALIGN="right">JTC 1/SC 17</td><td
15</td><td>Ricoh Company Ltd</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 29199-2 and 29199-4</td><td> </td></tr>
04</td><td>Zebra Technologies Corporation</td><td ALIGN="right">JTC 1/ SC
19</td><td>NXP B.V. (NL)</td><td ALIGN="right">JTC 1/SC 17</td><td
05</td><td>ODVA Inc.</td><td ALIGN="right">SC 121A</td><td ALIGN="right">IEC
62026-7 Ed. 1.0</td><td> </td></tr>
13</td><td>Landis Gyr</td><td ALIGN="right">TC 13</td><td ALIGN="right">IEC
62056-8-3 Ed. 1.0</td><td> </td></tr>
29</td><td>Toshiba Corporation</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 13818-1 2007/Cor.1 2008</td><td> </td></tr>
62455 Ed. 1.0</td><td> </td></tr>
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 23003-2 200x</td><td>
</td></tr>
30</td><td>OFS.</td><td ALIGN="right">SC 86B</td><td ALIGN="right">IEC 61754-20
Ed. 2.0</td><td> </td></tr>
30</td><td>CISC Semi Conductor</td><td ALIGN="right">JTC 1/SC 31</td><td
ALIGN="right">ISO/IEC 18000-6REV1</td><td> </td></tr>
27</td><td>Winstead Assets Ltd</td><td ALIGN="right">JTC 1/SC 31</td><td
31</td><td ALIGN="right">ISO/IEC 18000 Part 3 Mode 3</td><td> </td></tr>
ALIGN="right">IEC/TS 62351-8 Ed. 1.0</td><td> </td></tr>
09</td><td>EDF SA</td><td ALIGN="right">TC 69</td><td ALIGN="right">IEC 61851-1
Ed. 3.0</td><td> </td></tr>
08</td><td>Nokia (FI)</td><td ALIGN="right">100</td><td ALIGN="right">IEC
100/1508/DC</td><td> </td></tr>
08</td><td>Texas Instruments Incorporated</td><td ALIGN="right">JTC 1/SC
07</td><td>GE Consumer and Industrial</td><td ALIGN="right">SC 34A</td><td
25</td><td>Jinliang Qu</td><td ALIGN="right">SC 46F</td><td ALIGN="right">IEC
61169-42 Ed. 1.0</td><td> </td></tr>
20</td><td>IPICO Innovation Inc.</td><td ALIGN="right">JTC 1/SC 31</td><td
29</td><td ALIGN="right">ISO/IEC 15938-3 2002 Amd.3</td><td> </td></tr>
09</td><td>Agilent Technologies</td><td ALIGN="right">SC 86C</td><td
01</td><td>KYOCERA Corporation</td><td ALIGN="right">TC 49</td><td
25</td><td>Xi'an forstar S T CO. Ltd</td><td ALIGN="right">SC 46F</td><td
ALIGN="right">ISO/IEC 14496-5 2001/AMD-24</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-3 2005/AMD.9 2008</td><td> </td></tr>
26</td><td>IDENTEC SOLUTIONS AG</td><td ALIGN="right">JTC 1/SC 31</td><td
ALIGN="right">ISO/IEC 29199-2 and 29199-4</td><td> </td></tr>
09</td><td>EADS France</td><td ALIGN="right">SC 47A</td><td ALIGN="right">IEC
62132-5 Ed. 1.0</td><td> </td></tr>
09</td><td>Electric Power Research Institute</td><td ALIGN="right">SC 77A</td><td
31</td><td ALIGN="right">ISO/IEC 18000 part 6</td><td> </td></tr>
07</td><td>Philips International B.V.- IP S</td><td ALIGN="right">SC 34B</td><td
22</td><td>InfoPrint Solutions Company LLC</td><td ALIGN="right">JTC 1/SC
ALIGN="right">ISO/IEC FDIS 23000-6</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-12 2008/FPDAM 1</td><td> </td></tr>
ALIGN="right">ISO/IEC CD 29199-5</td><td> </td></tr>
ALIGN="right">ISO/IEC CD 29199-4</td><td> </td></tr>
ALIGN="right">ISO/IEC 15444-12 2008/FPDAM 1</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-12 3rd Edition</td><td> </td></tr>
