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Product
Selection
Guide

Optoelectronics & Photonics

www.macom.com
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Optoelectronics & Photonics


Products to meet the growing demand for data capacity

MACOM supports a large portfolio of electronic components, lasers, and photodiodes for

optical communications from long haul core networks to cloud datacenter networks to

FTTx access networks. The portfolio addresses the high performance analog interfaces

between electrical and optical domains, and provides solutions to meet the demanding size,

power and signal integrity requirements of today’s high speed networks—which are

expanding to meet the continuously growing demand for data capacity. These products

include high performance modulator drivers; transimpedance amplifiers; clock/data

recovery circuits; APD; PIN photodiodes; FP and DFB lasers; Silicon Photonics; PAM4 PHYs;

TOSAs and ROSAs for datacenter, enterprise, and telecom optical systems operating up to

400 Gbps and beyond. For FTTx, MACOM has the broadest portfolio of lasers, laser drivers,

limiting amplifiers, APD, PIN photodiodes, and TIAs covering systems from GPON,

EPON to XG-PON.
Limiting Driver

Linear Driver
Linear Driver
Limiting TIA
Laser Diode

Photodiode
PAM4 PHYs
DML Driver
TX/RX CDR

EML Driver

Linear TIA
4x64GG
25G PIN

4x32G

4x32G

GPPO Module

Surface Mount
Die
2 100G Client Side 100G Line Side
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Optoelectronics & Photonics


Enabling bandwidth density in optical networks

MACOM Products
> Lasers > CDRs > TOSA/ROSA
> L-PIC™ Silicon Photonics > PMDs > OTN–Framer and Mapper
> Physical Media Devices > TIAs > PAM-4 PHY
> Crosspoint Switches > Modulator Drivers > MACsec
> Limiting Amplifiers

MACOM Technologies
> SiPh > SAEFT™ > GaAs
> InP > CMOS > SiGe

MACOM Markets

FTTx/PON Wireless Fronthaul/ Cloud Data Center Metro Long Haul


Backhaul

Data Center

40–100 Kilometers Data Center


> 100 Kilometers
Backhaul
CPRI
Data Center

FTTx/PON Data Center

MACOM Technologies and Products Intra Data Center


in Optical & Photonic Content
Burst Mode Driver +

Limiting/Linear TIA

Limiting Amplifier

Limiting Amplifier
Limiting Amplifier

Burst Mode TIA

Post Amplifier

Laser Driver +

Laser Driver +
EML Driver +

EML Driver +
Limiting TIA

Laser Driver
Laser Diode

Burst Mode
Laser Diode

Laser Diode
APD & PIN

Dual CDRs

Dual CDRs
PIN Diode

Die Die

QFN Package QFN Package

PON ONU Side PON OLT Side For 100 Mbps to 12 Gbps SFP+/XFP and SFP/CSFP/QSFP+
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MACOM Optoelectronic & Photonic Technologies


Creating innovative design solutions to solve complex challenges

Indium Phosphide (InP) CMOS


MACOM has assumed a key position in the market as a MACOM utilizes CMOS technology extensively for
premier supplier of both photonic devices such as lasers, design in a range of applications from wireless infrastruc-
and optoelectronics products such as high speed modulator ture basestations to aerospace and defense, to include the
drivers, based on InP technology. Key applications IEEE 802.1AE MACsec Standard, which solves the security
include laser diodes for silicon photonics, data centers, issues of Ethernet networks by providing confidentiality,
mobile backhaul, access networks and metro markets, and authenticity and integrity of data. Enabling high-speed
modulator drivers for 100G and 400G coherent networks, data transmission, typical products and applications
metro networks and data centers. include PAM-4 PHYs, MACsec, mobile phones, cellular
basestations/wireless infrastructure, satellite radio,
Self-Aligning Etched Facet (SAEFT™)
GPS and DAB, 2.4 GHz and 5.0 GHz WLAN, VSAT, CATV
MACOM’s lasers are attached to the silicon PIC using and broadband, commercial and military radar, and
MACOM’s patented Self-Aligning Etched Facet (SAEFT™) multi-market applications.
technology for precision assembly and
alignment of lasers to silicon photonic Silicon Germanium (SiGe)
waveguides. This self-aligning laser attach technology is Building upon a long history in designing integrated
enabled by MACOM’s patented etched facet lasers and circuits and subsystems for radar and mmW markets,
completely eliminates the costly manufacturing steps of MACOM leads the way in applying SiGe BiCMOS
actively aligning lasers, photomonitor diodes, and lenses technology to both commercial and military needs.
in the production of TOSA products. MACOM’s L-PIC™ We see SiGe as a high value, differentiating technology
transmitters are shipped with lasers already attached to which we will continue to leverage in MACOM’s core
the silicon photonic circuit. product segments. Key applications include high-speed
optical network transceivers, basestations, wired broad-
Silicon Photonics (SiPh)
band communications, high speed crosspoint switches
Silicon-based Photonic Integrated Circuits (PICs) is an and global positioning systems.
emerging technology that uses crystalline semiconductor
wafers as the platform for the integration of active and Gallium Arsenide (GaAs)
passive photonic circuits to provide a complete TOSA or For over three decades, MACOM has been the world
ROSA optical path on a single chip. MACOM’s silicon PIC leader in the advancement of GaAs technology,
platform enables innovative solutions with the benefits producing state-of-the-art, high performance discrete
of high-density, low-cost and performance scalability by devices, control components, mixed signal processing
integrating lasers, photodetectors, optical modulators, and converters, driver amplifiers, CATV amplifiers, LNAs
and multiplexers onto a single chip. Along with an and power amplifiers as single purpose and multi-function
optimized quad modulator driver and a PIC controller IC, MMICs. Key applications include wireless backhaul,
this chipset solution has been developed for 100G industrial, scientific and medical, global positioning system,
CWDM4 and 200G/400G PAM4 CATV and wired broadband, aerospace and defense, and
Datacom applications. satellite communications.
Rx TIA/CDR
Photodetectors R-PIC™ Receiver
SiPh Controller ASICs
Demultiplexer
Tx Driver SM Optical Fiber

CW Lasers Input

Modulators Output
Multiplexer L-PIC™ Transmitter '
4
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MACOM Evaluation Modules and Reference Design Kits


Enhance new product development, reduce costs and optimize time-to-market

In addition to the support of our world-class application team, MACOM offers a number of custom reference
design kits, evaluation modules (EVM) and design guides which enhance the development of new products,
reduce costs and optimize time-to-market.

