Printed Circuit Board

Fabrication And Assembly

Copyright © 2004
D. L. Gould & Niagara College

Niagara College -Technology

 Design Factors for Printed
Circuit Boards
l Familiarization with darkroom procedures
l Chemicals for PCB fabrication
l Board selection
l Shearing and drilling the printed circuit
l Component identification and variation
l Component mounting techniques
l Device mounting techniques
Chemicals And The Darkroom

l M.G. Chemicals Developer

l Sodium Persulphate
l (Mercuric Chloride Activator)
 Board Selection

l Insulating base material - Grade Fr-4. Glass

cloth reinforced with epoxy resin with the
addition of flame retardant.
l Conducting foil material - 1 oz. copper foil
with an approximate thickness of 0.0014 in.
and a current carrying capacity from 0.50
amps to 6.00 amps depending on the
conductor width - 0.005 to 0.200 in.
 Shearing And Drilling
l Layout the dimensions of the board on the clear
acetate shielding using a fine point permanent marker.
l Shear foil side up to avoid tearing the foil, from the
insulating base material.
l Inspect all hole registrations following p.c.b.
fabrication and lightly centre punch if required.
l Typical drill sizes: (drill all holes #70)
• resistors & IC sockets - #70
• machine sockets - #60
• diodes & LEDs - #60
• FTP sockets - #60 & 1.5mm
 Component Lead Prep.
l Remove oxidation from the component leads.
l Set the bend allowance in all axial lead
components.
l Reposition leads of components (transistors,
SCRs, triacs etc.) as required for insertion in the
printed circuit board.
l Reset the rows of pins on D.I.P. packages to allow
insertion in printed circuit boards and IC sockets.
 Component Mounting
l Component identification and mounting:
• Axial lead components
• Radial lead components
Incorrect
Radial
Foil
Correct Radial Mount Mount
Service Clinch

Full Clinch Axial in confined area

Component Mounting
Component Mounting
Component Mounting
Component Mounting
 Component Mounting
l Use a third hand to support the p.c.b.
l All components mount on the insulating base
side of the p.c.b.
l Mount the small axial lead components first
l Components that do not dissipate more than 1 watt are
mounted flush against the p.c.b.
l Large heavy components must be fitted with a clamp
to provide support
l Components that generate more than 1 watt should be
mounted half the diameter of the component body
above the p.c.b.
 Component Mounting
l Device sockets should be used when possible to allow for
easy service and minimize component damage.
l All components should be oriented in the same direction
to facilitate reading component identification
l Special attention must be paid to components with a
notch, number, letter, or polarity, used for orientation
l Heat sinks are used on components which generate heat
that normal air convection does not remove
l Position components with identification turned up on the
surface of the p.c.b. to assist with future service
 Device Mounting
l TO220 package to a heat sink & chassis
3mm
Mica
Washer

Shoulder Chassis
Heat Sink Washer
3mm
 Device Mounting
l TO3 package to a chassis or p.c.b.
4mm

TO3

Thermal Compound

Chassis or P.C.B.

Shoulder Washer 4mm

 Summary
l MSDS sheets on chemicals for printed circuits.
l Typical printed circuit board material.
l P.C. drills must match hole registrations
l All axial lead components require a bend allowance
l A service clinch should be used on all components
l Almost all components mount flush to the board
l Components with metal bodies require special mounts
 Where to get more
information
l Electronic Fabrication Second Edition
by Gordon Shimizu
l Electronic Project Design and Fabrication Third Edition
by Ronald A. Reis
l Electronic Techniques Shop Practices and Construction
Fifth Edition
by Robert S. Villanucci.
l Electronics Construction
l Printed Circuit Design