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Experimental Methods
A microrolling device was used to perform roll bonding
assisted by electrical current on commercially pure 1100 series Al Fig. 2 (a) Schematic, showing illustration of the peel test of Al/
and C110 copper sheets having a 127 lm initial thickness in order Cu roll bonded sheets being pulled by a microtensile machine
to fabricate micro Al/Cu laminates. This is a well-controlled pro- and (b) peeling force profiles of electrically assisted Al/Cu roll
cess, the details of which can be found in previous articles in bonded samples for 0 A, 50 A, and 150 A applied currents. Data
Ref. [11]. Roll bonding was performed in a plane strain condition belong to the peel test of the roll bonded sheets by 50% thick-
ness reduction.
where the starting sheets are in the form of strips with approxi-
mately 10 mm width and several cm lengths [11]. Before roll
bonding, the surface of the sheets was prepared through cleaning/ It must be noted that during EARB, electrical current was
degreasing steps by acetone followed by wire brushing. The afore- passed through the sheets from the upper to the lower rolls. Here,
mentioned steps were consistent for all specimens in this study we examined the effects that arise by current application corre-
and are generally critical to enhancing roll bonding and improving sponding to current levels of 0 A, 50 A, and 150 A [11]. To evalu-
process performance [11]. Roll bonding was performed on the ate the bonding strength for different levels of applied current
sheets to obtain 50% thickness reduction. Figure 1(a) schemati- during roll bonding, peel tests were conducted on laminate com-
cally illustrates the EARB process steps. posites following the ASTM D1876T-Peel test, standardized for
A special tactic was used to prevent thin sheet slippage during small scale laminated sheets using a micro-uniaxial tensile
roll bonding because of the small mass of inertia of the thin machine, schematically shown in Fig. 2(a). The peeling rate was
sheets. The thin sheets were “clipped” together by a folded 0.1 mm/s. More details of this experimentation can be found in
stainless steel sheet, as shown in Fig. 1(b). Beside relative sheet Ref. [11] of a previous study. Figure 2(b) shows the peeling force
slippage prevention, the “clip” also made the sheet stack thicker profiles for roll bonded samples under the imposition of different
to achieve high thickness reduction, which was originally limited levels of electrical current.
by the machine roll gap setting limitation. The stainless steel clip Back-scattered electron detector (BSE)/EDS analysis and frac-
has a higher stiffness than that of Al and Cu, compression can be tography of Al and Cu peeled surfaces was performed using a
transferred to the roll bonded materials effectively. Quanta 600 SEM with 10 kV accelerating voltage and a 10 mm
working distance. Surface roughness of Al/Cu sheets was meas- response of Al/Cu sheets during roll bonding as well as peel test-
ured using a Zygo three-dimensional optical surface profiler ing for different levels of the applied current [11].
before and after brushing. Roll bonding on Al/Cu microsheets revealed a decreasing trend
for required force with increasing current; F150A < F50A ffi F0A
[11]. It was argued that this difference is related to heat generated
Results and Discussion during rolling due to the plastic deformation and applied current
simultaneously. Temperature rise due to Joule heating can be
Energy Dispersive Analysis of Peeled Al/Cu Fractured found based on equation: DT ¼ ððqE J 2 tÞ=ðqCp ÞÞ, where DT is the
Surfaces. Figure 3 shows the BSE imaging of the peeled surfaces adiabatic temperature rise, J is the current density, and t is the cur-
of laminates in both Al and Cu-sides for all three rolling conditions: rent pulse duration. Here, qE , q, Cp are material parameters
(0 A, 50 A, and 150 A applied current). It is seen that Cu on the Al- including: electrical resistivity, density, and specific heat capacity
side (Figs. 3(a)–3(c)) appears as circular shaped particles having [17]. Current density, J, can be found by dividing the current
different sizes ranging from 5 to 20 lm. The Cu particles are fairly amplitude to the current passing area which is defined as the
well distributed on the surface (arrow in Fig. 3(b) as an example). roll-workpiece contact area. Contact area is dependent on the
Morphological assessment indicates the Al sheet has a rough workpiece thickness reduction which is 50%.