MACOM evaluation modules provide customers with a vehicle to test product features, measure product
performance, and help design the product into their application. From backplanes to line cards and
optical modules, MACOM reference design kits and EVMs are built to ease the evaluation of our latest solutions
into the application environments of our customers and partners.

We package these offerings with our extensive GUI support as well. In addition to the EVM module and
the required software and user guide, schematics of circuit boards and modules, and supporting documents
are provided.

From low-speed solutions to those operating at 100G and above, MACOM offers hardware expertise and design
support to enable innovative, next-generation optical products in a wide variety of markets.

Contact the MACOM Sales team to learn more.

5
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Optoelectronics & Photonics

Data Center: QSFP28 and SR4


TOSA:
Lasers
TOSA: FBT4820AG 127D-25G-LCT11 ROSA: FBR4102PB
129D-25G-LCT11
Driver CDR
131D-25G-LCT11 TIA
Driver CDR
133D-25G-LCT11
1295-25B-LCT11-S3
1300-25B-LCT11-S3
1304-25B-LCT11-S3
1309-25B-LCT11-S3
Drivers
Driver CDR MAOM-002301 TIA
Driver CDR
MAOM-002304
MALD-37x45
Digital

*DEMUX
*MUX

Control
Optical Electrical Optical Electrical
Chip
CDRs
Driver CDR
M37049 TIA
Driver CDR
MALD-37030
MALD-37031
MASC-37048
Digital Control Chip
MAMF-011039
Driver CDR TIA
Driver CDR
ROSA:
TIAs
M03102
MATA-37x44
M03100
M03101 * DEMUX is not used for SR4, PSM4
* MUX is not used for SR4, PSM4
CDRs
M37046

Long Haul Metro MATA-003806

Coherent Receiver

Dual Polarization TIA


I
X
Q TIA
90%
Polarization Optical
I Controller Hybrid
Laser Y TIA
Q

TIA

Quad Channel Drivers


MAOM-003427 MAOM-003107 MAOM-03409D
MAOM-003405 MAOM-006417 MAOM-003415
MAOM-003407 MAOM-03404A MAOM-003417
MAOM-003414 MAOM-03409B MAOM-03417B

DAC DAC DAC DAC ADC ADC ADC ADC

DSP Engine

Coherent ASIC

6
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Optoelectronics & Photonics

400 Gbps Module 100 Gbps Module


QSFP-DD or OSFP Single Lambda QSFP28 for 2 km

53 GB Driver

53 GB Driver
PAM-4 PHY
4 x 25.8 GBit

NRZ Electrical
Driver
Host Side

4x 25 Gbps
Optical
MAOM-005411
53 GB Driver
MAOM-005311 to
1 x 53 GB
4 xWDM MUX *

Line Side

53 GB TIA MATP-10025
53 GB Driver
MATP-10026
TIA
MATA-03819
MATA-03919

PAM-4
8 x 26 GB PAM-4 Electrical

53 GB Driver PHY
8 x 26 GB
Host Side DML Laser
Optical

to 127D-10I-LT5AC-504
4 x 53 GB 133D-10I-LT5AC-504
Line Side Fiber Fronthaul 127D-10G-LT5AC-S
CPRI 133D-10G-LT5AC-S Chipset
53 GB TIA 131D-10G-LT5RC-S (Laser Driver +
131D-10I-LT5RC-504 Post Amplifier
MATP-40050 + DDMI)
MATP-40051 M02193
Laser
Driver

53 GB TIA
4 x WDM DEMUX *

DDMI
Optical Electrical
M02131

Post
TIA Amp
53 GB TIA

PD

53 GB TIA
Fiber Backhaul
SFP28 Long Reach Integrated CDR + Driver
MALD-37030
MALD-37031
DML Laser MAOM-002301
* MUX/DEMUX is not used for DR4 131D-25G-LCT11-502

TOSA: ROSA: PHY: Driver


MAOM-38051 MATA-005817 MATP-10025
Tx and Rx CDR

MAOM-38053 TIAs MATP-10026


MASC-38040
MATA-03819
MATP-40050 Optical Electrical
MATP-40051
Driver MATA-03919
MAOM-005411

TIA
Tx and Rx CDR
M03002 MASC-37028
PD MASC-37029

7
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Optoelectronics & Photonics

BOSA-on-Board for PON/FTTx Silicon Photonics for CWDM4

ROSA
Quad Quad
L-PIC™ R-PIC™
Electrical Channel Optical Channel Electrical

GPON Combo Chip


Transmitter Receiver
TIA
TIA CDR/Driver TIA/CDR
M02015
M02016
M02027
M02029
TOSA

Quad Channel SiPh SiPh Quad Channel


CDR/Driver Controller Controller TIA/CDR
MASC-37053A MATA-37244
Optical SiPh Controller SiPh Controller
Bidirectional MAMF-011095 MAMF-011095

Lasers GPON L-PIC™ Transmitter R-PIC™ Receiver


131D-02E-VT5TB-501 Combo Chip MAOP-L284CN MAOP-R284CN
131D-02E-VT5TB-502 M02098 (Integrated CW (Integrated DEMUX
131D-02E-VT5TB-503 M02099 lasers, monitor and photodectors)
131A-021-AT4GR-501 M02100 diodes, modulators,
131P-021-ST4GP MUX)
131F-021-KT5SB