ALIGN="right">ISO/IEC 23000-4 200X/FPDAM 2</td><td> </td></tr>
ALIGN="right">ISO/IEC FCD 14496-22(2nd Edition)</td><td> </td></tr>
12</td><td>QUALCOMM Incorporated</td><td ALIGN="right">JTC 1/SC29</td><td
ALIGN="right">ISO/IEC FDIS 23000-4 (2nd Edition)</td><td> </td></tr>
10</td><td>Fieldbus Foundation</td><td ALIGN="right">65C</td><td
ALIGN="right">IEC 61784-3-1</td><td> </td></tr>
10</td><td>Fieldbus Foundation</td><td ALIGN="right">65C</td><td
ALIGN="right">IEC 62439</td><td> </td></tr>
03</td><td>Fujitsu Limited</td><td ALIGN="right">86B</td><td ALIGN="right">IEC
61753-XXX-X (NWIP)</td><td> </td></tr>
18000-6REV1</td><td> </td></tr>
25</td><td>University of Pittsburgh</td><td ALIGN="right">JTC 1/SC 31</td><td
ALIGN="right">ISO/IEC CD18000-7.2</td><td> </td></tr>
25</td><td>University of Pittsburgh</td><td ALIGN="right">JTC 1/SC 31</td><td
ALIGN="right">ISO/IEC FCD18000-6REV1</td><td> </td></tr>
ALIGN="right">ISO/IEC 18000-6 REV1</td><td> </td></tr>
07</td><td>Beijing Kyland Technology Co. LTD</td><td ALIGN="right">65C</td><td
ALIGN="right">IEC 62439-6</td><td> </td></tr>
05</td><td>Bernecker Rainer, Industrie-Elektronik Ges.m.b.H</td><td
ALIGN="right">65C</td><td ALIGN="right">IEC 61784-3-13</td><td> </td></tr>
23</td><td>Beckhoff Automation GmbH</td><td ALIGN="right">65C</td><td
21</td><td>Alien Technology Corporation</td><td ALIGN="right">JTC 1/SC 31</td><td
31</td><td ALIGN="right">ISO/IEC FCD 18000-7.2</td><td> </td></tr>
ALIGN="right">ISO/IEC 18000-6 REV1</td><td> </td></tr>
07</td><td>Enterasys Networks Inc.</td><td ALIGN="right">JTC 1/SC 27</td><td
17</td><td>SUPCON Group Co., Ltd Zhejiang University</td><td
ALIGN="right">65C</td><td ALIGN="right">IEC 62439</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-10 Amd1</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-10 Ed.4</td><td> </td></tr>
31</td><td ALIGN="right">ISO/IEC 18000 Part6</td><td> </td></tr>
03</td><td>Lenovo (Singapore) Pte Ltd</td><td ALIGN="right">JTC 1/SC 27</td><td
</td></tr>
26</td><td>Echelon Corporation</td><td ALIGN="right">JTC 1/SC 25, ISO TC
205</td><td ALIGN="right">ISO/IEC 14908-1,2,3,4</td><td> </td></tr>
26</td><td>CommScope</td><td ALIGN="right">JTC 1/SC 25</td><td
ALIGN="right">ISO/IEC 14496-10 Amd 3 - ITU-T H.264</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-10 Amd 3 - ITU-T H.264</td><td> </td></tr>
60603-7-4 Ed. 1.0</td><td> </td></tr>
25</td><td>Fujitsu Limited</td><td ALIGN="right">JTC 1/SC 27</td><td
ALIGN="right">ISO/IEC 11889 (all parts)</td><td> </td></tr>
25</td><td>Advanced Micro Devices, Inc.</td><td ALIGN="right">JTC 1/SC 27</td><td
13</td><td>Savi Technology Inc.</td><td ALIGN="right">JTC 1/SC 31</td><td
06</td><td>Hewlett Packard Company</td><td ALIGN="right">JTC 1/SC 27</td><td
05</td><td>Infineon Technologies AG</td><td ALIGN="right">JTC 1/SC 27</td><td
04</td><td>Sun Microsystems, Incl.</td><td ALIGN="right">JTC 1/SC 27</td><td
21</td><td>TDF</td><td ALIGN="right">CIS/I</td><td ALIGN="right">CISPR
29</td><td> </td></tr>
21</td><td>TDF</td><td ALIGN="right">CIS/I</td><td ALIGN="right">CISPR
29</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-3, Amd. 3</td><td> </td></tr>
