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TXS0102
SCES640H – JANUARY 2007 – REVISED APRIL 2018
• UART
• GPIO
Typical Application Block Diagram for TXS0102
VCCA VCCB
Processor Peripheral
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TXS0102
SCES640H – JANUARY 2007 – REVISED APRIL 2018 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.1 Overview ................................................................. 14
2 Applications ........................................................... 1 8.2 Functional Block Diagram ....................................... 14
3 Description ............................................................. 1 8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 16
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3 9 Application and Implementation ........................ 17
9.1 Application Information............................................ 17
6 Specifications......................................................... 4
9.2 Typical Application ................................................. 17
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings ............................................................ 4 10 Power Supply Recommendations ..................... 19
6.3 Recommended Operating Conditions ...................... 5 11 Layout................................................................... 19
6.4 Thermal Information .................................................. 5 11.1 Layout Guidelines ................................................. 19
6.5 Electrical Characteristics........................................... 6 11.2 Layout Example .................................................... 19
6.6 Timing Requirements: VCCA = 1.8 V ±0.15 V............ 7 12 Device and Documentation Support ................. 20
6.7 Timing Requirements: VCCA = 2.5 V ± 0.2 V ............ 7 12.1 Documentation Support ....................................... 20
6.8 Timing Requirements: VCCA = 3.3 V ± 0.3 V ............ 7 12.2 Receiving Notification of Documentation Updates 20
6.9 Switching Characteristics: VCCA = 1.8 V ± 0.15 V .... 8 12.3 Community Resources.......................................... 20
6.10 Switching Characteristics: VCCA = 2.5 V ± 0.2 V .... 9 12.4 Trademarks ........................................................... 20
6.11 Switching Characteristics: VCCA = 3.3 V ± 0.3 V .. 10 12.5 Electrostatic Discharge Caution ............................ 20
6.12 Typical Characteristics .......................................... 11 12.6 Glossary ................................................................ 20
7 Parameter Measurement Information ................ 12 13 Mechanical, Packaging, and Orderable
8 Detailed Description ............................................ 14 Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed part number in title of front page graphic from TXS010x to TXS0102 .................................................................. 1
• Changed value from 8 V to 8000 V in ESD Ratings table...................................................................................................... 4
• Changed unit from kV to V in ESD Ratings table................................................................................................................... 4
• Added typical value column in Electrical Characteristics table ............................................................................................. 6
• Changed part number in title of Figure 10 from TXS01xx to TXS0102................................................................................ 15
• Added title to TXS0102 Layout Example diagram .............................................................................................................. 19
B2 1 8 B1
GND 2 7 VCCB
VCCA 3 6 OE
A2 4 5 A1
VCCA 1 8 VCCB
A1 2 7 B1
A2 3 6 B2
GND 4 5 OE
YZP Package
8-Pin DSBGA
Bottom View
A2 D1 4 5 D2 A1
VCCA C1 3 6 C2 OE
GND B1 2 7 B2 VCCB
B2 A1 1 8 A2 B1
Pin Functions
PIN
NO. TYPE (1) DESCRIPTION
NAME
DCT, DCU DQE, DQM YZP
B2 1 6 A1 I/O Input/output B. Referenced to VCCB.
GND 2 4 B1 — Ground
VCCA 3 1 C1 P A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB
A2 4 3 D1 I/O Input/output A. Referenced to VCCA.
A1 5 2 D2 I/O Input/output A. Referenced to VCCA.
Output enable (active High). Pull OE low to place all outputs in 3-state
OE 6 5 C2 I
mode. Referenced to VCCA.
VCCB 7 8 B2 P B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V
B1 8 7 A2 I/O Input/output B. Referenced to VCCB.