Crosspoints Backplane/Midplane
Line Card Switch Card
CDRs, Signal Crosspoints
Conditioners &
Backplane Drivers SFP 6.5 Gbps # Channels
M23636 36
6.5 Gbps # Channels SFP+ M21148 48
M21450 2 NPU/ M21147 80
M21030 4 XFP ASIC M21167 160
M21451 4
M21452 8 QSFP+ 12.5 Gbps
M21462 8 M21024 24
M21453 12 SFP28 M21036 36
M21463 12 M21048 48
QSFP28 M21080 80
10 Gbps NPU/ M21601 120
M21440 8 CFP24 ASIC M21605 160
M21441 12 CXP
28 Gbps
28 Gbps MAXP-37161 16
MAXP-37161 16

8
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Optoelectronics & Photonics

Drivers, TIAs, and Retimers for Short Reach VCSEL for Data Center Interconnect

Part Max Data Rate Channels Optical Reach Input/Output Package Type
Number Description (Gbps) (#) Interface Type (m) Interface and Size (mm)

MATA-37044 Quad 4 x 28G TIA and CDR 28 4 GS 300 Single-ended/ Die 2 x 3


– 250um spacing Differential
MATA-37244 Quad 4 x 28G TIA and CDR 28 4 GSG 300 Single-ended/ Die 2 x 3
– 250um spacing Supports 24.3 Gbps Differential
MALD-37045 Quad 4 x 28G Driver and CDR 28 4 GS 300 Differential/ Die 2 x 3
– 250um spacing Single-ended

MATA-37144 Quad 4 x 28G TIA and CDR 28 4 GS 300 Single-ended/ Die 2 x 3


– 250um spacing Differential
MALD-37145 Quad 4 x 28G Driver and CDR 28 4 GS 300 Differential/ Die 2 x 3
– 250um spacing Single-ended

MATA-37344 Quad 4 x 28G TIA 28 4 GS 300 Single-ended/ Die 2 x 3


– 250um spacing Differential
MALD-37345 Quad 4 x 28G Driver 28 4 GS 300 Differential/ Die 2 x 3
– 250um spacing Single-ended

MATA-37444 Quad 4 x 28G TIA and CDR for CPRI 28 4 GS 300 Single-ended/ Die 2 x 3
– 250um spacing Differential
MATA-37442 Quad 4 x 28G TIA and CDR for CPRI 28 4 GSG 300 Single-ended/ Die 2 x 3
– 250um spacing Supports 24.3 Gbps Differential
MALD-37445 Quad 4 x 28G Driver and CDR for CPRI 28 4 GS 300 Differential/ Die 2 x 3
– 250um spacingSupports 24.3 Gbps Single-ended

MATA-37644 Single 28G TIA and CDR 28 1 GS 300 Single-ended/ Die 1.4 x 2.3
– 250um spacing Differential
MALD-37645 Single 28G Driver and CDR 28 1 GS 300 Differential/ Die 1.4 x 2.3
– 250um spacing Single-ended

Drivers, Retimers, TIAs, Lasers, and TOSA/ROSA for Long Reach DML/EML Data Center Interconnect & Client Side (LR4, ER4)
Data Rate Max Output Max Input/Output Package Type
Part Max Channels Voltage Small Signal Interface and Size
Number Description (Gbps) (#) (Vpp) Gain (dB) (mm)

MAOM-003115 Linear EML Driver 28 1 2 10 Differential/ SMT 4 x 4 x 1.3


Single-ended
MAOM-003419 Quad Channel Linear EML Driver 28 4 2 12 Differential/ SMT 6 x 9.1 x 1.33
Single-ended
M37047 Four Channel 25G / 28G CDR with EML Driver 28 4 1.2 — Differential/ CSP 4 x 4.5
Single-ended
M37040 Quad Channel 25G/28G CDR 28 4 0.9 — Differential/ LFGA
with Integrated Limiting Amplifier Differential
M37046 Quad Channel 25G/28G CDR 28 4 0.9 — Differential/ CSP
with Integrated Limiting Amplifier Differential
MAOM-37051A Quad Channel 25/28 Gbps CDR 28 4 2.5 0.1 Differential/ SMT 11 x 7 x 1.4
with EML Driver Single-ended
MAOM-037057 Quad Channel 25/28 Gbps CDR 28 4 2 0.1 Differential/ SMT 5.6 x 9.6 x 1.33
with EML Driver Single-ended
M37049 Quad 4 x 28G Transmit CDR 28 4 1.1 — Differential/ CSP
Differential
MAOM-002301 28 Gbps DML Driver 28 1 80 100 Differential/ Die 0.878 x 1.378 x 0.1
Single-ended
MAOM-002304 Quad Channel 28 Gbps DML Driver 28 4 80 100 Differential/ Die 2.978 x 1.378 x 0.1
Single-ended
MASC-37446 Quad Channel 25G/28G CDR 28 4 0.9 — Differential/ CSP
with Integrated Limiting Amplifier for CPRI Differential
MASC-37448 Quad 4 x 28G Transmit CDR for CPRI 28 4 1.1 — Differential/ CSP
Differential
9
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Optoelectronics & Photonics

Drivers, Retimers, TIAs, Lasers, and TOSA/ROSA for Long Reach DML/EML Data Center Interconnect & Client Side (LR4, ER4) (continued)

Data Rate Max Output Max Input/Output Package Type


Part Max Channels Voltage Small Signal Interface and Size
Number Description (Gbps) (#) (Vpp) Gain (dB) (mm)