26</td><td>McDonnel Douglas Corporation</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 29199-2, ISO/IEC 29199-4</td><td> </td></tr>
20</td><td>Intel Corporation</td><td ALIGN="right">JTC 1/SC 27</td><td
30</td><td>SUPCON Group Co., Ltd Zhejiang University</td><td
30</td><td>Sequoia Smart Solutions Pty Ltd</td><td ALIGN="right">JTC 1/SC
21</td><td>AXALTO</td><td ALIGN="right">JTC 1/SC 17</td><td ALIGN="right">ISO/IEC
24727-2</td><td> </td></tr>
20</td><td>DENTSU INC.</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC
62227 Ed. 1.0</td><td> </td></tr>
ALIGN="right">ISO/IEC 29199-2, 29199-4</td><td> </td></tr>
10</td><td>Sharp Corporation</td><td ALIGN="right">TC 100</td><td
10</td><td>Sharp Corporation</td><td ALIGN="right">TC 100</td><td
14</td><td>Eastman Kodak Company</td><td ALIGN="right">JTC 1/SC 29</td><td
29</td><td ALIGN="right">ISO/IEC 14496-20 2006/aMD.2</td><td> </td></tr>
04</td><td>BKS Engineering AG</td><td ALIGN="right">SC 48B</td><td
25</td><td>Siemens AG (Munich)</td><td ALIGN="right">ISO/IEC JTC 1/SC 31</td><td
16</td><td>Brocade Communications Systems, Inc.</td><td ALIGN="right">JTC 1/SC
21</td><td>Nokia Corporation (US)</td><td ALIGN="right">CIS/F</td><td
ALIGN="right">CISPR 14-1 2005 AMD1 2008 AMD2 2011 CSV</td><td> </td></tr>
21</td><td>Nokia Corporation (US)</td><td ALIGN="right">ISO/IEC JTC 1/SC
21</td><td>Nokia Corporation (US)</td><td ALIGN="right">ISO/IEC JTC 1/SC
07</td><td>ODVA</td><td ALIGN="right">65C</td><td ALIGN="right">IEC
62439</td><td> </td></tr>
07</td><td>Rockwell Automation Technologies</td><td ALIGN="right">65C</td><td
06</td><td>NXP B.V.</td><td ALIGN="right">JTC 1/SC 31</td><td
14</td><td>Frescale Semiconductor</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-10-ITU-T H.264 (2005) Amd3</td><td> </td></tr>
14</td><td>Matsushita Electric Industrial Co., Ltd.</td><td ALIGN="right">JTC 1/SC
ALIGN="right">86B</td><td ALIGN="right">IEC 61754-25</td><td> </td></tr>
25</td><td ALIGN="right">ISO/IEC 18000-2,3,4,6, and or 7</td><td> </td></tr>
24</td><td>Rohde Schwarz GmbH Co.KG</td><td ALIGN="right">CIS/A</td><td
ALIGN="right">CISPR 16-1-1</td><td> </td></tr>
16</td><td>Philips International B.V.- IP S</td><td ALIGN="right">JTC 1/SC
25</td><td ALIGN="right">ISO/IEC 29341 all parts</td><td> </td></tr>
10</td><td>Mitsui Mining Smelting Co.</td><td ALIGN="right">91</td><td
10</td><td>IOWA State University Research Foundation</td><td
ALIGN="right">91</td><td ALIGN="right">IEC 61190-1-3</td><td> </td></tr>
10</td><td>Matsushita Electric Industrial Co., Ltd.</td><td
ALIGN="right">91</td><td ALIGN="right">IEC 61190-1-3</td><td> </td></tr>
10</td><td>Cookson Electronics</td><td ALIGN="right">91</td><td ALIGN="right">IEC
61190-1-3</td><td> </td></tr>
10</td><td>Senju Metal Industry</td><td ALIGN="right">91</td><td ALIGN="right">IEC
61190-1-3</td><td> </td></tr>
04</td><td>Nokia Corporation (US)</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-10 - ITU.T H.264</td><td> </td></tr>
21</td><td>Corning Cable Systems</td><td ALIGN="right">86B</td><td
