Process Specification

Pretreatment of Polyamide for Bonding 80–T–35–0131

Issue: 05/06
Page 1 / 8

Contents All directives are originally compiled, checked and

approved in the German language.
In case of discrepancies which could result from
1 Scope and Application possible translation errors or wrong interpretation of
the English text, the German version of these directi-
2 Related Documents ves shall always be binding.
3 Prerequisites
4 Materials and Equipment
5 Process
6 Quality Assurance
7 Safety and Health
8 Process Flow Chart

Data Sheet 1: Redux 775 liquid bonding primer

Data Sheet 2: Paratoluenesulfonic acid
Appendix 1: Selection table for pretreatment and bonding agent combination
Appendix 2: Selection criteria for pretreatment processes

Earlier issue: 11/98

The reproduction, distribution and utilization of this document as well as the communication of its contents to others without explicit authorization is
prohibited. Offenders will be held liable for the payment of damages. All rights reserved in the event of the grant of a patent, utility model or design.
 Page 2 80–T–35–0131 (05/06)

1 SCOPE AND APPLICATION

This process specification describes the pretreatment of polyamides for bonding with polyamides
and other materials.
Polyamides are difficult to dissolve and belong therefore to the range of plastics that are difficult
to bond. Only acids such as concentrated sulfuric acid or formic acid and phenolic substances
(phenol, cresol, resorcine) result in bite or dissolution.
The high degree of water absorption of some polyamides affects the quality of the bond.
This means that the relevant conditions (temperature and relative humidity) must be observed when
storing polyamide bonded parts.

2 RELATED DOCUMENTS
80–T–34–9032 Bonding of non–structural connections
80–T–35–0014 Cleaning with organic solvents (cold cleaning agents)
80–T–35–0090 Rinsing
80–T–35–0095 Water quality
80–T–35–0130 Pretreatment of non–structural joints for bonding

3 PREREQUISITES
See 80–T–34–9032.

4 MATERIALS AND EQUIPMENT

See 80–T–34–9032.

5 PROCESS
The pretreatment to be applied (see appendix 1) depends on the following factors:
– type of polyamide to be bonded
– form and dimension of the bonded parts and bonding surfaces
– mechanical and thermal loads
– effects of media (e.g. water, fuel, chemicals).

5.1 Pretreatment with bonding primer (process A)

5.1.1 Cleaning and roughening the surface
The surfaces of the parts to be bonded are first cleaned with a cleaning agent per 80–T–35–0014.
They are then roughened with abrasive paper grain size 120–240 and subsequently cleaned again
per 80–T–35–0014.

5.1.2 Preparation of the hardener for bonding primer

The hardener consists of ethanol and paratoluenesulfonic acid (see data sheet 2). These constituents
are mixed in the ratio 85 parts ethanol by weight : 15 parts paratoluenesulfonic acid by weight
and processed per 5.1.3.

5.1.3 Preparation and application of bonding primer

Bonding primer Redux 775 liquid (see data sheet 1) and hardener (see 5.1.2) are mixed in the ratio
100 : 100 parts by weight and applied by brush or spatula in the form of a thin continuous film.
 Page 3 80–T–35–0131 (05/06)

5.1.4 Processing time (pot life) of bonding primer

See data sheet 1.

5.1.5 Hardening conditions of bonding primer

The bonding primer hardens in an air circulation oven per data sheet 1.

5.1.6 Pretreatment of other bonded part surfaces

Per 80–T–35–0130.

5.1.7 Bonding agent selection

Unless specified otherwise in the design documents, see appendix 1 of this process specification
and/or 80–T–34–9032.

5.1.8 Preparation for joining

The bonding surfaces of the polyamide component pretreated per 5.1.1 thru 5.1.5 are roughened
with Scotch–Brite (Handpad 7558) to obtain a uniformly matt surface. Penetration of the bonding
primer is not permitted.
Immediately prior to bonding the bonding surfaces must be cleaned per 80–T–35–0014. The parts
to be bonded may then only be handled with clean, lint–free cotton gloves.
The bonding agent is processed per 80–T–34–9032.

5.2 Pretreatment by pickling (processes B and C)

5.2.1 Cleaning
The polyamide parts to be bonded are cleaned per 80–T–35–0014.

5.2.2 Pickling
There are two possibilities for pickling the polyamide parts to be bonded:

5.2.2.1 Process B:
Pickling in a bath with the following composition:
Sulfuric acid (concentrated) : 100 parts by weight
Potassium bichromate : 8 parts by weight
Water : 5 parts by weight
Pickling temperature : room temperature
Duration : approx. 3 minutes

5.2.2.2 Process C:
Pickling in a bath with the following composition:
Sodium dichromate : 7 parts by weight
Sulfuric acid (concentrated) : 25 parts by weight
Water : 100 parts by weight
Pickling temperature : room temperature
Duration : (14 " 1) minutes
 Page 4 80–T–35–0131 (05/06)

5.2.3 Rinsing
Immersion rinsing in cold water per 80–T–35–0090.
Water quality B per 80–T–35–0095.
Intensive rinsing is required. During the rinsing process care must be taken to prevent the polyamide
surfaces sticking together.