MASC-37048 Quad 4 x 28G Transmit CDR 28 4 1.1 — Differential/ CSP


Differential
MAOM-002301 28 Gbps DML Driver 28 1 80 100 Differential/ Die 0.878 x 1.378 x 0.1
Single-ended
MAOM-002304 Quad Channel 28 Gbps DML Driver 28 4 80 100 Differential/ Die 2.978 x 1.378 x 0.1
Single-ended
MAOM-003401 Quad Channel 28 Gbps EML Driver 28 4 1.8 0.7 Differential/ SMT 10 x 10 x 1.4
Single-ended
MAOM-002203 28 Gbps EML Driver 28 1 2.5 0.5 Differential/ SMT 4 x 4 x2.3
Single-ended
MAOM-002200 28 Gbps EML Driver 28 1 2.5 0.5 Differential/ SMT 4 x 4 x 1.45
Single-ended
MAOM-37447 Quad Channel 25G / 28G CDR 28 4 1.2 — Differential/ CSP 4 x 4.5
with EML Driver for CPRI Single-ended

MAOM-38051 4 x 28 GBaud PAM-4 CDR + Driver CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS
MAOM-38053 4 x 28 GBaud PAM-4 CDR + Driver CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS
MATA-003817 Single PAM-4 28 GBaud TIA CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS
MATA-03819 4 x PAM-4 TIA CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS
MATA-03919 4 x PAM-4 TIA for APD CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS
MASC-38040 4 x 28 GBaud PAM-4 CDR CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS
MATA-005817 Single 53 GBaud TIA CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS
MAOT-011000 100G CWDM4 TOSA CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS
MAOR-011000 100G CWDM4 ROSA CONTACT APPLICATIONS FOR COMPLETE SPECIFICATIONS

Data Rate Input/Output Package Type


Part Max Channels Transimpedance Bandwidth Interface and Size
Number Description (Gbps) (#) (kΩ) (GHz) (mm)

MO3100 TIA – 250um spacing 28 4 2.9 21 SIngle-ended/ Die 1.52 x 2.22


Differential
MO3101 TIA – 500um spacing 28 4 2.9 21 SIngle-ended/ Die 1.57 x 2.66
Differential
M03102 TIA – 750um spacing 28 4 2.9 21 Single-ended/ Die 1.57 x 3.41
Differential

Part Max Data Rate Wavelength Temp Options


Number Description (Gbps) (nm) (°) Package Type

127D-25G-LCT11 Die, Laser, 25G DFB, 1270 -3.5 nm / +2.5 nm, Chip on Tape 25 1270 -5 to 85 Die
129D-25G-LCT11 Die, Laser, 25G DFB, 1290 -3.5 nm / +2.5 nm, Chip on Tape 25 1290 -5 to 85 Die
131D-25G-LCT11 Die, Laser, 25G DFB, 1310 -3.5 nm / +2.5 nm, Chip on Tape 25 1310 -5 to 85 Die
133D-25G-LCT11 Die, Laser, 25G DFB, 1330 -3.5 nm / +2.5 nm, Chip on Tape 25 1330 -5 to 85 Die
1295-25B-LCT11-S3 Die, Laser, 25G DFB, 1295.56 ± 1 nm, Chip on Tape 25 1295.56 0 to 50 Die
1300-25B-LCT11-S3 Die, Laser, 25G DFB, 1300.05 ± 1 nm, Chip on Tape 25 1300.05 0 to 50 Die
1304-25B-LCT11-S3 Die, Laser, 25G DFB, 1304.58 ± 1 nm, Chip on Tape 25 1304.58 0 to 50 Die
1309-25B-LCT11-S3 Die, Laser, 25G DFB, 1309.14 ± 1 nm, Chip on Tape 25 1309.14 0 to 50 Die

Part Max Data Rate Channels Reach Input/Output


Number Description (Gbps) (#) Configuration (km) Interface Package Type

FBT4820AG 100G-BASE LR4 TOSA 25.78 4 DML + Driver 10 Flex/LC Hermetic


FBR4102PB 100G-BASE LR4, OTU4 ROSA 28 4 PIN + TIA 10 Flex/LC Hermetic

10
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Optoelectronics & Photonics

Drivers and TIAs for Long Haul, Metro, and Data Center Interconnect

Data Rate Max Output Max Input/Output Package Type


Part Max Channels Voltage Small Signal Interface and Size
Number Description (Gbps) (#) (Vpp) Gain (dB) (mm)

MAOM-03404A Quad Channel 32 Gbps Limiting Differential 32 4 5 27 Differential/ SMT 14 x 9.1 x 2.3
MZ Modulator Driver Differential

MAOM-03409B Quad Channel 32 Gbps Linear Differential 32 4 4 28 Differential/ SMT 14 x 9.1 x 2.3
MZ Modulator Driver Differential

MAOM-03409D Quad Channel 32 Gbps Linear Differential 32 4 4 19 Differential/ SMT 14 x 9.1 x 2.3
MZ Modulator Driver Differential

MAOM-003415 Quad Channel 32 Gbps Limiting MZ Modulator Driver 32 4 5.5 27 Differential/ SMT 14 x 9.1 x 2.8
Single-ended

MAOM-003417 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 4.5 21 Differential/ SMT 14 x 9.1 x 2.3
Single-ended

MAOM-03417B Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 4.5 27 Differential/ SMT 14 x 9.1 x 2.8
Single-ended

MAOM-003427 Quad Channel 46 Gbps Linear MZ Modulator Driver 46 4 5 23 Differential/ SMT 14 x 19 x 2.46
Single-ended
MAOM-003405 Quad Channel 32 Gbps Limiting MZ Modulator Driver 32 4 7 27 Differential/ SMT 13 x 19 x 2.46
Single-ended
MAOM-003407 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 6 27 Differential/ SMT 13 x 19 x 2.46
Single-ended
MAOM-003414 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 6 21 Differential/ SMT/GPPO 41 x 29 x 6.4
Single-ended
MAOM-003107 Dual Channel 32 Gbps Limiting MZ Modulator Driver 32 2 8.2 30 Single-ended/ SMT 16.1 x 10.6 x 3.42
Single-ended