18</td><td>QUALCOMM Incorporated</td><td ALIGN="right">ITU</td><td
ALIGN="right">ITU-R M.1457-7</td><td> </td></tr>
10</td><td>Motorola, Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-10 - ITU.T. H.264</td><td> </td></tr>
10</td><td>Motorola, Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
29</td><td ALIGN="right">ISO/IEC 14496-10/Amd.2</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-10 Amendment 3</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-10 (future edition)</td><td> </td></tr>
ALIGN="right">86B</td><td ALIGN="right">IEC 61755-3-32</td><td> </td></tr>
23</td><td>British Telecommunications plc</td><td ALIGN="right">JTC 1/SC
29</td><td ALIGN="right">ISO/IEC 14496-10 - ITU-T H.264</td><td> </td></tr>
18</td><td>Zhejiang SUPCON Technology Co., Ltd</td><td ALIGN="right">65C</td><td
ALIGN="right">ISO/IEC 14496-12, ISO/IEC 15444-12</td><td> </td></tr>
ALIGN="right">JTC 1/SC 29</td><td ALIGN="right">ISO/IEC 14496-10 - ITU-T
H.264</td><td> </td></tr>
29</td><td>ActivIdentity</td><td ALIGN="right">JTC 1/SC 17</td><td
27</td><td>Samsung SDI CO., Ltd.</td><td ALIGN="right">TC 105</td><td
21</td><td>NeoScale Systems Inc.</td><td ALIGN="right">JTC 1/SC 25</td><td
19</td><td>enikos Pty Ltd</td><td ALIGN="right">JTC 1/SC 29</td><td
18</td><td>US Conec Ltd</td><td ALIGN="right">86B</td><td ALIGN="right">IEC
61755-3-3, IEC 61755-3-4, IEC/PAS 61755-3-31, IEC/PAS 61755-3-32</td><td>
</td></tr>
24</td><td>Toshiba Corporation</td><td ALIGN="right">TC 105</td><td
21</td><td>Hitachi, Ltd.</td><td ALIGN="right">TC 105</td><td ALIGN="right">IEC
62282-6-300 Ed. 1.0</td><td> </td></tr>
18</td><td>TOKAI Corporation</td><td ALIGN="right">TC 105</td><td
16</td><td>NEC Corporation</td><td ALIGN="right">TC 105</td><td ALIGN="right">IEC
62282-6-300 Ed. 1.0</td><td> </td></tr>
15</td><td>BSH Bosh und Siemens Hausger�te GmbH</td><td ALIGN="right">SC
59D</td><td ALIGN="right">IEC 60456 Ed. 2.0</td><td> </td></tr>
10</td><td>Toyo Seikan Kaisha, Ltd.</td><td ALIGN="right">TC 105</td><td
29</td><td ALIGN="right">ISO/IEC 14496-12, ISO/IEC 15444-12</td><td> </td></tr>
10</td><td>Layered Media, Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-10 - ITU-T H.264</td><td> </td></tr>
ALIGN="right">ISO/IEC 13818-2 Amendment 2 - ITU-T H.262</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-10 Amendment 3 - ITU-T H.264</td><td> </td></tr>
03</td><td>Sony Corporation</td><td ALIGN="right">TC 100</td><td
19</td><td>Corning Cable Systems</td><td ALIGN="right">86B</td><td
ALIGN="right">IEC 61755-3-3, IEC 61755-3-4, IEC 61755-3-31, IEC/PAS 61755-3-
32</td><td> </td></tr>
19</td><td>Nokia Corporation (FI)</td><td ALIGN="right">JTC 1/SC 29</td><td
16</td><td>Sony Corporation</td><td ALIGN="right">TC 100</td><td
14</td><td>Savi Technology Inc.</td><td ALIGN="right">JTC 1/SC 31</td><td
09</td><td>enikos Pty Ltd</td><td ALIGN="right">JTC 1/SC 29</td><td
31</td><td>Siemens Aktiengesellschaft</td><td ALIGN="right">65C</td><td
18</td><td>Toshiba Corporation</td><td ALIGN="right">65C</td><td
ALIGN="right">IEC 61158 Series</td><td> </td></tr>
12</td><td>France Telecom TDF</td><td ALIGN="right">JTC 1/SC 29</td><td