5.2.4 Drying (desiccation)

Owing to the water absorption of the polyamide, the parts must be dried after rinsing for at least
2 days at room temperature or 30 minutes at (80 " 5)°C.
During the drying process the polyamide surfaces must not stick together.
Note: The pickled parts to be bonded may only be handled with clean, lint–free cotton gloves.
If not already effected directly after pretreatment, they must be stored protected from dust
until the bonding process (storage life unlimited).

5.2.5 Pretreatment of other bonded part surfaces

Pretreatment per 80–T–35–0130.

5.2.6 Bonding agent selection

Per 80–T–34–9032 and appendix 1.

5.3 Pretreatment with cold cleaning agents (process D)

5.3.1 Cleaning
The polyamide parts to be bonded are cleaned per 80–T–35–0014.

5.3.2 Pretreatment of other bonded part surfaces

Pretreatment per 80–T–35–0130.

5.3.3 Bonding agent selection

Per 80–T–34–9032.

5.4 Pretreatment by roughening and cold cleaning (process E)

5.4.1 Cleaning
The polyamide parts to be bonded are cleaned per 80–T–35–0014.

5.4.2 Roughening
The polyamide parts to be bonded are roughened with abrasive paper grain size 120–240.

5.4.3 Pretreatment of other bonded part surfaces

Pretreatment per 80–T–35–0130.

5.4.4 Bonding agent selection

Per 80–T–34–9032.
 Page 5 80–T–35–0131 (05/06)

6 QUALITY ASSURANCE
Unless specified otherwise in process– or component–specific design, manufacturing or QA docu-
ments, the competent organization unit shall ensure that the following measures are taken.
6.1 Check of bonding pretreatment with primer (process A)
Only such primers may be applied as are approved, checked by Incoming Goods Inspection and
released for production.
The pretreatment process must be checked for compliance with the following points:
S correct mixing ratio of hardener components
S correct mixing ratio of primer/hardener
S adherence to processing time
S hardening time
S storage life of components treated with primer.

6.2 Check of bonding pretreatment by pickling (processes B and C)

The following parameters of the pretreatment process must be checked:
S bath composition
S pickling temperature
S pickling duration
S rinsing time
S drying temperature
S drying time

6.3 Check of bonding pretreatment with cold cleaning agent (process D)

The pretreatment process must be checked for compliance with the following points:
S application of approved cold cleaning agents per 80–T–35–0014
S use of clean, lint–free cotton cloths

6.4 Check of bonding pretreatment by roughening and cold cleaning (process E)

The pretreatment process must be checked for compliance with the following points:
S application of approved cold cleaning agents per 80–T–35–0014
S use of clean, lint–free cotton cloths
S correct grain size of abrasive paper (grain size 120–240)

7 SAFETY AND HEALTH

Apply the local safety regulations.
It is the responsibility of the user of this standard to apply appropriate safety and health practices
and determine the applicability of regulatory limitations prior to use.
 Page 6 80–T–35–0131 (05/06)

8 PROCESS FLOW CHART

8.1 Pretreatment with bonding primer (process A)

Cleaning of polyamide
bonding parts per
80–T–35–0014

Roughening Pretreatment of other

per 5.1.1 bonding parts
per 80–T–35–0130

Cleaning
per 80–T–35–0014

Pretreatment and application of

bonding primer
per 5.1.2 and 5.1.3

Hardening the bonding primer

per 5.1.5

Bonding the parts

per 80–T–34–9032
 Page 7 80–T–35–0131 (05/06)

8.2 Pretreatment by pickling (processes B and C)

Cleaning of polyamide Pretreatment of other

bonding parts bonding parts
per 80–T–35–0014 per 80–T–35–0130

Pickling per 5.2.2.1 (B) Pickling per 5.2.2.2 (C)

Rinsing
per 80–T–35–0090
water quality B per 80–T–35–0095

Drying per 5.2.4

Bonding the parts

per 80–T–34–9032

8.3 Pretreatment with cold cleaning agents (process D)

Cleaning of polyamide Pretreatment of

bonding parts other bonding parts
per 80–T–35–0014 per 80–T–35–0130

Bonding agent selection

per 80–T–34–9032
 Page 8 80–T–35–0131 (05/06)