MAOM-006417 Quad Channe 64Gbaud Linear MZ Modulator Driver 64 4 4.5 27 Differential/ SMT 14 x 9.1 x 2.8
Single-ended

Data Rate Input/Output Package Type


Part Max Channels Transimpedance Bandwidth Interface and Size
Number Description (Gbps) (#) (kΩ) (GHz) (mm)

MATA-003806 Dual Channel Linear Differential TIA 32 2 10 23 Differential/ Die 1.562 x 1.387 x 0.275
Differential

MATA-003817 Linear TIA 28 1 5 23 SIngle-ended/ Die 1.14 x 1.47 x 0.275


Differential

MATA-005817 Linear TIA 56 1 5 35 SIngle-ended/ Die 1.14 x 1.47 x 0.275


Differential

Laser Drivers, TIAs, and Lasers for SFP28 (Wireless Mobile, Ethernet, and Fibre Channel)

Part Max Data Rate Supply Channels Max Output


Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package

MASC-37028 Dual 28G CDR with Integrated VCSEL Driver (24G to 26.5G) 28 3.3 / 1.8 1 Tx, 1 Rx 11 5 mm LGA
MASC-37029 Dual 28G CDR with Integrated VCSEL Driver (25.5G to 28.1G) 28 3.3 / 1.8 1 Tx, 1 Rx 11 5 mm LGA
MASC-37030 Dual 28G CDR with Integrated Laser Driver (24G to 26.5G) 28 3.3 1 Tx, 1 Rx 75 5 mm LGA
MASC-37031 Dual 28G CDR with Integrated Laser Driver (25.5G to 28.1G) 28 3.3 1 Tx, 1 Rx 75 5 mm LGA

Data Rate Differential Small Signal Input Input Optical Optical


Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity
Number Description (Gbps) Gain (kohm) (GHz) Current (mA p-p) (IRN, RMS nA) with PIN (dBm) with APD (dBm)

M03002 28 Gbps TIA 28 2.8 21 2.8 1.4 -18 N/A

Part Max Data Rate Wavelength Temp Options


Number Description (Gbps) (nm) (°) Package Type

131D-25G-LCT11-502 Die, Laser, 25G DFB, WL=±10 nm, Chip on Tape 25 1310 -5 to 85 Die

11
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Optoelectronics & Photonics

Data Center: 40G QSFP Lasers


Part Max Data Rate Wavelength Temp Options
Number Description (Gbps) (nm) (°) Package Type

127D-10G-LCT11-504 Die, Laser, 10G DFB, 1270 -3.5 nm / +2.5nm, Chip on Tape 10 1270 -5 to 85 Die
129D-10G-LCT11-504 Die, Laser, 10G DFB, 1290 -3.5 nm / +2.5nm, Chip on Tape 10 1290 -5 to 85 Die
131D-10G-LCT11-504 Die, Laser, 10G DFB, 1310 -3.5nm / +2.5nm, Chip on Tape 10 1310 -5 to 85 Die
133D-10G-LCT11-504 Die, Laser, 10G DFB, 1330 -3.5 nm / +2.5nm, Chip on Tape 10 1330 -5 to 85 Die

Data Center: Silicon Photonics


Part Max Data Rate Wavelength Temp Options
Number Description (Gbps) (nm) (°) Package Type

127D-00G-LCT11-20 Die, Laser, CW DFB, 20 mW, Chip on Tape — 1270 -5 to 85 Die


129D-00G-LCT11-20 Die, Laser, CW DFB, 20 mW, Chip on Tape — 1290 -5 to 85 Die
131D-00G-LCT11-20 Die, Laser, CW DFB, 20 mW, Chip on Tape — 1310 -5 to 85 Die
133D-00G-LCT11-20 Die, Laser, CW DFB, 20 mW, Chip on Tape — 1330 -5 to 85 Die
MAOP-L284CN 100G (4 x 25G) CWDM4 L-PIC™ Transmitter 100 4 lambda 0 to 85 Die
* MAOP-R284CN 100G (4 x 25G) CWDM4 R-PIC™ Receiver 100 4 lambda 0 to 85 Die
*Coming soon

GPON TIAs and Drivers

Part Max Data Rate Supply Channels Max Output


Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package

M02067 Laser Driver 2.1 3.3 1 85 4 mm QFN


M02066 Laser Driver 2.5 3.3 1 85 4 mm BCC+24L
M02090 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN
M02098 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN
M02099 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN
+ DDMI Controller & APD DC-DC Controller
M02100 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN
+ DDMI Controller & EEPROM

Data Rate Differential Small Signal Input Input Optical Optical


Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity
Number Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)

M02027 Multirate CMOS TIA with AGC 3.1 42 1.5 4 91 CONTACT MACOM
M02014 AGC Pre-Amplifier 2.488 11 1.4 4 250 -26.5 —
M02015 AGC Pre-Amplifier 2.488 9 1.4 4 290 -26 —
M02024 AGC Pre-Amplifier 2.488 51 1.27 4 180 -28 —
M02035 Burst Mode OLT TIA 2.488 3.6 1.7 1.5 250 — -33
M02013 AGC Pre-Amplifier 3.125 10 2.4 4 475 -23 —
M02025 CMOS TIA with AGC 3.2 20 1.45 4 120 -30 —
M02129 CMOS TIA with AGC 8.5 2 7.8 3 1200 -18 -25
M02036 Burst Mode GPON OLT TIA 1.25 3.8 0.8 2.5 170 — -35