27</td><td>LG Electronics Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 13818 Revision 2 and 3</td><td> </td></tr>
25</td><td>Mindego Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
05</td><td>All Media Guide, LLC</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 21000-5 Amd 1</td><td> </td></tr>
ALIGN="right">ISO/IEC 21000-5 Amd 1</td><td> </td></tr>
04</td><td>ODVA / Rockwell Automation</td><td ALIGN="right">65C</td><td
04</td><td>ODVA Inc.</td><td ALIGN="right">SC 22G</td><td ALIGN="right">IEC
61800-7-1 Ed. 2.0</td><td> </td></tr>
01</td><td>McData Corporation</td><td ALIGN="right">JTC 1/SC 25</td><td
01</td><td>McData Corporation</td><td ALIGN="right">JTC 1/SC 25</td><td
18</td><td>Siemens Schweiz AG</td><td ALIGN="right">JTC 1/SC 25</td><td
07</td><td>Tyco Technology Resources</td><td ALIGN="right">86B</td><td
</td></tr>
28</td><td>Monotype Imaging Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
28</td><td>Monotype Imaging Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
28</td><td>Phoenix Contact GmbH Co. KG</td><td ALIGN="right">65C</td><td
22</td><td>Agere Systems Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
06</td><td>Royal Philips Electronics</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496 ITU-T H.264</td><td> </td></tr>
24</td><td>Coding Technologies AB</td><td ALIGN="right">JTC 1/SC 29</td><td
05</td><td>ABB Switzerland Ltd</td><td ALIGN="right">65C</td><td
ALIGN="right">IEC 61158-x</td><td> </td></tr>
28</td><td>Bush-Jaeger Elektro GmbH</td><td ALIGN="right">JTC 1/SC 25</td><td
24</td><td>Schneider Electric Industries SAS</td><td ALIGN="right">JTC 1/SC
25</td><td ALIGN="right">ISO/IEC 14543-3-6</td><td> </td></tr>
21</td><td>Koninklijke KPN N.V.</td><td ALIGN="right">JTC 1/SC 29</td><td
20</td><td>Siemens AG (Karlsruhe)</td><td ALIGN="right">65C</td><td
15</td><td>Hager Controls SAS</td><td ALIGN="right">JTC 1/SC 25</td><td
15</td><td>Zumbotel Staff GmbH</td><td ALIGN="right">JTC 1/SC 25</td><td
15</td><td>Hager Controls SAS</td><td ALIGN="right">JTC 1/SC 25</td><td
08</td><td>Streamezzo</td><td ALIGN="right">JTC 1/SC 29</td><td
08</td><td>Mitsubishi Electric Corporation</td><td ALIGN="right">65C</td><td
ALIGN="right">IEC 61158-3-18, IEC 61158-4-18, IEC 61158-5-18, IEC 61158-6-
18</td><td> </td></tr>
ALIGN="right">ISO/IEC 14496-20, ISO/IEC 23001-1, ISO/IEC 15938-1</td><td>
</td></tr>
31</td><td>Xerox Corporation</td><td ALIGN="right">JTC 1/SC 28</td><td
26</td><td>Brocade Communications Systems, Inc.</td><td ALIGN="right">JTC 1/SC
14</td><td>BTG International Ltd</td><td ALIGN="right">JTC 1/SC 31</td><td
14</td><td>ATMEL Germany GmbH</td><td ALIGN="right">JTC 1/SC 31</td><td
11</td><td>Alien Technology Corporation</td><td ALIGN="right">JTC 1/SC 31</td><td
09</td><td>Texas Insruments</td><td ALIGN="right">JTC 1/SC 31</td><td
20</td><td>The Chamberlain Group, Inc.</td><td ALIGN="right">TC 61</td><td
15</td><td>OMRON Corporation</td><td ALIGN="right">JTC 1/SC 31</td><td
09</td><td>Siemens AG (Erlangen)</td><td ALIGN="right">SC 22G</td><td
05</td><td>Koninklijke Philips Electronics N.V.</td><td ALIGN="right">JTC 1/SC