surface indicative of ductile fracture (Figs. 3(a)–3(c), high magni- Herein, theoretical calculations of temperature rise also included
fication BSE images). Ductile fractured surfaces typically appear the heating effect of the stainless steel clip, treating the workpiece
rough and irregular, consisting of many microvoids and dimples as a composite material by considering the volume fraction of
[16] as indicated by the arrow in Fig. 3(b) as an example. each material. Theoretical estimation shows that the temperature
Figures 3(d)–3(f) show the fractography results for the Cu reaches around 350 C (623 K) for 150 A and close to 50 C
sheet. BSE imaging shows evidence of Al presence on the Cu-side (323 K) for 50 A [11], assuming there is no heat loss during the
where Al exhibits highly elongated morphologies and almost an process. Significant temperature rise during roll bonding under
interconnected thin Al network (arrow in Fig. 3(d)). The Cu-side high current density should result in material softening and thus
surface is smoother than the Al-side (arrow in Fig. 3(d), high mag- reduction of required deformation force. This effect was not appa-
nification image). There are large Al regions (islands) of Al on the rent for a 50 A current condition where there was no observable
surface (arrow in Fig. 3(e), high magnification image). The fine reduction in required force.
Al-rich features seem to match the grain boundary morphology Additionally, recrystallization temperature is estimated to be
(arrow in Fig. 3(f), high magnification image). around 0.5 homologous temperature for pure Al and Cu; 193 C
We note that the BSE imaging contrast can be attributed to (466 K) and 404 C (678 K), respectively. Therefore, in 150 A,
both differences in atomic composition (Z-contrast) as well as temperature is greater (Al) or equivalent (Cu) to the recrystalliza-
surface topography. Hence, EDS analysis was performed to fur- tion temperature. So, dynamic recrystallization and softening are
ther confirm Al/Cu-rich regions. Figure 4 shows EDS maps cor- quite likely in the Al-side. High current-induced recrystallization
responding to the BSE images presented in Fig. 3 for both Al and softening should lead to: (1) larger thickness reduction; (2)
and Cu-sides in low and high magnification images. Insets on the less required force; and (3) Cu/Al intermetallic components for-
right show the corresponding EDS maps for Al and Cu elements mation at the interface. Higher resolution characterization by elec-
separately. Maps of the Al-side surfaces (Figs. 4(a)–4(c)) indi- tron backscatter diffraction and transmission electron microscopy
cate a rough Al surface decorated with isolated Cu particles con- are currently underway to clarify the expected consequences of
sistent with BSE images (Fig. 3). EDS maps for Cu-side show temperature rise in high current density (150 A case) in terms of
large Al regions as well as fine line features that are Al-rich as interdiffusive phenomena. However, thermal effects of the applied
was also observed by BSE in Fig. 3. This indicates that the electrical current in the form of microstructure/texture evolutions
networklike features seen on the Cu-side surface by BSE are or formation of strong intermetallic components will affect bond
indeed Al-rich. interface properties such as bond strength, which is noticeable in
Empirical observations using EDS analysis does not show a peel test results for 150 A case (Fig. 2(b)) showing a significantly
significant variation in the morphology and distribution of Cu on larger bonding strength compared to the other two experimental
Al-side or Al on Cu-side for peeled surfaces, irrespective of conditions (50 A and 0 A).
applied current during roll bonding. However, there is a consider- For Al/Cu roll bonded with 50% thickness reduction, peeling
able difference in the deformation behavior and mechanical force increased with increasing applied current. Peeling forces are
significantly larger for 150 A compared to 50 A and no current compared to Cu. For Al to preferable adhere to the Cu surface
(Fig. 2(b)). There is also a large fluctuation in the peeling force would also indicate that fracture occasionally preferred to choose
data for 150 A current (Fig. 2(b)). It seems that the predominant a path through Al rather than breaking the bond at the Al/Cu
effect of EARB magnifies the localized bond strength effect and interface.
causes fluctuations of the peeling force. However, the peeling
force could also be affected by the amount of abrasion during
sample preparation and its random nature could result in variation
in the amount, depth, and evenness of the scratches on the surface
before roll bonding.