12
OptoBrochure_inside pages 070517.qxp_Layout 1 7/5/17 9:51 AM Page 13

Optoelectronics & Photonics

GPON Lasers and PIN/APD

Part Max Data Rate Wavelength Temp Options


Number Description (Gbps) (nm) (°) Package Type

131D-02E-VCT11-50x Die, Laser, 2.5G DFB NFF, Small Size, Chip on Tape 2.5 1310 -20 to 85 Die
131D-02I-LCT11 Die, Laser, 2.5G Std DFB, Chip on Tape 2.5 1310 -40 to 85 Die
131A-02I-ACT11 Die, APD, 2.5G, Chip on Tape 2.5 1310 /1490 -40 to 85 Die
131P-10I-SCT11 Die, PIN for STIA, Chip on Tape 2.5 1310 /1490 -40 to 85 Die
131D-02E-VT5TB-50x TO, Laser, 2.5G DFB NFF, 2 mm Ball Lens (6.6mm FL), Pinout Type B 2.5 1310 -20 to 85 TO-56
131A-02I-AT4GR-501 TO, 2.5G APD+TIA TO-46 2.5 1310 /1490 -40 to 85 TO-46
131P-02I-ST4GP TO, PIN+STIA, 2.5G 2.5 1310 /1490 -40 to 85 TO-56

EPON TIAs and Drivers

Part Max Data Rate Supply Channels Max Output


Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package

M02067 Laser Driver 2.1 3.3 1 85 4 mm QFN


M02066 Laser Driver 2.5 3.3 1 85 4 mm BCC+24L
M02090 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN
M02098 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN
M02099 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN
+ DDMI Controller & APD DC-DC Controller
M02100 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN
+ DDMI Controller & EEPROM

Data Rate Differential Small Signal Input Input Optical Optical


Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity
Number Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)

M02016 AGC Pre-Amplifier 1.25 24 1 4 130 -29l —


M02026 CMOS TIA with AGC 1.25 112 1.05 4 120 -31 —
M02028 CMOS TIA with AGC 1.25 24 1.3 4 80 -31 —
M02038 Burst Mode GEPON OLT TIA 1.25 8.5 0.85 4 350 — -34

EPON Lasers

Part Max Data Rate Wavelength Temp Options


Number Description (Gbps) (nm) (°) Package Type

131F-02I-KCT11 Die, Laser, 2.5G FP NFF, Chip on Tape 2.5 1310 -40 to 85 Die
131F-02I-KT5SB TO, Laser, 2.5G FP NFF, 1.5 mm Ball Lens (6.6 mm FL), Pinout Type B 2.5 1310 -40 to 85 TO-56

10G-PON Laser Drivers and TIAs

Part Max Data Rate Supply Channels Max Output


Number Description (Gbps) Voltage (V) (#) Mod Current Package

M02180 Burst Mode Laser Driver/Limiting Amplifier 12.5 3.3 1 100 mA 4.5 mm QFN
+ Rx CDR + DDMI Controller
+ APD DC-DC Controller & EEPROM
M02142 Burst Mode Post Amplifier 11.3 3.3 1 — 3 mm QFN
M02172 EML Driver 11.3 3.3 1 2.5 V 5 mm QFN

Data Rate Differential Small Signal Input Input Optical Optical


Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity
Number Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)

M02139 TIA with AGC 10.312 2.5 7.5 2.5 1500 -20 -27
MATA-02135 TIA with AGC 11.3 3.5 8.2 3 860 -21 -27

13
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Optoelectronics & Photonics

Laser Drivers, Post Amplifiers, TIAs, and Lasers for SFF/SFP/SFP+ Modules (Wireless Mobile, Ethernet, Fibre Channel, SONET)
Part Max Data Rate Supply Channels Max Output
Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package

M02097 LED Driver/Limiting Amplifier 0.5 3.3, 5 1 120 5 mm QFN


M02068 622 Mbps, Laser Driver 1 3.3 1 85 4 mm BCC+24L
M02094 VCSEL/FP Laser Driver 2 3.3, 5 1 45 4 mm QFN
M02067 Laser Driver 2.1 3.3 1 85 4 mm QFN
M02066 Laser Driver 2.5 3.3 1 85 4 mm BCC+24L
M02077 Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN
M02076 Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN
+ DDMI Controller & APD DC-DC Controller
M02170 Laser Driver 11.3 3.3 1 100 5 mm QFN
M02171 Dual Loop VCSEL Driver 11.3 3.3 1 25 5 mm QFN
M02172 EML Driver 11.3 3.3 1 2.5 5 mm QFN
M02190 DML Laser Driver/Limiting Amplifier 12.5 3.3, 2.5 1 80 4.5 mm QFN
with Integrated Tx/Rx CDR
M02193 DDMI Controller + EEPROM 13.5 3.3, 2.5 1 80 4.5 mm QFN
& APD DC-DC Controller
M02095 2.5 Gbps, 3.3/5 V Laser Driver/Limiting Amplifier 1.25 3.3, 5 1 85 5 mm QFN
M02096 2.5 Gbps, 3.3/5 V Laser Driver/Limiting Amplifier 4.3 3.3, 5 1 85 5 mm QFN

Data Rate Differential Small Signal Input Input Optical Optical


Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity
Number Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)

M02006 AGC Pre-Amplifier 0.155 260 0.1 2.2 8 -39 —


M02007 AGC Pre-Amplifier 0.156 62 0.14 2.8 8 -39 —
M02009 AGC Pre-Amplifier 0.622 36 0.4 4.5 70 -32 —
M02016 AGC Pre-Amplifier 1.25 24 1 4 130 -29l —
M02026 CMOS TIA with AGC 1.25 112 1.05 4 120 -31 —
M02028 CMOS TIA with AGC 1.25 24 1.3 4 80 -31 —
M02014 AGC Pre-Amplifier 2.488 11 1.4 4 250 -26.5 —
M02015 AGC Pre-Amplifier 2.488 9 1.4 4 290 -26 —
M02024 AGC Pre-Amplifier 2.488 51 1.27 4 180 -28 —
M02035 Burst Mode OLT TIA 2.488 3.6 1.7 1.5 250 — -33
M02025 CMOS TIA with AGC 3.2 20 1.45 4 120 -30 —
M02020 CMOS TIA with AGC 4.25 3.6 3.4 4 550 -23 -29
M02139 TIA with AGC 10.312 2.5 7.5 2.5 1500 -20 -27
M02129 TIA with AGC 8.5 2 7.8 3 1200 -18 -25
M02027 Multirate CMOS TIA with AGC 3.1 42 1.5 4 91 CONTACT MACOM
MATA-02135 TIA with AGC 11.3 3.5 8.2 3 860 -21 -27