24</td><td>Koninklijke Philips Electronics N.V.</td><td ALIGN="right">JTC 1/SC
16</td><td>Gemplus SA</td><td ALIGN="right">JTC 1/SC 17</td><td
27</td><td>Siemens AG (Karlsruhe)</td><td ALIGN="right">65C</td><td
27</td><td>Hirschmann Automation and Control GmbH</td><td
10</td><td>Elektro Beckhoff GmbH</td><td ALIGN="right">65C</td><td
ALIGN="right">IEC/PAS 62407</td><td> </td></tr>
09</td><td>Siemens AG</td><td ALIGN="right">65C</td><td ALIGN="right">IEC/PAS
62411</td><td> </td></tr>
08</td><td>Reichle De-Messari AG</td><td ALIGN="right">86B</td><td
ALIGN="right">IEC 61754-24-1 to 6</td><td> </td></tr>
19</td><td>GP C Systems International AB</td><td ALIGN="right">ITU</td><td
ALIGN="right">ITU-R M.1371-1</td><td> </td></tr>
18</td><td>Sanyo Electric Co., Ltd.</td><td ALIGN="right">TC 100</td><td
ALIGN="right">ISO/IEC 24824-2 - ITU X.892</td><td> </td></tr>
ALIGN="right">IEC 24824-1 - ITU X.891</td><td> </td></tr>
03</td><td>Tyco Technology Resources</td><td ALIGN="right">JTC 1/SC 25</td><td
22</td><td>Harting Electronics GmbH Co. KG</td><td ALIGN="right">JTC 1/SC
21</td><td>The Siemon Company</td><td ALIGN="right">JTC 1/SC 25</td><td
15</td><td>Amphenol Socapex</td><td ALIGN="right">48B</td><td ALIGN="right">IEC
61076-3-114, IEC 61076-3-115, IEC 61076-3-116</td><td> </td></tr>
15</td><td>Toshiba Corporation</td><td ALIGN="right">65C</td><td
12</td><td>Yokogawa Electric Corporation</td><td ALIGN="right">65C</td><td
17</td><td>Actaris Measurement Systems (PTY) Ltd.</td><td ALIGN="right">TC
24</td><td>Merlin Gerin SA (Pty) Ltd t/a Conlog</td><td ALIGN="right">13</td><td
ALIGN="right">ISO/IEC 14496-5 - ITU.T H.264.2</td><td> </td></tr>
ALIGN="right">IEC 14496-10 - ITU.T H.264</td><td> </td></tr>
15</td><td>Sony Corporation</td><td ALIGN="right">JTC 1/SC 29</td><td
14</td><td>Nokia Corporation (FI)</td><td ALIGN="right">JTC 1/SC 29</td><td
ALIGN="right">ISO/IEC 14496-10 Amd 1 ITU.T H. 264, ISO/IEC 14496-4, ISO/IEC 14496-
5</td><td> </td></tr>
12</td><td>Sharp Kabushiki Kaisha</td><td ALIGN="right">JTC 1/SC 29</td><td
29</td><td ALIGN="right">IEC 14496-10 - ITU.T H.264</td><td> </td></tr>
02</td><td>Matsushita Electric Industrial Co., Ltd.</td><td ALIGN="right">JTC 1/SC
29</td><td ALIGN="right">ISO/IEC 14496-10 - ITU.T H.264</td><td> </td></tr>
16</td><td>Tandberg Telecom AS</td><td ALIGN="right">JTC 1/SC 29</td><td
13</td><td>Schneider Automation Inc.</td><td ALIGN="right">65C</td><td
07</td><td>Agilent Technologies, Inc.</td><td ALIGN="right">65C</td><td
04</td><td>Telecoria Technologies, Inc.</td><td ALIGN="right">JTC 1/SC 29</td><td
19</td><td>Fujitsu Component Limited</td><td ALIGN="right">48B</td><td
02</td><td>Harting Electric GmbH Co. KG</td><td ALIGN="right">SC 48B</td><td
19</td><td>Sony Corporation</td><td ALIGN="right">100</td><td ALIGN="right">IEC
62375</td><td> </td></tr>
30</td><td>IMV Corporation</td><td ALIGN="right">SC 47E</td><td ALIGN="right">IEC
60747-14-4 Ed. 1.0</td><td> </td></tr>
25</td><td>AIST National Institute of Advanced Industrial Science and
Technology</td><td ALIGN="right">SC 47E</td><td ALIGN="right">IEC 60747-14-4 Ed.