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over recommended operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage range, VCCA –0.5 4.6 V
Supply voltage range, VCCB –0.5 6.5 V
A port –0.5 4.6
Input voltage range, VI (2) V
B port –0.5 6.5
A port –0.5 4.6
Voltage range applied to any output in the high-impedance or power-off state, VO (2) V
B port –0.5 6.5
A port –0.5 VCCA + 0.5
Voltage range applied to any output in the high or low state, VO (2) (3) V
B port –0.5 VCCB + 0.5
Input clamp current, IIK VI < 0 –50 mA
Output clamp current, IOK VO < 0 –50 mA
Continuous output current, IO ±50 mA
Continuous current through VCCA, VCCB, or GND ±100 mA
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
(2) The maximum VIL value is provided to ensure that a valid VOL is maintained. The VOL value is VIL plus the voltage drop across the pass-
gate transistor.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Figure 1. Low-Level Output Voltage (VOL(Bx)) vs Low-Level Figure 2. Low-Level Output Voltage (VOL(Bx)) vs Low-Level
Current (IOL(Bx)) Current (IOL(Bx))
NOTE
All parameters and waveforms are not applicable to all devices.
VCCI VCCO
DUT
IN OUT
15 pF 1M
VCCI VCCO
DUT
IN OUT
15 pF 1M
2 x VCCO
S1
50 k Open
From Output
Under Test
15 pF 50 k
tw
VCCI
0V
(1) All input pulses are measured one at a time, with one transition per measurement.
VCCI
VCCI / 2 VCCI / 2
Input
0V
TPLH TPHL
VOH
0.9 VCCO VCCO / 2
VCCO / 2
Output 0.1 VCCO VOL
tr tf
A. All input pulses are measured one at a time, with one transition per measurement.
Output
VCCA
Control
(low-level VCCA / 2 VCCA / 2
enabling) 0V
tPLZ
Output tPZL
Waveform 1(1) VCCO
S1 at x VCCO VCCO / 2
0.1 VCCO
VOL
tPZH tPHZ
Output
VOH
Waveform 2(2) VCCO
0.9
S1 at GND VCCO / 2
0V
(1) Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output
control.
(2) Waveform 2 is for an output with internal conditions such that the ouput is high, except when disabled by the output
control.
8 Detailed Description
8.1 Overview
The TXS0102 device is a directionless voltage-level translator specifically designed for translating logic voltage
levels. The A port is able to accept I/O voltages ranging from 1.65 V to 3.6 V, while the B port can accept I/O
voltages from 2.3 V to 5.5 V. The device is a pass-gate architecture with edge-rate accelerators (one-shots) to
improve the overall data rate. 10-kΩ pullup resistors, commonly used in open-drain applications, have been
conveniently integrated so that an external resistor is not needed. While this device is designed for open-drain
applications, the device can also translate push-pull CMOS logic outputs.
VCCA VCCB
OE
A1 B1
A2 B2
One
One- One
One-
T1 T2
shot
shot shot
shot
R1 R2
10k 10k
Gate Bias
A B
N2
These two bidirectional channels independently determine the direction of data flow without a direction-control
signal. Each I/O pin can be automatically reconfigured as either an input or an output, which is how this auto-
direction feature is realized.
The TXS0102 device is part of TI's "Switch" type voltage translator family and employs two key circuits to enable
this voltage translation:
1) An N-channel pass-gate transistor topology that ties the A-port to the B-port
and
2) Output one-shot (O.S.) edge-rate accelerator circuitry to detect and accelerate rising edges on the A or B
ports
For bidirectional voltage translation, pull-up resistors are included on the device for dc current sourcing capability.
The VGATE gate bias of the N-channel pass transistor is set at approximately one threshold voltage (VT) above
the VCC level of the low-voltage side. Data can flow in either direction without guidance from a control signal.
The O.S. rising-edge rate accelerator circuitry speeds up the output slew rate by monitoring the input edge for
transitions, helping maintain the data rate through the device. During a low-to-high signal rising edge, the O.S.
circuits turn on the PMOS transistors (T1, T2) to increase the current drive capability of the driver for
approximately 30 ns or 95% of the input edge, whichever occurs first. This edge-rate acceleration provides high
ac drive by bypassing the internal 10-kΩ pull-up resistors during the low-to-high transition to speed up the signal.