Part Max Data Rate Wavelength Temp Options


Number Description (Gbps) (nm) (°) Package Type

131F-10I-LCT11-S Die, Laser, 10G FP, Chip on Tape 10 1310 -40 to 85 Die
131F-10I-LT5K1C-S TO, Laser, 10G FP, 1.5 mm Ball Lens with Offset, Pinout Type C 10 1310 -40 to 85 TO-56
127D-10I-LCT11-504 Die, Laser, 10G DFB, Chip on Tape 10 1270 -40 to 85 Die
133D-10I-LCT11-504 Die, Laser, 10G DFB, Chip on Tape 10 1330 -40 to 85 Die
127D-10I-LT5AC-504 TO, Laser, 10G DFB, 1270±10 nm, Asph Lens, Pinout Type C 10 1270 -40 to 85 TO-56
133D-10I-LT5AC-504 TO, Laser, 10G DFB, 1330±10 nm, Asph Lens, Pinout Type C 10 1330 -40 to 85 TO-56
127D-10G-LT5AC-S TO, Laser, 10G DFB, 1270+/-10 nm Asph Lens, Pinout Type C 10 1270 -5 to 85 TO56
133D-10G-LT5AC-S TO, Laser, 10G DFB, 1330+/-10 nm Asph Lens, Pinout Type C 10 1270 -5 to 85 TO56
131F-02I-LCT11 Die, Laser, 2.5G FP, Chip on Tape 2.5 1310 -40 to 85 Die
131F-02I-LT5LB TO, Laser, 2.5G FP, 1.5 mm Ball Lens (6.35 mm FL), Pinout Type B 2.5 1310 -40 to 85 TO-56
131D-10I-LCT11-504 Die, Laser, 10G DFB, Chip on Tape 10 1310 -40 to 85 Die
131D-10G-LT5RC-S TO, Laser, 10G DFB, 2 mm Ball Lens, WL=±10 nm, Pinout Type C 10 1310 -5 to 85 TO-56
131D-10I-LT5RC-504 TO, Laser, 10G DFB, 2 mm Ball Lens, WL=±10 nm, Pinout Type C 10 1310 -40 to 85 TO-56

14
OptoBrochure_inside pages 070517.qxp_Layout 1 7/5/17 9:51 AM Page 15

Optoelectronics & Photonics

Line Cards: Crosspoints, Signal Conditioners, CDR, OTN framer/mapper, MACsec PHY
Part Switch Max Data Rate Supply Channels Embedded Embedded
Number Description Matrix Size (Gbps) Voltage (#) CDR SerDes Package

M21450 6.5 Gbps 2 x 2 Crosspoint 2x2 6.5 1.2 2 No No 6 mm 40-pin QFN


M21030 6.5 Gbps Quad Cable Driver 4x4 6.5 1.2 4 No No 6 mm 40-pin QFN
M21451 6.5 Gbps 4 x 4 Crosspoint 4x4 6.5 1.2 4 No No 6 mm 40-pin QFN
M21452 6.5 Gbps 8 x 8 Crosspoint 8x8 6.5 1.2 8 No No 10 mm 72-pin QFN
M21453 6.5 Gbps 12 x 12 Crosspoint 12 x 12 6.5 1.2 12 No No 12 mm 88-pin QFN
M23636 6.5 Gbps 36 x 36 Crosspoint 36 x 36 6.5 1.2 36 No — 23 mm 484-pin BGA
M21148 6.5 Gbps 48 x48 Crosspoint 48 x 48 6.5 1.2 48 No No 27 mm 676 pin BGA
M21147 6.5 Gbps 80 x 80 Crosspoint 80 x 80 6.5 1.2 80 No No 35 mm 1156-pin FCBGA
M21167 6.5 Gbps 160 x 160 Crosspoint 160 x 160 6.5 1.2 160 No No 35 mm 1936-pin FCBGA

M21440 10.3 Gbps 8 x 8 Crosspoint 8x8 10.312 1.2 8 Yes Yes 12 mm 88-pin QFN
M21441 10.3 Gbps 12 x 12 Crosspoint 12 x 12 10.312 1.2 12 Yes Yes 19 mm 324-pin BGA

M20001 Dual 2:1 Passive Switch 2x2 12.5 3.3 2 No No 3 mm 16-pin QFN
M21024 11.88 Gbps 24 x 24 Crosspoint 24 x 24 12.5 1.2 24 No No 21 mm 396-pin BGA
M21036 11.88 Gbps 36 x 36 Crosspoint 36 x 36 12.5 1.2 36 No No 23 mm 480-pin BGA
M21048 11.88 Gbps 48 x 48 Crosspoint 48 x 48 12.5 1.2 48 No No 27 mm672-pin BGA
M21080 12.5 Gbps 80 x 80 Crosspoint 80 x 80 12.5 1.8 80 No No 45 mm 1924-pin FCBGA
M21601 12.5 Gbps 120 x 120 Crosspoint 120 x 120 12.5 1.8 120 No No 45 mm 1924-pin FCBGA
M21605 12.5 Gbps 160 x 160 Crosspoint 160 x 160 12.5 1.8 160 No No 45 mm 1924-pin FCBGA