1.0</td><td> </td></tr>
23</td><td>Akebono Brake Industry Co., Ltd.</td><td ALIGN="right">SC 47E</td><td
18</td><td>Robert Bosch GmbH</td><td ALIGN="right">JTC 1/SC 29</td><td
13</td><td>RealNetworks,Inc</td><td ALIGN="right">JTC 1/SC 29</td><td
28</td><td>Sharp Laboratories Of America</td><td ALIGN="right">JTC 1/SC 29</td><td
28</td><td>Sharp Laboratories Of America</td><td ALIGN="right">JTC 1/SC 29</td><td
21</td><td>The Siemon Company</td><td ALIGN="right">48B</td><td ALIGN="right">IEC
61076-3-106</td><td> </td></tr>
14496-10 - ITU.T. H.264</td><td> </td></tr>
31</td><td>Thomson Licensing S.A</td><td ALIGN="right">JTC 1/SC 29</td><td
13</td><td>Fraunhofer Institut Fur Nachrichtentechnik</td><td ALIGN="right">JTC
1/SC 29</td><td ALIGN="right">ISO/IEC 14496-10 - ITU-T H.264</td><td> </td></tr>
24</td><td>Sony Corporation</td><td ALIGN="right">48B</td><td ALIGN="right">IEC
61076-3-112</td><td> </td></tr>
18</td><td>Eastman Kodak</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC
61966-2-2 Ed. 1.0</td><td> </td></tr>
22</td><td>Tyco Electronics Corp.</td><td ALIGN="right">86B</td><td
ALIGN="right">61755-3</td><td> </td></tr>
14</td><td>The Siemon Company</td><td ALIGN="right">48B</td><td
ALIGN="right">IEC/PAS 61076-3-104, IEC 61076-3-104, IEC/PAS 61076-3-111, IEC 61076-
3-106</td><td> </td></tr>
18</td><td>Microsoft Corporation</td><td ALIGN="right">TC 100</td><td
19</td><td>3M</td><td ALIGN="right">86B</td><td ALIGN="right">61754-19</td><td>
</td></tr>
15</td><td>ICL</td><td ALIGN="right">TC 57</td><td ALIGN="right">IEC 61970-301
Ed. 2.0</td><td> </td></tr>
12</td><td>BKS Engineering AG</td><td ALIGN="right">JTC 1/SC 25</td><td
ALIGN="right">IEC N 539</td><td> </td></tr>
01</td><td>Lucent</td><td ALIGN="right">All</td><td ALIGN="right">All</td><td>
</td></tr>
23</td><td>Alcatel</td><td ALIGN="right">SC 48B</td><td ALIGN="right">IEC 60603-
7-1 Ed. 1.0</td><td> </td></tr>
23</td><td>Alcatel</td><td ALIGN="right">SC 25</td><td ALIGN="right">ISO/IEC
11801</td><td> </td></tr>
28</td><td>Philips</td><td ALIGN="right">-</td><td ALIGN="right">OPIMA</td><td>
</td></tr>
13</td><td>Honeywell</td><td ALIGN="right">SC 121A</td><td ALIGN="right">IEC
62026-5 Ed. 1.0</td><td> </td></tr>
15</td><td>Alcatel Lucent</td><td ALIGN="right">86B</td><td ALIGN="right">-
</td><td> </td></tr>
08</td><td>Hewlett-Packard</td><td ALIGN="right">86C</td><td ALIGN="right">1290-
3-X</td><td> </td></tr>
ALIGN="right">86B</td><td ALIGN="right">IEC 61754-7</td><td> </td></tr>
13</td><td>Alcatel Lucent</td><td ALIGN="right">86A</td><td ALIGN="right">IEC SC
864/32ZNP</td><td> </td></tr>
03</td><td>Diamond SA</td><td ALIGN="right">86B</td><td ALIGN="right">E-
2000</td><td> </td></tr>
26</td><td>3M</td><td ALIGN="right">86B</td><td ALIGN="right">61754-4 APC
Ferrule</td><td> </td></tr>
28</td><td>AT T</td><td ALIGN="right">-</td><td ALIGN="right">-</td><td>
</td></tr>
29</td><td>Koninklijke Philips Electronics N. V.</td><td ALIGN="right">TC
07</td><td>Sony</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC 61120-1
Ed. 1.0</td><td> </td></tr>
15</td><td>Mitsubishi Electric Corporation</td><td ALIGN="right">TC 100</td><td
19</td><td>Koninklijke Philips Electronics N. V.</td><td ALIGN="right">60B /
100</td><td ALIGN="right">V-2000</td><td> </td></tr>
10</td><td>JVC</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC 60774-1 Ed.
1.0</td><td> </td></tr>
09</td><td>Sony</td><td ALIGN="right">TC 100</td><td ALIGN="right">IEC 60766 Ed.
1.0</td><td> </td></tr>
11</td><td>Hewlett-Packard</td><td ALIGN="right">66</td><td
ALIGN="right">66(CO)22</td><td> </td></tr>
26</td><td>Telefonaktiebolaget LM Ericsson (publ)</td><td ALIGN="right">51</td><td
</table>

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