The output resistance of the driver is decreased to approximately 50 Ω to 70 Ω during this acceleration phase. To
minimize dynamic ICC and the possibility of signal contention, the user should wait for the O.S. circuit to turn off
before applying a signal in the opposite direction. The worst-case duration is equal to the minimum pulse-width
number provided in the Timing Requirements section of this data sheet.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
11 Layout
TXS0102DCTR
1 B2 B1 8
To System 0.1 …F To System
Bypass
Bypass 2 7
GND VCCB Capacitor
Capacitor
0.1 µF
Keep OE low until VCCA
3 VCCA OE 6
and VCCB are powered
up
4 A2 A1 5
To Controller To Controller
12.4 Trademarks
NanoStar, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 18-Apr-2018
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
TXS0102DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCTT ACTIVE SM8 DCT 8 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCTTE4 ACTIVE SM8 DCT 8 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCTTG4 ACTIVE SM8 DCT 8 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (FE, NFEQ, NFER)
& no Sb/Br) NZ
TXS0102DCURG4 ACTIVE VSSOP DCU 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFER
& no Sb/Br)
TXS0102DCUT ACTIVE VSSOP DCU 8 250 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (FE, NFEQ, NFER)
& no Sb/Br) NZ
TXS0102DCUTG4 ACTIVE VSSOP DCU 8 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFER
& no Sb/Br)
TXS0102DQER ACTIVE X2SON DQE 8 5000 Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 2H
& no Sb/Br)
TXS0102DQMR ACTIVE X2SON DQM 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 (2H, 2H7)
& no Sb/Br)
TXS0102YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 (2H, 2H7, 2HN)
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 18-Apr-2018
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive: TXS0102-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Apr-2018
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Apr-2018
Pack Materials-Page 2
MECHANICAL DATA
0,30
0,65 0,13 M
0,15
8 5
0,15 NOM
ÇÇÇÇÇ
2,90 4,25
ÇÇÇÇÇ
2,70 3,75
ÇÇÇÇÇ
PIN 1 ÇÇÇÇÇ
INDEX AREA
Gage Plane
0,25
1 4
0° – 8°
3,15 0,60
2,75 0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00 4188781/C 09/02
www.ti.com 18-Apr-2018
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
TXS0102DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCTT ACTIVE SM8 DCT 8 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCTTE4 ACTIVE SM8 DCT 8 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCTTG4 ACTIVE SM8 DCT 8 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFE
& no Sb/Br) Z
TXS0102DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (FE, NFEQ, NFER)
& no Sb/Br) NZ
TXS0102DCURG4 ACTIVE VSSOP DCU 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFER
& no Sb/Br)
TXS0102DCUT ACTIVE VSSOP DCU 8 250 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (FE, NFEQ, NFER)
& no Sb/Br) NZ
TXS0102DCUTG4 ACTIVE VSSOP DCU 8 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFER
& no Sb/Br)
TXS0102DQER ACTIVE X2SON DQE 8 5000 Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 2H
& no Sb/Br)
TXS0102DQMR ACTIVE X2SON DQM 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 (2H, 2H7)
& no Sb/Br)
TXS0102YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 (2H, 2H7, 2HN)
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 18-Apr-2018
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive: TXS0102-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Apr-2018
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Apr-2018
Pack Materials-Page 2
MECHANICAL DATA
0,30
0,65 0,13 M
0,15
8 5
0,15 NOM
ÇÇÇÇÇ
2,90 4,25
ÇÇÇÇÇ
2,70 3,75
ÇÇÇÇÇ
PIN 1 ÇÇÇÇÇ
INDEX AREA
Gage Plane
0,25
1 4
0° – 8°
3,15 0,60
2,75 0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00 4188781/C 09/02
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life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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