MAXP-37161 28G 16 x 16 Crosspoint 16 x 16 28.05 1.8 16 Yes No 15 mm 196-pin BGA


& Signal Conditioner

S10123PRIB 10G OTN framer/mapper/FEC 1x1 11.3 2.5, 1.8, 1.2 1 Yes Yes 19 mm 324-pin FCBGA
S10124PRIB 10G OTN framer/mapper/FEC 1x2 11.3 2.5, 1.8, 1.2 1 Yes Yes 25 mm 576-pin FCBGA
S10126PRIB 10G OTN framer/mapper/FEC 1x1 11.3 2.5, 1.8, 1.2 1 Yes Yes 19 mm 324-pin FCBGA

S20101PRIC1 PQ20T: 2x10G OTN framer/ 2x2 11.19 2.5, 1.2, 0.9 2 Yes Yes 35 mm 1155-pin FCBGA
mapper/FEC
S40101PRIC1 PQ40T:4x10G/40G OTN framer/ 4x4 11.19 2.5, 1.2, 0.9 4 Yes Yes 35 mm 1155-pin FCBGA
mapper/FEC
S50101PRIC1 PQ50: 5x10G/40G OTN framer/ 5x5 11.19 2.5, 1.2, 0.9 5 Yes Yes 35 mm 1155-pin FCBGA
mapper/FEC
S60101PRIC1 PQ60T: 6x10G/40G OTN framer/ 6x6 11.19 2.5, 1.2, 0.9 6 Yes Yes 35 mm 1155-pin FCBGA
mapper/FEC

S12312PRI X24: 24x10G/40G/100G OTN 24 x 24 11.2 1.8, 1.5, 1.2, 0.9 24 Yes Yes 42.5 mm 1680-pin FCBGA
& MACsec
S12411PRI X120: 12x10G/40G/100G OTN 12 x 12 28 1.8, 1.5, 1.2, 0.9 12 Yes Yes 29 mm 783-pin FCBGA
& MACsec
S12412PRI X240: 24x10G/40G/100G OTN 24 x 24 27.96 1.8, 1.5, 1.2, 0.9 24 Yes Yes 42.5 mm 1680-pin FCBGA
& MACsec

S20010PRI 100G/50G/40G/50G/25G/10G 8x8 26.56 1.8, 0.9 8 Yes Yes 17 mm 256-pin HFCBGA
MACsec, 16SA
S20020PRI 100G/50G/40G/50G/25G/10G 8x8 26.56 1.8, 0.9 8 Yes Yes 17 mm 256-pin HFCBGA
MACsec, 512SA
MATP-10025/6 Prism: 100G Serial PAM4 PHY with FEC 1x1 106.25 1.8, 1.0, 0.75 1 Yes Yes 10 mm 196-pin HFCBGA
MATP-40050/1 Prism4: 4x100G PAM4 PHY 4x4 106.25 1.8, 1.0, 0.75 4 Yes Yes 11 mm 400-pin HFCBGA
for Optical Modules
S28010PRIB1 100Gbps Gearbox: CAUI-10 to CAUI-4 1x1 27.96 2.5, 1.2, 0.9 1 Yes Yes 17 mm 248-pin HFCBGA
S28110PRIA1 100Gbps Gearbox with CAUI-10 10 x 10 27.96 2.5, 1.2, 0.9 10 Yes Yes 19 mm 324-pin HFCBGA
Retimer Mode
S28115PRIA1 100Gbps Multi-Link Gearbox 10 x 10 25.78 2.5, 1.2, 0.9 10 Yes Yes 19 mm 324-pin HFCBGA
QT2025PRKDB 10GE Serial to XAUI PHY 1x1 10.52 1.8, 1.2 1 Yes Yes 13 mm 144-pin PBGA
for 10GBASE-LRM, LR, SR, 10GBASE-KR
QT2225PRKDB Dual 10GE Serial-to-XAUI PHY 2x2 10.52 1.8, 1.2 2 Yes Yes 23 mm 484-pin BGA
for SFP+ and Serial Backplane

15
rev Opto pkgs_062117.qxp_Layout 1 6/21/17 11:13 AM Page 1

Package Guide

Optoelectronics Photonics

4 x 4.5 mm CSP Die


3 mm QFN
4 mm QFN
5 mm QFN
10 mm 72-pin QFN
TO-Can TO56, TO46

Surface Mount Devices (SMD)

L-PIC™ Silicon Photonic Die

Modules

Ethernet PHYs and OTN Framers

PQX S28010

Crosspoint Switches
Yahara S28110
3 mm QFN
4 mm 24-pin QFN
6 mm 10-pin QFN
10 mm 72-pin QFN
12 mm 88-pin QFN

17 mm 252-pin BGA ES200 S28115


19 mm 324-pin BGA
21 mm 484-pin/ 1 924-pin BGA
23 mm 484-pin / 1924-pin BGA
23 mm 404-pin PBGA
27 mm 676-pin BGA
X240 QT2225
34 mm PBGA
35 mm 1156-pin BGA
35 mm 676-pin TEPBGA
35 mm 1936-pin FCBGA
50 mm 2389-pin BGA

MATP-10025/6  QT2025
TOSA & ROSA (Optical Sub Assemblies) MATP-40050/1
OptoBrochure_inside pages 062117_r29.qxp_Layout 1 6/21/17 11:07 AM Page 16

Additional product information can be found on our website at


www.macom.com

Contact our worldwide sales offices, authorized representatives,


and industry-leading distributors to request samples, test boards,
and application support.

All contacts are listed on our website at:


www.macom.com/purchases

MACOM Technology Solutions Inc.


Lowell, Massachusetts 01851
North America 800.366.2266 • Europe +353.21.244.6400
India +91.80.43537383 • China (Shanghai) +86.21.5108.6464
www.macom.com

MTS-L-rev062017