To quantify this, roughness measurements were performed on
the Al and Cu sheets before and after brushing. Results of this
quantification (Fig. 5(a)) reveals a rougher surface created during
wire brushing on the surface of Al sheet compared with Cu sheet
having almost the same initial surface roughness. Because Al
is relatively soft compared with Cu [18], it is easier to produce
long/deep scratches on the surface by wire brushing. This will
have a significant effect on bonding enhancement during the roll
bonding of Al/Cu sheet [17,18]; the mechanism of bonding forma-
tion will be described later. The profile of the Al surface is shown
in Fig. 5(b). It shows a network of deep scratches/microcracks on
the Al surface as a result of wire brushing, which is consistent
with the morphology of the Al network seen on the Cu-side
(Figs. 3(d)–3(f)).
Knowing all these effects, quantitative analysis of the weight
percent of Al and Cu elements was performed on different regions
of peeled surfaces on both Al/Cu-sides from the low magnification
EDS maps (2 2 lm area). The average weight percent values
from this quantification with the standard deviation are shown in
Table 1. This was done to show a semiquantitative comparison of
the amounts of permanently attached metal after peeling for the Fig. 5 (a) Average of surface roughness measured for Al
and Cu sheets before and after brushing, indicating a higher
Al and Cu-sides.
value of roughness on Al sheet as compared with Cu sheet. (b)
Energy dispersive quantification indicates more Al on the Cu- Optical (left inset) of the Al surface after brushing showing an
side than Cu on Al-side. However, in case of 150 A, the weight interconnected network of scratches/cracks produced on the
percentages are very close. Higher percentage of Al on Cu-side surface of al sheets and corresponding roughness profile (right
can be explained in relation to the lower tensile strength of the Al inset) captured by Zygo surface optical profilometer.
Fig. 8 SE images of fractured surfaces observed for 0, 50, and 150 A currents for: (a) Al-side
and (b) Cu-side, showing the different types of features on the fractured surfaces indicated by
numbers 1–5. Number 1 refers to unbounded areas, 2 to the Al/Cu particles on the Cu/Al-sides,
3 to the area that vein patterns are created, 4 to the faceted regions caused by shear of Al or
Cu during detachment from their sides, and 5 to the regions that underwent brittle fracture
during peeling, leaving microcracks on the surface.
The presence of such vein patterns is greater in extent in the case feature type is microcracks or regions with rough surfaces that are
of 150 A (Fig. 7(c), high magnification image) than the two lower attributed to brittle fracture. All of these feature types are indi-
current cases. Less vein pattern in Al-side for 0 A and 50 A shows cated in Fig. 8 for Al/Cu-sides. The detachment of Al or Cu from
that the nature of fracture is more brittle at the interface during their side and sticking on the other side create valleys with
peeling compared with 150 A. Five different types of morphologi- smooth, flat (facet) surfaces, characteristic of brittle fracture.
cal features are designated for our fractography study. The first fea- These valleys with flat surfaces are evidence of shear in Al and
ture type is regions of unbounded area where there is no bond Cu during peeling. It can be concluded that EARB Cu/Al fracture
created between two sheets during roll bonding. The second feature is a combination of ductile and brittle modes in which the ductile
type is large area attachments of Cu on Al-side or Al on Cu-side. fracture occurs at the extruded material joints and leave ridges
The third feature type is vein pattern. The fourth feature is and dimples on the surface. The brittle fracture occurs where there
regions with faceted morphology indicative of local shear and is a strong interface bond, and cracks propagate through the sheets
detachment of Cu from Cu-side and Al from Al-side. The last rather than the interface to leave a faceted surface morphology.