8.4 Pretreatment by roughening and cold cleaning (process E)

Cleaning of polyamide
bonding parts
per 80–T–35–0014

Roughening Pretreatment of other

per 5.4.2 bonding parts
per 80–T–35–0130

Cleaning
per 80–T–35–0014

Bonding agent selec-

tion per 80–T–34–9032
Process Specification

Pretreatment of Polyamide for Bonding 80–T–35–0131

Data Sheet 1
– Redux 775 Liquid – Issue: 05/06
Page 1 / 1

Product Redux 775 Liquid

Manufacturer Hexcel Composites
Material data sheet —
Basis Phenolic resin
Hardener —
Mixing ratio Basis Hardener 1)

parts by weight 100 100

parts by volume — —
Storage/Storage life [a] 2) 0,5 1
Storage temperature [°C] RT 0–5
Processing parametes and properties of the mixed product
Consistency liquid
Color brown
Density [g/cm3] 1,12
Coat thickness [mm] thin, even film
Bonding primer —
Processing time [h] 6 max.
Waiting time (open) [min] —
Hardening temperature [°C] 100 " 5
Hardening time [min] 12 " 2
Adhesion [N/mm2] —
Peeling strength [N/cm] —

Remarks: 1) Preparation/Mixing with hardener: See 5.1.2 and 5.1.3

2) The product must be stored protected from sunlight.

Earlier issue: 11/98

The reproduction, distribution and utilization of this document as well as the communication of its contents to others without explicit authorization is
prohibited. Offenders will be held liable for the payment of damages. All rights reserved in the event of the grant of a patent, utility model or design.
Process Specification

Pretreatment of Polyamide for Bonding 80–T–35–0131

Data Sheet 2
– Paratoluenesulfonic Acid – Issue: 11/98
Page 1 / 1

Product : paratoluenesulfonic acid (toluenesulphonic acid–4–monohydrate)

Total formula : C7H8O3SSH2O
Manufacturer : Chemical industry
Consistency : solid (crystals, sheets, prisms)
Color : pink–violet
Storage temperature [°C] : RT (storage dry)

Earlier issue: 12/87

Copying of this document, and giving it to others and the use or communication of the contents thereof, are forbidden without express authority.
Offenders are liable to the payment of damages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or
design.
Process Specification

Pretreatment of Polyamide for Bonding 80–T–35–0131

Appendix 1
– Selection Table – Issue: 11/98
Page 1 / 1

Selection table for pretreatment and bonding agent combination

Materials
PA 6 PA 11 PA 12 elast.
PA 66 PA 12
PA 610
PA 612
Process 3)

A B C D E A A D E
Material 5)

4)
E 1 2 2 X E6 2 1 1 X X
G
CA X 2 X 3 X X X 1–2 1–2 r
a
N X X X X 3 X X X 3 d
e
s
B2 X X X X 3 X X X 3

Key:
3) Process : A pretreatment with primer per 5.1
B pickling per 5.2.2.1
C pickling per 5.2.2.2
D cleaning with cold cleaning agent per 80–T–35–0014
E roughening + cleaning with cold cleaning agent per 5.4
4) Grades : 1 bonding with optimum bonding strength
2 bonding with medium bonding strength
3 subordinate bonding
X not applied
5) Bonding agents : E epoxy bonding agents
(selection per CA cyanacrylate bonding agent
80–T–34–9032) N chloroprene–based bonding agent
B2 nitrite–based bonding agent

Earlier issue: 12/87

Copying of this document, and giving it to others and the use or communication of the contents thereof, are forbidden without express authority.
Offenders are liable to the payment of damages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or
design.
Process Specification

Pretreatment of Polyamide for Bonding 80–T–35–0131

Appendix 2
– Pretreatment Processes – Issue: 11/98
Page 1 / 1

Criteria for selection of pretreatment processes

Pretreatment process Advantages Disadvantages

Bonding primer (A) – bonding possible with com- – brown pretreatment surface
mon epoxy resins
– high strength
– no pretreatment bath required
– pretreatment of individual sur-
faces possible
Pickling (B) – unlimited storage – surface embrittlement
– also used for large bonding – masking of unbonded areas
areas required
– white pretreatment surface
Pickling (C) – unlimited storage – slightly brown component sur-
– slight component coloration face
– easy processing – surface embrittlement
– high unit quantities – for small components
Cleaning (D) – simple process – only to be applied to CA
– no coloration bonding agents
Roughening + – simple process – only to be applied to special
cleaning (E) – no coloration bonding agents
– low strength

Earlier issue: 12/87

Copying of this document, and giving it to others and the use or communication of the contents thereof, are forbidden without express authority.
Offenders are liable to the payment of damages. All rights are reserved in the event of the grant of a patent or the registration of a utility model or
design.